JP2001077247A - Electronic part case - Google Patents
Electronic part caseInfo
- Publication number
- JP2001077247A JP2001077247A JP24523799A JP24523799A JP2001077247A JP 2001077247 A JP2001077247 A JP 2001077247A JP 24523799 A JP24523799 A JP 24523799A JP 24523799 A JP24523799 A JP 24523799A JP 2001077247 A JP2001077247 A JP 2001077247A
- Authority
- JP
- Japan
- Prior art keywords
- container
- opening
- semiconductor element
- resin
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】小型化を実現する電子部品容
器を目指すもので、主に移動体通信分野などに使用され
る無線通信機器や携帯電話機に搭載する積層基板を用い
半導体搭載容器と圧電振動子収納容器を重ね合わせたと
きの精度を向上する容器構造に関する。BACKGROUND OF THE INVENTION The present invention aims at a miniaturized electronic component container, and uses a laminated substrate mounted on a wireless communication device or a mobile phone mainly used in a mobile communication field or the like, and uses a semiconductor mounting container and a piezoelectric vibrator. The present invention relates to a container structure that improves accuracy when child storage containers are stacked.
【０００２】[0002]
【従来の技術】従来から用いられる圧電発振器は、図３
（ａ）に示すように積層基板の凹部内に埋め込むように
集積回路を配置し、その上部に気密容器形状を成した圧
電振動子を配置し圧電発振器を構成している。2. Description of the Related Art A conventional piezoelectric oscillator is shown in FIG.
As shown in (a), an integrated circuit is arranged so as to be embedded in a concave portion of a laminated substrate, and a piezoelectric vibrator having an airtight container shape is arranged above the integrated circuit to constitute a piezoelectric oscillator.
【０００３】積層基板は通常アルミナ材料を用いたセラ
ミック基板が使われており、昨今の電子部品の傾向と要
求とから小型化、軽量化、薄型化が必須条件にあること
から、小さい電子部品容器に半導体素子を搭載し、半導
体素子の保護および固着強度を補強するための樹脂の充
填が図３（ｂ）に示すような容器凹部の開口周辺まで達
する状態の構造となっている。上述するように、集積回
路などの半導体素子を搭載する容器と、圧電振動子を収
納する容器とを重ね合わせ一体化することにより、圧電
発振器を小型化することを実現していた。[0003] A ceramic substrate using an alumina material is usually used for the laminated substrate, and since the trend and demands of the electronic components in recent years have made it necessary to reduce the size, weight and thickness of the substrate, a small electronic component container is required. A semiconductor element is mounted on the semiconductor device, and a resin filling for protecting the semiconductor element and reinforcing the fixing strength reaches the periphery of the opening of the container recess as shown in FIG. 3B. As described above, the size of the piezoelectric oscillator has been reduced by stacking and integrating a container for mounting a semiconductor element such as an integrated circuit and a container for storing the piezoelectric vibrator.
【０００４】[0004]
【発明が解決しようとする課題】前述するように、最近
の傾向として無線通信機器や携帯電話機など移動体通信
分野を中心に小型化、軽量化、薄型化が急激な展開を見
せている中、図５に示すように積層基板に埋め込むよう
に集積回路を配置し、その上部に圧電振動子を収納した
気密容器を重ね合わせ一体化し配置した圧電発振器の構
成では、半導体素子を搭載する容器上端部（重ね合わ
せ）の平坦度が要求されてくる。As described above, as a recent trend, the miniaturization, weight reduction, and thinning have been rapidly developed mainly in the field of mobile communication such as wireless communication devices and mobile phones. As shown in FIG. 5, in a configuration of a piezoelectric oscillator in which an integrated circuit is arranged so as to be embedded in a laminated substrate and an airtight container housing a piezoelectric vibrator is superposed and integrated on the integrated circuit, an upper end portion of the container in which a semiconductor element is mounted is provided. (Overlay) flatness is required.
