JP2001217599A - Surface mounting component attaching device and electronic component detecting method thereof - Google Patents
Surface mounting component attaching device and electronic component detecting method thereofInfo
- Publication number
- JP2001217599A JP2001217599A JP2000026936A JP2000026936A JP2001217599A JP 2001217599 A JP2001217599 A JP 2001217599A JP 2000026936 A JP2000026936 A JP 2000026936A JP 2000026936 A JP2000026936 A JP 2000026936A JP 2001217599 A JP2001217599 A JP 2001217599A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- light
- mounting
- component
- linear slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、装着ヘッドの保持部材
により保持された電子部品の検査を簡単かつ正確に行う
ことができる表面実装部品装着機および表面実装部品装
着機における電子部品検出方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component mounting machine capable of easily and accurately inspecting an electronic component held by a holding member of a mounting head, and an electronic component detecting method in the surface mount component mounter. .
【０００２】[0002]
【従来の技術】プリント基板に装着されるＩＣ等の電子
部品は、高い装着精度の確保と、不良電子部品の装着防
止等のため、事前にＣＣＤカメラにより吸着ノズルに保
持された状態でこの電子部品を撮像し、この電子部品に
対する前記した様々な情報を得て、この情報に基づいて
所定の処理を行うことで対応している。2. Description of the Related Art In order to ensure high mounting accuracy and prevent mounting of defective electronic components, electronic components such as ICs mounted on a printed circuit board are held in advance by suction nozzles by a CCD camera in order to prevent the mounting of defective electronic components. This is achieved by capturing an image of the component, obtaining the various information described above for the electronic component, and performing a predetermined process based on the information.
【０００３】特に、電子部品の周縁部に突設させた多数
本のリードは、高さ方向の曲がりを生じていると、プリ
ント基板への装着に不都合を来すため、あらかじめ、レ
ーザビームをこのリード部へ照射し、この照射された状
態をＣＣＤカメラにより撮像し、リード不良の有無やリ
ードの欠損等を検出する必要があるものである。In particular, if a large number of leads projecting from the peripheral edge of an electronic component bend in the height direction, it will cause inconvenience in mounting on a printed circuit board. It is necessary to irradiate the lead portion, take an image of the illuminated state with a CCD camera, and detect the presence or absence of a lead defect, loss of the lead, and the like.
【０００４】従来、この検出は、ノズル部材に吸着され
たリード付部品の下方から、水平方向に対して所定角度
で傾斜する平面を通る検査用照明光を部品のリードに照
射しながら該リードを撮像し、得られたリード画像にお
けるリード列方向と直交する方向のリードの位置に基づ
いて前記リードの異常を検出していた。Conventionally, this detection is performed by irradiating the lead of the component with illumination light for inspection that passes through a plane inclined at a predetermined angle with respect to the horizontal direction from below the component with the lead sucked by the nozzle member. Abnormality of the lead is detected based on the position of the lead in the direction perpendicular to the direction of the lead row in the obtained lead image obtained by imaging.
【０００５】しかしながら、この検出方法では、サイズ
や厚みが違う電子部品は、一度での撮像でリードの曲が
り量を計測することが不可能であり、一辺若しくは二辺
までしか同時に計測することができない。However, according to this detection method, it is impossible to measure the amount of bending of a lead by imaging at once for electronic components having different sizes and thicknesses, and it is possible to measure only one or two sides simultaneously. .
【０００６】したがって、四辺にリードがそれぞれ設け
られた電子部品に対しては、一辺若しくは二辺のリード
を、まず撮像して、それぞれのリードの曲がり量を計測
した後、残りの三辺若しくは二辺を計測するために、電
子部品の位置を、Ｘ，Ｙ，θ軸方向へ移動させて、再
度、これらリードを撮像してそれぞれのリードの曲がり
量を計測する必要があった。Accordingly, for an electronic component having leads on four sides, one or two leads are first imaged, the amount of bending of each lead is measured, and then the remaining three or two leads are measured. In order to measure the side, it is necessary to move the position of the electronic component in the X, Y, and θ-axis directions, image these leads again, and measure the amount of bending of each lead.
【０００７】この計測方法では、電子部品の位置を、前
記したようにＸ，Ｙ，θ軸方向へ移動させるため、この
移動のための機械的な動作によって発生する機械特有の
誤差が、そのまま検出された電子部品の位置ずれに反映
して、微量なリードの曲がり量の計測誤差の要因となっ
て高い精度による検出ができない問題点を有するもので
あった。In this measuring method, since the position of the electronic component is moved in the X, Y, and θ axis directions as described above, the machine-specific error generated by the mechanical operation for this movement is directly detected. There is a problem that it is not possible to detect with a high accuracy due to a measurement error of a slight amount of bending of the lead, which is reflected in the positional deviation of the electronic component.
【０００８】[0008]
【発明が解決しようとする課題】本発明は、前記した問
題点を解決するためになされたもので、電子部品の下面
へ、光線照射手段により四方向から直線スリット光を照
射し、電子部品に照射されたこの光の位置を、テレセン
トリックレンズからなる入光手段を介して、ＣＣＤカメ
ラからなる撮像手段により撮像して電子部品を検出する
ことにより、装着ヘッドの保持部材により保持された電
子部品の検査を、該電子部品のサイズや厚み等が違って
いても、一度の撮像で行うことができ、かつ、その検出
を正確に行うことができる表面実装部品装着機および表
面実装部品装着機における電子部品検出方法を提供する
ことを目的としている。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and irradiates a linear slit light from four directions to a lower surface of an electronic component by means of a light beam irradiating means, thereby applying the electronic component to the electronic component. The position of the illuminated light is imaged by an image pickup means such as a CCD camera via a light input means formed of a telecentric lens to detect the electronic part, thereby detecting the position of the electronic part held by the holding member of the mounting head. Even if the size and thickness of the electronic component are different, the inspection can be performed by a single imaging, and the detection can be performed accurately. It is intended to provide a component detection method.
