JP2001067726A - Optical disk - Google Patents
Optical diskInfo
- Publication number
- JP2001067726A JP2001067726A JP23917099A JP23917099A JP2001067726A JP 2001067726 A JP2001067726 A JP 2001067726A JP 23917099 A JP23917099 A JP 23917099A JP 23917099 A JP23917099 A JP 23917099A JP 2001067726 A JP2001067726 A JP 2001067726A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- substrates
- thickness
- optical disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＤＶＤ−Ｖｉｄｅ
ｏ，ＤＶＤ−ＲＯＭ等の読み出し専用型、ＤＶＤ−Ｒ等
のライトワンス（追記）型、あるいはＤＶＤ−ＲＡＭ、
ＤＶＤ−ＲＷ等の書き換え可能型、等の各種光ディスク
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a DVD-Video
o, read-only type such as DVD-ROM, write-once (appendable) type such as DVD-R, or DVD-RAM,
The present invention relates to various rewritable optical disks such as a DVD-RW.
【０００２】[0002]
【従来の技術】従来の光ディスク複製方法は、表面に光
ヘッド案内溝及びアドレス等を表わすピットやセクタ・
マークあるいは記録情報などの凹凸パターンを有する、
フォトレジスト付き原盤からニッケルメッキによりスタ
ンパを作製し，そのスタンパを設置した金型内に恒温溶
解させたプラスチック基板材料（例えばポリカーボネイ
トなど）を流し込んだ後に固めて取り出すと表面に凹凸
パターンが複製されたプラスチック基板が完成する。こ
の基板上に直接または他の層を介して、反射膜またはレ
ーザー光照射によって変化する記録膜を形成し、この膜
に傷がつかないように紫外線硬化樹脂をスピン塗布して
硬化させるとＣＤ−Ａｕｄｉｏ、ＣＤ−、ＣＤ−ＲＯ
Ｍ、ＣＤ−Ｒなどの光ディスクは完成する。これに対
し、２枚の基板を貼り合わせる種類の光ディスクがあ
る。ＭＯ、ＰＤ、ＤＶＤ−ＲＯＭ、ＤＶＤ−Ｒ、ＤＶＤ
−ＲＡＭ、ＤＶＤ−ＲＷ等である。ＭＯ，ＰＤなどは
１．２ｍｍと厚い基板２枚を貼り合わせるため接着剤の
硬化収縮の影響はほとんど受けない。それに対しＤＶＤ
シリーズは基板の板厚が半分の０．６ｍｍと薄く、２枚
を貼り合わせてＣＤシリーズと同じ厚さ１．２ｍｍにな
る構造になっている。貼り合わせる際の接着剤としては
光あるいは熱または空気中の水分で硬化するタイプなど
各種ある。2. Description of the Related Art Conventional optical disk duplication methods employ optical head guide grooves and pits or sectors representing addresses and the like on the surface.
Having an uneven pattern such as marks or recorded information,
A stamper was prepared from a master with photoresist by nickel plating. A plastic substrate material (for example, polycarbonate) melted at a constant temperature was poured into a mold on which the stamper was installed, and then solidified and removed. The plastic substrate is completed. A reflective film or a recording film that is changed by laser light irradiation is formed on the substrate directly or through another layer, and a UV-curable resin is spin-coated and cured so that the film is not damaged. Audio, CD-, CD-RO
Optical disks such as M and CD-R are completed. On the other hand, there is an optical disk of a type in which two substrates are bonded. MO, PD, DVD-ROM, DVD-R, DVD
-RAM, DVD-RW, etc. MO, PD, and the like are hardly affected by curing shrinkage of the adhesive because two substrates having a thickness of 1.2 mm are bonded to each other. DVD
The series has a structure in which the thickness of the substrate is as thin as 0.6 mm, which is half, and the two sheets are bonded together to have the same thickness of 1.2 mm as the CD series. There are various types of adhesives for bonding such as a type which is cured by light, heat or moisture in the air.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術は板厚
１．２ｍｍの基板２枚を貼り合わせる方法であり、２枚
の基板が同じストレス、強度を持つものである。１．２
ｍｍの基板貼りあわせに比べ０．６ｍｍと薄い基板を貼
り合わせる際には反りなどの機械的に問題となる特性を
小さく抑えることが難しい。同じ反りをもつ基板２枚を
貼り合わせる場合には接着剤を介して２枚の基板の機械
的特性バランスを取ることは比較的容易である。しかし
ながらどちらか一枚の基板に膜がついていないあるいは
ストレスの小さい膜が形成されている場合、前述と同じ
様に貼り合わせると２枚の基板の機械的特性バランスは
取り難くなる。The above-mentioned prior art is a method of bonding two substrates having a thickness of 1.2 mm, and the two substrates have the same stress and strength. 1.2
When a substrate as thin as 0.6 mm is bonded as compared with a substrate having a thickness of 0.6 mm, it is difficult to suppress mechanically problematic characteristics such as warpage. When bonding two substrates having the same warpage, it is relatively easy to balance the mechanical properties of the two substrates via an adhesive. However, if one of the substrates has no film or a film with a small stress is formed, it is difficult to balance the mechanical properties of the two substrates by bonding together in the same manner as described above.
