JP2001092157A - Method for regnerative working of organic photoreceptor substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the deflection accuracy of an outside diameter by subjecting the inside diameter of an organic photoreceptor coating film in an as-plastically worked state to spigot joint working for removing the deflection with the outside diameter of the organic photoreceptor coating film as a reference for working and to recycle the organic photoreceptor by clamping the spigot joint with high-accuracy chucks and subjecting the spigot joint to outside diameter working and simultaneously executing the removal of an under-coating layer which is hardly removable thermosetting resin and the outside diameter working by the least possible cutting margin. SOLUTION: The method for regenerating the substrate of the cylindrical electrophotographic organic photoreceptor formed by subjecting a substrate of aluminum or aluminum alloy used at the inner and outer diameters in the as-plastically worked state, such as the as-drawn state, or the substrate of the aluminum or aluminum alloy used at the inner diameter in the as-plastically worked state, such as the as-drawn state, to outer diameter cutting, etc., is the method for regenerating the substrate which consists in clamping the outer diameter of the organic photoreceptor coating film, subjecting the inner diameters at both ends to spigot joint working to remove the deflection of <=15 mm in the inner diameters at both ends to <=0.03 mm in the circumferential deflection of the inner diameter based on the outer diameter of the organic photoreceptor coating film, then supporting the spigot joint and removing the organic photoreceptor coating film and the outer diameter of the substrate by machining, thereby finishing the substrate to a desired roughness and outer diameter accuracy.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は電子写真用有機感光
体基体の再利用方法、及び部材の加工方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for recycling an organic photoreceptor substrate for electrophotography and a method for processing a member.

【０００２】[0002]

【従来の技術】円筒状電子写真用感光体の形成は、光書
き込み系に半導体レーザー光を使用したデジタル化が主
流となり、それに伴いレーザー光の干渉性から書き込み
時の異常画像防止の目的のため電荷発生層の下層に光散
乱剤を分散した樹脂膜を形成して使用する。この光散乱
剤分散樹脂膜は吸湿による異常画像等を防止する目的か
ら熱硬化性樹脂を使用し塗布焼成して形成するため、基
体の再利用の際は除去が非常に困難であり、種々の方法
が提案されてはいるが、実施段階での問題点が多く、生
産ラインの良品率によっては再利用されずに破棄されて
しまうというのが現状である。しかし、最近の資源再利
用の風潮から、基体としての再利用又はアルミ資源とし
ての再利用は至上命令化されつつある。2. Description of the Related Art In order to form a cylindrical electrophotographic photoreceptor, digitization using a semiconductor laser beam in an optical writing system has become mainstream, and the coherence of the laser beam has been accompanied by the purpose of preventing abnormal images during writing. A resin film in which a light scattering agent is dispersed is formed and used below the charge generation layer. This light-scattering agent-dispersed resin film is formed by applying and baking using a thermosetting resin for the purpose of preventing an abnormal image or the like due to moisture absorption. Therefore, when the substrate is reused, it is very difficult to remove it. Although a method has been proposed, there are many problems in the implementation stage, and at present, it is discarded without being reused depending on the non-defective product line rate. However, due to the recent trend of resource recycling, recycling as a base material or recycling as an aluminum resource is being ordered to the utmost.