【０００５】要するに前記の半導体素子を搭載する容器
上端部の平坦度が悪いと、半導体素子を搭載する容器
と、圧電振動子を搭載する容器との重ね合わせ精度が悪
くなり、重ね合わせて一体化して構成する圧電発振器の
高さ方向の寸法精度が均一にならないばかりか、両容器
（半導体搭載容器と圧電振動子収納容器）の接続状態も
不安定になることから、仮に両容器間を電気的に接続す
るような配線接続が施されている場合には、接続不良な
どを招くおそれがある。[0005] In short, if the flatness of the upper end portion of the container on which the semiconductor element is mounted is poor, the overlay accuracy of the container on which the semiconductor element is mounted and the container on which the piezoelectric vibrator is mounted is deteriorated. Not only is the dimensional accuracy in the height direction of the piezo-electric oscillator constructed inconsistent, but also the connection between the two containers (semiconductor mounting container and piezoelectric vibrator storage container) becomes unstable. If a wiring connection is made such that the connection is poor, there is a possibility that a connection failure or the like may occur.
【０００６】[0006]
【課題を解決する手段】これらの課題を解決するために
本発明は、半導体素子を搭載する容器の上端部（圧電振
動子を収納する容器との接合部）の平坦度を向上するた
めに、積層構造の凹状形状容器の開口部の少なくとも一
層の積層基板の穴寸法が凹部寸法より小さい寸法にした
（容器の凹部開口部の穴面積が凹部の底面積より小さ
い）電子部品容器に半導体を搭載することを特徴とする
ものである。SUMMARY OF THE INVENTION In order to solve these problems, the present invention has been made to improve the flatness of the upper end portion of a container on which a semiconductor element is mounted (joint portion with a container for storing a piezoelectric vibrator). A semiconductor is mounted on an electronic component container in which the hole size of at least one layer of the laminated substrate in the opening portion of the concave container having a laminated structure is smaller than the concave portion size (the hole area of the concave opening portion of the container is smaller than the bottom area of the concave portion). It is characterized by doing.
【０００７】[0007]
【背景】昨今の半導体実装技術において、（ベアチップ
ＬＳＩ実装面部に）フリップチップ実装強度を補強する
ために、ベアチップＬＳＩとの間隙部に充填される熱硬
化性の液体でなるアンダーフィル用樹脂を用いている。
この技術が圧電発振器の発振回路部にも広く応用されて
いる。例えば本明細書の従来の技術にも記述される、半
導体素子を搭載する電子部品容器もまさに上記技術を用
いたものである。BACKGROUND ART In recent semiconductor mounting technology, in order to reinforce flip chip mounting strength (on a bare chip LSI mounting surface), an underfill resin made of a thermosetting liquid filled in a gap with the bare chip LSI is used. ing.
This technique is widely applied to the oscillation circuit section of a piezoelectric oscillator. For example, an electronic component container on which a semiconductor element is mounted, which is also described in the prior art of this specification, is the one exactly using the above technology.
【０００８】要するに、半導体素子を搭載する電子部品
容器も半導体素子の接合強度を補強するために、アンダ
ーフィル用樹脂を充填している。ところが、収納容器自
身が非常に薄く、小型であるためアンダーフィル用樹脂
を充填する容積が少ないため、アンダーフィル用樹脂を
充填する分量を加減するのが非常に難しいことや、アン
ダーフィル用樹脂の流動性が良いために容器凹部の開口
部から、不必要にアンダーフィル用樹脂が突出し硬化し
てしまうおそれもある。上述する課題を解消するため
に、本願の特徴を持つ電子部品容器を構成するものであ
る。In short, an electronic component container on which a semiconductor element is mounted is also filled with an underfill resin in order to reinforce the bonding strength of the semiconductor element. However, since the storage container itself is very thin and small, the volume for filling the underfill resin is small, so it is very difficult to adjust the amount of the underfill resin to be filled. Since the fluidity is good, the resin for underfill may unnecessarily protrude from the opening of the concave portion of the container and may be hardened. In order to solve the problems described above, an electronic component container having the features of the present application is provided.
