JP2001111193A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JP2001111193A JP2001111193A JP28739099A JP28739099A JP2001111193A JP 2001111193 A JP2001111193 A JP 2001111193A JP 28739099 A JP28739099 A JP 28739099A JP 28739099 A JP28739099 A JP 28739099A JP 2001111193 A JP2001111193 A JP 2001111193A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- mounting
- leg
- interrupter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、基板の取付孔に挿
入して取り付けられる例えばインタラプタ等の半導体装
置、とくにその取付脚部の構造に特徴を有し、かつ、基
板に取り付けた状態での浮き上がりを抑止する浮き上が
り抑止片を備えた半導体装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, such as an interrupter, which is inserted into a mounting hole of a substrate, and particularly to a structure of a mounting leg portion of the semiconductor device. The present invention relates to a semiconductor device provided with a lifting restraining piece for restraining a lifting.
【０００２】[0002]
【従来の技術】従来、インタラプタ等の半導体装置を基
板に取り付ける際、半導体装置の下端部に設けた取付脚
部を基板に設けた孔に挿入して取り付けることが普通に
行われている。図４は従来のインタラプタの取付脚の拡
大図である。図示するように、その取付脚の構造は、イ
ンタラプタから下方に垂直に延びた細く弾性を有する取
付脚本体の下部に、基板の孔の縁と係合するくさび形部
分を設け、該くさび形部分は、取付脚本体からほぼ直角
外方に延びた平坦面２’ａと、その平坦面２’ａの裏側
に設けられ、基板の孔に脚を取り付けるための傾斜案内
面となる、内方に向かって傾斜した傾斜面２’ｂとから
成っている。従って、取付に際しては、インタラプタを
基板の孔７ａに合わせて押し込むことにより、前記案内
面２’ｂが孔の縁に接合して押され、その結果、脚本体
はそれ自身の弾性により内方に屈曲後退して孔の中に挿
入される。続いて、取付脚下端のくさび形部分が孔を通
過すると、脚は孔７の壁からの圧力から解放されて外方
にはじけ、その水平面２’ａが基板の裏側に接するとと
もに、脚の上部の幅広部２’ｃが基板に接して停止し、
これによって、取付脚２’は、その上部は基板の表面に
かつ下部は基板の裏面にそれぞれ支持されて基板に固定
される。2. Description of the Related Art Conventionally, when a semiconductor device such as an interrupter is mounted on a substrate, a mounting leg provided at a lower end of the semiconductor device is usually inserted into a hole provided on the substrate. FIG. 4 is an enlarged view of a mounting leg of a conventional interrupter. As shown in the figure, the structure of the mounting leg is such that a wedge-shaped portion is provided at a lower portion of a thin and elastic mounting leg body extending vertically downward from the interrupter, the wedge-shaped portion being engaged with an edge of a hole of a substrate. A flat surface 2'a extending outwardly at a right angle from the mounting leg body, and an inward guide surface which is provided on the back side of the flat surface 2'a and serves as an inclined guide surface for mounting the leg in the hole of the substrate. And an inclined surface 2'b inclined toward the center. Therefore, when mounting, the guide surface 2'b is joined to the edge of the hole and pushed by pushing the interrupter in accordance with the hole 7a of the substrate, and as a result, the leg body is inwardly moved by its own elasticity. It is bent back and inserted into the hole. Subsequently, when the wedge-shaped portion at the lower end of the mounting leg passes through the hole, the leg is released from the pressure from the wall of the hole 7 and springs outward, so that the horizontal surface 2′a contacts the back side of the substrate and the upper portion of the leg Of the wide portion 2'c comes into contact with the substrate and stops,
As a result, the mounting leg 2 'is supported on the upper surface of the substrate and the lower portion is supported on the rear surface of the substrate, and is fixed to the substrate.
