JP2001060532A - Formation of external electrode of laminated ceramic electronic component - Google Patents
Formation of external electrode of laminated ceramic electronic componentInfo
- Publication number
- JP2001060532A JP2001060532A JP11233105A JP23310599A JP2001060532A JP 2001060532 A JP2001060532 A JP 2001060532A JP 11233105 A JP11233105 A JP 11233105A JP 23310599 A JP23310599 A JP 23310599A JP 2001060532 A JP2001060532 A JP 2001060532A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer ceramic
- plating
- layers
- electronic component
- ceramic electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、積層セラミックコ
ンデンサ,積層バリスタ,積層誘電体共振器,積層圧電
素子等を含む積層セラミック電子部品の改良に係り、詳
しくは耐ヒートサイクル性の高い外部電極を形成する積
層セラミック電子部品の外部電極形成方法である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic electronic component including a multilayer ceramic capacitor, a multilayer varistor, a multilayer dielectric resonator, a multilayer piezoelectric element, and the like. This is a method for forming external electrodes of the multilayer ceramic electronic component to be formed.
【0002】[0002]
【従来の技術】電子機器等の小型化が進み、デイスクリ
ート部品は表面実装タイプ部品で小型なものになってい
る。殊に、高低電圧の集積回路に用いられる積層セラミ
ックコンデンサも極小化の要請が強くなっている。これ
に応じ、外部電極としては電気回路との接合性が良好で
電気的特性,信頼性,機械的特性に優れる上に、燒結体
である積層セラミック素体との接合強度が高いものが望
まれている。2. Description of the Related Art As electronic devices and the like have been reduced in size, discrete components have become smaller as surface mount type components. In particular, there is an increasing demand for miniaturization of multilayer ceramic capacitors used in high- and low-voltage integrated circuits. Accordingly, it is desired that the external electrodes have good bonding properties with the electric circuit, excellent electrical characteristics, reliability, and mechanical characteristics, and also have high bonding strength with the multilayer ceramic body which is a sintered body. ing.
【0003】一般に、積層セラミック電子部品はPd,
Pt,Ag/Pd等の貴金属を主成分とする導電性ペー
ストからなる内部電極を誘電体のセラミックグリーンシ
ートに印刷し、そのセラミックグリーンシートを内部電
極と交互に複数積層焼成させて積層セラミック素体を形
成し、更に、外部電極を積層セラミック素体の両端部に
形成することにより構成されている。Generally, multilayer ceramic electronic components are Pd,
An internal electrode made of a conductive paste containing a noble metal such as Pt or Ag / Pd as a main component is printed on a dielectric ceramic green sheet, and the ceramic green sheet is alternately laminated and fired with the internal electrode in a plurality of layers. And external electrodes are formed at both ends of the multilayer ceramic body.
【0004】従来、外部電極としては内部電極とのなじ
みを良くし、接続不良が生じないようAgまたはCu等
の金属粉末を主成分とし、ガラスフリットを加えた導電
性ペーストを積層セラミック素体の両端部に塗布し焼き
付けて内部電極の貴金属と融合する結合状態の良好な第
1の電極層として下地電極層を設けることが行われてい
る。Conventionally, as an external electrode, a conductive paste containing a metal powder such as Ag or Cu as a main component and a glass frit as a main component so as to improve the familiarity with the internal electrode and prevent a connection failure from occurring is used. 2. Description of the Related Art A base electrode layer is provided as a first electrode layer in a well-bonded state that is applied to both ends and baked to fuse with a noble metal of an internal electrode and has a good bonding state.
【0005】また、搭載される基板の電気回路と半田付
け固定するのに濡れ性及び耐半田性を向上させるため、
Ni等のメッキ被膜でなる中間の電極層を下地電極層に
被着し、更に、SnまたはSn/Pb等のメッキ被膜で
なる最外層の電極層を積層することにより外部電極とし
て形成されている。Further, in order to improve wettability and solder resistance for soldering and fixing to an electric circuit of a mounted board,
An external electrode is formed by depositing an intermediate electrode layer made of a plating film of Ni or the like on a base electrode layer and further laminating an outermost electrode layer made of a plating film of Sn or Sn / Pb or the like. .
