JP2001177217A - Manufacturing method of printed-wiring board having thin board thickness - Google Patents
Manufacturing method of printed-wiring board having thin board thicknessInfo
- Publication number
- JP2001177217A JP2001177217A JP35696299A JP35696299A JP2001177217A JP 2001177217 A JP2001177217 A JP 2001177217A JP 35696299 A JP35696299 A JP 35696299A JP 35696299 A JP35696299 A JP 35696299A JP 2001177217 A JP2001177217 A JP 2001177217A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board
- reinforcing plate
- manufacturing
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント配線板の製
造方法に係り、特に薄板厚プリント配線板の製造方法に
関するものである。The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a thin and thick printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板を製造するには一般的に
ドリル、レジスト処理、めっき処理、エッチング処理な
どの各製造過程を経るが、それらどの工程をとっても、
押えたり、吊るしたり、液体中で揺らせたり、液体を吹
き付けたりで材料に大きな機械的負荷がかかる。一般的
なプリント配線板の基材はガラス繊維が入れられていた
り、樹脂自体の厚みもあり極めて頑丈であるため前記機
械的負荷に耐えることができるが、薄板厚の基材やガラ
ス繊維を含まない基材を使用して製造すると前記機械的
負荷により基材が破損してしまうことがある。そこで薄
板厚の基材の場合、従来は作業ボード（複数の製品を面
付けし作業性のよいサイズにした基材）を金属製の補強
枠に取り付けて作業を行なっていた。2. Description of the Related Art Generally, a printed wiring board is manufactured through various manufacturing processes such as a drill, a resist process, a plating process, and an etching process.
A large mechanical load is applied to the material when it is pressed, suspended, shaken in a liquid, or sprayed with a liquid. The base material of a general printed wiring board contains glass fiber, and the resin itself has the thickness and is extremely strong, so it can withstand the mechanical load, but includes a thin-walled base material and glass fiber. If the substrate is manufactured using a non-existent substrate, the substrate may be damaged by the mechanical load. Therefore, in the case of a thin base material, work has conventionally been performed by attaching a work board (a base material having a plurality of products imposed thereon and having a good workability) to a metal reinforcing frame.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、補強枠
を取り付けても作業ボード自体の強度が低いため、取り
扱いが難しく、基材のひび割れや破れを防止することが
できなかった。本発明は、上記課題を解決するためにな
されたもので、板厚が薄く製造上取り扱いが難しいプリ
ント配線板や板厚が薄くガラス繊維を含まないプリント
配線板の製造において作業ボードの強度不足による破損
を防止する製造方法を提供することを目的とする。However, even if a reinforcing frame is attached, the work board itself is low in strength, so that it is difficult to handle, and cracking or tearing of the base material cannot be prevented. The present invention has been made in order to solve the above-described problems, and in the production of a printed wiring board having a small thickness, which is difficult to handle in production and a printed wiring board having a small thickness and no glass fiber, the strength of a work board is insufficient. An object of the present invention is to provide a manufacturing method for preventing breakage.
【０００４】[0004]
【課題を解決するための手段】請求項１の薄板厚プリン
ト配線板の製造方法は、ガラス繊維を含まない薄板厚プ
リント配線板の製造方法において、 ａ）補強板としてガラス繊維入り樹脂基材又は樹脂フィ
ルム基材或いは金属薄板材を使用してプリント配線板製
品外形部分を切り抜き、 ｂ）２枚の樹脂付銅箔の樹脂同志を向かい合わせた間に
前記補強板を挟持し加圧加熱して積層した作業ボードを
作製し、 ｃ）該作業ボードを使用して従来工法のセミアディティ
ブ工法又はサブトラクティブ工法によりプリント配線板
を製造し、 ｄ）外形加工により該作業ボードから製品部分を切り抜
くことで製品内に補強板を残さない、ことを特徴とす
る。According to a first aspect of the present invention, there is provided a method for manufacturing a thin printed wiring board which does not contain glass fiber, comprising the steps of: Cut out the outer part of the printed wiring board product using a resin film base material or a thin metal sheet material. B) Hold the reinforcing plate between two resin-coated copper foils facing each other and pressurize and heat. A laminated work board is manufactured. C) A printed wiring board is manufactured using the work board by a conventional semi-additive method or a subtractive method. D) A product portion is cut out from the work board by external processing. It does not leave a reinforcing plate in the product.
【０００５】請求項１の薄板厚プリント配線板の製造方
法によれば、作業ボードの芯に入れられた補強板のため
にプリント配線板製造の各工程における機械的負荷に耐
え、基材が破損してしまうことがないので、他のプリン
ト配線板製造と同等に扱うことができる。According to the method for manufacturing a thin and thick printed wiring board according to the first aspect, the reinforcing plate inserted into the core of the work board withstands the mechanical load in each step of manufacturing the printed wiring board and damages the base material. Therefore, it can be handled in the same manner as other printed wiring board manufacturing.