【０００３】このような脚構造の場合、取付脚の上部の
幅広部２’ｃと下部の水平面２’ａとの間隔が基板の厚
さに等しい、つまり理想的に形成されていれば、取付脚
と基板との間には隙間が生じないから、インタラプタは
基板に垂直に強固に取り付けられる。しかしながら、実
際には基板の厚さや取付脚の寸法には製作上の誤差等が
あり、基板の厚さと取付脚の上部の幅広部２’ｃと下部
の水平面２’ａ間の間隔とを等しくすることはできない
から、インタラプタを基板に取り付けた状態においても
インタラプタは取付孔の中でがたつきその取付は安定し
ない。 取付が安定しないと正確な検知はできず、極端
な場合、センサとして使用できない事態となる。In the case of such a leg structure, if the distance between the wide portion 2'c on the upper side of the mounting leg and the horizontal surface 2'a on the lower side is equal to the thickness of the substrate, that is, if it is ideally formed, the mounting Since there is no gap between the legs and the substrate, the interrupter is firmly mounted vertically to the substrate. However, in practice, there are manufacturing errors in the thickness of the substrate and the dimensions of the mounting legs, and the thickness of the substrate is equal to the distance between the wide portion 2′c on the upper side of the mounting legs and the horizontal surface 2′a on the lower side. Therefore, even when the interrupter is mounted on the substrate, the interrupter rattles in the mounting hole and the mounting is not stable. If the attachment is not stable, accurate detection cannot be performed. In an extreme case, the sensor cannot be used as a sensor.
【０００４】また、半導体装置の電極と基板の電極を半
田付けすると、硬化した半田ペーストが収縮する結果、
半導体装置と基板の間で収縮力が働き、それによって基
板の半導体装置取り付け部が盛り上がることがあり、こ
のような場合も半導体装置の位置ずれが生じ、半導体装
置が上述のようにフォトインタラプタのようなセンサの
場合には、正確な検知動作ができなくなるおそれがあ
る。When the electrodes of the semiconductor device and the electrodes of the substrate are soldered, the cured solder paste shrinks,
A contraction force acts between the semiconductor device and the substrate, which may cause the semiconductor device mounting portion of the substrate to swell. In such a case, the semiconductor device may be displaced, and the semiconductor device may be moved like a photo interrupter as described above. In the case of a simple sensor, an accurate detection operation may not be performed.
【０００５】[0005]
【発明の解決しようとする課題】本発明は、従来技術の
前記欠点を解消すべくなされたものであって、その第１
の目的は、簡単な構成ながらフォトインタラプタのよう
な半導体装置を基板に対して容易かつ確実に取り付けで
きるようにした取付脚の構造を提供することである。第
２の目的は、半田ペーストが収縮して基板に盛り上がり
が生じた場合にも半導体の位置を正しく保つため、浮き
上りを防止することができる半導体装置を提供すること
である。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art, and its first object is to solve the above-mentioned problems.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a structure of a mounting leg which enables a semiconductor device such as a photo interrupter to be easily and reliably mounted on a substrate while having a simple configuration. A second object of the present invention is to provide a semiconductor device capable of preventing the semiconductor device from being lifted up in order to maintain the position of the semiconductor correctly even when the solder paste shrinks and the substrate is raised.
