JP2001044506A - Fixation structure for light emitting diode - Google Patents
Fixation structure for light emitting diodeInfo
- Publication number
- JP2001044506A JP2001044506A JP11210836A JP21083699A JP2001044506A JP 2001044506 A JP2001044506 A JP 2001044506A JP 11210836 A JP11210836 A JP 11210836A JP 21083699 A JP21083699 A JP 21083699A JP 2001044506 A JP2001044506 A JP 2001044506A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- insertion hole
- lead
- light emitting
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Landscapes
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、発光ダイオード
の固定構造、特に車両用ランプ装置に好適な発光ダイオ
ードの固定構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode fixing structure, and more particularly to a light emitting diode fixing structure suitable for a vehicle lamp device.
【０００２】[0002]
【従来の技術】車両用のランプ等で使用されている発光
ダイオードとしては、一般に発光ダイオードの底面に形
成されたリードを、ランプに設けられたプリント基板に
対して、半田付けすることにより固定している。すなわ
ち、プリント基板に設けた挿通孔に発光ダイオードのリ
ードを表面側から挿入し、裏面側で余分なリードを切断
した後、更に切断後のリードを裏面に沿って折り曲げ
る。そして、プリント基板の裏面には金属配線が印刷さ
れているため、そこにフラックスを塗布した後、ディッ
プ半田法、リフロー半田法等によりリードを半田付けす
る。更に、半田付けの後に、プリント基板の裏面に保護
膜をコーティングしている。2. Description of the Related Art In general, a light emitting diode used in a lamp for a vehicle is fixed by soldering a lead formed on a bottom surface of the light emitting diode to a printed circuit board provided on the lamp. ing. That is, the lead of the light emitting diode is inserted into the insertion hole provided on the printed circuit board from the front side, the extra lead is cut on the back side, and then the cut lead is bent along the back side. Since the metal wiring is printed on the back surface of the printed circuit board, a flux is applied thereto, and then the leads are soldered by a dip soldering method, a reflow soldering method or the like. Further, after soldering, the back surface of the printed circuit board is coated with a protective film.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
ように、プリント基板に発光ダイオードを半田付けする
構造では、発光ダイオードのリードを１本づつプリント
基板に半田付けするため作業工程が複雑で、専用設備も
必要となり、そしてプリント基板自体も高価なため、コ
スト的に不利である。However, in the conventional structure in which the light emitting diodes are soldered to the printed circuit board, the work steps are complicated because the leads of the light emitting diodes are soldered one by one to the printed circuit board. Equipment is required, and the printed circuit board itself is expensive, which is disadvantageous in terms of cost.
【０００４】また、いったん固定した後に取り外す作業
が困難であるため、発光ダイオードの交換が面倒である
と共に、不要になった際に複数の部品に解体してリサイ
クルを行うのが面倒である。[0004] In addition, since it is difficult to remove the light-emitting diode once it is fixed, it is troublesome to replace the light-emitting diode, and it is also troublesome to disassemble the light-emitting diode into a plurality of parts when they are no longer needed.
【０００５】更に、有害物質を含む半田を利用するた
め、環境面での影響もある。[0005] Furthermore, the use of solder containing harmful substances has an environmental impact.
【０００６】加えて、平らなプリント基板を使用するた
め、発光ダイオードを２次元的（平面的）にしか並べて
固定できない。In addition, since a flat printed circuit board is used, the light emitting diodes cannot be arranged and fixed only two-dimensionally (planarly).
【０００７】この発明は、このような従来の技術に着目
してなされたものであり、半田付けに代わる有効な発光
ダイオードの固定構造を提供するものである。The present invention has been made by paying attention to such a conventional technique, and provides an effective fixing structure of a light emitting diode instead of soldering.
【０００８】[0008]
【課題を解決するための手段】請求項１記載の発明は、
合成樹脂製のハウジングの裏面に金属プレート配線を重
ね合わせた状態で配索すると共にハウジング及び金属プ
レート配線にそれぞれ対応する挿通孔を設け、両挿通孔
に対して発光ダイオードのリードを表面側から挿入し、
リードを少なくとも金属プレート配線の挿通孔に対して
圧入状態にした。According to the first aspect of the present invention,
The metal plate wiring is routed on the back surface of the synthetic resin housing in a state of being overlapped, and insertion holes corresponding to the housing and the metal plate wiring are provided, and the light emitting diode leads are inserted into both insertion holes from the front side. And
The lead was pressed into at least the insertion hole of the metal plate wiring.
【０００９】請求項２記載の発明は、金属プレート配線
の挿通孔の互いに直交する二方向の径のうち、少なくと
も一方の径を、リードの対応する径よりも若干小さくし
た。According to the second aspect of the present invention, at least one of the diameters of the through holes of the metal plate wiring in two directions perpendicular to each other is slightly smaller than the corresponding diameter of the lead.
【００１０】請求項３記載の発明は、金属プレート配線
の挿通孔で互いに向かい合う一対の対向縁のうち、少な
くとも一方の対向縁がリードの挿入時に弾性変形する。According to a third aspect of the present invention, at least one of the pair of opposing edges facing each other in the insertion hole of the metal plate wiring is elastically deformed when the lead is inserted.