【０００４】本発明の目的は、従来の貼りあわせプロセ
スを変更することなく 貼りあわせ後の機械的に問題と
なる特性を小さく抑えた光ディスクを作製することにあ
る。[0004] It is an object of the present invention to produce an optical disk with reduced mechanically problematic characteristics after bonding without changing the conventional bonding process.
【０００５】[0005]
【課題を解決するための手段】上記目的は２枚の基板を
貼り合わせる光ディスクにおいて、ストレス、強度の違
いに応じて１００ミクロンの範囲内で板厚の異なる基板
を貼り合わせることにより達成される。The above object can be attained by bonding substrates having different thicknesses within a range of 100 microns according to differences in stress and strength in an optical disk in which two substrates are bonded.
【０００６】一般的にはこの２枚の基板は同じ板厚のも
のを用いる。なぜならプラスチック基板を作製する際に
流し込む金型で基板厚が固定されてしまうため、板厚の
異なる基板を作製するには別の金型を用意しなければな
らない。Generally, the two substrates have the same thickness. This is because the thickness of the substrate is fixed by the mold that is poured when producing a plastic substrate. Therefore, another mold must be prepared to produce substrates having different thicknesses.
【０００７】また、２枚の基板を貼り合わせる際の接着
剤は硬化する際に収縮する。したがってその硬化収縮を
考慮した貼り合わせが必要である。ストレス、強度の異
なる２枚の基板を貼り合わせる場合には当然、どちらか
弱い方の基板が接着剤の硬化収縮の影響を受け、２枚の
基板間の機械的特性バランスが保てない。[0007] The adhesive used for bonding the two substrates shrinks when cured. Therefore, it is necessary to perform bonding in consideration of the curing shrinkage. When two substrates having different stresses and strengths are bonded to each other, the weaker substrate is affected by the curing shrinkage of the adhesive, so that the mechanical characteristics balance between the two substrates cannot be maintained.
【０００８】従って本発明では次の構成とした。Therefore, the present invention has the following configuration.
【０００９】（１）少なくとも１枚の基板表面に光スポ
ット案内溝及び／またはアドレスピット、記録情報など
のエンボスピットからなる凹凸パターンを有する２枚の
基板を接着剤を用いて貼り合わせてある光ディスクにお
いて、前記２枚の基板厚が５〜１００ミクロンの範囲内
で異なることを特徴とする光ディスク。(1) An optical disk in which at least one substrate has two substrates having a light spot guide groove and / or a concavo-convex pattern composed of embossed pits such as address pits and recorded information on the surface of the substrate using an adhesive. 2. The optical disk according to claim 1, wherein the two substrates have different thicknesses within a range of 5 to 100 microns.
【００１０】（２）（１）に記載の光ディスクにおい
て、接着剤が光あるいは熱および空気中の水分などで硬
化することを特徴とする光ディスク。(2) The optical disk according to (1), wherein the adhesive is cured by light, heat, moisture in air, or the like.