【０００３】再利用方法の従来技術として、特開平８−
６２６４号公報には熱硬化性樹脂を膨潤可能な液体中に
浸漬し、樹脂成分を溶解させることなく剥離除去する方
法が記載されているが、切削スジ状欠陥、ビビリ状欠
陥、黒ポチ欠陥等の基体欠陥には対応できない。また、
特開平１０−１７７２５４号公報には基体をステンレス
とし、６００〜１２００℃で加熱して有機感光層を除去
する方法が記載され、特開平１０−１７７２６６号公報
には基体をガラスとし、ガラス転移点より高温で熱処理
除去する方法が記載され、加熱除去のために基体の熱的
耐久性を上げるよう材質をステンレスやガラスとし、再
利用を可能としているが、やはり基体欠陥の場合の対応
はなされていない。また、特開平９−２１１８７５号公
報には溶剤含有織布を用い、圧接除去ブラシで残渣を拭
き取る方法が記載され、特開平８−３０００５号公報に
は剥離層を設けて基体を剥離層より剥がし再利用する方
法が記載されているが、同様に基体欠陥の場合の対応が
なされていない。また、特許第２６８２１０５号公報に
は感光体の外周表面に砂粒、鋼粒、珪石粒を含む高圧水
を吹き付けて基体を研磨し、再利用する方法が記載され
ており、基体の研磨を兼ねて無機感光体であるセレン合
金の除去を目的としているが、微細粒子の高圧噴射では
基体欠陥部を取り除くのは困難であり、対応し難い。ま
た、従来公知の方法で、感光体をそのまま切削研磨して
基体を再利用する方法があるが、この方法では、そのま
まの基体内径を基準加工なしに切削研削するため加工代
が大きく、再利用できない外径となってしまう。このた
め、そのままの内径基準加工をやめ、先願である特願平
１０−１１７８７６号明細書に記載されている、溶剤で
溶解可能な感光層を除去後、センターレス装置で下引き
層を研磨除去し、基体を再利用する方法が取られている
が、複写画像の形成方法に半導体レーザーによる光書き
込み方法を取る感光体では、画像欠陥である干渉縞模様
の防止のため、アルミやアルミ合金の基体表面粗さによ
り形成される光散乱剤入り下引き層表面での表面粗さが
波長λ／ｎの１／４の整数倍が必要であり、軸方向への
ライン書き込みビーム径に対する粗さの分布を一定にす
る必要がある。そのままの内径基準加工をやめ、センタ
ーレス加工により外径研削する方法では、砥石の目詰ま
りや砥粒の脱落等から表面粗さを一定に容易にコントロ
ールできない問題があった。As a prior art of a recycling method, Japanese Patent Laid-Open No.
Japanese Patent No. 6264 describes a method in which a thermosetting resin is immersed in a swellable liquid and peeled off without dissolving the resin component. However, cutting streak-like defects, chatter-like defects, black spot defects, etc. Cannot cope with the substrate defect. Also,
JP-A-10-177254 describes a method in which a substrate is made of stainless steel and the organic photosensitive layer is removed by heating at 600 to 1200 ° C. JP-A-10-177266 describes a method in which the substrate is made of glass and has a glass transition point. A method of heat treatment removal at a higher temperature is described, and the material is made of stainless steel or glass so as to increase the thermal durability of the substrate for removal by heating, and the material can be reused. Absent. Japanese Patent Application Laid-Open No. Hei 9-212875 describes a method of using a solvent-containing woven fabric and wiping off residues with a pressure-removing brush. Although a method of recycling is described, no measure is taken in the case of a substrate defect. Further, Japanese Patent No. 2682105 describes a method in which high-pressure water containing sand particles, steel particles, and silica particles is sprayed on the outer peripheral surface of a photoreceptor to polish and reuse a substrate, which also serves to polish the substrate. The purpose is to remove the selenium alloy as an inorganic photoreceptor, but it is difficult to remove the base defect by high-pressure injection of fine particles, which is difficult to cope with. In addition, there is a method in which a photoreceptor is directly cut and polished and a substrate is reused by a conventionally known method. However, in this method, since the inner diameter of the substrate is cut and ground without reference processing, a large machining allowance is required. The outside diameter becomes impossible. Therefore, the inner diameter reference processing is stopped as it is, and after removing the solvent-soluble photosensitive layer described in the specification of Japanese Patent Application No. 10-117876, the undercoat layer is polished with a centerless apparatus. The method of removing and reusing the substrate has been adopted.However, in the case of a photoreceptor using a light writing method using a semiconductor laser as a method of forming a copied image, aluminum or an aluminum alloy is used to prevent interference fringe patterns which are image defects. The surface roughness on the surface of the undercoat layer containing the light scattering agent formed by the surface roughness of the substrate needs to be an integral multiple of 1/4 of the wavelength λ / n, and the roughness with respect to the line writing beam diameter in the axial direction. Needs to be constant. In the method in which the inner diameter reference processing is stopped as it is and the outer diameter is ground by centerless processing, there is a problem that the surface roughness cannot be easily controlled to a constant level due to clogging of a grindstone or falling off of abrasive grains.

【０００４】円筒状電子写真用有機感光体のアルミ又は
アルミ合金基体は、生産コストの低減から旋削加工等に
よる外径加工又は内径加工を施さずに使用する方向にな
りつつある。この方法は、引き抜き加工等の塑性加工の
ままの内径と塑性加工のままの外径に有機感光体塗布膜
を形成してしまうもの、及び塑性加工のままの内径に外
径を旋削や研削等をして所望の粗さを得て有機感光体塗
布膜を形成するもの等がある。この基体の、特に有機感
光体塗布膜の下引き層が光散乱剤を含有し、熱硬化性樹
脂で形成されている場合に塗膜欠陥を生じたものは、基
体からの除去が困難であるため、また、塗布膜欠陥が基
体に起因すると想定できるもの、例えば切削スジ状欠陥
やビビリ状欠陥及び黒ポチ欠陥等のあるものは再利用さ
れずにほとんど破棄処分となる。このため、基体の再利
用をするには、熱硬化性樹脂である下引き層を除去する
と同時に基体表面の欠陥を除去すべく所定面形状と精度
に再加工できることが好ましく、特に複写画像の形成方
法に半導体レーザーによる光書き込み方法では、干渉縞
状異常画像の防止等から、基体の表面形状を一定に効率
よく形成する必要があり、旋削加工が選定される。The aluminum or aluminum alloy base of the cylindrical electrophotographic organic photoreceptor is being used without being subjected to outer diameter processing or inner diameter processing such as turning in order to reduce production costs. This method involves forming an organic photoreceptor coating film on the inner diameter of the plastic processing such as drawing and the outer diameter of the plastic processing, and turning or grinding the outer diameter on the inner diameter of the plastic processing. To obtain a desired roughness to form an organic photoreceptor coating film. If the undercoat layer of the organic photoreceptor coating film contains a light scattering agent and is formed of a thermosetting resin, it is difficult to remove the substrate from the substrate. For this reason, those which can be assumed to be caused by the coating film defects, such as those having cutting streak-like defects, chatter-like defects and black spot defects, are almost discarded without being reused. For this reason, in order to reuse the substrate, it is preferable that the undercoat layer, which is a thermosetting resin, can be removed and, at the same time, the surface can be reworked with a predetermined surface shape and precision so as to remove defects on the surface of the substrate. In the optical writing method using a semiconductor laser, it is necessary to form the surface shape of the substrate uniformly and efficiently in order to prevent an interference fringe-like abnormal image and the like.