【０００６】[0006]
【課題を解決するための手段】本発明では、取付脚本体
に前記取付孔の下端縁に係合する傾斜面を設けることに
よって、前記取付孔内で屈曲した取付脚の弾発力によ
り、取付脚に常に下向きの力が作用するようにして、イ
ンタラプタのような半導体装置を基板に確実に係止する
ようにしたものであって、具体的には、請求項１は、基
板に挿入するための取付脚を有する半導体装置におい
て、前記取付脚は、半導体装置本体から下方に垂直に延
び弾性を有する脚本体と、脚本体下部において基板の取
付孔の下端部に弾発接合する接合部を有し、該接合部は
垂直な脚本体側面から外下方に向かって傾斜した傾斜面
からなることを特徴とする半導体装置である。According to the present invention, the mounting leg body is provided with an inclined surface which engages with the lower end edge of the mounting hole so that the mounting leg is bent by the elastic force of the mounting leg in the mounting hole. A downward force is always applied to the leg so that a semiconductor device such as an interrupter is securely locked to the substrate. Specifically, claim 1 is to insert the semiconductor device into the substrate. In the semiconductor device having the mounting legs, the mounting legs have a leg body extending vertically downward from the semiconductor device body and having elasticity, and a joining portion elastically joined to a lower end portion of the mounting hole of the substrate at a lower portion of the leg body. The junction is a semiconductor device characterized in that it has a slope inclined from the vertical leg body side surface toward the outside and downward.
【０００７】請求項２の発明は、請求項１に記載された
半導体装置において、接合部の傾斜面は水平面に対して
４５°以下に形成されていることを特徴とする半導体装
置である。According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the inclined surface of the junction is formed at an angle of 45 ° or less with respect to a horizontal plane.
【０００８】請求項３の発明は、請求項１に記載された
半導体装置において、半導体装置本体の下部側面から外
方に延び、かつ、半導体装置を基板に取り付けたときに
基板面に接する水平な下面を有する取付***を備えて
いることを特徴とする半導体装置である。According to a third aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the horizontal portion extends outward from a lower side surface of the semiconductor device main body and contacts the substrate surface when the semiconductor device is mounted on the substrate. A semiconductor device comprising a mounting piece having a lower surface.
【０００９】請求項４の発明は、請求項３に記載された
半導体装置において、半導体本体の側面に浮き上がり抑
止片を有することを特徴とする半導体装置である。According to a fourth aspect of the present invention, there is provided the semiconductor device according to the third aspect of the present invention, wherein the semiconductor device further comprises a lifting suppressing piece on a side surface of the semiconductor body.
【００１０】[0010]
【発明の実施の形態】図面に従って本発明の１実施形態
を説明する。図１は、本発明１の実施形態のインタラプ
タ全体を示すものであって、１はインタラプタ本体を示
す。本体１の下端から下方に向けて取付脚２が基板７に
設けた取り付け孔７ｂを貫通して延びている。５は取り
付け***であって、図３に示すように、本体下部にお
いてその側面から外下方に突出した傾斜面５ａと、該傾
斜面の下方終端に形成された本体と平行な面５ｂと、該
平行な面の終端に形成された本体と直角な面５ｃとから
なる略三角の翼状に形成されている。この***５は、
基板７に対して直立したインタラプタ１を安定的に支え
る役割を果たしている。なお、***の形状はここで説
明する形状に限定するものでなく、要はインタラプタ等
の半導体装置を基板に取り付けたときに、その取付に安
定性を与えるものであれば任意である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows the entire interrupter according to the first embodiment of the present invention, wherein 1 indicates an interrupter main body. The mounting leg 2 extends downward from the lower end of the main body 1 through a mounting hole 7 b provided in the substrate 7. Reference numeral 5 denotes a mounting stabilizing piece, as shown in FIG. 3, an inclined surface 5a projecting outward and downward from a side surface of the lower portion of the main body, and a surface 5b formed at a lower end of the inclined surface and parallel to the main body. It is formed in a substantially triangular wing shape composed of a main body formed at the end of the parallel surface and a surface 5c perpendicular to the main surface. This stable piece 5
It plays a role of stably supporting the interrupter 1 standing upright on the substrate 7. The shape of the stabilizing piece is not limited to the shape described here. In short, any shape can be used as long as it provides stability when a semiconductor device such as an interrupter is mounted on a substrate.