【０００９】[0009]
【課題を解決するための手段】前記した目的を達成する
ための本発明の手段は、供給部の電子部品を装着ヘッド
の保持部材によって保持し、該電子部品を前記供給部か
ら装着部への搬送中に、前記保持部材によって保持され
た前記電子部品を検出手段により検出した後、前記装着
部におけるプリント基板の所定位置に前記電子部品を装
着する表面実装部品装着機にあって、前記検出手段は、
ＣＣＤカメラからなる撮像手段と、テレセントリックレ
ンズからなる入光手段と、発光ダイオードからなる照明
手段と、複数本のレーザビームからなる光線照射手段と
を備える表面実装部品装着機の構成にある。In order to achieve the above-mentioned object, the present invention provides an electronic apparatus comprising: an electronic component of a supply unit, which is held by a holding member of a mounting head; A surface mount component mounting machine for mounting the electronic component at a predetermined position on a printed circuit board in the mounting portion after detecting the electronic component held by the holding member by a detection unit during transportation. Is
The surface mount component mounting machine includes an imaging unit including a CCD camera, a light input unit including a telecentric lens, an illumination unit including a light emitting diode, and a light irradiation unit including a plurality of laser beams.
【００１０】また、供給部の電子部品を、複数個を有す
る装着ヘッドの保持部材によって保持し、該電子部品を
前記供給部から装着部への搬送中に、検出手段によっ
て、前記保持部材により保持された前記電子部品の下方
を移動しながら、一直線状に配設された一側部最外側の
前記装着ヘッドから他側部最外側の前記装着ヘッドに対
して、これら装着ヘッドの並設方向と平行した一連の連
続動作により前記電子部品の保持状態を検出し、その
後、前記装着部におけるプリント基板の所定位置に前記
電子部品を装着する表面実装部品装着機にあって、前記
検出手段は、ＣＣＤカメラからなる撮像手段と、テレセ
ントリックレンズからなる入光手段と、発光ダイオード
からなる照明手段と、複数本のレーザビームからなる光
線照射手段とを備える表面実装部品装着機の構成にあ
る。Further, the electronic component of the supply unit is held by a holding member of a mounting head having a plurality, and the electronic component is held by the holding member by the detecting means while the electronic component is being transported from the supply unit to the mounting unit. While moving below the electronic component, the mounting head on the outermost side on one side is arranged in a straight line with respect to the mounting head on the outermost side on the other side. In a surface mount component mounting machine that detects the holding state of the electronic component by a series of parallel continuous operations, and then mounts the electronic component at a predetermined position on a printed circuit board in the mounting portion, the detection unit includes a CCD. An image pickup unit including a camera, a light input unit including a telecentric lens, an illumination unit including a light emitting diode, and a light irradiation unit including a plurality of laser beams are provided. In the configuration of the surface mount component placement machines.
【００１１】更に、検出手段における光線照射手段は、
電子部品に対してその電極部に直線スリット光を四方向
から照射するように構成される。[0011] Further, the light beam irradiation means in the detection means may include:
The electronic component is configured to irradiate its electrode portion with linear slit light from four directions.
【００１２】そして、装着ヘッドの保持部材によって保
持した電子部品を、検出手段により検出する電子部品検
出方法にあって、前記電子部品の下面へ、光線照射手段
により四方向から直線スリット光を照射し、電子部品に
照射されたこの光の位置を、テレセントリックレンズか
らなる入光手段を介して、ＣＣＤカメラからなる撮像手
段により撮像して電子部品を検出する表面実装部品装着
機における電子部品検出方法にある。In the electronic component detection method for detecting an electronic component held by a holding member of a mounting head by a detection means, a lower surface of the electronic component is irradiated with linear slit light from four directions by a light beam irradiation means. The position of the light radiated to the electronic component is imaged by an imaging means such as a CCD camera through a light-entering means including a telecentric lens to detect an electronic component. is there.
【００１３】また、複数個からなる装着ヘッドの保持部
材によって保持した電子部品を、該電子部品の下側を移
動する検出手段により一連の連続動作により検出する電
子部品検出方法にあって、前記電子部品の下面へ、光線
照射手段により四方向から直線スリット光を照射し、電
子部品に照射されたこの光の位置を、テレセントリック
レンズからなる入光手段を介して、ＣＣＤカメラからな
る撮像手段により撮像して電子部品を検出する表面実装
部品装着機における電子部品検出方法にある。[0013] The electronic component detection method includes detecting electronic components held by a plurality of holding members of a mounting head by a series of continuous operations by detecting means moving below the electronic components. The lower surface of the component is irradiated with linear slit light from four directions by light beam irradiation means, and the position of this light irradiated on the electronic component is imaged by an imaging means comprising a CCD camera via a light entering means comprising a telecentric lens. And an electronic component detection method in a surface mount component mounting machine for detecting an electronic component.
【００１４】そして、あらかじめ試験板を用いて、この
試験板の下面へ、光線照射手段により四方向から直線ス
リット光を照射し、該試験板に照射されたこの光の位置
を、テレセントリックレンズからなる入光手段を介し
て、ＣＣＤカメラからなる撮像手段によりＺ軸方向に対
して前記試験板を上下させて複数回撮像して、前記Ｚ軸
方向へ上下させたときの各Ｚ軸座標の四本のレーザビー
ム直線スリット光の線分位置と、その線分位置から計算
した前記各Ｚ軸座標の二次元的な傾き量と、四本のレー
ザビーム直線スリット光が前記試験板を照射したときに
写る格子寸法と、各Ｚ軸座標の四本のレーザビーム直線
スリット光の線分位置を計測して、これら検出値をそれ
ぞれ制御手段へ記憶させる第一の工程と、前記電子部品
の下面へ、光線照射手段により四方向から直線スリット
光を照射し、電子部品に照射されたこの光の位置を、テ
レセントリックレンズからなる入光手段を介して、ＣＣ
Ｄカメラからなる撮像手段により撮像し、電子部品を検
出して検出値を得る第二の工程と、前記第一および第二
の工程で得た検出値を比較演算して、電子部品の状態を
検査する第三の工程とを備えさせる表面実装部品装着機
における電子部品検出方法にある。Then, using a test plate in advance, the lower surface of the test plate is irradiated with linear slit light from four directions by light beam irradiation means, and the position of the light irradiated on the test plate is determined by a telecentric lens. The test plate is moved up and down with respect to the Z-axis direction by the imaging means including a CCD camera through the light incident means, and images are taken a plurality of times, and four Z-axis coordinates are obtained when the test plate is moved up and down in the Z-axis direction. The line segment position of the laser beam linear slit light, the two-dimensional tilt amount of each of the Z-axis coordinates calculated from the line segment position, and the four laser beam linear slit lights irradiating the test plate The first step of measuring the grid dimensions to be imaged and the line segment positions of the four laser beam linear slit lights of each Z-axis coordinate, and storing these detected values in the control means, respectively, Light irradiation Irradiating a linear slit light from four directions by the step, the position of the light irradiated to the electronic component, through the light entrance means comprising a telecentric lens, CC
The second step of capturing an image by an imaging unit including a D camera and detecting an electronic component to obtain a detection value, and comparing and calculating the detection values obtained in the first and second steps to determine the state of the electronic component And a third step of inspecting the electronic component.