【０００５】しかし、旋削加工では、塑性加工のままの
内径基準で外径を旋削すると、外径との同芯度が悪い場
合は旋削代を多く取らなければならず、規定の外径寸法
を削り過ぎたり、削り残し等が発生し再利用できないも
のが多く発生してしまうという欠点があった。また、下
引き層を含む感光体と基体外径旋削加工を同時に行なう
ためには、基体内径部に旋削加工時に発生する振動を確
実に吸収する緩衝材を挿入する必要があり、振動吸収押
圧力条件を調整できる緩衝材構造と挿入取り出しが容易
である必要がある。However, in turning, when the outer diameter is turned on the basis of the inner diameter while plastic working is being performed, if the concentricity with the outer diameter is poor, a larger allowance must be taken for turning, and the specified outer diameter dimension must be increased. There is a drawback that too much or uncut parts are generated and many of them cannot be reused. Further, in order to simultaneously perform the outer diameter turning of the photoreceptor including the undercoat layer and the outer diameter of the substrate, it is necessary to insert a cushioning material that reliably absorbs the vibration generated during the turning into the inner diameter of the substrate. It is necessary to have a buffer structure capable of adjusting the conditions and easy insertion and removal.

【０００６】すなわち、円筒状電子写真用有機感光体の
アルミ又はアルミ合金の基体は近年の生産技術の進歩に
より引き抜き加工等の塑性加工のままの内外径または引
き抜き加工等の塑性加工のままの内径で外径旋削加工等
を施され使用されるようになった。基体を再利用しよう
とすると、塑性加工であるためのその寸法精度、等に内
径基準での外径内周振れは大きく、０．０５ｍｍ以上の
ものが多く、その再利用加工方法は限られ、有機感光体
膜を溶剤で除去及びその後に研磨法やベルト研磨法及び
バフ研磨法等の外径取り代を少なくしたり、外径に倣う
方法が採用されるに至っている。溶剤での除去は、有機
感光体膜を剥がすだけで、その基体の欠陥のために塗膜
不良となったものでは、表面の傷や旋削加工のすじや微
少なバリがあり、除去できずに残ってしまい、そのまま
では再利用できないため、その後に研磨法やベルト研磨
法及びバフ研磨法等の外径に倣う方法を採用しなければ
ならず、コスト的には新品の方が安価となってしまい、
生産歩留まりによっては破棄してしまう方向となってい
る。また、有機感光体膜の層構成によっては、熱硬化性
の膜が採用され溶剤等では剥離に時間を要したり、可燃
性の溶剤であったりするため設備費が掛かってしまう等
の欠点があり、やはり生産歩留まりによっては破棄して
しまう方向となっている。また、研磨法やベルト研磨法
及びバフ研磨法等の外径に倣う方法では規則的にコント
ロールされた有機感光体基体表面を造ることができず、
有機感光体のレーザー光画像形成光書き込みドット数に
よっては干渉縞状の画像欠陥を生じることがある。ま
た、有機感光体表面の形状がランダムに加工されるため
交差する形状が多くなり、表面粗さを粗くするとバリ状
表面となり易く、有機感光体外観欠陥や画像黒ポチ欠陥
が多くなり、歩留まりを悪くし、再利用の意味がなくな
る。That is, the aluminum or aluminum alloy base of the cylindrical electrophotographic organic photoreceptor has an inner / outer diameter as it is subjected to plastic working such as drawing or an inner diameter as it is subjected to plastic working such as drawing due to the progress of production technology in recent years. It has come to be used after turning the outside diameter. When trying to reuse the substrate, the dimensional accuracy for plastic processing, the outer diameter inner circumference runout on the basis of the inner diameter is large, many of 0.05 mm or more, the recycling processing method is limited, A method of removing the organic photoreceptor film with a solvent and thereafter reducing the margin for the outer diameter, such as a polishing method, a belt polishing method, and a buff polishing method, or adopting a method according to the outer diameter has been adopted. Removal with a solvent only removes the organic photoreceptor film.If the coating film is defective due to a defect in the substrate, there are surface scratches, streaks in turning, and minute burrs. Since it remains and cannot be reused as it is, it is necessary to adopt a method that follows the outer diameter such as a polishing method, a belt polishing method, and a buff polishing method. Sisters,
They are being discarded depending on the production yield. In addition, depending on the layer structure of the organic photoreceptor film, a thermosetting film is employed, and a solvent or the like requires a long time for stripping, or a flammable solvent causes a disadvantage such as an increase in equipment cost. Yes, they tend to be discarded depending on the production yield. In addition, a method that follows the outer diameter such as a polishing method, a belt polishing method, and a buff polishing method cannot produce a regularly controlled organic photoreceptor substrate surface,
Depending on the number of dots written by the laser light image forming light on the organic photoreceptor, image defects in the form of interference fringes may occur. In addition, since the shape of the surface of the organic photoreceptor is randomly processed, the number of intersecting shapes increases, and if the surface roughness is roughened, it tends to become a burr-like surface, and the number of organic photoreceptor appearance defects and image black spot defects increases, thereby increasing the yield. Worse, reuse is meaningless.