【００１１】図２は、本発明のインタラプタの取付脚２
を拡大して示した図であって、図２から明らかなよう
に、取付脚本体２の下部側面には脚を基板７の取付孔７
ｂに挿入したとき、基板７の取付孔７ｂの下端縁７ａに
接合する傾斜面３が形成されており、傾斜面に続いてさ
らに水平面２ｂ、該水平面の端部からさらに取付脚２の
下端部に向かって内方に傾斜した傾斜面２ｃ形成されて
いる。この傾斜面２ｃは、取付脚２を基板の孔７ｂに挿
入する際に取付脚２を前記孔７ｂ内に案内するための案
内面を構成している。また、取付脚２は、前記基板７の
孔７ｂへの挿入時において、前記取付***５の下面５
ｃが基板表面に基板面に当接したとき、その傾斜面２ａ
が前記孔７ｂの下端縁７ａに当接するような長さに形成
されている。したがって、取付脚２を前記取付孔７ｂに
挿入すると、取付脚２の傾斜面２ａが孔の前記下端縁７
ａに当接して、自然な位置よりインタラプタ本体内方に
屈曲し、その結果、取付脚２の反発力が前記孔の下端縁
７ａに作用し、前記傾斜面２ａがその抗力を受け、取付
脚には図２において下向きの力が作用する。つまり、こ
の状態ではインタラプタ本体のそれ以上の下降は不可能
であるから、インタラプタ本体には常に下向きの力が作
用することとなり、その取付が強固となる。なお、取付
脚２の形状は、基板の取付孔の下端部と接合する傾斜面
を有し、かつ、孔に容易に挿入できる形状であれば任意
である。FIG. 2 shows the mounting leg 2 of the interrupter of the present invention.
FIG. 2 is an enlarged view of FIG. 2, and as is apparent from FIG.
b, the inclined surface 3 joined to the lower edge 7a of the mounting hole 7b of the substrate 7 is formed. The inclined surface 3 is further connected to the horizontal surface 2b, and the lower end of the mounting leg 2 is further extended from the end of the horizontal surface. An inclined surface 2c that is inclined inward toward is formed. The inclined surface 2c constitutes a guide surface for guiding the mounting leg 2 into the hole 7b when the mounting leg 2 is inserted into the hole 7b of the board. When the board 7 is inserted into the hole 7b, the mounting leg 2
When c is in contact with the substrate surface, the inclined surface 2a
Is formed so as to contact the lower end edge 7a of the hole 7b. Therefore, when the mounting leg 2 is inserted into the mounting hole 7b, the inclined surface 2a of the mounting leg 2
a, and bends inward from the natural position of the interrupter main body. As a result, the repulsive force of the mounting leg 2 acts on the lower edge 7a of the hole, and the inclined surface 2a receives the reaction force. , A downward force acts in FIG. That is, in this state, it is impossible to further lower the interrupter main body, so that a downward force is always applied to the interrupter main body, and the mounting of the interrupter main body becomes strong. The shape of the mounting leg 2 is arbitrary as long as it has an inclined surface to be joined to the lower end of the mounting hole of the substrate and can be easily inserted into the hole.
【００１２】本発明によれば、インタラプタの取付脚２
を基板７の取付孔７ｂに挿入するだけで基板に係止で
き、しかも、取付脚２の傾斜面２ａにより常に下方への
力が作用するからしっかりと固定することができる。ま
た、取付脚２の傾斜面４の水平面に対する傾斜角度は、
取付安定性の関係から４５°以下が望ましい。According to the present invention, the mounting leg 2 of the interrupter
Can be locked to the board simply by inserting it into the mounting hole 7 b of the board 7, and can be firmly fixed because a downward force always acts on the inclined surface 2 a of the mounting leg 2. The inclination angle of the inclined surface 4 of the mounting leg 2 with respect to the horizontal plane is as follows:
45 ° or less is desirable from the viewpoint of mounting stability.
