JP2001118680A - Manufacturing method of organic electroluminescent element with curved surface - Google Patents
Manufacturing method of organic electroluminescent element with curved surfaceInfo
- Publication number
- JP2001118680A JP2001118680A JP29540799A JP29540799A JP2001118680A JP 2001118680 A JP2001118680 A JP 2001118680A JP 29540799 A JP29540799 A JP 29540799A JP 29540799 A JP29540799 A JP 29540799A JP 2001118680 A JP2001118680 A JP 2001118680A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- sealing cap
- transparent substrate
- curved
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007789 sealing Methods 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 230000009466 transformation Effects 0.000 claims abstract description 22
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 238000000748 compression moulding Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 21
- 238000005304 joining Methods 0.000 description 16
- 239000010409 thin film Substances 0.000 description 8
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910001000 nickel titanium Inorganic materials 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910017090 AlO 2 Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000799 K alloy Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- SXKZZFLSYPUIAN-UHFFFAOYSA-N [Cu].[Zn].[Au] Chemical compound [Cu].[Zn].[Au] SXKZZFLSYPUIAN-UHFFFAOYSA-N 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- 229910001515 alkali metal fluoride Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- QBAACSOJSANLBS-UHFFFAOYSA-N copper nickel Chemical compound [Ni][Cu][Ni][Cu] QBAACSOJSANLBS-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 125000006617 triphenylamine group Chemical group 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、有機ＥＬ（エレク
トロルミネセンス）曲面素子の製造方法に関する。The present invention relates to a method for manufacturing an organic EL (electroluminescence) curved surface element.
【０００２】[0002]
【従来の技術】有機ＥＬ素子を使用して曲面ディスプレ
イを製造する場合に、樹脂基板と、樹脂等からなる平板
状の封止板とを使用して素子を形成し、有機ＥＬ積層体
とともに一体に変形させて曲面形状とする方法がある。
しかし、この方法では、特に、素子の中央部において有
機ＥＬ積層体が封止板に接触し、損傷することがある。
また、金属等からなり、有機ＥＬ積層体との接触を防止
するための凹部を有する封止キャップを使用し、これを
基板と接合させた後、一体に変形させて曲面形状を有す
るディスプレイとする方法もある。しかし、この方法で
は、変形に大きな力を要し、且つ一定の安定した曲面と
することも容易ではない。2. Description of the Related Art When manufacturing a curved display using an organic EL element, the element is formed using a resin substrate and a flat sealing plate made of resin or the like, and is integrally formed with the organic EL laminate. To form a curved surface.
However, in this method, the organic EL laminate may come into contact with the sealing plate and be damaged, particularly at the center of the device.
In addition, a sealing cap made of metal or the like and having a concave portion for preventing contact with the organic EL laminate is used, and after joining this to a substrate, it is integrally deformed to obtain a display having a curved surface shape. There are ways. However, in this method, a large force is required for deformation, and it is not easy to form a stable and stable curved surface.
【０００３】更に、封止キャップの周縁等を予め所要の
曲面形状に変形させておき、この封止キャップの曲面
に、有機ＥＬ積層体を備える基板を接合させる方法もあ
る。しかし、この方法では、接合面が曲面であるため、
全面を均等に加圧し、接合させることは容易ではない。
そのため、十分に接合されなかった個所から水分等が侵
入し、輝度の低下等、問題を生ずることがある。このよ
うに、従来のいずれの方法によっても、基板と封止キャ
ップとが均等に、強固に接合され、一定の安定した曲面
が保持される曲面ディスプレイとすることは容易ではな
かった。Further, there is a method in which a peripheral edge of a sealing cap is deformed into a required curved shape in advance, and a substrate having an organic EL laminate is joined to the curved surface of the sealing cap. However, in this method, since the joining surface is a curved surface,
It is not easy to uniformly press and bond the entire surface.