【００１５】[0015]
【実施例】次に、本発明に関する表面実装部品装着機お
よび表面実装部品装着機における電子部品検出方法の実
施の一例を図面に基づいて説明する。図１においてＡは
表面実装部品装着機で、その機体１の適所に電子部品ｂ
の供給部ｍが、また、機体１内において搬送手段２によ
りプリント基板ｃが搬入出される装着部ｎが設けられて
いる。本発明実施例において用いられる電子部品ｂは、
例えば、方形状等に形成された四辺（二辺の場合もあ
る）に多数本の電極（リード）ｂ１が突設された、いわ
ゆるＱＦＰ（Quad Flat Package ）等が有効であり、こ
の電子部品ｂの検出にあって、電極ｂ１の浮き計測（コ
プラナリティ計測）が容易に行われる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a surface mount component mounting machine and an electronic component detection method in the surface mount component mounter according to the present invention will be described with reference to the drawings. In FIG. 1, A is a surface mount component mounting machine.
And a mounting section n in which the printed circuit board c is loaded / unloaded by the transport means 2 in the machine body 1 is provided. The electronic component b used in the embodiment of the present invention includes:
For example, a so-called QFP (Quad Flat Package) in which a large number of electrodes (leads) b1 are projected on four sides (in some cases, two sides) formed in a square shape or the like is effective. , The measurement of the floating of the electrode b1 (coplanarity measurement) is easily performed.
【００１６】そして、機体１には、前後方向（Ｘ軸方
向）と左右方向（平面上において前記Ｘ軸方向と直交す
るＹ軸方向）および縦軸方向（Ｚ軸方向）、更に、この
縦軸方向（Ｚ軸方向）を中心として、所定角度を旋回す
る装着ヘッド３が設けられていて、それぞれの方向に対
して、数値制御可能なサーボモータ等からなる進退手段
４，移動手段５，昇降手段６および回転手段７により高
精度で作動されるものであって、これら各手段４，５，
６，７は制御手段８により適宜制御される。The body 1 has a longitudinal direction (X-axis direction), a left-right direction (Y-axis direction orthogonal to the X-axis direction on a plane), and a vertical axis direction (Z-axis direction). A mounting head 3 is provided which rotates at a predetermined angle about a direction (Z-axis direction). The moving means 5 comprises a servomotor or the like which can be numerically controlled in each direction. 6 and the rotating means 7, which are operated with high precision.
6 and 7 are appropriately controlled by the control means 8.
【００１７】なお、この装着ヘッド３は、移動手段５に
よって移動される可動体９へ取り付けられていて、４ヘ
ッドあるいは６ヘッド等の複数個からなる多ヘッドに構
成されているものであって、それぞれの装着ヘッド３の
下端部には、電子部品ｂの上面を吸着する吸着ノズル等
の保持部材１０が取り付けられる。The mounting head 3 is attached to a movable body 9 which is moved by the moving means 5, and is constituted by a plurality of heads such as four heads or six heads. A holding member 10 such as a suction nozzle for sucking the upper surface of the electronic component b is attached to the lower end of each mounting head 3.
【００１８】そして、電子部品ｂがプリント基板ｃへ装
着される前には、表面実装部品装着機Ａ内において、装
着ヘッド３の保持部材１０に吸着保持された電子部品ｂ
の保持姿勢や、電子部品ｂにおける電極ｂ１の不良等の
電子部品情報が検査される。Before the electronic component b is mounted on the printed circuit board c, the electronic component b sucked and held by the holding member 10 of the mounting head 3 in the surface mount component mounting machine A.
The electronic component information such as the holding posture of the electronic component b and the defect of the electrode b1 in the electronic component b is inspected.
【００１９】この検査にあっては、ＣＣＤカメラからな
る撮像手段１１と、テレセントリックレンズからなる入
光手段１２と、発光ダイオードからなる照明手段１３
と、複数本のレーザビームからなる光線照射手段１４と
からなる検出手段１５が用いられるものであって、撮像
手段１１による画像認識により前記した電子部品情報が
得られ、制御手段８へ送信される。In this inspection, an image pickup means 11 comprising a CCD camera, a light input means 12 comprising a telecentric lens, and an illumination means 13 comprising a light emitting diode
And a detection means 15 comprising a plurality of light beam irradiation means 14 comprising a plurality of laser beams. The electronic component information is obtained by image recognition by the imaging means 11 and transmitted to the control means 8. .
【００２０】また、この電子部品情報の収集は、電子部
品ｂが停止状態若しくは移動状態、撮像手段１１が停止
状態若しくは移動状態において、照明手段１３により照
明して、該電子部品ｂを撮像するもので、本実施例にあ
っては、可動体９へ取付体１６を介してこの検出手段１
５が取り付けられている。The electronic component information is collected by illuminating the electronic component b by illuminating the electronic component b when the electronic component b is in a stopped state or a moving state and the imaging unit 11 is in a stopped state or a moving state. In this embodiment, the detecting means 1 is attached to the movable body 9 via the mounting body 16.
5 is attached.
【００２１】更に、この検出手段１５は、数値制御可能
なサーボモータ等により制御される往復手段１７により
該装着ヘッド３の下方を、すなわち、電子部品ｂの下面
側を左右方向（図１において示すＹ軸方向）へ略水平に
進退運動するように取り付けられる。該検出手段１５
は、機体１における適所に固定状態あるいは可動状態で
設けてもよい。Further, the detecting means 15 is controlled by a reciprocating means 17 controlled by a numerically controllable servomotor or the like to move the lower part of the mounting head 3, that is, the lower surface side of the electronic component b in the left-right direction (shown in FIG. 1). (Y-axis direction). The detecting means 15
May be provided in a fixed state or a movable state at an appropriate position in the body 1.
【００２２】なお、この検出手段１５においては、照明
手段１３および光線照射手段１４の発光位置と発光時間
とを規制する位置検出部材１８が設けられているもので
あって、光電管や近接スイッチを用いて、あるいは前記
往復手段１７に連係させてその数値制御によりコントロ
ールするもので、可動体９に対して、各複数個の装着ヘ
ッド３に対応させて、照明手段１３および光線照射手段
１４の射光開始と射光停止とを規制する検出子１９を取
り付け、これら検出子１９に対応する検出体２０を取付
体１６に設けてある。The detecting means 15 is provided with a position detecting member 18 for regulating the light emitting position and the light emitting time of the illuminating means 13 and the light irradiating means 14, and uses a photoelectric tube or a proximity switch. Or by linking with the reciprocating means 17 and controlling by numerical control. The movable body 9 is caused to correspond to each of the plurality of mounting heads 3 and to start emitting light of the illuminating means 13 and the light emitting means 14. Detectors 19 for restricting the stop of light emission are mounted, and a detector 20 corresponding to these detectors 19 is provided on the mounting body 16.
