JP2001223496A - Electromagnetic wave shielding laminated body - Google Patents
Electromagnetic wave shielding laminated bodyInfo
- Publication number
- JP2001223496A JP2001223496A JP2000033166A JP2000033166A JP2001223496A JP 2001223496 A JP2001223496 A JP 2001223496A JP 2000033166 A JP2000033166 A JP 2000033166A JP 2000033166 A JP2000033166 A JP 2000033166A JP 2001223496 A JP2001223496 A JP 2001223496A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electromagnetic wave
- wave shielding
- sheet
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器から発生
する電磁波の外部への漏洩を防止するための電子機器筺
体の製造用として適した電磁波シールド性積層体、それ
を用いた電磁波シールド性筺体及びそれらの製造法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding laminate suitable for manufacturing an electronic device housing for preventing leakage of electromagnetic waves generated from an electronic device to the outside, and an electromagnetic wave shielding housing using the same. And their production methods.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来、
ノート型パーソナルコンピューター、電子手帳、携帯電
話等に代表される携帯用電子機器の筺体は、薄肉化、軽
量化、絶縁性、設計の自由度等から樹脂成形品が用いら
れている。電子機器の筺体には、電子機器内部で発生す
る電磁波の外部への漏洩防止のために導電性が必要であ
り、金属と樹脂の多層構造にする方法、樹脂製の筺体内
部に導電性塗料を塗布したり又は金属メッキしたりして
導電層を設ける方法、樹脂に導電性添加剤を練り込む方
法等により導電性を付与している。2. Description of the Related Art
BACKGROUND ART A housing of a portable electronic device typified by a notebook personal computer, an electronic organizer, a mobile phone, and the like uses a resin molded product because of its thinness, weight, insulation, design freedom, and the like. The housing of an electronic device must have conductivity to prevent leakage of electromagnetic waves generated inside the electronic device to the outside. A method of forming a multilayer structure of metal and resin, and a method of applying a conductive paint inside a resin housing The conductivity is provided by a method of providing a conductive layer by coating or metal plating, a method of kneading a conductive additive into a resin, or the like.
【０００３】しかし、金属と樹脂の多層構造にした場
合、薄肉化が困難になり軽量化も図れない。また、筺体
内部に導電層を設ける方法は、工程が複雑になり、製品
価格も割高になってしまう。更に、樹脂自体に導電性添
加剤を練り込む方法は、樹脂の機械的性質が低下するだ
けでなく、溶融粘度も増加してしまうので、製品の信頼
性、軽量化、薄肉化の面で問題がある。[0003] However, in the case of a multilayer structure of metal and resin, it is difficult to reduce the thickness, and it is not possible to reduce the weight. Also, the method of providing the conductive layer inside the housing complicates the process and increases the price of the product. Furthermore, the method of kneading the conductive additive into the resin itself not only deteriorates the mechanical properties of the resin but also increases the melt viscosity, which is a problem in terms of product reliability, weight reduction, and thinning. There is.
【０００４】本発明は、特に電子機器に適用した場合、
電磁波の外部への漏洩を防止でき、併せて薄肉化、軽量
化等もできる電磁波シールド性積層体、前記積層体を用
いた電磁波シールド性筺体及びそれらの製造法を提供す
ることを目的とする。[0004] The present invention, especially when applied to electronic equipment,
It is an object of the present invention to provide an electromagnetic wave shielding laminate capable of preventing electromagnetic waves from leaking to the outside, and at the same time, making it thinner and lighter, an electromagnetic wave shielding housing using the laminate, and a method of manufacturing the same.
【０００５】[0005]
【課題を解決するための手段】本発明は、基材樹脂シー
トの１面に導電性樹脂層を有しており、基材樹脂シート
を構成する樹脂と導電性樹脂層を構成する樹脂の溶解度
パラメーターの差が２．０以下である電磁波シールド性
積層体、前記積層体からなる電磁波シールド性筺体及び
それらの製造法を提供する。According to the present invention, a conductive resin layer is provided on one surface of a base resin sheet, and the solubility of the resin forming the base resin sheet and the resin forming the conductive resin layer is determined. Provided are an electromagnetic wave shielding laminate having a parameter difference of 2.0 or less, an electromagnetic wave shielding housing made of the laminate, and a method for producing them.