For this reason, moisture and the like may enter from places where the bonding is not sufficiently performed, which may cause a problem such as a decrease in luminance. As described above, it has not been easy to form a curved display in which the substrate and the sealing cap are uniformly and firmly joined by any of the conventional methods, and a constant and stable curved surface is maintained.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の従来
技術の問題点を解決するものであり、透明基板と封止キ
ャップとが十分な強度で密着され、接合されて、接合面
から素子内部への水分等の侵入による輝度の低下等を生
ずることがなく、且つ一定の曲面形状が安定して保持さ
れる有機ＥＬ曲面素子の製造方法を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, in which a transparent substrate and a sealing cap are brought into close contact with sufficient strength and joined together, and the element is removed from the joining surface. An object of the present invention is to provide a method of manufacturing an organic EL curved surface element that does not cause a decrease in luminance or the like due to invasion of moisture or the like into the inside and that a constant curved surface shape is stably maintained.
【０００５】[0005]
【課題を解決するための手段】第１発明の有機ＥＬ曲面
素子の製造方法は、透明基板、該透明基板の表面に形成
された有機ＥＬ積層体、及び該透明基板に接合され、該
有機ＥＬ積層体を封止する封止キャップを備える有機Ｅ
Ｌ曲面素子の製造方法において、形状記憶合金からなる
上記封止キャップの上記透明基板と接合される面が曲面
となるように形状を記憶させ、その後、変態温度以下の
温度において上記曲面が平面となるように成形し、次い
で、上記封止キャップの上記透明基板と接合される面
と、該透明基板の上記有機ＥＬ積層体が形成された面の
周縁とを、封止樹脂によって接合し、その後、上記封止
キャップを上記変態温度以上の温度に加熱し、上記封止
キャップの上記透明基板と接合される面を上記曲面に復
元させるとともに、上記透明基板及び上記有機ＥＬ積層
体を曲面形状とすることを特徴とする。According to a first aspect of the present invention, there is provided a method of manufacturing an organic EL curved surface element, comprising: a transparent substrate; an organic EL laminate formed on the surface of the transparent substrate; Organic E with a sealing cap for sealing the laminate
In the method for manufacturing an L-curved surface element, the shape is stored such that the surface of the sealing cap made of a shape memory alloy that is bonded to the transparent substrate is a curved surface, and then the curved surface is flat at a temperature equal to or lower than the transformation temperature. Then, the surface of the sealing cap to be joined to the transparent substrate and the periphery of the surface of the transparent substrate on which the organic EL laminate is formed are joined by a sealing resin. Heating the sealing cap to a temperature equal to or higher than the transformation temperature, restoring the surface of the sealing cap bonded to the transparent substrate to the curved surface, and forming the transparent substrate and the organic EL laminate into a curved surface shape. It is characterized by doing.
【０００６】上記「透明基板」としては、有機ＥＬ積層
体の発光による文字、図形等の視認が損なわれない程度
の透明性を有する材質からなるものを使用することがで
きる。また、封止キャップの変形によって容易に変形し
得る柔軟性と、上記「有機ＥＬ曲面素子」の表層として
の形状を保持し得るだけの強度を併せ有し、且つ表面が
容易に傷付かない程度の硬さを有するものが好ましい。
そのような基板としては、ポリエチレンテレフタレー
ト、ポリエーテルスルホン、ポリカーボネート等からな
り、厚さ１００〜３００μｍ程度のものを用いることが
できる。透明性の観点からはポリカーボネートからなる
基板が特に好ましい。この透明基板は無色透明であって
もよいし、適宜の色調に着色された着色透明のものであ
ってもよい。[0006] As the above-mentioned "transparent substrate", a substrate made of a material having such a degree of transparency that characters or figures due to light emission of the organic EL laminate are not impaired can be used. In addition, it has both flexibility that can be easily deformed by the deformation of the sealing cap and strength enough to maintain the shape as the surface layer of the “organic EL curved surface element”, and is such that the surface is not easily damaged. Is preferred.
As such a substrate, a substrate made of polyethylene terephthalate, polyether sulfone, polycarbonate, or the like and having a thickness of about 100 to 300 μm can be used. From the viewpoint of transparency, a substrate made of polycarbonate is particularly preferable. The transparent substrate may be colorless and transparent, or may be colored and transparent with an appropriate color tone.