【００２３】前記したテレセントリックレンズからなる
入光手段１２は、電子部品ｂの画像を撮像手段１１へ集
束して送り込むもので、撮像する電子部品ｂの位置が変
化しても、基本的に像が変化しないテレセントリックレ
ンズの特性を利用するものである。The light input means 12 composed of the telecentric lens described above focuses and sends the image of the electronic component b to the image pickup means 11, and basically, even if the position of the electronic component b to be picked up changes, the image is basically formed. This utilizes the characteristics of a telecentric lens that does not change.
【００２４】前記した発光ダイオードからなる照明手段
１３は、撮像手段１１による電子部品ｂの画像の読み取
りに際して、画像認識し得る光量を与えるもので、青
色、赤色、緑色等の多数個の発光ダイオードを用いて、
前記位置検出部材１８の信号に基づいて作動される。な
お、この発光ダイオードの前側には、発光の拡散板２１
を付設することもある。The above-mentioned illuminating means 13 comprising light-emitting diodes gives an amount of light for recognizing an image when the image of the electronic component b is read by the image pickup means 11, and a large number of light-emitting diodes of blue, red, green, etc. make use of,
The operation is performed based on a signal from the position detecting member 18. In addition, a light-emitting diffusion plate 21 is provided in front of the light-emitting diode.
May be added.
【００２５】前記した複数本のレーザビームからなる光
線照射手段１４は、方形状の電子部品ｂに対してその四
辺に対応するように四方向から照射される四本の直線ス
リット光を照射するように構成され、該スリット光が電
子部品ｂの電極ｂ１に照射されることでその光が電極ｂ
１のみを照らす。これら四本の直線スリット光は、電子
部品ｂの電極ｂ１高さを光切断法を用いて計測するため
に、撮像手段１１の撮像略中心部において互いに交差す
る傾斜状態、例えば、内方へ向かって４５°に傾くよう
に照射される。これにより、検出手段１５の高さをコン
パクトに製作することができる。The light beam irradiating means 14 composed of a plurality of laser beams emits four linear slit light beams radiated from four directions to the rectangular electronic component b so as to correspond to the four sides. When the slit light is applied to the electrode b1 of the electronic component b, the light is applied to the electrode b.
Illuminate only one. In order to measure the height of the electrode b1 of the electronic component b using the light cutting method, these four straight slit lights are inclined in a mutually intersecting manner at the substantially central portion of the imaging unit 11 for imaging, for example, inward. Irradiation at an angle of 45 °. Thereby, the height of the detecting means 15 can be made compact.
【００２６】次に、本発明実施例の表面実装部品装着機
Ａおよび表面実装部品装着機における電子部品検出方法
を説明する。この表面実装部品装着機Ａにおいて、電子
部品ｂがプリント基板ｃ上に装着される前に、あらかじ
め、装着ヘッド１０の保持部材３に吸着保持された電子
部品ｂは、その保持姿勢や、電子部品ｂにおける電極ｂ
１の不良等の電子部品情報が検査される。Next, a description will be given of a surface mount component mounting machine A and an electronic component detection method in the surface mount component mounter of the embodiment of the present invention. In the surface mount component mounting machine A, before the electronic component b is mounted on the printed circuit board c, the electronic component b that has been sucked and held by the holding member 3 of the mounting head 10 in advance has its holding posture and electronic component. electrode b at b
Electronic component information such as the defect 1 is inspected.
【００２７】まず、この検査を行う事前の準備工程（第
一の工程）として、検出手段１５に対する撮像特性のサ
ンプルを得る。すなわち、光線照射手段１４によって照
射される四本のレーザビーム直線スリット光３０は、そ
の交差する中心位置ｓと撮像手段１１の中心位置ｒと
は、図３（ａ）に示すように、Ｘ軸方向およびＹ軸方向
にずれて一致しない現象が起こることが多い。更に、こ
のレーザビーム直線スリット光３０があたる電子部品ｂ
をＺ軸方向へ上下すると、前記したＸ，Ｙ軸方向のずれ
量が変化することがある。また、四本のレーザビーム直
線スリット光３０の二次元的な傾き（θ軸方向の傾き）
と撮像手段１１の傾きには、θ角の角度のずれを生じ、
更に、このレーザビーム直線スリット光３０があたる電
子部品ｂをＺ軸方向へ上下すると、前記したθ角の角度
のずれ量が変化することがある。これらは、光線照射手
段１４や撮像手段１１を取り付けた際の取付誤差や、電
子部品ｂをＺ軸方向へ上下させたときの移動誤差に起因
する。First, as a preparatory step (first step) for performing this inspection, a sample of the imaging characteristics for the detecting means 15 is obtained. That is, as shown in FIG. 3A, the four laser beam linear slit lights 30 radiated by the light beam irradiating means 14 have a center position s at which they intersect and a center position r of the imaging means 11, as shown in FIG. In many cases, a phenomenon in which the directions and the Y-axis direction do not coincide with each other occurs. Further, the electronic component b to which the laser beam linear slit light 30 falls
Is shifted in the Z-axis direction, the shift amount in the X- and Y-axis directions may change. Also, the two-dimensional inclination of the four laser beam linear slit lights 30 (the inclination in the θ-axis direction)
And the inclination of the imaging means 11 causes a deviation of an angle of θ angle,
Further, when the electronic component b to which the laser beam linear slit light 30 is applied is moved up and down in the Z-axis direction, the above-mentioned angle deviation of the θ angle may change. These are caused by a mounting error when the light beam irradiating unit 14 and the imaging unit 11 are mounted, and a moving error when the electronic component b is moved up and down in the Z-axis direction.