【０００６】[0006]
【発明の実施の形態】本発明の電磁波シールド性積層体
は、基材樹脂シートの１面に導電性樹脂層を有している
ものであり、基材樹脂シートと導電性樹脂層の樹脂部分
が接した状態で一体化されている。BEST MODE FOR CARRYING OUT THE INVENTION The electromagnetic wave shielding laminate of the present invention has a conductive resin layer on one surface of a base resin sheet, and a resin portion of the base resin sheet and the conductive resin layer. Are in contact with each other.
【０００７】基材樹脂シートの樹脂と導電性樹脂層の樹
脂部分は、基材樹脂シートと導電性樹脂層との密着性を
高めるため、溶解度パラメーターの差が２．０以下であ
り、好ましくは１．７以下であり、より好ましくは１．
５以下である。[0007] The difference in solubility parameter between the resin of the base resin sheet and the resin portion of the conductive resin layer is 2.0 or less, in order to enhance the adhesion between the base resin sheet and the conductive resin layer, and is preferable. 1.7 or less, more preferably 1.
5 or less.
【０００８】基材樹脂シートの樹脂と導電性樹脂層の樹
脂は、上記溶解度パラメーターを満たす範囲で選択する
ことができ、例えば、基材樹脂シートの樹脂としてＡＢ
Ｓ樹脂を用いた場合は、導電性樹脂層の樹脂としてＡＢ
Ｓ樹脂、耐衝撃性ポリスチレン（ＨＩＰＳ）、ポリブチ
レンテレフタレート（ＰＢＴ）、ウレタン樹脂、ポリア
ミド（ＰＡ）、ポリカーボネート（ＰＣ）及びこれらの
アロイ、例えばＰＣ／ＨＩＰＳ、ＰＣ／ＡＢＳ樹脂、Ｐ
ＢＴ／ＡＢＳ樹脂、ＰＡ／ＡＢＳ樹脂等を用いることが
できる。The resin of the base resin sheet and the resin of the conductive resin layer can be selected within a range satisfying the above-mentioned solubility parameter.
When the S resin is used, AB is used as the resin of the conductive resin layer.
S resin, high impact polystyrene (HIPS), polybutylene terephthalate (PBT), urethane resin, polyamide (PA), polycarbonate (PC) and alloys thereof, for example, PC / HIPS, PC / ABS resin, P
BT / ABS resin, PA / ABS resin and the like can be used.
【０００９】導電性樹脂層の形態は特に限定されない
が、製造時の簡便さのため、導電性樹脂がシート状であ
ることが好ましく、樹脂と繊維状導電性シールド材から
なるものが好ましい。Although the form of the conductive resin layer is not particularly limited, the conductive resin is preferably in the form of a sheet, and preferably made of a resin and a fibrous conductive shield material, for convenience in manufacturing.
【００１０】繊維状導電性シールド材としては、表面が
金属で被覆された繊維からなるものにすることができ、
電磁波シールド性の点からは表面が金属で被覆された繊
維から得られる織物が好ましいが、そのほか織物の表面
を金属被覆したものでもよい。The fibrous conductive shielding material may be made of a fiber whose surface is coated with a metal,
From the viewpoint of the electromagnetic wave shielding property, a fabric obtained from a fiber whose surface is coated with a metal is preferable, but in addition, a fabric whose surface is coated with a metal may be used.
【００１１】繊維は天然又は合成繊維を使用することが
でき、例えば、ポリエステル繊維、ナイロン繊維、アク
リル繊維、アセテート繊維、木綿、羊毛等が挙げられる
が、後の成形加工時において伸びが要求されるため、合
成繊維が好ましい。As the fiber, natural or synthetic fiber can be used, and examples thereof include polyester fiber, nylon fiber, acrylic fiber, acetate fiber, cotton, wool, etc., and elongation is required at the time of subsequent molding. Therefore, synthetic fibers are preferred.