【０００７】[0007]

【発明が解決しようとする課題】本発明の目的は、有機
感光体塗布膜外径を加工基準として塑性加工のままの内
径に振れ取りのためのインロー加工を施して外径振れ精
度を良くし、そのインローを高精度のチャックにて握持
して外径加工を行ない、除去困難な熱硬化性樹脂である
下引き層の除去と最小限の旋削代による外径加工を同時
に行ない、有機感光体基体の再利用を可能とすることに
ある。SUMMARY OF THE INVENTION It is an object of the present invention to improve the accuracy of the outer diameter run-out by subjecting the inner diameter of the plastic photo-processed to the inner diameter of the plastic photosensitive film as a processing reference by performing a spigot process for shaking off. , The outer diameter is processed by holding the spigot with a high-precision chuck, and the undercoat layer, which is difficult to remove, is simultaneously removed and the outer diameter is processed by a minimum turning allowance. An object of the present invention is to enable reuse of a body substrate.

【０００８】[0008]

【課題を解決するための手段】本発明者等は鋭意検討の
結果、上記課題は、本発明の（１）「引き抜き加工等の
塑性加工のままの内外径で使用されるアルミ又はアルミ
合金の基体、または引き抜き加工等の塑性加工のままの
内径で使用されるアルミ、またはアルミ合金の基体で外
径旋削加工等を施されて形成される円筒状電子写真用有
機感光体の基体再生方法において、その有機感光体塗布
膜の外径を握持し、両端内径の１５ｍｍ以下を有機感光
体塗布膜外径基準で内径円周振れ０．０３ｍｍ以下に振
れ取りインロー加工をした後、インロー部を支持し、有
機感光体塗布膜と基体外径とを旋削加工により除去し、
所望の粗さと外径精度に仕上げることを特徴とする基体
の再生加工方法」、（２）「前記インロー部の支持方法
は握持用爪開閉に無摺動式開閉チャックを使用し、無摺
動式開閉チャック爪外径は基体握持時の基体インロー径
で研磨加工したものを使用することを特徴とする前記
（１）項に記載の基体の再生加工方法」、（３）「前記
有機感光体塗布膜を旋削加工により除去と同時に基体外
径を所望の外径精度に仕上げる過程で、基体内径に挿入
押圧する緩衝材は、円筒状中空弾性部材に圧空圧力管理
された圧縮空気を注入し、膨張押圧保持させ、旋削加工
終了後減圧して取り出す方法であることを特徴とする前
記（１）又は（２）項に記載の基体の再生加工方法」に
よって達成されることを見い出した。Means for Solving the Problems The present inventors have conducted intensive studies and as a result, the above-mentioned problems have been solved by the present invention in (1) aluminum or aluminum alloy used in the inner and outer diameters as they are subjected to plastic working such as drawing. In a method for regenerating a substrate of a cylindrical electrophotographic organic photoreceptor formed by subjecting an outer diameter turning process or the like to a substrate or an aluminum or aluminum alloy substrate used at the inner diameter of a plastic process such as a drawing process or the like. After gripping the outer diameter of the organic photoreceptor coating film, the inner diameter of 15 mm or less at both ends is shaken to 0.03 mm or less in inner diameter circumferential run with respect to the outer diameter of the organic photoreceptor coating film, and then the spigot processing is performed. Support, remove the organic photoreceptor coating film and the outer diameter of the substrate by turning,
(2) "The method of supporting the spigot portion is to use a non-slidable open / close chuck for opening / closing gripping claws, (3) The method for regenerating a substrate according to the above (1), wherein the outer diameter of the movable opening / closing chuck claw is polished with the diameter of the substrate inlay at the time of gripping the substrate. In the process of removing the photoreceptor coating film by turning and finishing the outer diameter of the substrate to the desired outer diameter accuracy at the same time as the buffer material inserted and pressed into the inner diameter of the substrate, compressed air controlled by air pressure is injected into the cylindrical hollow elastic member. And a method in which the substrate is expanded, pressed and held, and taken out under reduced pressure after the completion of the turning process, which is achieved by the above-mentioned (1) or (2).

【０００９】[0009]

【発明の実施の形態】以下、図面によって本発明を詳細
に説明する。図１は円筒状電子写真用有機感光体基体の
断面図であり、有機感光体（１）に駆動用部品（２）及
び（３）が取り付けられた形態を示したものである。有
機感光体（１）の両端内径（ａ）、（ｂ）に駆動用部品
（２）及び（３）の挿入ボス部が軽圧入の状態で挿入さ
れる。このとき、駆動用部品（２）の挿入ボス部先端端
面に取り付けられた電極板（６）が、感光体基体内径に
接触し、外部への電気導通が取れるよう構成されてい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view of a cylindrical electrophotographic organic photoreceptor substrate, showing a form in which driving parts (2) and (3) are attached to an organic photoreceptor (1). The insertion bosses of the driving parts (2) and (3) are inserted into the inner diameters (a) and (b) of both ends of the organic photoreceptor (1) with a light press fit. At this time, the electrode plate (6) attached to the tip end face of the insertion boss portion of the driving component (2) is configured to come into contact with the inner diameter of the photoreceptor base and establish electrical conduction to the outside.