【００２８】そのため、前記した誤差を修正するため
に、あらかじめ、図３（ａ），（ｂ）および（ｃ），
（ｄ）に示すように、試験板（キャリブレーションプレ
ート）３１を用いて、これをＺ軸方向へ上下させたとき
の各Ｚ軸座標における四本のレーザビーム直線スリット
光３０の交差する中心位置ｓと、前記各Ｚ軸座標の二次
元的な傾き量と、四本のレーザビーム直線スリット光３
０が試験板３１を照射したときに写る格子寸法Ｌ１，Ｌ
２と、各Ｚ軸座標における四本のレーザビーム直線スリ
ット光３０の線分位置Ｔ１，Ｔ２，Ｔ３，Ｔ４を計測し
ておく。これら得られたデータは制御手段８に送信され
記憶される。なお、格子寸法Ｌ１，Ｌ２とは、四本のレ
ーザビーム直線スリット光３０が作る格子の縦横の寸法
である。線分位置Ｔ１，Ｔ２，Ｔ３，Ｔ４における線分
とは、直線の二点で限られた部分である。For this reason, in order to correct the above-mentioned error, FIGS. 3 (a), (b) and (c),
As shown in (d), when the test plate (calibration plate) 31 is moved up and down in the Z-axis direction, the center position where the four laser beam linear slit lights 30 intersect at each Z-axis coordinate. s, the two-dimensional tilt amount of each of the Z-axis coordinates, and four laser beam linear slit lights 3
0 indicates the lattice dimensions L1 and L that are projected when the test plate 31 is irradiated.
2, and the line segment positions T1, T2, T3, and T4 of the four laser beam linear slit lights 30 in each Z-axis coordinate are measured. These obtained data are transmitted to the control means 8 and stored. Note that the grating dimensions L1 and L2 are vertical and horizontal dimensions of the grating formed by the four laser beam linear slit lights 30. The line segment at the line segment positions T1, T2, T3, and T4 is a portion limited by two points of a straight line.
【００２９】この状態で、供給部ｍより受け取って、装
着ヘッド３の保持部材１０に吸着保持された電子部品ｂ
は、取付体９に設けられた検出手段１５により検出（第
二の工程）が行われるもので、まず、この検出手段１５
における撮像手段１１と入光手段１２と照明手段１３と
の操作によって、図４に示すように、電子部品ｂの中心
位置ｂＯと、該電子部品ｂの二次元的な傾きαを求め
る。In this state, the electronic component b received from the supply unit m and sucked and held by the holding member 10 of the mounting head 3
Is a detection (second step) performed by the detection means 15 provided on the mounting body 9.
As shown in FIG. 4, the center position bO of the electronic component b and the two-dimensional inclination α of the electronic component b are obtained by the operation of the imaging unit 11, the light input unit 12, and the illumination unit 13 in.
【００３０】前記した第一の工程において計測して得ら
れたデータに基づいて、すなわち、四本のレーザビーム
直線スリット光３０が試験板３１を照射したときに写る
格子寸法Ｌ１，Ｌ２と、あらかじめ入力されている電子
部品形状データの電極部位置が一致する高さに、図５
（ａ），（ｂ）に示すように、電子部品ｂをＺ軸方向へ
移動させる。On the basis of the data obtained by the measurement in the first step described above, that is, the lattice dimensions L1 and L2 that appear when the four laser beam linear slit lights 30 irradiate the test plate 31, FIG. 5 shows the height at which the electrode part position of the input electronic component shape data matches.
As shown in (a) and (b), the electronic component b is moved in the Z-axis direction.
【００３１】次に、電子部品ｂの中心位置ｂＯおよび該
電子部品ｂの二次元的な傾きαと、あらかじめ、計測し
てある四本のレーザビーム直線スリット光３０の交差す
る中心位置ｓと、前記各Ｚ軸座標の二次元的な傾き量と
を考慮して、これに対応するように、図５（ｃ），
（ｄ）に示すように、四本のレーザビーム直線スリット
光３０が電極ｂ１を照射する位置に電子部品ｂを、Ｘ
軸，Ｙ軸方向およびθ各方向へ移動させる。Next, the center position bO of the electronic component b, the two-dimensional inclination α of the electronic component b, the center position s at which the four laser beam linear slit lights 30 previously measured intersect, and In consideration of the two-dimensional inclination amount of each Z-axis coordinate, FIG.
As shown in (d), the electronic component b is placed at a position where the four laser beam linear slit lights 30 irradiate the electrode b1 with X
Move in the axis, Y-axis, and θ directions.
【００３２】この状態において、電子部品ｂの四辺の各
電極ｂ１に照射されたレーザビーム直線スリット光３０
を撮像手段１１と入光手段１２により撮像する。この撮
像高さは、電子部品ｂの中心位置ｂＯおよび該電子部品
ｂの二次元的な傾きαを求めたときの撮像高さと異なる
が、入光手段１２を使用することにより撮像手段１１か
ら電子部品ｂまでのワーキングディスタンスが変化して
も、撮像手段１１に写る像の大きさは変わらない。In this state, the laser beam linear slit light 30 applied to each electrode b1 on the four sides of the electronic component b
Is imaged by the imaging means 11 and the light input means 12. This imaging height is different from the imaging height when the center position bO of the electronic component b and the two-dimensional inclination α of the electronic component b are obtained. Even if the working distance up to the component b changes, the size of the image shown on the imaging means 11 does not change.
【００３３】この撮像結果に対して、あらかじめ制御手
段８へ記憶させてある四本のレーザビーム直線スリット
光３０の線分位置Ｔ１，Ｔ２，Ｔ３，Ｔ４と、電子部品
ｂの四辺の各電極ｂ１に照射されたレーザビーム直線ス
リット光３０の位置のずれ量を計測し、この演算によ
り、四本のレーザビーム直線スリット光３０の傾斜から
電極ｂ１の高さデータを計算する。In response to the imaging results, the line segment positions T1, T2, T3, and T4 of the four laser beam linear slit lights 30 stored in the control means 8 in advance and the electrodes b1 on the four sides of the electronic component b The amount of deviation of the position of the laser beam linear slit light 30 applied to the laser beam is measured, and by this calculation, the height data of the electrode b1 is calculated from the inclinations of the four laser beam linear slit lights 30.
【００３４】例えば、あらかじめ制御手段８へ記憶させ
てある四本のレーザビーム直線スリット光３０の線分位
置Ｔ１，Ｔ２，Ｔ３，Ｔ４と、電子部品ｂの四辺の各電
極ｂ１に照射されたレーザビーム直線スリット光３０の
位置のずれ量が、図６に示すように、内側方向に０．０
５ｍｍであり、レーザビーム直線スリット光３０の傾斜
が４５°（図５（ｄ）参照）の場合は、電極ｂ１の高さ
を−０．０５ｍｍと算出する。For example, the line segment positions T1, T2, T3, and T4 of the four laser beam linear slit lights 30 stored in the control means 8 in advance, and the laser beams applied to the four electrodes b1 on the four sides of the electronic component b As shown in FIG. 6, the deviation amount of the position of the beam straight slit light 30 is 0.0
If it is 5 mm and the inclination of the laser beam linear slit light 30 is 45 ° (see FIG. 5D), the height of the electrode b1 is calculated as −0.05 mm.