【００１１】（３）（１）に記載の光ディスクにおい
て、直接または他の層を介して、一方の基板の上に反射
膜またはレーザー光照射によって変化する記録膜を形成
し、もう一方の基板には形成しないことを特徴とする光
ディスク。(3) In the optical disc described in (1), a reflection film or a recording film that changes by irradiation with a laser beam is formed on one substrate directly or via another layer, and the other substrate is formed on the other substrate. An optical disc characterized by not being formed.
【００１２】（４）（１）に記載の光ディスクにおい
て、直接または他の層を介して、一方の基板の上に反射
膜またはレーザー光照射によって変化する記録膜を形成
し、もう一方の基板は半透明な反射膜を形成したことを
特徴とする光ディスク。(4) In the optical disc described in (1), a reflection film or a recording film that changes by irradiation with laser light is formed on one substrate directly or via another layer, and the other substrate is formed on the other substrate. An optical disc having a translucent reflective film formed thereon.
【００１３】（５）（１）に記載の光ディスクにおい
て、直接または他の層を介して、一方の基板の上に反射
膜またはレーザー光照射によって変化する記録膜を形成
し、もう一方の基板にはレーザー光照射によって変化す
る半透明な記録膜を形成したことを特徴とする光ディス
ク。(5) In the optical disc described in (1), a reflection film or a recording film that changes by irradiation with laser light is formed on one substrate directly or via another layer, and the other substrate is formed on the other substrate. An optical disc characterized by forming a translucent recording film that changes by laser light irradiation.
【００１４】[0014]
【発明の実施の形態】表面に光ヘッド案内溝及びアドレ
ス等を表わすピットあるいは記録情報などの凹凸パター
ンを有する、フォトレジスト付き原盤からニッケルメッ
キによりスタンパを作製し，そのスタンパを設置した金
型内に恒温溶解させたプラスチック基板材料（例えばポ
リカーボネイトなど）を流し込んだ後に固めて取り出す
と表面に凹凸パターンが複製されたプラスチック基板が
出来上がる。この基板上に直接または他の層を介して、
反射膜またはレーザー光照射によって変化する記録膜等
を形成した。まずポリカーボネイト基板上に下部保護層
としてＺｎＳ・ＳｉＯ2膜を１２０ｎｍ、界面層であるＣ
ｒ2Ｏ3膜を５ｎｍ積層した後、情報を記録する層として
Ｇｅ−Ｓｂ−Ｔｅ膜を８ｎｍ積層した。さらに界面層で
あるＣｒ2Ｏ3層を５ｎｍ、上部保護層としてＺｎＳ・ Ｓ
ｉＯ2膜を１３５ｎｍ積層し、反射層および熱拡散層と
してＣｒ−Ｏ膜を３０ｎｍ、Ａｌ−Ｔｉ膜を８０ｎｍ積
層した。BEST MODE FOR CARRYING OUT THE INVENTION A stamper is formed by nickel plating from a master with a photoresist having an optical head guide groove, a pit representing an address, or a concavo-convex pattern such as recorded information on a surface, and a mold in which the stamper is installed. When a plastic substrate material (for example, polycarbonate or the like), which is melted at a constant temperature, is poured into the substrate and solidified, a plastic substrate having a concave and convex pattern replicated on the surface is obtained. On this substrate directly or through another layer,
A reflective film or a recording film that changes with laser light irradiation was formed. First 120nm and ZnS · SiO 2 film as a lower protective layer on a polycarbonate substrate, C is the interfacial layer
After laminating the r 2 O 3 film to a thickness of 5 nm, a Ge—Sb—Te film was laminated to a thickness of 8 nm as a layer for recording information. Further, a Cr 2 O 3 layer serving as an interface layer is 5 nm thick, and ZnS · S is used as an upper protective layer.
An iO 2 film was laminated to a thickness of 135 nm, and a Cr—O film was laminated to a thickness of 30 nm and an Al—Ti film was laminated to a thickness of 80 nm as a reflection layer and a heat diffusion layer.