【００１０】図２は、有機感光体の層構成の１例であ
り、導電性の基体（７）、下引き層（８）、電荷発生層
（９）、電荷輸送層（１０）からなっている。下引き層
（８）は電荷発生層（９）を均一に塗布するため、及び
光書き込み光源がレーザー光の場合は電荷発生層（９）
で吸収されなかった光を散乱させ、整反射による干渉縞
のような異常画像の形成を抑制するため酸化チタンやア
ルミナ微粉末等の光散乱剤が分散され成膜されている。
この下引き層（８）が絶縁性材料で構成される場合は、
その膜厚は２〜６μｍ、電気抵抗制御型である場合は５
〜１５μｍ程度で熱硬化性樹脂により成膜されるのが電
気特性上主流であり、基体再生を行なう場合は除去が非
常に困難であり、種々の方法が提案されている。FIG. 2 shows an example of the layer structure of the organic photoreceptor, which comprises a conductive substrate (7), an undercoat layer (8), a charge generation layer (9), and a charge transport layer (10). I have. The undercoat layer (8) is for uniformly coating the charge generation layer (9), and when the optical writing light source is a laser beam, the charge generation layer (9).
Light scattering agents such as titanium oxide and alumina fine powder are dispersed to form a film in order to scatter light that has not been absorbed by the above and to suppress the formation of abnormal images such as interference fringes due to regular reflection.
When the undercoat layer (8) is made of an insulating material,
The film thickness is 2 to 6 μm, and 5 if the electric resistance control type is used.
A film formed of a thermosetting resin with a thickness of about 15 μm is the mainstream in terms of electrical characteristics, and it is very difficult to remove the substrate when regenerating the substrate, and various methods have been proposed.

【００１１】図３は、振れ取りインロー加工の１例を示
す図で、駆動用部品（２）及び（３）の取り外された有
機感光体（１１）外径を主軸台両端に取り付けられたコ
レット式チャック（１２）、（１３）で握持し、有機感
光体（１１）を回転駆動させて旋削刃具（１４）でイン
ロー加工を施す形態を示す。この外径基準の加工方法で
インロー加工（例えばエグロ社製、精密ＣＮＣ両端加工
機ＢＳを使用）を施すと、その加工精度は非常によく、
塑性加工のままの精度で外径円周振れが０．０５ｍｍ以
上あるものが、これにより０．０３ｍｍ以下とすること
ができる。FIG. 3 is a view showing an example of the run-out spigot processing, in which the outer diameter of the organic photoreceptor (11) from which the driving parts (2) and (3) are removed is attached to both ends of the headstock. An example is shown in which the organic photoreceptor (11) is gripped by the chucks (12) and (13), and the organic photoreceptor (11) is rotationally driven to perform spigot processing with a turning blade (14). When the spigot processing (for example, using a precision CNC double-end processing machine BS manufactured by Egro Co., Ltd.) is performed with this processing method based on the outer diameter, the processing accuracy is very good,
In the case where the outside diameter circumferential runout is 0.05 mm or more with the precision as it is in the plastic working, it can be reduced to 0.03 mm or less.

【００１２】図４は、振れ取りインロー加工の他の１例
を示す図で、固定Ｖ受け台（１５）にセット後、押えＶ
受け台（１６）で有機感光体（１７）外径を固定後、左
右の回転駆動旋削刃具（１８）にてインロー加工（例え
ばエグロ社製、精密ＣＮＣ両端加工機ＵＢ−６００を使
用）を施す形態を示し、上記同様の加工精度０．０３ｍ
ｍ以下のものが得られる。FIG. 4 is a view showing another example of the run-out spigot processing, in which the presser V is set on the fixed V receiving table (15).
After fixing the outer diameter of the organic photoreceptor (17) with the pedestal (16), inlay processing (for example, using a precision CNC double-end processing machine UB-600, manufactured by Egro Corporation) is performed with left and right rotary drive turning tools (18). The form is shown and the processing accuracy is the same as above: 0.03m
m or less are obtained.