【０００７】上記「有機ＥＬ積層体」は、透明基板の表
面に、少なくとも陽極、有機ＥＬ薄膜及び陰極が、この
順に積層され、形成される。有機ＥＬ薄膜は少なくとも
発光層を備え、この発光層の他、正孔輸送層及び／又は
電子輸送層を備えていてもよい。更に、正孔注入層及び
／又は電子注入層を備えていてもよい。これらの各層
は、真空蒸着法、スピンコート法、キャスト法、スパッ
タリング法及びＬＢ法等、各種の方法によって形成する
ことができる。The above-mentioned "organic EL laminate" is formed by laminating at least an anode, an organic EL thin film and a cathode in this order on the surface of a transparent substrate. The organic EL thin film includes at least a light emitting layer, and may include a hole transport layer and / or an electron transport layer in addition to the light emitting layer. Further, a hole injection layer and / or an electron injection layer may be provided. Each of these layers can be formed by various methods such as a vacuum evaporation method, a spin coating method, a casting method, a sputtering method, and an LB method.
【０００８】有機ＥＬ薄膜を構成する各層は、それぞれ
種々の材質により形成することができる。発光層は、ベ
ンゾチアゾール系、ベンゾイミダゾール系等の蛍光増白
剤、及び金属キレート化オキシノイド化合物、スチリル
ベンゼン系化合物等の金属錯体などにより形成すること
ができる。また、正孔輸送層はトリフェニルアミン誘導
体等により、電子輸送層はアルミキノリウム錯体等によ
り形成することができる。更に、正孔注入層は銅フタロ
シアニン錯体等により、電子注入層はアルカリ金属のフ
ッ化物又は酸化物等により形成することができる。Each layer constituting the organic EL thin film can be formed of various materials. The light-emitting layer can be formed of a benzothiazole-based or benzimidazole-based fluorescent whitening agent, a metal chelated oxinoid compound, a metal complex such as a styrylbenzene-based compound, or the like. Further, the hole transport layer can be formed of a triphenylamine derivative or the like, and the electron transport layer can be formed of an aluminum quinolium complex or the like. Further, the hole injection layer can be formed of a copper phthalocyanine complex or the like, and the electron injection layer can be formed of an alkali metal fluoride or oxide.
【０００９】陽極及び陰極も、それぞれ種々の材質によ
り形成することができる。陽極は、金、ニッケル等の金
属単体、及びＩＴＯ、ＣｕＩ、ＳｎＯ2、ＺｎＯ等の金
属化合物などを使用して形成することができ、生産性、
安定した導電性等の観点からＩＴＯを用いて形成するこ
とが特に好ましい。また、陰極は、マグネシウム−銀合
金又はマグネシウムと銀との混合物、ナトリウム、ナト
リウム−カリウム合金、マグネシウム、リチウム、アル
ミニウム、Ａｌ／ＡｌＯ2、或いはインジウム、イッテ
ルビウム等によって形成することができる。The anode and the cathode can be formed of various materials, respectively. The anode can be formed using a metal simple substance such as gold and nickel, and a metal compound such as ITO, CuI, SnO 2 , and ZnO.
It is particularly preferable to use ITO from the viewpoint of stable conductivity and the like. The cathode, a magnesium - a mixture of silver alloy or magnesium and silver, sodium, sodium - potassium alloy, magnesium, lithium, aluminum, Al / AlO 2, or indium can be formed by ytterbium.
【００１０】上記「封止キャップ」は、その周縁におい
て透明基板と接合される接合面を有し、その他の部分
は、この封止キャップと有機ＥＬ積層体とが接触しない
程度の空間が形成される形状であることが好ましい。封
止キャップは上記「形状記憶合金」からなり、透明基板
と有機ＥＬ積層体とは、この封止キャップによって曲面
形状に保持され、固定される。[0010] The "sealing cap" has a joining surface which is joined to the transparent substrate at the periphery thereof, and the other portion is formed with a space that does not allow the sealing cap and the organic EL laminate to come into contact with each other. Preferably, the shape is The sealing cap is made of the “shape memory alloy”, and the transparent substrate and the organic EL laminate are held and fixed in a curved shape by the sealing cap.