【００１５】紫外線硬化樹脂を接着剤としてもう一枚の
膜を形成していない基板を貼り合わせると光ディスクの
完成である。貼り合わせ後の接着剤層の厚さは約３０ミ
クロンであった。An optical disk is completed when another substrate on which no film is formed is bonded using an ultraviolet-curable resin as an adhesive. The thickness of the adhesive layer after bonding was about 30 microns.
【００１６】この時の２枚の基板板厚と機械特性の関係
を表１に示す。機械的特性は反りを表すＲａｄｉａｌ Ｔ
ｉｌｔで示す。機械特性の測定はジャパンイーエム社製
ＤＬＤ３０００装置を使用した。ＰＣ基板の屈折率は
１．５８である。表中の縦軸は上記膜を形成した基板、
横軸は膜をつけていない透明基板である。Table 1 shows the relationship between the thickness of the two substrates and the mechanical characteristics at this time. The mechanical properties are Radial T indicating warpage.
Indicated by ilt. The mechanical characteristics were measured using a DLD3000 device manufactured by Japan EM. The refractive index of the PC board is 1.58. The vertical axis in the table is the substrate on which the film is formed,
The horizontal axis is a transparent substrate without a film.
【００１７】評価判定基準は ○は＜±０．５（ｄｅ
ｇ）、△は±０．５〜±０．７ （ｄｅｇ）、×は＞±
０．７（ｄｅｇ）とした。The evaluation criteria are as follows: ○ is <± 0.5 (de)
g), △ is ± 0.5 to ± 0.7 (deg), × is> ±
0.7 (deg).
【００１８】[0018]
【表１】 [Table 1]
【００１９】上記結果からわかるように２枚の基板が同
じ厚さである場合に比べ、厚さを変えた方がＲａｄｉａ
ｌ Ｔｉｌｔを小さくできる範囲が広くなった。As can be seen from the above results, the Radia has a different thickness as compared to the case where the two substrates have the same thickness.
The range in which l Tilt can be reduced has been widened.
【００２０】上記のように厚さの異なる基板を作るに
は、例えば射出成形時に樹脂を射出後、型を締める際、
圧力に差を付けることによって同じ金型で厚さの多少異
なる基板を作ることができる。In order to produce substrates having different thicknesses as described above, for example, when injecting a resin at the time of injection molding and then tightening a mold,
By making the pressure different, a substrate having a slightly different thickness can be produced with the same mold.
【００２１】上記以外の工程としてあらかじめ基板の光
入射側にハードコートを設けることや、接着剤からの影
響を防ぐために基板上に形成した記録膜等の上に保護コ
ートを設けることも場合によっては必要になるが、この
場合でも基板板厚を変えて最適条件を決めることは同じ
である。また縦軸のポリカーボネート基板にＡｌまたは
Ａｌ−ＴｉまたはＡｕの反射膜１００ｎｍを形成して同
様の実験を行った。 最適な条件は多少違うが基板板厚を
変えて最適条件を決めることは同じである。As a process other than the above, a hard coat may be provided in advance on the light incident side of the substrate, or a protective coat may be provided on a recording film or the like formed on the substrate in order to prevent the influence of the adhesive. Although it is necessary, in this case, the optimum conditions are determined by changing the substrate thickness. A similar experiment was conducted by forming a reflective film of Al, Al-Ti or Au on the polycarbonate substrate on the vertical axis with a thickness of 100 nm. Although the optimum conditions are slightly different, it is the same to determine the optimum conditions by changing the thickness of the substrate.
【００２２】また２枚の基板の組み合わせとして、縦軸
のポリカーボネート基板にＡｌまたはＡｌ−Ｔｉまたは
Ａｕの反射膜１００ｎｍ、横軸のポリカーボネート基板
には半透明反射層としてＳｉＮ膜を５５ｎｍを形成した
組み合わせについても同様の実験を行った。先の測定に
用いた基板とは形成した膜のストレスが異なるため、最
適な条件は多少違うが基板板厚を変えて最適条件を決め
ることは同じである。As a combination of two substrates, a polycarbonate substrate on the vertical axis has a reflection film of Al, Al—Ti or Au of 100 nm, and a polycarbonate substrate on the horizontal axis has a SiN film as a translucent reflection layer of 55 nm. A similar experiment was performed for Since the stress of the formed film is different from that of the substrate used in the previous measurement, the optimum conditions are slightly different, but it is the same to determine the optimum conditions by changing the thickness of the substrate.