【００３５】この値は、制御手段８において、あらかじ
め定められた装着許容範囲の電子部品データと比較演算
し、この許容範囲内であれば、この保持部材１０に吸着
保持された電子部品ｂのプリント基板ｃへの装着が行わ
れ、前記した許容範囲外であれば、装着不可と判断さ
れ、機体１の適所に設けられた回収部などへ返却され、
プリント基板ｃには装着されない。（第三の工程）This value is compared with the electronic component data in a predetermined allowable mounting range by the control means 8, and if it is within this allowable range, the electronic component b sucked and held by the holding member 10 is printed. The mounting to the board c is performed, and if it is out of the allowable range described above, it is determined that the mounting is not possible, and it is returned to a collection unit or the like provided at an appropriate position of the body 1,
It is not mounted on the printed circuit board c. (Third step)
【００３６】このように本願実施例によれば、光線照射
手段１４により互いに交差する傾斜をもって電子部品ｂ
の下面へ四本の直線スリット光３０を照射し、電子部品
ｂに照射されたこの光の位置を、テレセントリックレン
ズからなる入光手段１２を介して、ＣＣＤカメラからな
る撮像手段１１により撮像して電子部品ｂの画像を検出
することにより、ＱＦＰのように四辺に電極ｂ１があ
り、四辺の各電極ｂ１位置が電子部品ｂの中心位置ｂＯ
から等距離の電子部品ｂであれば、電子部品ｂのサイズ
や厚みが違っていても、撮像手段１１の取付状態を変更
することなく、また、電子部品ｂの位置を動かすことな
く、一回の撮像で電極高さを四辺同時に計測して、電子
部品ｂにおける電極ｂ１の浮き計測を簡単かつ確実に行
うことができる。As described above, according to the embodiment of the present invention, the electronic component b
Is irradiated with four linear slit lights 30 on the lower surface of the electronic component b, and the position of the light irradiated on the electronic component b is imaged by the imaging means 11 composed of a CCD camera via the light entrance means 12 composed of a telecentric lens. By detecting the image of the electronic component b, there are electrodes b1 on four sides as in the QFP, and the positions of the electrodes b1 on the four sides are the center position bO of the electronic component b.
If the electronic component b is equidistant from the electronic component b, even if the size and thickness of the electronic component b are different, one time without changing the mounting state of the imaging unit 11 and without moving the position of the electronic component b. By measuring the height of the electrodes at the same time on the four sides of the image, the floating measurement of the electrode b1 on the electronic component b can be easily and reliably measured.
【００３７】更に、二辺に電極ｂ１があり、二辺の各電
極ｂ１位置が電子部品ｂの中心位置ｂＯから等距離の電
子部品（ＳＯＰ）であれば、電子部品のサイズや厚みが
違っていても、撮像手段１１の取付状態を変更すること
なく、また、電子部品ｂの位置を動かすことなく、一回
の撮像で電極高さを二辺同時に計測して、電子部品ｂに
おける電極ｂ１の浮き計測を簡単かつ確実に行うことが
できる。Further, if there are electrodes b1 on two sides and the positions of the electrodes b1 on the two sides are electronic components (SOP) equidistant from the center position bO of the electronic component b, the size and thickness of the electronic components are different. However, without changing the mounting state of the imaging unit 11 and without moving the position of the electronic component b, the electrode height is measured at the same time on both sides in one image pickup operation, and the electrode b1 of the electronic component b is measured. Floating measurement can be performed easily and reliably.
【００３８】なお、図７に示すように、四辺に電極ｂ１
があり、四辺の各電極ｂ１位置が電子部品ｂの中心位置
ｂＯから等距離でない電子部品ｂの場合は、すなわち、
同図において電子部品ｂの縦横長さが、ｈ≠ｇの場合
は、電子部品ｂの位置を動かすことなく、一回の撮像で
電極高さを四辺同時に計測することはできないが、電子
部品位置をＺ軸方向へ移動して二回の撮像で電極高さを
計測して、電子部品ｂにおける電極ｂ１の浮き計測を簡
単かつ確実に行うことができる。Note that, as shown in FIG.
In the case of the electronic component b in which the positions of the four electrodes b1 are not equidistant from the center position bO of the electronic component b,
In the figure, when the vertical and horizontal lengths of the electronic component b are h ≠ g, it is not possible to measure the electrode height on all four sides simultaneously by one imaging without moving the position of the electronic component b. Is moved in the Z-axis direction, the height of the electrode is measured by two imagings, and the floating measurement of the electrode b1 on the electronic component b can be easily and reliably performed.
【００３９】このとき、電子部品位置をＺ軸方向へ移動
することで、機械的な作動誤差（ロストモーション）な
どによる位置ずれを生ずることがあるが、あらかじめ試
験板（キャリブレーションプレート）３１を用いて、該
試験板３１をＺ軸方向へ上下させたときの各Ｚ軸座標の
四本のレーザビーム直線スリット光３０の交差する中心
位置ｓと、前記各Ｚ軸座標の二次元的な傾き量と、四本
のレーザビーム直線スリット光３０が試験板３１を照射
したときに写る格子寸法Ｌ１，Ｌ２と、各Ｚ軸座標の四
本のレーザビーム直線スリット光３０の線分位置Ｔ１，
Ｔ２，Ｔ３，Ｔ４を計測して、制御手段８へ記憶させて
あるため、電極高さの計測や電極ｂ１の浮き計測に影響
を与えることがない。At this time, when the position of the electronic component is moved in the Z-axis direction, a position shift due to a mechanical operation error (lost motion) or the like may occur, but a test plate (calibration plate) 31 is used in advance. Then, when the test plate 31 is moved up and down in the Z-axis direction, the center position s where the four laser beam linear slit lights 30 of each Z-axis coordinate intersect, and the two-dimensional inclination amount of each of the Z-axis coordinates And the lattice dimensions L1 and L2 that appear when the four laser beam linear slit lights 30 irradiate the test plate 31 and the line segment positions T1 and T1 of the four laser beam linear slit lights 30 at each Z-axis coordinate.
Since T2, T3, and T4 are measured and stored in the control means 8, there is no influence on the measurement of the electrode height or the measurement of the floating of the electrode b1.