【０００９】[0009]
【発明の実施の形態】以下、添付図面に従ってこの発明
の実施例を説明する。なお、各図において同一の符号は
同様の対象を示すものとする。図１に本発明の電子部品
容器５の斜視図を示す。図１においてベースにはアルミ
ナ系材料を用いたセラミック積層基板やガラスエポキシ
樹脂基板が用いられており、半導体素子２を搭載する容
器と圧電振動子６を収納する容器とを重ね合わせ一体化
し圧電発振器を構成している。これらの容器は半導体素
子２（集積回路）からの接続のために、セラミック積層
基板（一般的にはセラミック積層基板の一層の厚みは、
０．１ミリ程度）は幾層（少なくとも２層〜３層）もの
ラミネート（積層）構造となっている。ここで、本実施
例は半導体素子２をフリップチップ形態で図示している
が、半導体帯素子２をワイヤーボンディング接続する形
態であっても構わない。Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 shows a perspective view of an electronic component container 5 of the present invention. In FIG. 1, a ceramic laminated substrate or a glass epoxy resin substrate using an alumina-based material is used as a base. Is composed. These containers are used for connection from the semiconductor element 2 (integrated circuit).
(Approximately 0.1 mm) has a laminate structure of several layers (at least two to three layers). Here, in this embodiment, the semiconductor element 2 is illustrated in a flip-chip form, but the semiconductor strip element 2 may be connected by wire bonding.
【００１０】要するに、積層基板により形成された凹部
１中には発振回路である半導体素子２を組み込んだ容器
の上部には気密容器形状を成した圧電振動子６を配置し
た構成で圧電発振器を形成する。なお、圧電振動子６
は、発振回路を組み込んだ積層基板とは、図示しない圧
電振動子６の電極部ではんだ付けにより固着し導通がと
られている。In short, a piezoelectric oscillator is formed in a configuration in which a piezoelectric vibrator 6 having an airtight container shape is arranged in a concave portion 1 formed by a laminated substrate and a container in which a semiconductor element 2 which is an oscillation circuit is incorporated is disposed above the container. I do. The piezoelectric vibrator 6
Is electrically connected to the laminated substrate incorporating the oscillation circuit by soldering at an electrode portion of the piezoelectric vibrator 6 (not shown).
【００１１】一方、図２には半導体素子２を搭載する容
器の断面図を示す。図２（ａ）は容器構造を説明し、図
２（ｂ）はアンダーフィル用樹脂３を充填した後の状態
を示すものである。図２（ａ）の容器断面図では半導体
素子２を搭載する容器を仮に三層構造のセラミックラミ
ネート基板として説明すると、半導体素子２を搭載する
基板（Ａ）と、凹部１空間を形成する基板（Ｂ）と開口
部を形成する基板（Ｃ）とから形成されている。また、
この凹部１空間にはセラミック基板に半導体素子２を搭
載し電気的な接続と固着を取る構造と、半導体素子２の
固着の強度を図るために、樹脂３が充填してある。FIG. 2 is a sectional view of a container on which the semiconductor element 2 is mounted. FIG. 2A illustrates the container structure, and FIG. 2B illustrates a state after the underfill resin 3 is filled. In the sectional view of the container in FIG. 2A, if the container on which the semiconductor element 2 is mounted is described as a three-layer ceramic laminated substrate, a substrate (A) on which the semiconductor element 2 is mounted and a substrate ( B) and a substrate (C) forming an opening. Also,
The cavity 1 is filled with a resin 3 in order to mount a semiconductor element 2 on a ceramic substrate to make electrical connection and fixation, and to increase the strength of the fixation of the semiconductor element 2.
【００１２】樹脂３は前述（背景）のように、昨今の容
器（電子部品）形状が薄型、小型であるため樹脂３を充
填する容積が少ないため、樹脂３を充填する分量を加減
するのが非常に難しいことや、樹脂３の流動性により容
器凹部１の開口部４から、不必要に樹脂３が突出し硬化
してしまうことにより、樹脂３を充填した後の容器凹部
１開口部４の平坦度精度は非常に不安定な状態しなって
しまう。As described above (background), since the shape of the resin (electronic component) is thin and small as described above (background), the volume to be filled with the resin 3 is small. Because the resin 3 unnecessarily protrudes from the opening 4 of the container recess 1 due to the fluidity of the resin 3 and hardens, the flatness of the opening 4 of the container recess 1 after the resin 3 is filled. The degree of accuracy is very unstable.