【００２３】別に縦軸のポリカーボネート基板に下部保
護層としてＺｎＳ・ＳｉＯ2膜を１２０ｎｍ、界面層であ
るＣｒ2Ｏ3膜を５ｎｍ積層した後、情報を記録する層と
してＧｅ−Ｓｂ−Ｔｅ膜を８ｎｍ積層した。さらに界面
層であるＣｒ2Ｏ3層を５ｎｍ、上部保護層としてＺｎＳ
・ ＳｉＯ2膜を１３５ｎｍ積層し、反射層および熱拡散
層としてＣｒ−Ｏ膜を３０ｎｍ、Ａｌ−Ｔｉ膜を８０ｎ
ｍ積層し、横軸のポリカーボネート基板には半透明反射
層としてＳｉＮ膜３０ｎｍを形成した組み合わせについ
ても同様の実験を行った。この組み合わせについても前
述と同様基板板厚を変えて最適条件を決めることは同じ
である。Separately, a 120 nm ZnS.SiO 2 film as a lower protective layer and a 5 nm Cr 2 O 3 film as an interface layer are laminated on a polycarbonate substrate on the vertical axis, and a Ge—Sb—Te film is recorded as a layer for recording information. 8 nm was laminated. Further, a Cr 2 O 3 layer serving as an interface layer is 5 nm thick, and ZnS is used as an upper protective layer.
An SiO 2 film is laminated to a thickness of 135 nm, a Cr—O film is 30 nm as a reflection layer and a heat diffusion layer, and an Al—Ti film is 80 n.
A similar experiment was performed for a combination of m-layers and a 30-nm SiN film as a translucent reflective layer formed on a polycarbonate substrate on the horizontal axis. As for the combination, it is the same to determine the optimum conditions by changing the thickness of the substrate as described above.
【００２４】さらに２枚の基板の組み合わせとして、縦
軸のポリカーボネート基板に下部保護層としてＡｕ膜を
１０ｎｍ、ＺｎＳ・ＳｉＯ2膜を１００ｎｍ、情報を記録
する層としてＧｅ−Ｓｂ−Ｔｅ膜を１０ｎｍ、上部保護
層としてＺｎＳ・ ＳｉＯ2膜を２０ｎｍ、反射層Ａｌ−
Ｃｒ膜を８０ｎｍ積層した。横軸のポリカーボネート基
板には ＺｎＳ・ＳｉＯ2膜を１００ｎｍ 、情報を記録す
る層としてＧｅ−Ｓｂ−Ｔｅ膜を８ｎｍ、上部保護層と
してＺｎＳ・ ＳｉＯ2膜を１００ｎｍ積層した。Further, as a combination of two substrates, an Au film as a lower protective layer is 10 nm, a ZnS.SiO 2 film is 100 nm as a lower protective layer, and a Ge—Sb—Te film is 10 nm as a layer for recording information on the polycarbonate substrate on the vertical axis. 20 nm ZnS.SiO 2 film as upper protective layer, reflective layer Al-
An 80 nm Cr film was laminated. The polycarbonate substrate of the horizontal axis was 100nm laminated ZnS · SiO 2 film a Ge-Sb-Te film of ZnS · SiO 2 film 100nm, information as a layer for recording 8 nm, as the upper protective layer.
【００２５】この組み合わせについても前述と同様基板
板厚を変えて最適条件を決めることは同じである。In this combination, it is the same to determine the optimum condition by changing the substrate thickness in the same manner as described above.