【００１２】繊維の表面を金属で被覆する方法は、メッ
キ、蒸着、スパッタリング等を適用することができ、金
属は銅、ニッケル、銀等の金属単体のほか、酸化インジ
ウム、酸化スズ等の金属酸化物、硫化銅、硫化亜鉛等の
金属硫化物、塩化亜鉛、沃化銅等の金属ハロゲン化物等
も使用することができる。The surface of the fiber can be coated with a metal by plating, vapor deposition, sputtering, or the like. The metal may be a simple metal such as copper, nickel or silver, or a metal oxide such as indium oxide or tin oxide. , Metal sulfides such as copper sulfide and zinc sulfide, and metal halides such as zinc chloride and copper iodide can also be used.
【００１３】シート状の導電性樹脂は、例えば、シート
状樹脂上に繊維状導電性シールド材である織物を置き、
熱ラミネート法により一体化する方法、繊維状導電性シ
ールド材である織物に樹脂を含浸させ、熱プレスする方
法等により製造できる。As the sheet-like conductive resin, for example, a woven fabric which is a fibrous conductive shield material is placed on the sheet-like resin,
It can be manufactured by a method of integrating by a heat laminating method, a method of impregnating a resin as a fibrous conductive shielding material with a resin, and hot pressing.
【００１４】次に、本発明の電磁波シールド性積層体の
製造法を、上記の熱ラミネート法により得られたシート
状の導電性樹脂を使用した場合を例にとって説明する。 （第１の製造法）金型（凹型）内に、シート状の導電性
樹脂を樹脂部分が内側になるように設置した後、金型
（凸型）を重ね合わせ、注入孔から前記樹脂上に基材樹
脂シートとなる溶融樹脂を注入して電磁波シールド性積
層体を成形する。 （第２の製造法）ロール状に巻き取られたシート状の導
電性樹脂の一部を金型（凹型）内に樹脂部分が上になる
ように設置した後、金型（凸型）を重ね合わせ、注入孔
から溶融樹脂を前記樹脂上に注入して電磁波シールド性
積層体を成形する。その後、凸型を外し、シート状の導
電性樹脂を一方向に引き取って成形した積層体部分を凹
型から取り出した後、凸型を再度重ね合わせ、同様にし
て樹脂上に溶融樹脂を注入し、電磁波シールド性積層体
を成形する。そして、この操作を連続的に繰り返す。な
お、金型から取り出した電磁波シールド性積層体は、カ
ッター等で打ち抜いて分離する。Next, a method for producing the electromagnetic wave shielding laminate of the present invention will be described by taking as an example a case where a sheet-like conductive resin obtained by the above-mentioned thermal lamination method is used. (First manufacturing method) After a sheet-shaped conductive resin is placed in a mold (concave mold) so that the resin portion is on the inside, the mold (convex mold) is overlapped, and the resin is injected through the injection hole. Then, a molten resin to be a base resin sheet is injected into the mixture to form an electromagnetic wave shielding laminate. (Second Manufacturing Method) After a part of a sheet-shaped conductive resin wound into a roll is placed in a mold (concave mold) such that the resin portion is on top, the mold (convex mold) is removed. Lamination is performed, and a molten resin is injected from the injection hole onto the resin to form an electromagnetic wave shielding laminate. After that, the convex mold was removed, the sheet-shaped conductive resin was taken in one direction, and the molded laminate portion was taken out of the concave mold, and then the convex molds were overlapped again, and the molten resin was injected onto the resin in the same manner, An electromagnetic wave shielding laminate is formed. Then, this operation is continuously repeated. The electromagnetic wave shielding laminate taken out of the mold is separated by punching with a cutter or the like.