【0006】その外部電極を形成する層のうち、中間の
電極層は主にNiメッキ被膜で形成されている。このN
iメッキ被膜は被膜部分として極めて薄いため、電流効
率を確保する必要から基本組成のワット浴を用いたバレ
ルメッキで処理されている。[0006] Among the layers forming the external electrodes, an intermediate electrode layer is mainly formed of a Ni plating film. This N
Since the i-plated film is extremely thin as a film portion, it is processed by barrel plating using a watt bath having a basic composition because it is necessary to ensure current efficiency.
【0007】本来は電着応力の少ない,即ち、大きい残
留応力を残す浴組成物のNiCl2・6H2O(塩化ニ
ッケル)が少ないスルファミン酸浴で処理するのが望ま
しい。然し、これにはNiイオン補充に臭化ニッケル
(NiBr2)を使用する必要があるため、安全衛生上
及び経済コストを考慮することによりワット浴が用いら
れている。[0007] It is originally desirable to treat with a sulfamic acid bath having a low electrodeposition stress, that is, a low NiCl 2 .6H 2 O (nickel chloride) bath composition which leaves a large residual stress. However, since it is necessary to use nickel bromide (NiBr 2 ) for replenishing Ni ions, a watt bath is used in consideration of safety and health and economic costs.
【0008】ところが、上述した外部電極では半田量を
多く半田盛をする場合、−55〜125℃の耐ヒートサイク
ル性に対して劣化する傾向が見られる。このため、Ni
メッキ被膜の膜厚を厚く形成することにより対処する
と、膜厚が厚くなる程にメッキ被膜の引っ張り応力が強
く発生し、逆に、耐ヒートサイクル性が劣化するという
悪循環を招く。However, when a large amount of solder is used for the above-mentioned external electrodes and soldering is performed, there is a tendency that the heat cycle resistance at −55 to 125 ° C. is deteriorated. Therefore, Ni
If the thickness of the plating film is increased, the tensile stress of the plating film increases as the thickness increases, and conversely, the heat cycle resistance deteriorates, resulting in a vicious cycle.
【0009】[0009]
【発明が解決しようとする課題】本発明は、上述の欠点
を解消し、極小の積層セラミックコンデンサ等にも適用
可能で、耐ヒートサイクル性に優れて半田付け性の良好
な信頼性の高い外部電極を形成する積層セラミック電子
部品の外部電極形成方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned drawbacks and can be applied to very small multilayer ceramic capacitors, etc., and has excellent heat cycle resistance, good solderability and high reliability. An object of the present invention is to provide a method for forming external electrodes of a multilayer ceramic electronic component for forming electrodes.
【0010】[0010]
【課題を解決するための手段】本発明の請求項1に係る
積層セラミック電子部品の外部電極形成方法において
は、内部電極と接続させて積層セラミック素体の両端に
被着するAgまたはCuの下地電極層と、該下地電極層
に被着する中間のNiメッキ層と、該Niメッキ層に被
着する最外層のSnまたはSn/Pb,Sn/Cu,S
n/Bi,Sn/Znのうちいずれか一種のメッキ層と
から外部電極を形成するもので、少なくとも一種以上の
スルホン酸系化合物を含有するNiメッキ液により中間
のNiメッキ層を形成するようにされている。According to a first aspect of the present invention, there is provided a method for forming an external electrode of a multilayer ceramic electronic component, wherein the underlayer of Ag or Cu is attached to both ends of a multilayer ceramic body by being connected to an internal electrode. An electrode layer, an intermediate Ni plating layer deposited on the base electrode layer, and Sn or Sn / Pb, Sn / Cu, S of the outermost layer deposited on the Ni plating layer.
An external electrode is formed from any one of n / Bi and Sn / Zn plating layers. An intermediate Ni plating layer is formed by a Ni plating solution containing at least one or more sulfonic acid compounds. Have been.
【0011】本発明の請求項2に係る積層セラミック電
子部品の外部電極形成方法においては、添加量1〜40
ml/Lのスルホン酸系化合物を含有するNiメッキ液
により中間のNiメッキ層を形成するようにされてい
る。In the method for forming an external electrode of a multilayer ceramic electronic component according to a second aspect of the present invention, the additive amount is 1 to 40.
An intermediate Ni plating layer is formed by a Ni plating solution containing a sulfonic acid compound at a concentration of ml / L.