【００２６】さらに別の積層構造として、縦軸のポリカ
ーボネート基板に下部保護層としてＺｎＳ・ＳｉＯ2膜を
１００ｎｍ、情報を記録する層としてＧｅ−Ｓｂ−Ｔｅ
膜を２５ｎｍ、上部保護層としてＺｎＳ・ ＳｉＯ2膜を
２０ｎｍ積層し、反射層および熱拡散層としてＡｌ−Ｃ
ｒ膜を８０ｎｍ積層した基板についても同様の実験を行
った。As still another laminated structure, a ZnS.SiO 2 film is formed as a lower protective layer on the polycarbonate substrate on the vertical axis at a thickness of 100 nm, and a Ge-Sb-Te layer is formed as a layer for recording information.
A 25 nm thick film, a 20 nm thick ZnS.SiO 2 film as an upper protective layer, and an Al-C
A similar experiment was performed on a substrate on which an r film was stacked to a thickness of 80 nm.
【００２７】この組み合わせについても前述と同様基板
板厚を変えて最適条件を決めることは同じである。For this combination, it is the same to determine the optimum conditions by changing the substrate thickness as described above.
【００２８】また別の組み合わせとして 縦軸のポリカ
ーボネート基板に下部保護層としてＺｎＳ・ＳｉＯ2膜を
１００ｎｍ、情報を記録する層としてＧｅ−Ｓｂ−Ｔｅ
膜を２５ｎｍ、上部保護層としてＺｎＳ・ ＳｉＯ2膜を
２０ｎｍ積層し、反射層および熱拡散層としてＡｌ−Ｃ
ｒ膜を８０ｎｍ積層し、横軸のポリカーボネート基板に
は透明誘電体層としてＳｉＮ膜を５５ｎｍ形成した。Further the ZnS · SiO 2 film on the polycarbonate substrate of the vertical axis as the lower protective layer as another combination 100 nm, information as a layer for recording Ge-Sb-Te
A 25 nm thick film, a 20 nm thick ZnS.SiO 2 film as an upper protective layer, and an Al-C
An r film was laminated to a thickness of 80 nm, and a 55 nm SiN film was formed as a transparent dielectric layer on the polycarbonate substrate on the horizontal axis.
【００２９】この組み合わせについても前述と同様基板
板厚を変えて最適条件を決めることは同じである。In this combination, the optimum condition is determined by changing the substrate thickness in the same manner as described above.
【００３０】[0030]
【発明の効果】本発明により従来の光ディスクの製造工
程を変えることなく、貼り合わせる基板の板厚を選ぶこ
とにより、ストレス、強度の異なる基板２枚を貼り合わ
せる難しいプロセスにおいても安定に反りなどの機械的
特性に優れた光ディスクを提供することができた。According to the present invention, by selecting the thickness of the substrates to be bonded without changing the conventional optical disk manufacturing process, it is possible to stably warp even in a difficult process of bonding two substrates having different stresses and strengths. An optical disk having excellent mechanical properties could be provided.
【図１】本発明の１実施例における光ディスクを示す
図。FIG. 1 is a diagram showing an optical disk according to an embodiment of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 安藤 圭吉 東京都国分寺市東恋ケ窪一丁目280番地 株式会社日立製作所中央研究所内 Ｆターム(参考） 5D029 KB14 RA01 RA08 RA28 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Keikichi Ando 1-280 Higashi Koigakubo, Kokubunji-shi, Tokyo F-term in Central Research Laboratory, Hitachi, Ltd. 5D029 KB14 RA01 RA08 RA28
Claims (5)
内溝及び／またはアドレスピット、記録情報などのエン
ボスピットからなる凹凸パターンを有する２枚の基板を
接着剤を用いて貼り合わせてある光ディスクにおいて、
前記２枚の基板厚が５〜１００ミクロンの範囲内で異な
ることを特徴とする光ディスク。1. An optical disc in which at least one substrate has at least two substrates having an uneven pattern composed of light spot guide grooves and / or embossed pits such as address pits and recorded information on the surface of the substrate using an adhesive. ,
An optical disc characterized in that the two substrates have different thicknesses within a range of 5 to 100 microns.
剤が光あるいは熱および空気中の水分などで硬化するこ
とを特徴とする光ディスク。2. The optical disk according to claim 1, wherein the adhesive is cured by light, heat, moisture in the air, or the like.