【００１３】図３は本発明に係る半導体装置の別の実施
形態のインタラプタを示すものである。図１に示した実
施形態との差異は、本実施形態においてはインタラプタ
本体１の例えば上部側面に、基板７が浮き上がったとき
にインタラプタ１の上動を抑える浮き上がり抑止片６を
設けたことである。浮き上がり抑止片６はインタラプタ
の側部外面から外方に突出した水平面６ａを備え、この
水平面６ａが半導体本体の浮き上がり抑止機能を有して
いる。即ち、インタラプタ１を取り付けた基板の電極等
に半田付けを行うと、半田ペーストが硬化収縮する際
に、基板に半田ペーストの収縮力が作用し基板を浮き上
がらせることがある。その場合インタラプタも浮き上が
るが、本発明ではインタラプタ１が浮き上がると、前記
浮き上がり抑止片６の上面がインタラプタ１を設置する
機器のフレーム又はシャシ等に当接し、インタラプタ１
の浮き上がりを効果的に抑止することができる。なお、
取り付ける機器に予め前記浮き上がり抑止片を受けるた
めの部材を設置しておくことができる。また、浮き上が
り抑止片の形状はインタラプタの浮き上がりを抑止でき
るものであれば任意である。FIG. 3 shows an interrupter of another embodiment of the semiconductor device according to the present invention. The difference from the embodiment shown in FIG. 1 is that, in the present embodiment, a lift suppressing piece 6 that suppresses the upward movement of the interrupter 1 when the substrate 7 floats is provided, for example, on the upper side surface of the interrupter main body 1. . The lifting suppressing piece 6 has a horizontal surface 6a protruding outward from the side outer surface of the interrupter, and this horizontal surface 6a has a function of preventing the semiconductor body from lifting. That is, when soldering is performed on an electrode or the like of a substrate to which the interrupter 1 is attached, when the solder paste cures and contracts, the contraction force of the solder paste acts on the substrate, and the substrate may be lifted. In this case, the interrupter also floats, but in the present invention, when the interrupter 1 floats, the upper surface of the lifting restraining piece 6 comes into contact with the frame or chassis of the device on which the interrupter 1 is installed, and the interrupter 1
Can be effectively suppressed. In addition,
A member for receiving the lifting restraining piece can be installed in the device to be mounted in advance. Further, the shape of the lifting suppressing piece is arbitrary as long as the lifting of the interrupter can be suppressed.
【発明の効果】請求項１、２に対応する効果：半導体装
置を基板の取付孔に取り付けた状態において取付脚の傾
斜面が常に孔の端部に当接するため、取付脚の反発力が
前記孔の端部に作用して、その結果取付脚には常に下向
きの力が作用し、しかもその状態では半導体装置本体の
下端部が基板に接触しているため、半導体装置を基板の
取付孔に対して単に挿入するだけで容易かつ強固に取り
付けることができる。請求項３に対応する効果：取付安
定片を備えたことにより半導体装置を一層安定して取り
付けることができる。請求項４に対応する効果：浮き上
がり抑止片を設けたことにより、例え基板が浮き上がっ
たとしても前記抑止片が機器のシャシ等に当接して浮き
上がりを抑止するから、半導体装置が位置ずれを起こす
ことはない。According to the present invention, when the semiconductor device is mounted in the mounting hole of the substrate, the inclined surface of the mounting leg always comes into contact with the end of the hole. Acting on the end of the hole, a downward force always acts on the mounting leg, and in this state, the lower end of the semiconductor device body is in contact with the substrate. It can be easily and firmly attached simply by inserting it. According to the third aspect of the present invention, the semiconductor device can be mounted more stably by providing the mounting stabilizing piece. According to the fourth aspect of the present invention, the provision of the lifting suppressing piece prevents the semiconductor device from being displaced even if the substrate is lifted, because the suppressing piece contacts the chassis of the device to prevent the lifting. There is no.
【図１】 本発明の半導体装置の実施形態について、基
板に取り付けた状態で示した図である。FIG. 1 is a diagram showing an embodiment of a semiconductor device of the present invention in a state where it is mounted on a substrate.