【００１５】本発明の電磁波シールド性積層体の厚み
は、用途に応じて要求される重量、厚み、機械的強度、
電磁波シールド性の強さ等を考慮して、基材樹脂シート
の厚み、導電性樹脂層の厚みを選択して決定されるもの
であり、例えば、携帯用電子機器の筺体用として適用す
る場合には、基材樹脂シートの厚みを０．１〜１０ｍ
ｍ、導電性樹脂層の厚みを０．０２〜０．５ｍｍとし、
電磁波シールド性積層体の総厚みを０．１２〜１０．５
ｍｍにすることができる。[0015] The thickness of the electromagnetic wave shielding laminate of the present invention depends on the weight, thickness, mechanical strength,
Considering the strength of electromagnetic wave shielding, etc., the thickness of the base resin sheet, the thickness of the conductive resin layer is selected and determined, for example, when applied for the housing of portable electronic devices The thickness of the base resin sheet is 0.1 to 10 m
m, the thickness of the conductive resin layer is 0.02 to 0.5 mm,
The total thickness of the electromagnetic wave shielding laminate is 0.12 to 10.5
mm.
【００１６】本発明の電磁波シールド性筺体は、上記し
た電磁波シールド性積層体を使用し、金型を用いた同様
の成形法により製造することができる。The electromagnetic wave shielding casing of the present invention can be manufactured by using the above-mentioned electromagnetic wave shielding laminate and by a similar molding method using a mold.
【００１７】本発明の電磁波シールド性積層体及び電磁
波シールド性筺体は、各種電子・電気機器用のハウジン
グ等に使用することができ、特にノート型パーソナルコ
ンピューター、電子手帳、携帯電話等の携帯用電子機器
のハウジング用として適している。The electromagnetic wave shielding laminate and the electromagnetic wave shielding housing of the present invention can be used for housings for various electronic and electric devices and the like, and in particular, portable electronic devices such as notebook personal computers, electronic organizers, and mobile phones. Suitable for equipment housing.
【００１８】[0018]
【実施例】以下、実施例により本発明をさらに詳しく説
明するが、本発明はこれらにより限定されるものではな
い。EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the invention is limited thereto.
【００１９】製造例 表１に示す樹脂シート上に繊維状導電性シールド材（織
物）を配置した後、熱プレス機で熱ラミネートして一体
化し、導電性樹脂シートＡ〜Ｄを得た。なお、表１中の
「メッキ率」は、使用した繊維の総表面積に対するメッ
キ面積の百分率である。Production Example After a fibrous conductive shielding material (woven fabric) was placed on the resin sheet shown in Table 1, it was heat-laminated by a hot press and integrated to obtain conductive resin sheets A to D. The “plating rate” in Table 1 is a percentage of the plating area with respect to the total surface area of the used fibers.
【００２０】[0020]
【表１】 [Table 1]
【００２１】実施例１〜４、比較例１〜４ 表２に示す導電性樹脂層となる導電性樹脂シートＡ〜Ｄ
と基材樹脂シートとなるＡＢＳ樹脂（溶解度パラメータ
ー１０．６）を使用し、インモールド成形法で、厚みが
３ｍｍで、１０×１０ｃｍの大きさの電磁波シールド性
積層体を得た。この電磁波シールド性積層体をアンリツ
電気製のＭＡ８６０２型電磁シールド特性テスターにセ
ットし、ADVANTEST社製のＲ３３７１Ａ型スペクトラム
アナライザーで電磁波のシールド特性を評価した。結果
を表２に示す。Examples 1 to 4 and Comparative Examples 1 to 4 Conductive resin sheets A to D to be conductive resin layers shown in Table 2
An electromagnetic wave shielding laminate having a thickness of 3 mm and a size of 10 × 10 cm was obtained by an in-mold molding method using an ABS resin (solubility parameter 10.6) serving as a base resin sheet. This electromagnetic wave shielding laminate was set on an MA8602 type electromagnetic shielding characteristic tester manufactured by Anritsu Electric Co., Ltd., and the electromagnetic wave shielding characteristics were evaluated with an R3371A type spectrum analyzer manufactured by ADVANTEST. Table 2 shows the results.
