JP2001093882A5 - - Google Patents
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- Publication number
- JP2001093882A5 JP2001093882A5 JP1999268328A JP26832899A JP2001093882A5 JP 2001093882 A5 JP2001093882 A5 JP 2001093882A5 JP 1999268328 A JP1999268328 A JP 1999268328A JP 26832899 A JP26832899 A JP 26832899A JP 2001093882 A5 JP2001093882 A5 JP 2001093882A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etch
- plasma
- introducing
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 3
- 210000002381 Plasma Anatomy 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26832899A JP2001093882A (ja) | 1999-09-22 | 1999-09-22 | 温度測定装置、及びその温度測定装置が設けられた真空処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26832899A JP2001093882A (ja) | 1999-09-22 | 1999-09-22 | 温度測定装置、及びその温度測定装置が設けられた真空処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001093882A JP2001093882A (ja) | 2001-04-06 |
| JP2001093882A5 true JP2001093882A5 (hu) | 2005-11-04 |
Family
ID=17457026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26832899A Pending JP2001093882A (ja) | 1999-09-22 | 1999-09-22 | 温度測定装置、及びその温度測定装置が設けられた真空処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001093882A (hu) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7341673B2 (en) | 2003-08-12 | 2008-03-11 | Lam Research Corporation | Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission |
| TWI320951B (en) * | 2002-08-13 | 2010-02-21 | Lam Res Corp | Methods for in situ substrate temperature monitoring by electromagnetic radiation emission |
| US7235155B2 (en) * | 2003-03-14 | 2007-06-26 | Tokyo Electron Limited | Method and apparatus for monitoring plasma conditions using a monitoring ring |
| US7112763B2 (en) * | 2004-10-26 | 2006-09-26 | Applied Materials, Inc. | Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers |
| JP2010025756A (ja) * | 2008-07-18 | 2010-02-04 | Fuji Electric Systems Co Ltd | 温度計測装置及び温度分布計測システム |
| JP5577160B2 (ja) * | 2010-06-07 | 2014-08-20 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びプラズマ処理方法 |
| JP6295674B2 (ja) * | 2014-01-20 | 2018-03-20 | ウシオ電機株式会社 | 熱処理装置およびランプ制御方法 |
| CN113970571A (zh) * | 2021-10-25 | 2022-01-25 | 攀钢集团攀枝花钢铁研究院有限公司 | 简易的黑度系数比对装置及黑度系数快速测定方法 |
-
1999
- 1999-09-22 JP JP26832899A patent/JP2001093882A/ja active Pending
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