【0012】[0012]
【発明の実施の形態】本発明に係る積層セラミック電子
部品の外部電極形成方法は、Pd,Pt,Ag/Pd等
の貴金属を主成分とする導電性ペーストからなる内部電
極を誘電体のセラミックグリーンシートに印刷し、その
セラミックグリーンシートを内部電極と交互に複数積層
焼成させて積層セラミック素体を形成してから、外部電
極を積層セラミック素体の両端部に設けるのに適用され
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for forming an external electrode of a multilayer ceramic electronic component according to the present invention is a method of forming an internal electrode made of a conductive paste containing a noble metal such as Pd, Pt, Ag / Pd as a main component. The method is applied to printing on a sheet, firing a plurality of the ceramic green sheets alternately with the internal electrodes and firing them to form a multilayer ceramic body, and then providing external electrodes at both ends of the multilayer ceramic body.
【0013】その外部電極は、内部電極と接続させて積
層セラミック素体の両端に被着するAgまたはCuの下
地電極層と、この下地電極層に被着する中間のNiメッ
キ層と、更に、Niメッキ層に被着する最外層のSnま
たはSn/Pb,Sn/Cu,Sn/Bi,Sn/Zn
のうちいずれか一種のメッキ層とを積層させて形成され
る。[0013] The external electrode is composed of an Ag or Cu base electrode layer connected to the internal electrode and attached to both ends of the multilayer ceramic body, an intermediate Ni plating layer attached to the base electrode layer, and Sn or Sn / Pb, Sn / Cu, Sn / Bi, Sn / Zn of the outermost layer adhered to the Ni plating layer
Are formed by laminating any one of the plating layers.
【0014】その外部電極を形成する層のうち、中間の
Niメッキ層は少なくとも一種以上のスルホン酸系化合
物を含有するNiメッキ液により形成する。殊に、添加
量1〜40ml/Lのスルホン酸系化合物を含有するN
iメッキ液により形成するとよい。これにより、耐ヒー
トサイクル性及び半田付性の良好な外部電極として形成
することができる。Among the layers forming the external electrodes, an intermediate Ni plating layer is formed by a Ni plating solution containing at least one sulfonic acid compound. In particular, N containing a sulfonic acid compound in an addition amount of 1 to 40 ml / L
It is preferable to use an i plating solution. This makes it possible to form an external electrode having good heat cycle resistance and good solderability.
【0015】その有効性を確認するべく、次の表1で示
すNiメッキ組成浴及び作業条件の下で、表2で示すよ
うにSO3H基を有するRSO2NH2(スルホン酸ア
ミド)の添加量を変えたNiメッキ液を用い、このNi
メッキ液から中間のメッキ層を形成した外部電極を積層
セラミックコンデンサ素体の両端部に設け、各20個に
ついて耐ヒートサイクル性及び半田付性不良の発生件数
を検査した。In order to confirm its effectiveness, RSO 2 NH 2 (sulfonamide) having SO 3 H groups as shown in Table 2 was obtained under the Ni plating composition bath and operating conditions shown in Table 1 below. Using a Ni plating solution with a different addition amount,
External electrodes having an intermediate plating layer formed from a plating solution were provided at both ends of the multilayer ceramic capacitor body, and the number of occurrences of poor heat cycle resistance and poor solderability was inspected for each of 20 pieces.
【0016】[0016]
【表1】 [Table 1]
【0017】[0017]
【表2】 [Table 2]
【0018】耐ヒートサイクル性及び半田付性について
は、表2で示す如くメッキ液に対するSO3H基を有す
るRSO2NH2(スルホン酸アミド)の添加量が1.
0〜40.0ml/LのNiメッキ液で中間層のNiメ
ッキ層を形成した外部電極により良好な結果が得られ
た。Regarding heat cycle resistance and soldering resistance, as shown in Table 2, the amount of RSO 2 NH 2 (sulfonic acid amide) having SO 3 H group added to the plating solution was 1.
Good results were obtained with an external electrode having an intermediate Ni plating layer formed with a Ni plating solution of 0 to 40.0 ml / L.
【0019】これに対し、試料1の添加量0.5ml/
Lの場合、半田付け性は従来例の添加量0に比べてわず
かながら改善されているが、耐ヒートサイクル性の不良
率が5%も発生したことから、多量生産には不適であ
る。On the other hand, the amount of sample 1 added was 0.5 ml /
In the case of L, the solderability is slightly improved as compared with the addition amount 0 of the conventional example, but the defective rate of heat cycle resistance is as high as 5%, which is not suitable for mass production.