または他の層を介して、一方の基板の上に反射膜または
レーザー光照射によって変化する記録膜を形成し、もう
一方の基板には形成しないことを特徴とする光ディス
ク。3. The optical disk according to claim 1, wherein a reflection film or a recording film which is changed by laser light irradiation is formed on one substrate directly or via another layer, and the other film is formed on the other substrate. An optical disc characterized by not performing.
または他の層を介して、一方の基板の上に反射膜または
レーザー光照射によって変化する記録膜を形成し、もう
一方の基板は半透明な反射膜を形成したことを特徴とす
る光ディスク。4. The optical disc according to claim 1, wherein a reflection film or a recording film that changes by irradiation with a laser beam is formed on one substrate directly or via another layer, and the other substrate is translucent. An optical disc characterized by having a reflective film formed thereon.
または他の層を介して、一方の基板の上に反射膜または
レーザー光照射によって変化する記録膜を形成し、もう
一方の基板にはレーザー光照射によって変化する半透明
な記録膜を形成したことを特徴とする光ディスク。5. The optical disk according to claim 1, wherein a reflection film or a recording film that changes by irradiation with a laser beam is formed on one of the substrates directly or via another layer, and a laser film is formed on the other substrate. An optical disc characterized by forming a translucent recording film that changes with light irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23917099A JP2001067726A (en) | 1999-08-26 | 1999-08-26 | Optical disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23917099A JP2001067726A (en) | 1999-08-26 | 1999-08-26 | Optical disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001067726A true JP2001067726A (en) | 2001-03-16 |
Family
ID=17040777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23917099A Pending JP2001067726A (en) | 1999-08-26 | 1999-08-26 | Optical disk |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001067726A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6716505B2 (en) | 2001-08-31 | 2004-04-06 | General Electric Company | Storage medium for data with improved dimensional stability |
-
1999
- 1999-08-26 JP JP23917099A patent/JP2001067726A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6716505B2 (en) | 2001-08-31 | 2004-04-06 | General Electric Company | Storage medium for data with improved dimensional stability |
| US6893700B2 (en) | 2001-08-31 | 2005-05-17 | General Electric Company | Storage medium for data with improved dimensional stability |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| USRE43967E1 (en) | Information recording medium and method of manufacturing resinous substrate for use in the recording medium | |
| JP3338660B2 (en) | optical disk | |
| KR20010071304A (en) | Dvd disc with four information layers, and method for making same | |
| JP2003077187A (en) | Method for manufacturing optical disk | |
| WO2003056554A1 (en) | Multi-layered optical recording medium manufacturing method and multi-layered optical recording medium | |
| US9196288B2 (en) | Process and apparatus for producing optical recording medium | |
| JP4266044B2 (en) | Information recording medium | |
| TWI395218B (en) | Method and apparatus for producing optical recording medium | |
| US20040262793A1 (en) | Multi-layered optical recording medium and multi-layered optical recording medium manufacturing method | |
| JP2001067726A (en) | Optical disk | |
| US20070147223A1 (en) | Optical disc and method of producing the same | |
| JP4649395B2 (en) | Optical recording medium manufacturing method and manufacturing apparatus | |
| US20060134369A1 (en) | Optical disc and method of producing the same | |
| JP2008186509A (en) | Optical information recording medium and its manufacturing method | |
| JP3594002B2 (en) | optical disk | |
| JP4260929B2 (en) | Optical information recording medium and manufacturing method thereof | |
| JP2005196967A (en) | Information recording medium and manufacturing method for resin substrate used for the same | |
| JP2006318645A (en) | Information recording medium | |
| JP2006286076A (en) | Manufacturing method of optical disk, and optical disk | |
| JPH1186344A (en) | Optical recording medium | |
| JP2001056971A (en) | Production of optical disk medium and optical disk medium | |
| JP2003281784A (en) | Optical recording medium and manufacturing method of optical recoding medium | |
| JP2004152364A (en) | Optical disk and its manufacturing method | |
| JP2006277951A (en) | Information recording medium | |
| JP2006318644A (en) | Information recording medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040618 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040629 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040720 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060131 |