【図２】 半導体装置の取付脚の構造を説明するための
一部拡大図である。FIG. 2 is a partially enlarged view for explaining a structure of a mounting leg of the semiconductor device.
【図３】 本発明の半導体装置の他の実施形態につい
て、基板に取り付けた状態で示した図である。FIG. 3 is a view showing another embodiment of the semiconductor device of the present invention in a state where it is mounted on a substrate.
【図４】 従来の半導体装置の取付脚の構造を説明する
ための一部拡大図である。FIG. 4 is a partially enlarged view for explaining a structure of a mounting leg of a conventional semiconductor device.
１…半導体装置本体、２…脚、５…取付***、６…浮
き上がり抑止片、７…基板、７ｂ…取付孔DESCRIPTION OF SYMBOLS 1 ... Semiconductor device main body, 2 ... Legs, 5 ... Mounting stable piece, 6 ... Floating restraining piece, 7 ... Substrate, 7b ... Mounting hole
Claims (4)
有する半導体装置において、前記取付脚は、半導体装置
本体から下方に垂直に延び弾性を有する脚本体と、該脚
本体下部において前記基板の取付孔の下縁に弾発接合す
る接合部を有し、該接合部は垂直な脚本体側面から外下
方に向かって傾斜した傾斜面からなることを特徴とする
半導体装置。1. A semiconductor device having a mounting leg for insertion into a mounting hole of a substrate, wherein the mounting leg extends vertically downward from the semiconductor device main body and has elasticity, and the substrate is provided at a lower portion of the leg main body. A semiconductor device having a joint portion which resiliently joins a lower edge of the mounting hole, the joint portion comprising an inclined surface inclined outward and downward from a vertical leg body side surface.
て、接合部の傾斜面は水平面に対して４５°以下に形成
されていることを特徴とする半導体装置。2. The semiconductor device according to claim 1, wherein an inclined surface of the junction is formed at an angle of 45 ° or less with respect to a horizontal plane.
て、半導体装置本体の下部側面から外方に延び、かつ、
半導体装置を基板に取り付けたときに基板面に接する水
平な下面を有する取付***を備えていることを特徴と
する半導体装置。3. The semiconductor device according to claim 1, wherein the semiconductor device extends outward from a lower side surface of the semiconductor device body, and
A semiconductor device comprising: a mounting stabilizing piece having a horizontal lower surface that comes into contact with a substrate surface when the semiconductor device is mounted on the substrate.
て、半導体装置本体の側面に浮き上がり抑止片を備えた
ことを特徴とする半導体装置。4. The semiconductor device according to claim 3, further comprising a lifting-stopping piece on a side surface of the semiconductor device body.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28739099A JP2001111193A (en) | 1999-10-07 | 1999-10-07 | Semiconductor device |
| PCT/JP2000/006915 WO2001026162A1 (en) | 1999-10-07 | 2000-10-04 | Photo-interrupter and semiconductor device using it |
| EP00964656A EP1220328A4 (en) | 1999-10-07 | 2000-10-04 | Photo-interrupter and semiconductor device using it |
| US10/089,801 US6677580B1 (en) | 1999-10-07 | 2000-10-04 | Photo-interrupter and semiconductor device using it |
| TW089120987A TW476165B (en) | 1999-10-07 | 2000-10-07 | Photo interrupter and semiconductor device using such photo interrupter |
| US10/630,657 US6927486B2 (en) | 1999-10-07 | 2003-07-31 | Photo-interrupter and semiconductor device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28739099A JP2001111193A (en) | 1999-10-07 | 1999-10-07 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001111193A true JP2001111193A (en) | 2001-04-20 |
Family
ID=17716739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28739099A Withdrawn JP2001111193A (en) | 1999-10-07 | 1999-10-07 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001111193A (en) |
-
1999
- 1999-10-07 JP JP28739099A patent/JP2001111193A/en not_active Withdrawn
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