【0020】また、試料9の添加量45.0ml/L以
上になると、耐ヒートサイクルの不良率が10%以上、
半田付け性の不良率が5%以上になり、量産性に適さな
い。これにより、SO3H基を有するRSO2NH
2(スルホン酸アミド)の添加量が1.0〜40.0m
l/LのNiメッキ液で中間層のNiメッキ層を形成し
た外部電極がよいことが理解できる。When the addition amount of the sample 9 is 45.0 ml / L or more, the defective rate of the heat cycle resistance is 10% or more,
The defective rate of solderability is 5% or more, which is not suitable for mass production. Thereby, RSO 2 NH having an SO 3 H group is obtained.
2 (sulfonic acid amide) added amount is 1.0 to 40.0 m
It can be understood that an external electrode having an intermediate Ni plating layer formed with 1 / L Ni plating solution is preferable.
【0021】一般に、SO3H基を有するRSO2NH
2(スルホン酸アミド)を添加剤として含まないワット
浴によると、電着応力は大きいが、それを添加しまたは
添加量を増やしていくと、硬さ,引張り強さが大きくな
り、伸びが小さくなって脆さを与える。このため、RS
O2NH2(スルホン酸アミド)を添加することで、電
着応力,即ち、引張り応力が減少し圧縮応力に変えさせ
ることにより、耐ヒートサイクル性を改善できる。Generally, RSO 2 NH having an SO 3 H group
2 According to the watt bath which does not contain (sulfonamide) as an additive, the electrodeposition stress is large, but as it is added or its amount is increased, the hardness and tensile strength increase, and the elongation decreases. Gives brittleness. For this reason, RS
By adding O 2 NH 2 (sulfonamide), the electrodeposition stress, that is, the tensile stress is reduced and the stress is changed to the compressive stress, whereby the heat cycle resistance can be improved.
【0022】一方、SO3H基を有するRSO2NH2
(スルホン酸アミド)の添加量が40.0ml/L以上
になると、引張り強さが大きくなり、且つ、脆さが増大
し、耐ヒートサイクル性や半田付け性を悪くする。ま
た、RSO2NH2によるNiメッキ層の引張り応力は
析出するNi結晶粒内を変えることから低下すると推考
できる。On the other hand, RSO 2 NH 2 having an SO 3 H group
When the amount of (sulfonamide) added is 40.0 ml / L or more, the tensile strength increases, the brittleness increases, and the heat cycle resistance and the solderability deteriorate. In addition, it can be inferred that the tensile stress of the Ni plating layer due to RSO 2 NH 2 is reduced by changing the inside of precipitated Ni crystal grains.
【0023】[0023]
【発明の効果】以上の如く、本発明の請求項1に係る積
層セラミック電子部品の外部電極形成方法に依れば、内
部電極と接続させて積層セラミック素体の両端に被着す
るAgまたはCuの下地電極層と、該下地電極層に被着
する中間のNiメッキ層と、該Niメッキ層に被着する
最外層のSnまたはSn/Pb,Sn/Cu,Sn/B
i,Sn/Znのうちいずれか一種のメッキ層とから外
部電極を形成するもので、少なくとも一種以上のスルホ
ン酸系化合物を含有するNiメッキ液により中間のNi
メッキ層を形成することにより、耐ヒートサイクル性に
優れ、半田付け性の良好な信頼性の高い外部電極を積層
セラミック電子部品に設けられる。As described above, according to the method for forming an external electrode of a multilayer ceramic electronic component according to the first aspect of the present invention, Ag or Cu which is connected to an internal electrode and adheres to both ends of a multilayer ceramic body is provided. , An intermediate Ni plating layer deposited on the underlying electrode layer, and Sn or Sn / Pb, Sn / Cu, Sn / B of the outermost layer deposited on the Ni plating layer.
An external electrode is formed from any one of i, Sn / Zn and a plating layer. An Ni plating solution containing at least one or more sulfonic acid compounds is used to form an intermediate Ni.
By forming the plating layer, a highly reliable external electrode having excellent heat cycle resistance and good solderability is provided on the multilayer ceramic electronic component.
【0024】本発明の請求項2に係る積層セラミック電
子部品の外部電極形成方法に依れば、添加量1〜40m
l/Lのスルホン酸系化合物を含有するNiメッキ液に
より中間のNiメッキ層を形成することにより、その添
加量の特定値に基づいて耐ヒートサイクル性に優れ、半
田付け性の良好な信頼性の高い外部電極を積層セラミッ
ク電子部品に設けられる。According to the method for forming an external electrode of a multilayer ceramic electronic component according to claim 2 of the present invention, the additive amount is 1 to 40 m.