【００１３】そこで本発明の特徴である、容器の凹部１
開口部４の少なくとも一層の積層基板の寸法（Ｃ’：凹
部開口部穴面積）が凹部１寸法（Ｂ’：凹部底面積）よ
り小さい寸法（（Ｂ’）＞（Ｃ’））にすることによ
り、図２（ｂ）に示すように樹脂３が凹部１開口部４の
少なくとも一層のセラミック基板により樹脂３の溢れ出
しを防止し、開口部４上部を平坦化することを実現す
る。Therefore, the concave portion 1 of the container, which is a feature of the present invention, is provided.
The dimension (C ′: recess opening area) of at least one layered substrate in the opening 4 is smaller than the dimension of the recess 1 (B ′: bottom area of the recess) ((B ′)> (C ′)). Accordingly, as shown in FIG. 2B, the resin 3 is prevented from overflowing by the ceramic substrate of at least one layer of the opening 4 of the recess 1, and the upper part of the opening 4 is flattened.
【００１４】なお、本発明において、容器の凹部１開口
部４の少なくとも一層の積層基板が凹部１開口部４間口
より小さい寸法とし、０．１〜０．２ミリ程度（全体的
な外周寸法差として）を想定している。また、本実施例
では、半導体素子２を搭載する容器上部に圧電振動子６
を収納する容器を重ね一体化した圧電発振器を構成して
いるが、その上下関係に制約を受けるものではなく、容
器の凹部１を直接搭載回路基板（図示しない）に接した
形態で配置する場合であっても本発明の効果を奏するも
のである。In the present invention, at least one layer of the laminated substrate in the opening 4 of the recess 1 of the container has a size smaller than the width of the opening 4 of the recess 1 and is about 0.1 to 0.2 mm (overall outer dimension difference). As). Further, in the present embodiment, the piezoelectric vibrator 6
A piezoelectric oscillator is configured by stacking and integrating a container for storing the piezoelectric element, but the upper and lower relationship is not limited, and the concave portion 1 of the container is arranged in a form directly in contact with a mounting circuit board (not shown). Even so, the effects of the present invention are exhibited.
【００１５】上述の内容により、最近の要求課題である
小型化、軽量化、薄型化を実現しようとした場合での高
さ方向の寸法精度を飛躍的に向上することができる。な
お、本実施例はセラミックのラミネート構造を例に挙げ
たが、樹脂による容器成形により、開口部を凹部底面積
よりも小さい容器構造であっても本発明の効果を奏する
ものである。According to the above-mentioned contents, the dimensional accuracy in the height direction in the case of realizing the recent demands of miniaturization, weight reduction and thinning can be drastically improved. In the present embodiment, the ceramic laminated structure is taken as an example. However, the effects of the present invention can be achieved even if the container is formed with a resin and the opening is smaller than the bottom area of the concave portion.
【００１６】[0016]
【発明の効果】以上のように、本発明により樹脂の充填
の溢れ出を防止するために、半導体素子を搭載する容器
凹部開口部側の少なくとも一層を、凹部開口部寸法より
小さくすることにより、樹脂の溢れ出しを防止すること
ができる。その結果、容器同士の重ね合わせ時の精度が
向上できることや、重ね合わせ部の接触を確実に行うこ
とができ、製品寸法精度と、歩留まりの向上を実現でき
る。As described above, according to the present invention, in order to prevent overflow of the resin filling, at least one layer on the side of the concave portion of the container in which the semiconductor element is mounted is made smaller than the size of the concave portion. The resin can be prevented from overflowing. As a result, it is possible to improve the accuracy at the time of superimposing the containers, and it is possible to reliably perform the contact of the superimposed portion, thereby realizing the improvement of the product dimensional accuracy and the yield.