【００１１】形状記憶合金としては、ニッケル−チタン
合金が実用的であり、ニッケルとチタンとの量比によっ
て、その変態温度を幅広い温度域において任意に設定す
ることができる。この他、銅−亜鉛−アルミニウム合
金、銅−亜鉛−スズ合金、銅−アルミニウム−ニッケル
合金、銅−金−亜鉛合金、銅−スズ合金及びニッケル−
アルミニウム合金等を使用することができる。これらの
各種の形状記憶合金もそれぞれ特定の広い温度域におい
て任意の変態温度を有するものとすることができる。形
状記憶合金の上記「変態温度」は特に限定されないが、
簡易な装置により、簡便な操作で成形することができる
６０〜１００℃とすることが好ましい。As a shape memory alloy, a nickel-titanium alloy is practical, and its transformation temperature can be arbitrarily set in a wide temperature range depending on the ratio between nickel and titanium. In addition, copper-zinc-aluminum alloy, copper-zinc-tin alloy, copper-aluminum-nickel alloy, copper-gold-zinc alloy, copper-tin alloy and nickel-
An aluminum alloy or the like can be used. Each of these various shape memory alloys can also have an arbitrary transformation temperature in a specific wide temperature range. The "transformation temperature" of the shape memory alloy is not particularly limited,
The temperature is preferably set to 60 to 100 ° C., at which molding can be performed by a simple apparatus using a simple operation.
【００１２】封止キャップの接合面を所定の曲面形状と
し、これを「記憶」させるためには、変態温度未満の温
度において所定の曲面形状に成形した後、変態温度以上
の温度において熱処理する方法が挙げられる。曲面形状
に成形する方法は特に限定されないが、成形型を用いた
圧縮成形法が一般的であり、封止キャップの接合面ばか
りでなく、その他の部分も同時に所定の曲面形状等に成
形することができる。更に、変態温度未満の温度におい
て封止キャップを再成形し、接合面を、所定の曲面から
「平面」へと変形させる際も、圧縮成形法等を用いるこ
とができる。尚、この平面とは、接合面を均一に加圧
し、接合することができる程度の平滑性を有しているこ
とを意味し、必ずしも精度の高い平滑面である必要はな
い。In order to make the joining surface of the sealing cap a predetermined curved surface shape and to “remember” this, a method of forming the surface into a predetermined curved shape at a temperature lower than the transformation temperature and then performing a heat treatment at a temperature higher than the transformation temperature is used. Is mentioned. The method of molding into a curved surface shape is not particularly limited, but a compression molding method using a molding die is generally used, and not only the joining surface of the sealing cap but also other parts are simultaneously molded into a predetermined curved surface shape. Can be. Further, when the sealing cap is reformed at a temperature lower than the transformation temperature to deform the joint surface from a predetermined curved surface to a “flat surface”, a compression molding method or the like can be used. The flat surface means that the bonding surface has a smoothness enough to uniformly press and bond the bonding surface, and does not necessarily have to be a highly accurate smooth surface.
【００１３】封止キャップの接合面と、透明基板の有機
ＥＬ積層体が形成された面の周縁とは、封止樹脂によっ
て接合することができる。この接合は、接合面に封止樹
脂を塗布し、必要に応じて乾燥させ、硬化させること等
により行うことができる。上記「封止樹脂」としては、
エポキシ樹脂、アクリレート樹脂等の熱硬化性樹脂の
他、光硬化性樹脂などを使用することができる。この光
硬化性樹脂は、硬化速度が大きいため特に好ましい。ま
た、輝度の低下等を抑えるため、水分等が透過し難い硬
化体が形成される封止樹脂を使用することがより好まし
い。尚、水分等の侵入を十分に抑えるためには、接合面
における樹脂層の厚さは薄いほうが有利であり、接合性
が損なわれない範囲でより薄くすることが好ましい。The joining surface of the sealing cap and the periphery of the surface of the transparent substrate on which the organic EL laminate is formed can be joined with a sealing resin. This joining can be performed by applying a sealing resin to the joining surface, drying and curing as necessary. As the “sealing resin”,
In addition to thermosetting resins such as epoxy resins and acrylate resins, photocurable resins and the like can be used. This photocurable resin is particularly preferable because of its high curing speed. In addition, in order to suppress a decrease in luminance or the like, it is more preferable to use a sealing resin that forms a cured body through which moisture or the like hardly permeates. In order to sufficiently suppress the invasion of moisture and the like, it is advantageous that the thickness of the resin layer on the joining surface is thinner, and it is preferable that the thickness be smaller as long as the joining property is not impaired.