【００４０】また、本願発明の実施例によれば、図８に
示すような、リード状の電極を有しない、バンプ形状の
電極ｂ１を有する電子部品ｂの、該電極ｂ１の高さを計
測して、コプラナリティ計測を行うことができる。この
場合、電極ｂ１への照明を行う照明手段１３は、同図に
示すように、バンプ形状の電極ｂ１を照明するため、横
方向に照射するように配置したものを使用するものであ
る。このため、電子部品ｂの中央部に近い位置にある電
極ｂ１の高さを計測するために、電子部品位置が下がっ
ても、照明手段１３と干渉することがない。Further, according to the embodiment of the present invention, as shown in FIG. 8, the height of the electronic component b having the bump-shaped electrode b1 without the lead-shaped electrode is measured. Thus, coplanarity measurement can be performed. In this case, as shown in the drawing, the illuminating means 13 for illuminating the electrode b1 uses one arranged so as to irradiate the bump-shaped electrode b1 in the horizontal direction. Therefore, since the height of the electrode b1 located near the center of the electronic component b is measured, even if the position of the electronic component is lowered, it does not interfere with the illumination means 13.
【００４１】[0041]
【発明の効果】前述したように本発明は、周辺に電極が
ある電子部品の検出において、電子部品のサイズや厚み
が違っていても、撮像手段の取付状態を変更することな
く、また、電子部品の位置を動かすことなく、一回の撮
像で電極高さを各辺同時に計測することができる格別な
効果を奏するものである。As described above, according to the present invention, in detecting an electronic component having an electrode in the periphery, even if the size and thickness of the electronic component are different, the electronic component can be mounted without changing the mounting state of the imaging means. This provides a special effect that the height of the electrode can be measured simultaneously on each side by a single imaging without moving the position of the component.
【図１】本発明に関する表面実装部品装着機の概略を示
す平面図である。FIG. 1 is a plan view schematically showing a surface mount component mounting machine according to the present invention.
【図２】図１における表面実装部品装着機の装着ヘッド
部の概略を示す側面図である。FIG. 2 is a side view schematically showing a mounting head of the surface mount component mounting machine in FIG. 1;
【図３】本発明に関する表面実装部品装着機における電
子部品検出方法において、第一の工程を示す説明図であ
る。FIG. 3 is an explanatory view showing a first step in the electronic component detection method in the surface mount component mounting machine according to the present invention.
【図４】図３における第二の工程において、電子部品の
中心位置と傾きを計測する状態を示す説明図である。FIG. 4 is an explanatory diagram showing a state of measuring a center position and an inclination of an electronic component in a second step in FIG.
【図５】図４における電子部品の中心位置と傾きを修正
する状態を示す説明図である。FIG. 5 is an explanatory diagram showing a state in which the center position and the inclination of the electronic component in FIG. 4 are corrected.
【図６】図４における第二の工程において、電子部品の
電極高さを計測する状態を示す説明図である。FIG. 6 is an explanatory diagram showing a state in which the electrode height of the electronic component is measured in the second step in FIG.
【図７】図３における方法において使用する他の例の電
子部品を示す平面図である。FIG. 7 is a plan view showing another example of the electronic component used in the method in FIG. 3;
【図８】図３における方法において使用する他の例の電
子部品の検出状態を示す説明図である。FIG. 8 is an explanatory diagram showing a detection state of another example of an electronic component used in the method in FIG. 3;
Ａ 表面実装部品装着機 ｂ 電子部品 ｃ プリント基板 １ 機体 １０ 保持部材 １１ 撮像手段 １２ 入光手段 １３ 照明手段 １４ 光線照射手段 １５ 検出手段 ３０ 直線スリット光 Reference Signs List A surface mount component mounting machine b electronic component c printed circuit board 1 body 10 holding member 11 imaging means 12 light input means 13 illumination means 14 light beam irradiation means 15 detection means 30 linear slit light
Claims (6)
材によって保持し、該電子部品を前記供給部から装着部
への搬送中に、前記保持部材によって保持された前記電
子部品を検出手段により検出した後、前記装着部におけ
るプリント基板の所定位置に前記電子部品を装着する表
面実装部品装着機にあって、 前記検出手段は、ＣＣＤカメラからなる撮像手段と、テ
レセントリックレンズからなる入光手段と、発光ダイオ
ードからなる照明手段と、複数本のレーザビームからな
る光線照射手段とを備えることを特徴とする表面実装部
品装着機。An electronic component of a supply unit is held by a holding member of a mounting head, and while the electronic component is being conveyed from the supply unit to the mounting unit, the electronic component held by the holding member is detected by a detecting unit. After the detection, in the surface mount component mounting machine for mounting the electronic component at a predetermined position of the printed circuit board in the mounting portion, the detection means, imaging means comprising a CCD camera, and light input means comprising a telecentric lens A surface mounting component mounting machine, comprising: an illuminating unit including a light emitting diode; and a light beam irradiating unit including a plurality of laser beams.
着ヘッドの保持部材によって保持し、該電子部品を前記
供給部から装着部への搬送中に、検出手段によって、前
記保持部材により保持された前記電子部品の下方を移動
しながら、一直線状に配設された一側部最外側の前記装
着ヘッドから他側部最外側の前記装着ヘッドに対して、
これら装着ヘッドの並設方向と平行した一連の連続動作
により前記電子部品の保持状態を検出し、その後、前記
装着部におけるプリント基板の所定位置に前記電子部品
を装着する表面実装部品装着機にあって、 前記検出手段は、ＣＣＤカメラからなる撮像手段と、テ
レセントリックレンズからなる入光手段と、発光ダイオ
ードからなる照明手段と、複数本のレーザビームからな
る光線照射手段とを備えることを特徴とする表面実装部
品装着機。2. An electronic component of a supply unit is held by a holding member of a mounting head having a plurality of units, and while the electronic component is being transported from the supply unit to the mounting unit, the electronic component is held by the holding member by detection means. While moving below the electronic component that has been, from the outermost mounting head on one side disposed in a straight line to the mounting head on the other outermost side,
The holding state of the electronic component is detected by a series of continuous operations parallel to the direction in which the mounting heads are arranged, and thereafter, a surface mount component mounting machine that mounts the electronic component at a predetermined position on the printed circuit board in the mounting section is used. Wherein the detection means includes an imaging means including a CCD camera, a light input means including a telecentric lens, an illumination means including a light emitting diode, and a light irradiation means including a plurality of laser beams. Surface mount component mounting machine.