By forming an intermediate Ni plating layer with a Ni plating solution containing 1 / L of a sulfonic acid-based compound, the heat cycle resistance is excellent based on a specific value of the addition amount, and the solderability is good. High external electrodes are provided on the multilayer ceramic electronic component.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡部 昌幸 秋田県由利郡仁賀保町平沢字前田151 テ ィーディーケイ エムシーシー株式会社内 Fターム(参考) 5E001 AA00 AB03 AC10 AH07 AJ03 5E082 AA01 AB03 BC23 EE04 EE11 EE23 EE35 FF05 FG06 FG26 GG10 GG11 GG28 JJ03 JJ12 JJ23 PP03 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masayuki Okabe 151 Maeda, Hirasawa, Nikaho-cho, Yuri-gun, Akita F-term in TDCMCC Co., Ltd. FF05 FG06 FG26 GG10 GG11 GG28 JJ03 JJ12 JJ23 PP03
Claims (2)
体の両端に被着するAgまたはCuの下地電極層と、該
下地電極層に被着する中間のNiメッキ層と、該Niメ
ッキ層に被着する最外層のSnまたはSn/Pb,Sn
/Cu,Sn/Bi,Sn/Znのうちいずれか一種の
メッキ層とから外部電極を形成する積層セラミック電子
部品の外部電極形成方法において、少なくとも一種以上
のスルホン酸系化合物を含有するNiメッキ液により中
間のNiメッキ層を形成したことを特徴とする積層セラ
ミック電子部品の外部電極形成方法。1. An Ag or Cu base electrode layer connected to an internal electrode and applied to both ends of a multilayer ceramic body, an intermediate Ni plating layer applied to the base electrode layer, and an Ni plating layer Sn or Sn / Pb, Sn of the outermost layer to be deposited
/ Cu, Sn / Bi, Sn / Zn, in a method for forming an external electrode from a plating layer of any one of Sn / Zn, a Ni plating solution containing at least one or more sulfonic acid compound. A method for forming external electrodes of a multilayer ceramic electronic component, wherein an intermediate Ni plating layer is formed by the method described above.
化合物を含有するNiメッキ液により中間のNiメッキ
層を形成したことを特徴とする請求項1記載の積層セラ
ミック電子部品の外部電極形成方法。2. An external electrode for a multilayer ceramic electronic component according to claim 1, wherein an intermediate Ni plating layer is formed by a Ni plating solution containing a sulfonic acid compound in an addition amount of 1 to 40 ml / L. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11233105A JP2001060532A (en) | 1999-08-19 | 1999-08-19 | Formation of external electrode of laminated ceramic electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11233105A JP2001060532A (en) | 1999-08-19 | 1999-08-19 | Formation of external electrode of laminated ceramic electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001060532A true JP2001060532A (en) | 2001-03-06 |
Family
ID=16949862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP11233105A Pending JP2001060532A (en) | 1999-08-19 | 1999-08-19 | Formation of external electrode of laminated ceramic electronic component |
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JP (1) | JP2001060532A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7458151B2 (en) | 2004-11-30 | 2008-12-02 | Tdk Corporation | Method of forming external electrode |
JP2015046451A (en) * | 2013-08-28 | 2015-03-12 | 株式会社村田製作所 | Electronic component |
CN111223663A (en) * | 2020-01-10 | 2020-06-02 | 福建火炬电子科技股份有限公司 | Metal support ceramic capacitor and preparation method thereof |
-
1999
- 1999-08-19 JP JP11233105A patent/JP2001060532A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7458151B2 (en) | 2004-11-30 | 2008-12-02 | Tdk Corporation | Method of forming external electrode |
JP2015046451A (en) * | 2013-08-28 | 2015-03-12 | 株式会社村田製作所 | Electronic component |
CN111223663A (en) * | 2020-01-10 | 2020-06-02 | 福建火炬电子科技股份有限公司 | Metal support ceramic capacitor and preparation method thereof |
CN111223663B (en) * | 2020-01-10 | 2022-03-25 | 福建火炬电子科技股份有限公司 | Metal support ceramic capacitor and preparation method thereof |
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