【００２２】[0022]
【表２】 [Table 2]
【００２３】[0023]
【発明の効果】本発明の電磁波シールド性積層体は、樹
脂が本来有している機械的性質を損なうことなく電磁波
シールド性を高めることができ、しかも薄肉化、軽量
化、絶縁性、設計の自由度の点で優れており、更に製造
法が簡便であるという点でも優れている。The electromagnetic wave shielding laminate according to the present invention can enhance the electromagnetic wave shielding property without impairing the mechanical properties inherent in the resin, and can reduce the thickness, weight, insulation and design. It is excellent in the degree of freedom, and also excellent in that the manufacturing method is simple.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F100 AB01B AB16B AB17B AB24B AJ02B AJ08B AK01A AK01B AK12B AK25B AK42B AK45B AK46B AK51B AK74A AK74B BA02 BA26 DG01B DG20B EH66B EH71B GB41 JD08 JG01B JG04 JL03 5E321 AA01 BB23 BB41 BB44 CC16 GG05 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4F100 AB01B AB16B AB17B AB24B AJ02B AJ08B AK01A AK01B AK12B AK25B AK42B AK45B AK46B AK51B AK74A AK74B BA02 BA26 DG01B DG20B EH41B01 J03B01 J03B01 J03B01 J03B01
Claims (7)
有しており、基材樹脂シートを構成する樹脂と導電性樹
脂層を構成する樹脂の溶解度パラメーターの差が２．０
以下である電磁波シールド性積層体。A conductive resin layer is provided on one surface of a base resin sheet, and a difference in solubility parameter between a resin forming the base resin sheet and a resin forming the conductive resin layer is 2.0.
The following electromagnetic wave shielding laminate.
と繊維状導電性シールド材からなるものである請求項１
記載の電磁波シールド性積層体。2. The conductive resin according to claim 1, wherein the conductive resin has a sheet shape and is made of a resin and a fibrous conductive shielding material.
An electromagnetic wave shielding laminate according to the above.
金属で被覆された繊維からなるものである請求項２記載
の電磁波シールド性積層体。3. The electromagnetic wave shielding laminate according to claim 2, wherein the fibrous conductive shielding material is made of a fiber whose surface is coated with a metal.
シールド性積層体からなる電磁波シールド性筺体。4. An electromagnetic wave shielding casing comprising the electromagnetic wave shielding laminate according to claim 1.
シールド性積層体の製造法であり、シート状の導電性樹
脂を金型内に設置した後、溶融樹脂を注入して成形する
電磁波シールド性積層体の製造法。5. The method for producing an electromagnetic wave shielding laminate according to claim 1, wherein a sheet-like conductive resin is placed in a mold, and then a molten resin is injected and molded. A method for producing an electromagnetic wave shielding laminate.
シールド性積層体の製造法であり、ロール状に巻き取ら
れたシート状の導電性樹脂の一部を金型内に設置した
後、溶融樹脂を注入して積層体を成形し、続いてシート
状の導電性樹脂を一方向に引き取った後、溶融樹脂を注
入して積層体を成形する操作を連続的に繰り返す電磁波
シールド性積層体の製造法。6. The method for producing an electromagnetic wave shielding laminate according to claim 1, wherein a part of the sheet-shaped conductive resin wound into a roll is placed in a mold. After that, the molten resin is injected to form a laminate, and then the sheet-shaped conductive resin is taken in one direction, and then the operation of injecting the molten resin and forming the laminate is continuously repeated to form an electromagnetic wave shield. Manufacturing method of laminate.
請求項４記載の電磁波シールド性筺体の製造法。7. A method for manufacturing an electromagnetic wave shielding casing according to claim 4, wherein the manufacturing method according to claim 5 or 6 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000033166A JP2001223496A (en) | 2000-02-10 | 2000-02-10 | Electromagnetic wave shielding laminated body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000033166A JP2001223496A (en) | 2000-02-10 | 2000-02-10 | Electromagnetic wave shielding laminated body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001223496A true JP2001223496A (en) | 2001-08-17 |
Family
ID=18557685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000033166A Pending JP2001223496A (en) | 2000-02-10 | 2000-02-10 | Electromagnetic wave shielding laminated body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001223496A (en) |
-
2000
- 2000-02-10 JP JP2000033166A patent/JP2001223496A/en active Pending
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