部品に対してその電極部に直線スリット光を四方向から
照射するように構成されたことを特徴とする請求項１ま
たは２記載の表面実装部品装着機。3. The surface mount according to claim 1, wherein the light beam irradiating means in the detecting means is configured to irradiate the linear slit light to the electronic part from four directions to the electronic component. Component mounting machine.
電子部品を、検出手段により検出する電子部品検出方法
にあって、 前記電子部品の下面へ、光線照射手段により四方向から
直線スリット光を照射し、電子部品に照射されたこの光
の位置を、テレセントリックレンズからなる入光手段を
介して、ＣＣＤカメラからなる撮像手段により撮像して
電子部品を検出することを特徴とする表面実装部品装着
機における電子部品検出方法。4. An electronic component detection method for detecting an electronic component held by a holding member of a mounting head by a detector, wherein the lower surface of the electronic component is irradiated with linear slit light from four directions by a light beam irradiator. Wherein the position of the light radiated to the electronic component is imaged by an imaging means comprising a CCD camera via a light incident means comprising a telecentric lens, and the electronic component is detected. Electronic component detection method.
よって保持した電子部品を、該電子部品の下側を移動す
る検出手段により一連の連続動作により検出する電子部
品検出方法にあって、 前記電子部品の下面へ、光線照射手段により四方向から
直線スリット光を照射し、電子部品に照射されたこの光
の位置を、テレセントリックレンズからなる入光手段を
介して、ＣＣＤカメラからなる撮像手段により撮像して
電子部品を検出することを特徴とする表面実装部品装着
機における電子部品検出方法。5. An electronic component detection method for detecting an electronic component held by a holding member of a plurality of mounting heads by a series of continuous operations by detecting means moving below the electronic component, The lower surface of the component is irradiated with linear slit light from four directions by light beam irradiation means, and the position of this light irradiated on the electronic component is imaged by an imaging means comprising a CCD camera via a light entering means comprising a telecentric lens. An electronic component detection method for a surface mount component mounting machine, comprising:
の下面へ、光線照射手段により四方向から直線スリット
光を照射し、該試験板に照射されたこの光の位置を、テ
レセントリックレンズからなる入光手段を介して、ＣＣ
Ｄカメラからなる撮像手段によりＺ軸方向に対して前記
試験板を上下させて複数回撮像して、前記Ｚ軸方向へ上
下させたときの各Ｚ軸座標の四本のレーザビーム直線ス
リット光の線分位置と、その線分位置から計算した前記
各Ｚ軸座標の二次元的な傾き量と、四本のレーザビーム
直線スリット光が前記試験板を照射したときに写る格子
寸法と、各Ｚ軸座標の四本のレーザビーム直線スリット
光の線分位置を計測して、これら検出値をそれぞれ制御
手段へ記憶させる第一の工程と、 前記電子部品の下面へ、光線照射手段により四方向から
直線スリット光を照射し、電子部品に照射されたこの光
の位置を、テレセントリックレンズからなる入光手段を
介して、ＣＣＤカメラからなる撮像手段により撮像し、
電子部品を検出して検出値を得る第二の工程と、 前記第一および第二の工程で得た検出値を比較演算し
て、電子部品の状態を検査する第三の工程とを備えさせ
たことを特徴とする請求項４または５記載の表面実装部
品装着機における電子部品検出方法。6. Using a test plate in advance, the lower surface of the test plate is irradiated with linear slit light from four directions by light beam irradiation means, and the position of the light irradiated on the test plate is determined by a telecentric lens. CC through the light incident means
The test plate is moved up and down with respect to the Z-axis direction by an image pickup means composed of a D camera, and images are taken a plurality of times. A line segment position, a two-dimensional tilt amount of each of the Z-axis coordinates calculated from the line segment position, a grid size which is projected when four laser beam linear slit lights irradiate the test plate; A first step of measuring the line segment positions of the four laser beam linear slit lights in the axis coordinates, and storing these detected values in the control means, respectively, on the lower surface of the electronic component, from four directions by light beam irradiation means By irradiating the linear slit light, the position of this light illuminated on the electronic component is imaged by an imaging means such as a CCD camera through a light incident means including a telecentric lens,
A second step of detecting an electronic component to obtain a detection value, and a third step of comparing and calculating the detection values obtained in the first and second steps, and inspecting a state of the electronic component. The electronic component detection method in a surface mount component mounting machine according to claim 4 or 5, wherein
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| JP2000026936A JP4189111B2 (en) | 2000-02-04 | 2000-02-04 | Surface mount component mounting machine and electronic component detection method in surface mount component mounter |
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| JP2000026936A JP4189111B2 (en) | 2000-02-04 | 2000-02-04 | Surface mount component mounting machine and electronic component detection method in surface mount component mounter |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1032761C2 (en) * | 2006-10-27 | 2008-04-29 | Assembleon Bv | Device suitable for placing a component on a substrate. |
| US7428329B2 (en) | 2003-05-28 | 2008-09-23 | Fuji Machine Mfg. Co., Ltd. | Pickup image processing device of electronic part mounting device and pickup image processing method |
| CN110333470A (en) * | 2019-07-18 | 2019-10-15 | 深圳橙子自动化有限公司 | A kind of device attachment calibration method for flying probe |
| DE112019007030T5 (en) | 2019-03-15 | 2021-12-02 | Yamaha Hatsudoki Kabushiki Kaisha | Measuring device and surface mount device |
-
2000
- 2000-02-04 JP JP2000026936A patent/JP4189111B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7428329B2 (en) | 2003-05-28 | 2008-09-23 | Fuji Machine Mfg. Co., Ltd. | Pickup image processing device of electronic part mounting device and pickup image processing method |
| NL1032761C2 (en) * | 2006-10-27 | 2008-04-29 | Assembleon Bv | Device suitable for placing a component on a substrate. |
| EP1916887A1 (en) * | 2006-10-27 | 2008-04-30 | Assembléon B.V. | Device suitable for placing components on a substrate |
| US7570801B2 (en) | 2006-10-27 | 2009-08-04 | Assembleon N.V. | Device suitable for placing components on a substrate |
| KR101361587B1 (en) * | 2006-10-27 | 2014-02-12 | 아셈블레온 엔. 브이. | Device suitable for placing components on a substrate |
| DE112019007030T5 (en) | 2019-03-15 | 2021-12-02 | Yamaha Hatsudoki Kabushiki Kaisha | Measuring device and surface mount device |
| CN110333470A (en) * | 2019-07-18 | 2019-10-15 | 深圳橙子自动化有限公司 | A kind of device attachment calibration method for flying probe |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4189111B2 (en) | 2008-12-03 |
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