【図１】本発明の電子部品容器を示す斜視図である。FIG. 1 is a perspective view showing an electronic component container of the present invention.
【図２】本発明の半導体素子を搭載する容器構造を示す
断面図である。FIG. 2 is a cross-sectional view showing a container structure on which the semiconductor element of the present invention is mounted.
【図３】従来の電子部品容器を示す斜視図である。FIG. 3 is a perspective view showing a conventional electronic component container.
１ 凹部 ２ 半導体素子 ３ 樹脂 ４ 開口部 DESCRIPTION OF SYMBOLS 1 Concavity 2 Semiconductor element 3 Resin 4 Opening
Claims (4)
し、該半導体素子を樹脂で被う電子部品容器において、 該電子部品容器の凹部開口部が該凹部の底部面積より小
さいことを特徴とする電子部品容器。1. An electronic component container in which a semiconductor element is mounted in a concave portion of a concave-shaped container and the semiconductor element is covered with a resin, wherein an opening of the concave portion of the electronic component container is smaller than a bottom area of the concave portion. Electronic parts container.
て、該容器の凹部開口部の穴面積が該凹部の底面積より
小さいことを特徴とする電子部品容器。2. The electronic component container according to claim 1, wherein the container has a laminated structure, and a hole area of an opening of a concave portion of the container is smaller than a bottom area of the concave portion.
を特徴とする請求項２記載の電子部品容器。3. The electronic component container according to claim 2, wherein a laminated substrate of a ceramic substrate is used.
容器と、圧電振動子を搭載した容器とを一体化すること
により圧電発振器を構成することを特徴とする電子部品
容器。4. An electronic component container, wherein the electronic component container according to claim 1 and a container on which a piezoelectric vibrator is mounted are integrated to constitute a piezoelectric oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24523799A JP4244087B2 (en) | 1999-08-31 | 1999-08-31 | Electronic component container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24523799A JP4244087B2 (en) | 1999-08-31 | 1999-08-31 | Electronic component container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001077247A true JP2001077247A (en) | 2001-03-23 |
| JP4244087B2 JP4244087B2 (en) | 2009-03-25 |
Family
ID=17130709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24523799A Expired - Fee Related JP4244087B2 (en) | 1999-08-31 | 1999-08-31 | Electronic component container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4244087B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006238246A (en) * | 2005-02-28 | 2006-09-07 | Kyocera Kinseki Corp | Crystal oscillator and manufacturing method thereof |
| JP2007274455A (en) * | 2006-03-31 | 2007-10-18 | Nippon Dempa Kogyo Co Ltd | Surface mount crystal oscillator |
| JP2009124619A (en) * | 2007-11-19 | 2009-06-04 | Nippon Dempa Kogyo Co Ltd | Surface mounted crystal oscillator |
| JP2009176894A (en) * | 2008-01-23 | 2009-08-06 | Panasonic Corp | Optical semiconductor device |
| JP2015095717A (en) * | 2013-11-11 | 2015-05-18 | 日本電波工業株式会社 | Surface-mounted crystal oscillator |
-
1999
- 1999-08-31 JP JP24523799A patent/JP4244087B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006238246A (en) * | 2005-02-28 | 2006-09-07 | Kyocera Kinseki Corp | Crystal oscillator and manufacturing method thereof |
| JP4647339B2 (en) * | 2005-02-28 | 2011-03-09 | 京セラキンセキ株式会社 | Quartz oscillator and manufacturing method thereof |
| JP2007274455A (en) * | 2006-03-31 | 2007-10-18 | Nippon Dempa Kogyo Co Ltd | Surface mount crystal oscillator |
| JP2009124619A (en) * | 2007-11-19 | 2009-06-04 | Nippon Dempa Kogyo Co Ltd | Surface mounted crystal oscillator |
| JP2009176894A (en) * | 2008-01-23 | 2009-08-06 | Panasonic Corp | Optical semiconductor device |
| JP2015095717A (en) * | 2013-11-11 | 2015-05-18 | 日本電波工業株式会社 | Surface-mounted crystal oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4244087B2 (en) | 2009-03-25 |
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