【００１４】透明基板に封止キャップを接合した後、封
止キャップを形状記憶合金の「変態温度以上」に「加
熱」し、その形状を「復元」させる。この加熱は、素子
全体を、形状記憶合金の変態温度より１０℃以上、特に
２０℃以上高い温度に調温された熱処理槽等の内部に静
置する等の方法によって行うことができる。このよう
に、素子全体を所要温度に加熱する方法は簡便ではある
が、有機ＥＬ曲面素子の構成部材、特に、透明基板等の
変形、或いは熱劣化等を生ずることのないような加熱温
度に設定する必要がある。After joining the sealing cap to the transparent substrate, the sealing cap is "heated" to "above the transformation temperature" of the shape memory alloy to "restore" its shape. This heating can be performed by a method such as leaving the entire element in a heat treatment tank or the like whose temperature is controlled at a temperature higher than the transformation temperature of the shape memory alloy by 10 ° C. or more, particularly 20 ° C. or more. As described above, the method of heating the entire element to the required temperature is simple, but the heating temperature is set so as not to cause deformation of the constituent members of the organic EL curved element, particularly, the transparent substrate or the like, or thermal deterioration. There is a need to.
【００１５】[0015]
【発明の実施の形態】以下、有機ＥＬ曲面素子の製造方
法を工程に沿って説明するための図１〜４に基づいて本
発明を更に詳しく説明する。 （１）封止キャップの成形 形状記憶合金として、変態温度が８０℃に調整されたニ
ッケル−チタン合金を使用し、先ず、図１に示すよう
に、その断面が曲面形状となった封止キャップ１を圧縮
成形した。成形後、４５０℃、６０分の熱処理を行い形
状を記憶させた。その後、他の成形型を用い、変態温度
を５０℃下回る温度において再成形し、図２に示すよう
に、その断面が平面形状となった封止キャップ１’とし
た。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to FIGS. (1) Molding of sealing cap As a shape memory alloy, a nickel-titanium alloy whose transformation temperature was adjusted to 80 ° C. was used. First, as shown in FIG. 1, a sealing cap having a curved cross section was used. 1 was compression molded. After molding, heat treatment was performed at 450 ° C. for 60 minutes to memorize the shape. After that, another molding die was used to re-mold at a temperature lower than the transformation temperature by 50 ° C. to obtain a sealing cap 1 ′ having a planar cross section as shown in FIG.
【００１６】（２）有機ＥＬ積層体の作製 ポリエチレンテレフタレート製の透明基板２の表面に、
蒸着法によりＩＴＯ薄膜からなる透明な陽極を形成し
た。その後、この陽極の表面に、有機ＥＬ薄膜を蒸着法
により形成した。有機ＥＬ薄膜は、陽極の表面から、順
次、ホール注入層、ホール輸送層、発光層、電子輸送
層、及び電子注入層が積層され、形成されている。次い
で、有機ＥＬ薄膜の表面に、蒸着法によりＭｇＡｇ薄膜
からなる陰極を形成し、有機ＥＬ積層体３を得た。(2) Preparation of Organic EL Laminate On the surface of a transparent substrate 2 made of polyethylene terephthalate,
A transparent anode composed of an ITO thin film was formed by a vapor deposition method. Thereafter, an organic EL thin film was formed on the surface of the anode by an evaporation method. The organic EL thin film is formed by sequentially laminating a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer from the surface of the anode. Next, a cathode made of a MgAg thin film was formed on the surface of the organic EL thin film by a vapor deposition method, and an organic EL laminate 3 was obtained.