【００１３】図５は、インロー加工により外径円周振れ
精度が０．０３ｍｍ以下に施された有機感光体（１９）
を握持用爪（２２）の開閉に無摺動式開閉チャック（藤
井精密工業株式会社製、エアーバルーンチャック、クラ
フトグラフィー、ダイナミックツール株式会社製ダイア
フラムチャック）（２１）、（２３）を用いて加工され
たインロー部を握持し、有機感光体塗布膜と共に有機感
光体基体外径を旋削刃具（２４）で所定寸法に旋削を施
す状態を示す。旋削加工時は、切り粉吸引フード（２
５）により効率よく切り粉の回収を行ない、飛散防止を
し、有機感光体塗布膜中の分散剤による旋削装置駆動系
の摩耗を防ぐようにする。また、有機感光体基体は肉厚
が薄いため、旋削時のビビリ振動等を防ぎ、表面を精度
よく仕上げる目的から緩衝材（２６）を挿入押圧し、旋
削終了後テール側の握持用爪を閉じて無摺動式開閉チャ
ック（２３）を移動させ、有機感光体基体内径をロボッ
ト等の移載機で握持し、主軸側無摺動式開閉チャック
（２１）を閉じて有機感光体基体を搬送する。FIG. 5 shows an organic photoreceptor (19) having an outer diameter circumferential runout accuracy of not more than 0.03 mm by a spigot process.
Non-sliding open / close chuck (Fujii Seimitsu Kogyo Co., Ltd., Air Balloon Chuck, Kraftgraphy, Dynamic Tool Co., Ltd. Diaphragm Chuck) (21), (23) for opening and closing the gripping claw (22) This shows a state in which the processed spigot portion is gripped and the outer diameter of the organic photoreceptor base is turned to a predetermined size with a turning blade (24) together with the organic photoreceptor coating film. When turning, use a swarf suction hood (2
According to 5), the chips are efficiently collected, scattering is prevented, and wear of the driving system of the turning device due to the dispersant in the coating film of the organic photoreceptor is prevented. In addition, since the organic photoreceptor base is thin, it prevents chattering vibration during turning, inserts and presses a cushioning material (26) for the purpose of finishing the surface with high precision, and after the turning is completed, grips the tail side gripping claw. Close and move the non-slidable open / close chuck (23), grasp the inner diameter of the organic photosensitive body with a transfer machine such as a robot, and close the spindle side non-slidable open / close chuck (21) to close the organic photosensitive body. Is transported.

【００１４】図６は、緩衝材の全体断面図で、有機感光
体基体への挿入ガイド（２７）と円筒状弾性部材（２
８）と圧空供給開閉用バルブ（２９）と圧空供給時にク
ランプ機構となる圧空供給口（３０）が取り付けられて
いる。有機感光体基体に挿入後、圧空供給部（３１）を
接合し、圧空圧力０．０１ＭＰａ〜０．３ＭＰａの管理
設定された圧力にて膨張させ、有機感光体基体内径面に
円筒状弾性部材（２８）外径面を押圧密着させる構造で
ある。有機感光体基体からの取り出しは、圧空供給部
（３１）の中心部押しピン（３２）でバルブ（２９）の
先端を押し圧空の排気を行ない、抜き取りを行なう。円
筒状弾性部材（２８）の外径表面にはシームレスナイロ
ン繊維等の部材を被覆する方法をとると、出し入れ時の
摩耗に対して有効である。FIG. 6 is an overall cross-sectional view of the cushioning member, showing an insertion guide (27) into the organic photosensitive body and a cylindrical elastic member (2).
8), a compressed air supply opening / closing valve (29), and a compressed air supply port (30) serving as a clamp mechanism when supplying compressed air. After being inserted into the organic photoreceptor substrate, the compressed air supply unit (31) is joined, expanded under a pressure set at a controlled pressure of 0.01 MPa to 0.3 MPa, and a cylindrical elastic member ( 28) A structure in which the outer diameter surface is pressed and adhered. The removal from the organic photoreceptor substrate is performed by pressing the tip of the valve (29) with the center push pin (32) of the compressed air supply unit (31) and exhausting the compressed air. If a method of covering the outer diameter surface of the cylindrical elastic member (28) with a member such as a seamless nylon fiber is adopted, it is effective against abrasion at the time of putting in and out.

【００１５】[0015]

【発明の効果】以上、詳細且つ具体的な説明より明らか
なように、本発明の請求項１の方法により、円筒状電子
写真用有機感光体の外径を基準として内径円周振れ０．
０３ｍｍ以下に精度よく振れ取りインロー旋削加工を施
し、外径加工を行なう基準を造るため、外径加工旋削代
を非常に少なくでき、基体の欠陥のために塗膜不良とな
ったもの、また、表面の傷や、旋削加工のすじや微少な
バリで塗膜不良となったものを除去できる余裕が出て非
常な利点となる。また、基体の振れ取りがされているた
め、旋削中の加工量変動が小さくなり、ビビリ振動等が
軽減でき、ウネリのない安定な表面粗さとなり、有機感
光体塗膜と基体表面を取り外しをせずに所望の粗さと寸
法精度に旋削加工できるため、非常に効率的となる。As is apparent from the above detailed and concrete description, the method according to claim 1 of the present invention provides a method of producing a cylindrical electrophotographic photosensitive member for electrophotography in which the inner circumferential circumference of the organic photosensitive member is reduced by 0.degree.
In order to create a standard for performing outside diameter machining by performing run-out inlay turning with a precision of 03 mm or less, the machining allowance for outside diameter machining can be extremely reduced, and coating defects due to defects in the base, This is a great advantage because there is room to remove surface defects, coating streaks caused by turning and fine burrs, which have become defective. In addition, since the substrate is deflected, fluctuations in the processing amount during turning are reduced, chatter vibration and the like can be reduced, the surface roughness becomes stable without undulation, and the organic photoreceptor coating film and the substrate surface must be removed. It is very efficient because it can be turned to the desired roughness and dimensional accuracy without having to do so.