【０００６】[0006]
【発明の実施の形態】本発明の実施形態を図１及び図２
に基づいて説明する。図１は本発明の一実施形態である
セミアディティブ工法による製造方法を示す各工程での
断面形状の模式図であり、図２は補強板を芯にした作業
ボードの平面模式図である。図１において、１は樹脂、
２は銅箔、３は補強板、４は無電解銅めっき、５はめっ
きレジスト、６は電解パターン銅めっきを示す。また、
図２において、７は作業ボード、８は基準孔、９は作業
ボードの製品域、１０は作業ボードの補強板域（製品外
形外）を示す。1 and 2 show an embodiment of the present invention.
It will be described based on. FIG. 1 is a schematic diagram of a cross-sectional shape in each step showing a manufacturing method by a semi-additive method according to an embodiment of the present invention, and FIG. 2 is a schematic plan view of a work board having a reinforcing plate as a core. In FIG. 1, 1 is a resin,
2 indicates a copper foil, 3 indicates a reinforcing plate, 4 indicates electroless copper plating, 5 indicates a plating resist, and 6 indicates electrolytic pattern copper plating. Also,
2, reference numeral 7 denotes a work board, 8 denotes a reference hole, 9 denotes a product area of the work board, and 10 denotes a reinforcing plate area (outside the product outer shape) of the work board.
【０００７】図１（ａ）は基材の準備を示し、１と２は
樹脂付銅箔として予め一体化されたものである。３の補
強板材質は、ガラス繊維入りプリプレグ又はフレキシブ
ルプリント用ポリイミドフィルム或いはステンレス等の
金属板でもよく、厚さは５０μｍ程度が適当であり、製
品となる部分を取り除くように予め外形形状を加工した
ものを準備する。図１（ｂ）は前工程で準備した基材を
加熱加圧することで積層を行なったところを示す。図１
（ｃ）は樹脂付銅箔の銅箔２をエッチングにより除去し
た状態を示す。ここで補強板３が無いと樹脂１だけにな
り、ガラス繊維を含まない厚さ１００μｍ程度の弱い材
質なので、強度不足により破損してしまうことが多い。
図１（ｄ）は樹脂１表面に導通のための無電解銅めっき
４を施した状態を示す。図１（ｅ）はパターン形成のた
めに感光性ドライフィルムを貼りつけ、パターンフィル
ムを重ねて露光した後現像し、めっきレジスト５を形成
した状態である。FIG. 1 (a) shows the preparation of a substrate, wherein 1 and 2 are previously integrated as resin-coated copper foil. The reinforcing plate material of 3 may be a prepreg containing glass fiber or a polyimide film for flexible printing or a metal plate such as stainless steel, and the thickness is suitably about 50 μm. Prepare things. FIG. 1B shows a state where the base material prepared in the previous step is laminated by heating and pressing. FIG.
(C) shows a state where the copper foil 2 of the resin-coated copper foil is removed by etching. If the reinforcing plate 3 is not provided, only the resin 1 is used. Since the material is a weak material that does not contain glass fibers and has a thickness of about 100 μm, it often breaks due to insufficient strength.
FIG. 1D shows a state in which electroless copper plating 4 for conduction is applied to the surface of the resin 1. FIG. 1E shows a state in which a photosensitive dry film is stuck for pattern formation, the pattern film is overlaid and exposed, and then developed to form a plating resist 5.
【０００８】図１（ｆ）はパターン銅めっき６を施した
状態、図１（ｇ）はめっきレジスト５を剥離した状態を
示す。図１（ｈ）はパターン以外の無電解銅めっき４を
除去するためにソフトエッチングを行なった状態を示
す。これにより、回路形成が完了したことになる。図１
（ｉ）に示すように、製品外形外を切り離すと、製品外
形外にだけ入れた補強板を含まない薄い樹脂だけの基材
による図１（ｊ）の薄板厚プリント配線板製品が出来上
がる。FIG. 1F shows a state in which the pattern copper plating 6 has been applied, and FIG. 1G shows a state in which the plating resist 5 has been peeled off. FIG. 1H shows a state where soft etching is performed to remove the electroless copper plating 4 other than the pattern. Thereby, the circuit formation is completed. FIG.
As shown in (i), when the outside of the product outer shape is cut off, a thin printed wiring board product of FIG.
【０００９】上記実施例はセミアディティブ工法による
ものであるが、サブトラクティブ工法による場合も同様
に本発明の製造方法を適用することができる。なお、前
記製造方法には貫通スルーホールのための孔明け工程を
省略しているが、実際には図１（ｃ）の後に孔明けを実
施することでスルーホール加工を行なう。さらに普通の
プリント配線板と同様に、本製造方法による薄板厚プリ
ント配線板をコア材としてビルドアッププリント配線板
を製造することも可能であり、その場合には図１（ｈ）
の後にビルドアップ層形成、ビアホール穿孔、銅めっ
き、ビルドアップ層パターン形成等の工程を追加する。
本発明は、ガラス繊維を含まない薄板厚プリント配線板
の製造方法に関するものであるが、ガラス繊維を含むプ
リント配線板に関しても薄くて強度が不足する場合に適
用すれば効果があることは言うまでも無い。Although the above embodiment is based on the semi-additive method, the manufacturing method of the present invention can be similarly applied to the subtractive method. In the above-mentioned manufacturing method, the step of making a through hole is omitted, but in practice, the hole is formed by performing the hole after FIG. 1 (c). Further, similarly to an ordinary printed wiring board, it is also possible to manufacture a build-up printed wiring board by using a thin thick printed wiring board according to the present manufacturing method as a core material. In this case, FIG.