【００１７】（３）封止キャップと透明基板との接合 （１）において得られた（ｂ）の平面状の封止キャップ
の接合面１１’にエポキシ樹脂を塗布し、（２）におい
て有機ＥＬ積層体が形成された透明基板の周縁に接合さ
せ、接合面の全面を加圧しながら、紫外線によりエポキ
シ樹脂を硬化させ、図３の平板状の有機ＥＬ素子を得
た。形成された接合層４は、幅、厚さともに均一であっ
た。また、封止キャップは透明基板の所定の位置に正確
に接合されており、位置のずれはほとんどなかった。(3) Joining the sealing cap to the transparent substrate The epoxy resin is applied to the joining surface 11 'of the planar sealing cap (b) obtained in (1), and the organic EL is used in (2). The substrate was bonded to the periphery of the transparent substrate on which the laminate was formed, and the epoxy resin was cured by ultraviolet rays while pressing the entire surface of the bonding surface to obtain the flat organic EL device of FIG. The formed bonding layer 4 was uniform in both width and thickness. Further, the sealing cap was accurately bonded to a predetermined position on the transparent substrate, and there was almost no displacement.
【００１８】（４）曲面形状の復元 （３）において接合された封止キャップと透明基板、及
びこの基板の表面に形成された有機ＥＬ積層体を、１０
０℃に調温された熱処理槽に１０分間静置し、封止キャ
ップを曲面形状に復元させた。この温度は使用した形状
記憶合金の変態温度を２０℃上回る温度であるが、封止
キャップは容易に記憶されていた曲面形状に復元され
た。また、同時に、この封止キャップの変形に追随し
て、透明基板及びその表面に形成された有機ＥＬ積層体
も、ほぼ同様の曲面形状となり、図４のような有機ＥＬ
曲面素子５が得られた。(4) Restoration of Curved Surface Shape The sealing cap and the transparent substrate joined in (3) and the organic EL laminate formed on the surface of this substrate
It was allowed to stand in a heat treatment tank adjusted to 0 ° C. for 10 minutes to restore the sealing cap to a curved surface shape. Although this temperature was 20 ° C. higher than the transformation temperature of the shape memory alloy used, the sealing cap was easily restored to the memorized curved shape. At the same time, following the deformation of the sealing cap, the transparent substrate and the organic EL laminate formed on the surface thereof have substantially the same curved surface shape, and the organic EL laminate shown in FIG.
The curved surface element 5 was obtained.
【００１９】尚、本発明においては、上記の実施例に限
られず、目的、用途に応じて本発明の範囲内で種々変更
した実施例とすることができる。即ち、形状記憶合金の
変態温度は広い温度域において調整することができる
が、例えば、ニッケル−チタン合金であれば、６０〜９
０℃程度の変態温度を有するものを使用することによ
り、有機ＥＬ曲面素子を容易に製造することができる。
また、銅−亜鉛−アルミニウム合金では、６０〜１００
℃程度の変態温度を有するものを使用することにより、
実用的な有機ＥＬ曲面素子を容易に製造することができ
る。It should be noted that the present invention is not limited to the above embodiment, but may be variously modified within the scope of the present invention according to the purpose and application. That is, the transformation temperature of the shape memory alloy can be adjusted in a wide temperature range.
By using a material having a transformation temperature of about 0 ° C., an organic EL curved surface element can be easily manufactured.
In the case of a copper-zinc-aluminum alloy, 60 to 100
By using one having a transformation temperature of about ℃
A practical organic EL curved surface element can be easily manufactured.
【００２０】[0020]
【発明の効果】第１発明によれば、透明基板と封止キャ
ップとが十分に密着され、強固に接合されて、接合面か
ら素子内部への水分等の侵入による輝度の低下等が抑え
られた有機ＥＬ曲面素子を製造することができる。ま
た、この製造方法によれば、加熱のみによって、一定の
曲面形状が安定して保持される有機ＥＬ曲面素子を容易
に得ることができる。According to the first aspect of the present invention, the transparent substrate and the sealing cap are sufficiently adhered to each other and are firmly joined to each other, so that a decrease in luminance or the like due to intrusion of moisture or the like from the joining surface into the inside of the device can be suppressed. An organic EL curved surface element can be manufactured. Further, according to this manufacturing method, it is possible to easily obtain an organic EL curved surface element in which a fixed curved shape is stably maintained only by heating.