【００１６】また、本発明の請求項２の方法により、円
筒状電子写真用有機感光体の引き抜き加工等の塑性加工
のままの内径で外径旋削加工等を施されるものの基体内
径握持方法は、爪の開閉にガイド部を持つ摺動式が主流
を占めているが、切り粉や摩耗による動作不良から基体
加工精度を悪くしてしまうことがしばしば起こり、量産
時の問題を引き起こすことが多く、頻繁にメンテナンス
を行ない、維持管理する必要があった。爪の開閉にガイ
ド部を持たない無摺動式開閉チャックを外径旋削と有機
感光体膜除去に組み合わせれば、切り粉や摩耗による動
作不良から基体加工精度を悪くしてしまうことがなくな
り、安定した量産性を得ることができ、維持管理が容易
となる。また、無摺動式開閉チャックを基体握持時の径
で爪研磨を行なうことで、繰り返し寸法精度は１μｍ以
下、真円度０．３μｍ以下が可能となるため、外径旋削
代を少なくでき、旋削により繰り返しの基体再利用が可
能となる。また、旋削による基体再利用では従来の旋削
装置本体と加工ラインの切り粉回収ラインの一部を改良
すれば、そのまま使用できる利点があり、実施効果が大
きい。According to a second aspect of the present invention, there is provided a method of gripping an inner diameter of a substrate, wherein an outer diameter turning operation or the like is performed at an inner diameter while plastic processing such as a drawing operation of a cylindrical organic photoreceptor is performed. The mainstream is the sliding type, which has a guide part for opening and closing the claw.However, it often happens that the processing accuracy of the base is deteriorated due to malfunction due to cutting chips and abrasion, which may cause problems in mass production. In many cases, it was necessary to perform frequent maintenance and maintenance. By combining a non-slidable opening / closing chuck that has no guide for opening and closing the nail with outer diameter turning and removal of the organic photoreceptor film, the processing accuracy of the base is not degraded due to malfunction due to cutting chips and abrasion, Stable mass productivity can be obtained, and maintenance is easy. In addition, by performing nail polishing with the diameter of the non-sliding type opening / closing chuck at the time of gripping the base, repeated dimensional accuracy can be 1 μm or less and roundness 0.3 μm or less, so that the outer diameter turning allowance can be reduced. Turning allows repeated reuse of the substrate. Further, in the reuse of the substrate by turning, if the conventional turning device body and a part of the chip recovery line of the processing line are improved, there is an advantage that the chip can be used as it is, and the effect of the present invention is large.

【００１７】また、本発明の請求項３の方法により、円
筒状電子写真用有機感光体の外径旋削加工では、所望の
安定した粗さと表面寸法精度に旋削加工するため基体の
剛性を保たなければならない。塗布膜によっては基体表
面に０．６μｍの段差を生じると欠陥となってしまうた
め、引き抜き加工等の塑性加工の薄肉管では内径に緩衝
材を入れて外径旋削加工を施さなければならない。この
緩衝材の基体内径への押圧力調整は緩衝材の弾性力や材
質及び寸法等に非常なノウハウを伴い難しいものであっ
たが、円筒状弾性部材を圧縮空気により膨張させて押接
しその圧力条件を調整すれば適正な値が得られ易く、管
理が容易となる。また、圧縮空気供給及び排出バルブを
備えれば円筒状弾性部材出し入れの摩耗も少なくなり、
着脱も非常に容易となって安定した生産性を得ることが
できる。According to the method of the third aspect of the present invention, in the outer diameter turning of the organic electrophotographic photosensitive member for cylindrical electrophotography, the rigidity of the substrate is maintained in order to perform the turning to the desired stable roughness and surface dimensional accuracy. There must be. Depending on the coating film, if a step of 0.6 μm is generated on the surface of the base, it becomes a defect. Therefore, in a thin-walled tube for plastic working such as drawing, it is necessary to insert a cushioning material into the inner diameter and perform outer diameter turning. It was difficult to adjust the pressing force of the cushioning material against the inner diameter of the base body because it required a great deal of know-how in the elasticity, material, dimensions, etc. of the cushioning material. If the conditions are adjusted, an appropriate value is easily obtained, and the management becomes easy. Also, if a compressed air supply and discharge valve is provided, the wear of the cylindrical elastic member is reduced,
The attachment / detachment is also very easy, and stable productivity can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図１】円筒状電子写真用有機感光体基体の断面図であ
る。FIG. 1 is a sectional view of a cylindrical organic photoreceptor substrate for electrophotography.

【図２】有機感光体の層構成の１例を示した図である。FIG. 2 is a diagram illustrating an example of a layer configuration of an organic photoreceptor.

【図３】本発明の振れ取りインロー加工の１例を示す図
である。FIG. 3 is a view showing one example of a run-out spigot processing of the present invention.

【図４】本発明の振れ取りインロー加工の他の１例を示
す図である。FIG. 4 is a view showing another example of the run-out spigot processing of the present invention.

【図５】本発明の振れ取りインロー加工後の感光体基体
外径と感光層膜の施削加工の１例を示す図である。FIG. 5 is a diagram showing an example of the outer diameter of a photoconductor substrate and a shaving process of a photosensitive layer film after a run-out spigot process of the present invention.