After that, steps such as build-up layer formation, via hole drilling, copper plating, and build-up layer pattern formation are added.
The present invention relates to a method for manufacturing a thin printed wiring board containing no glass fiber, but it goes without saying that it is effective if applied to a printed wiring board containing glass fiber which is thin and has insufficient strength. Not even.
【００１０】[0010]
【発明の効果】本発明によれば、機械的強度が不足する
ガラス繊維を含まない薄板厚プリント配線板を製造する
にあたり、作業ボードが製品外形外全域芯部の補強板に
より保護されるので、普通のプリント配線板を製造する
工程と同じ工程を経てもその機械的負荷に耐えられ、扱
いが容易であるとともにプリント配線板基材が破損する
こともなく高い良品率が得られる。According to the present invention, the work board is protected by the reinforcing plate of the whole area outside the product outer shape in manufacturing a thin and thick printed wiring board which does not contain glass fiber having insufficient mechanical strength. Even if it goes through the same process as that for manufacturing a normal printed wiring board, it can withstand the mechanical load, is easy to handle, and has a high yield rate without damaging the printed wiring board base material.
【図１】本発明の一実施形態であるセミアディティブ工
法による製造方法実施例を示す各工程での断面形状の模
式図である。FIG. 1 is a schematic view of a cross-sectional shape in each step showing an example of a manufacturing method by a semi-additive method according to an embodiment of the present invention.
【図２】本発明の実施形態を示す補強板を芯にした作業
ボード実施例を示す平面模式図である。FIG. 2 is a schematic plan view showing an example of a working board with a reinforcing plate as a core according to the embodiment of the present invention.
１ 樹脂 ２ 銅箔 ３ 補強材 ４ 無電解銅めっき ５ めっきレジスト ６ 電解パターン銅めっき ７ 作業ボード ８ 基準孔 ９ 作業ボードの製品域 １０ 作業ボードの補強板域（製品外形外） REFERENCE SIGNS LIST 1 resin 2 copper foil 3 reinforcing material 4 electroless copper plating 5 plating resist 6 electrolytic pattern copper plating 7 work board 8 reference hole 9 product area of work board 10 reinforcement board area of work board (outside product outline)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 3/22 Ｈ０５Ｋ 3/22 Ｃ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 3/22 H05K 3/22 C
Claims (1)
線板の製造方法において、 ａ）補強板としてガラス繊維入り樹脂基材又は樹脂フィ
ルム基材或いは金属薄板材を使用してプリント配線板製
品外形部分を切り抜き、 ｂ）２枚の樹脂付銅箔の樹脂同志を向かい合わせた間に
前記補強板を挟持し加圧加熱して積層した作業ボードを
作製し、 ｃ）該作業ボードを使用して従来工法のセミアディティ
ブ工法又はサブトラクティブ工法によりプリント配線板
を製造し、 ｄ）外形加工により該作業ボードから製品部分を切り抜
くことで製品内に補強板を残さない、ことを特徴とする
薄板厚プリント配線板の製造方法。1. A method for producing a thin printed wiring board containing no glass fiber, comprising: a) using a resin base material containing glass fiber or a resin film base material or a metal thin plate material as a reinforcing plate; B) a work board laminated by pressing and heating the reinforcing plate between two resin-coated copper foils facing each other, and c) using the work board in a conventional manner. Printed wiring boards are manufactured by the semi-additive method or the subtractive method of construction, and d) by cutting out the product part from the work board by external processing, no reinforcing plate is left in the product. Plate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35696299A JP2001177217A (en) | 1999-12-16 | 1999-12-16 | Manufacturing method of printed-wiring board having thin board thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35696299A JP2001177217A (en) | 1999-12-16 | 1999-12-16 | Manufacturing method of printed-wiring board having thin board thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001177217A true JP2001177217A (en) | 2001-06-29 |
Family
ID=18451663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35696299A Pending JP2001177217A (en) | 1999-12-16 | 1999-12-16 | Manufacturing method of printed-wiring board having thin board thickness |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001177217A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008193065A (en) * | 2007-02-07 | 2008-08-21 | Samsung Electro Mech Co Ltd | Method of manufacturing printed circuit board |
-
1999
- 1999-12-16 JP JP35696299A patent/JP2001177217A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008193065A (en) * | 2007-02-07 | 2008-08-21 | Samsung Electro Mech Co Ltd | Method of manufacturing printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050719 |
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