【図１】形状記憶合金の変態温度以上の温度で曲面形状
を付与された封止キャップの断面図である。FIG. 1 is a cross-sectional view of a sealing cap provided with a curved shape at a temperature equal to or higher than a transformation temperature of a shape memory alloy.
【図２】形状記憶合金の変態温度未満の温度で再成形さ
れた平面形状の封止キャップの断面図である。FIG. 2 is a cross-sectional view of a planar sealing cap reshaped at a temperature lower than a transformation temperature of a shape memory alloy.
【図３】その表面に有機ＥＬ積層体が形成された透明基
板と、平面形状の封止キャップとを接合した状態を表す
断面図である。FIG. 3 is a cross-sectional view illustrating a state in which a transparent substrate having an organic EL laminate formed on a surface thereof and a planar sealing cap are joined.
【図４】形状記憶合金の変態温度以上の温度で再加熱す
るこにより得られた有機ＥＬ曲面素子の断面図である。FIG. 4 is a cross-sectional view of an organic EL curved surface element obtained by reheating at a temperature higher than a transformation temperature of a shape memory alloy.
１；曲面形状の封止キャップ、１’；平面形状の封止キ
ャップ、１１’；接合面、２；透明基板、３；有機ＥＬ
積層体、４；接合層、５；有機ＥＬ曲面素子。DESCRIPTION OF SYMBOLS 1; Curved sealing cap, 1 '; Planar sealing cap, 11'; Joining surface, 2; Transparent substrate, 3; Organic EL
Laminated body, 4; bonding layer, 5; organic EL curved surface element.
Claims (1)
た有機ＥＬ積層体、及び該透明基板に接合され、該有機
ＥＬ積層体を封止する封止キャップを備える有機ＥＬ曲
面素子の製造方法において、形状記憶合金からなる上記
封止キャップの上記透明基板と接合される面が曲面とな
るように形状を記憶させ、その後、変態温度未満の温度
において上記曲面が平面となるように成形し、次いで、
上記封止キャップの上記透明基板と接合される面と、該
透明基板の上記有機ＥＬ積層体が形成された面の周縁と
を、封止樹脂によって接合し、その後、上記封止キャッ
プを上記変態温度以上の温度に加熱し、上記封止キャッ
プの上記透明基板と接合される面を上記曲面に復元させ
るとともに、上記透明基板及び上記有機ＥＬ積層体を曲
面形状とすることを特徴とする有機ＥＬ曲面素子の製造
方法。1. Manufacture of an organic EL curved element including a transparent substrate, an organic EL laminate formed on a surface of the transparent substrate, and a sealing cap joined to the transparent substrate and sealing the organic EL laminate. In the method, the shape is stored so that the surface of the sealing cap made of a shape memory alloy that is bonded to the transparent substrate is a curved surface, and then the curved surface is molded at a temperature lower than the transformation temperature so that the curved surface is flat. And then
A surface of the sealing cap to be joined to the transparent substrate and a peripheral edge of the surface of the transparent substrate on which the organic EL laminate is formed are joined by a sealing resin. An organic EL, wherein the surface of the sealing cap bonded to the transparent substrate is restored to the curved surface, and the transparent substrate and the organic EL laminate are curved. Manufacturing method of curved surface element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29540799A JP2001118680A (en) | 1999-10-18 | 1999-10-18 | Manufacturing method of organic electroluminescent element with curved surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29540799A JP2001118680A (en) | 1999-10-18 | 1999-10-18 | Manufacturing method of organic electroluminescent element with curved surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001118680A true JP2001118680A (en) | 2001-04-27 |
Family
ID=17820216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29540799A Pending JP2001118680A (en) | 1999-10-18 | 1999-10-18 | Manufacturing method of organic electroluminescent element with curved surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001118680A (en) |
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| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040319 |