【図６】本発明の加工方法に用いる緩衝材の断面を示す
図である。FIG. 6 is a diagram showing a cross section of a cushioning material used in the processing method of the present invention.

【符号の説明】[Explanation of symbols]

１ 有機感光体 ２ 駆動用部品 ３ 駆動用部品 ａ 内径 ｂ 内径 ４ 駆動部品インロー部 ５ 駆動部品インロー部 ６ 電極板 ７ 基体 ８ 下引き層 ９ 電荷発生層 １０ 電荷輸送層 １１ 有機感光体 １２ 両端加工チャック １３ 両端加工チャック １４ 旋削刃具 １５ Ｖ型両端加工チャック １６ Ｖ型両端加工チャック １７ 有機感光体 １８ 回転式旋削刃具 １９ 有機感光体 ２０ 旋盤主軸 ２１ 主軸側握持用チャック本体 ２２ 握持用爪 ２３ テール側握持用チャック本体 ２４ 外径加工用旋削刃具 ２５ 切り粉吸引フード ２６ 緩衝材 ２７ 挿入ガイド ２８ 円筒状弾性部材 ２９ バルブ ３０ 圧空供給口 ３１ 圧空供給部 ３２ 押しピン DESCRIPTION OF SYMBOLS 1 Organic photoreceptor 2 Driving part 3 Driving part a Inner diameter b Inner diameter 4 Driving part spigot part 5 Driving part spigot part 6 Electrode plate 7 Base 8 Subbing layer 9 Charge generation layer 10 Charge transport layer 11 Organic photoreceptor 12 Both ends processing Chuck 13 Both-end processing chuck 14 Turning blade 15 V-type both-end processing chuck 16 V-type both-end processing chuck 17 Organic photoreceptor 18 Rotary turning blade 19 Organic photoreceptor 20 Lathe main spindle 21 Main spindle side gripping chuck body 22 Gripping claw 23 Tail-side grip chuck body 24 Turning tool for outer diameter processing 25 Chip suction hood 26 Buffer material 27 Insertion guide 28 Cylindrical elastic member 29 Valve 30 Compressed air supply port 31 Compressed air supply unit 32 Push pin

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 引き抜き加工等の塑性加工のままの内外
径で使用されるアルミ又はアルミ合金の基体、または引
き抜き加工等の塑性加工のままの内径で使用されるアル
ミ、またはアルミ合金の基体で外径旋削加工等を施され
て形成される円筒状電子写真用有機感光体の基体再生方
法において、その有機感光体塗布膜の外径を握持し、両
端内径の１５ｍｍ以下を有機感光体塗布膜外径基準で内
径円周振れ０．０３ｍｍ以下に振れ取りインロー加工を
した後、インロー部を支持し、有機感光体塗布膜と基体
外径とを旋削加工により除去し、所望の粗さと外径精度
に仕上げることを特徴とする基体の再生加工方法。1. An aluminum or aluminum alloy substrate used with an inner or outer diameter as it is subjected to plastic processing such as drawing, or an aluminum or aluminum alloy substrate used with an inner diameter as it is subjected to plastic processing such as drawing. In a method of regenerating a substrate for an organic photoreceptor for cylindrical electrophotography formed by performing outer diameter turning or the like, the outer diameter of the organic photoreceptor coating film is grasped, and the inner diameter of both ends is reduced to 15 mm or less. After the inner diameter circumferential runout is reduced to 0.03 mm or less on the basis of the outer diameter of the film, the inner portion is supported, the inner surface is supported, and the organic photoreceptor coating film and the outer diameter of the substrate are removed by turning to obtain a desired roughness and outer surface. A method for reprocessing a substrate, characterized in that the substrate is finished to a diameter accuracy. 【請求項２】 前記インロー部の支持方法は握持用爪開
閉に無摺動式開閉チャックを使用し、無摺動式開閉チャ
ック爪外径は基体握持時の基体インロー径で研磨加工し
たものを使用することを特徴とする請求項１に記載の基
体の再生加工方法。2. The method of supporting the spigot portion uses a non-slidable type opening / closing chuck for opening and closing the gripping jaws, and the outer diameter of the non-slidable type opening / closing chuck jaws is polished by the base spigot diameter when the substrate is gripped. The method for reclaiming a substrate according to claim 1, wherein the substrate is used. 【請求項３】 前記有機感光体塗布膜を旋削加工により
除去と同時に基体外径を所望の外径精度に仕上げる過程
で、基体内径に挿入押圧する緩衝材は、円筒状中空弾性
部材に圧空圧力管理された圧縮空気を注入し、膨張押圧
保持させ、旋削加工終了後減圧して取り出す方法である
ことを特徴とする請求項１又は２に記載の基体の再生加
工方法。3. In the process of removing the organic photoreceptor coating film by turning and finishing the outer diameter of the substrate to a desired outer diameter accuracy at the same time, the cushioning material inserted and pressed into the inner diameter of the substrate is compressed air pressure to the cylindrical hollow elastic member. 3. The method for regenerating a substrate according to claim 1 or 2, wherein a controlled compressed air is injected, expanded and held, and the pressure is reduced and taken out after turning.