【００１１】請求項４記載の発明は、合成樹脂製のハウ
ジングの表面に金属プレート配線を重ね合わせた状態で
配索すると共に、ハウジング及び金属プレート配線にそ
れぞれ対応する挿通孔を設け、両挿通孔に対して発光ダ
イオードのリードを表面側から挿入し、リードを金属プ
レート配線の挿通孔に対して接触させると共にハウジン
グの挿通孔に対して圧入状態にした。According to a fourth aspect of the present invention, a metal plate wiring is laid on a surface of a synthetic resin housing in a state of being overlapped, and insertion holes respectively corresponding to the housing and the metal plate wiring are provided. Then, the lead of the light emitting diode was inserted from the front side, and the lead was brought into contact with the insertion hole of the metal plate wiring and pressed into the insertion hole of the housing.
【００１２】請求項５記載の発明は、ハウジングの挿通
孔が非貫通形状である。According to a fifth aspect of the present invention, the insertion hole of the housing has a non-penetrating shape.
【００１３】請求項６記載の発明は、ハウジングの挿通
孔が貫通形状である。According to a sixth aspect of the present invention, the insertion hole of the housing has a penetrating shape.
【００１４】請求項７記載の発明は、リードの先端部を
ハウジングの挿通孔の内面に対して抜け方向で係合する
形状にした。According to a seventh aspect of the present invention, the distal end portion of the lead is shaped to engage with the inner surface of the insertion hole of the housing in the detaching direction.
【００１５】請求項８記載の発明は、金属プレート配線
の挿通孔で互いに向かい合う一対の対向縁のうち、少な
くとも一方の対向縁がリードの挿入時に弾性変形すると
共に、該弾性変形する対向縁の下方のハウジングに凹部
を形成した。According to an eighth aspect of the present invention, at least one of the pair of opposing edges facing each other in the insertion hole of the metal plate wiring is elastically deformed when the lead is inserted, and is located below the elastically deformed opposing edge. A recess was formed in the housing.
【００１６】[0016]
【発明の実施の形態】以下、この発明の好適な実施形態
を図面に基づいて説明する。Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
【００１７】図１〜図４は、この発明の第１実施形態を
示す図である。この実施形態では、自動車のストップラ
ンプの場合を例に説明する。図中の符号１は、このスト
ップランプのレンズ内部に設けられた合成樹脂製のハウ
ジングを示している。ストップランプ自体が、車体の表
面形状に対応した立体的形状（三次元的形状）になって
いるため、このハウジング１も立体的に成形されてい
る。つまり、図は一つの発光ダイオード２を固定してい
る部分だけを拡大して示しているため、平板状に見える
が、その全体形状はストップランプの形状に見合った立
体的形状をしている。そして、ハウジング１の裏面１ｂ
には各発光ダイオード２の取付点を順番に通るように２
本の金属プレート配線３がハウジング１に対して重ね合
わせた状態で（非接合状態で）平行に配索されており、
各発光ダイオード２に電気を供給できるようになってい
る。FIG. 1 to FIG. 4 are views showing a first embodiment of the present invention. In this embodiment, a case of a stop lamp of an automobile will be described as an example. Reference numeral 1 in the drawing indicates a synthetic resin housing provided inside the lens of the stop lamp. Since the stop lamp itself has a three-dimensional shape (three-dimensional shape) corresponding to the surface shape of the vehicle body, the housing 1 is also three-dimensionally formed. That is, since the figure shows only a portion where one light emitting diode 2 is fixed in an enlarged manner, it looks like a flat plate, but its overall shape has a three-dimensional shape corresponding to the shape of the stop lamp. Then, the back surface 1b of the housing 1
2 so that they pass through the mounting point of each light emitting diode 2 in order.
The metal plate wirings 3 are routed in parallel (in a non-joined state) in a state of being superimposed on the housing 1 (in a non-joined state).
Electricity can be supplied to each light emitting diode 2.
【００１８】この金属プレート配線３には、発光ダイオ
ード２の取付点に、該発光ダイオード２の２本のリード
５に対応する形状の挿通孔４が形成されている。つま
り、２本のリード５は、それぞれ断面長方形のため、挿
通孔４も長方形をしている。この実施形態のリード５
は、全長にわたって同じ断面形状であり、先端部７もリ
ード５の本体と同じ断面形状を有している。また、この
挿通孔４とリード５とでは、挿通孔４の方が、リード５
の断面サイズよりも若干小さく形成されている。尚、挿
通孔４の全体サイズを必ずしもリード５の断面サイズよ
りも小さくする必要はなく、例えば、挿通孔４の互いに
直交する二方向の径のうち、少なくとも一方の径を、リ
ード５の対応する径よりも若干小さくするだけでも良
い。また、リード５の表面には、導通性を良くするため
の金メッキ（ロジウムメッキでも可）が施されている。In the metal plate wiring 3, an insertion hole 4 having a shape corresponding to the two leads 5 of the light emitting diode 2 is formed at a mounting point of the light emitting diode 2. That is, each of the two leads 5 has a rectangular cross section, so that the insertion hole 4 is also rectangular. Lead 5 of this embodiment
Has the same cross-sectional shape over the entire length, and the tip 7 also has the same cross-sectional shape as the main body of the lead 5. Also, between the insertion hole 4 and the lead 5, the insertion hole 4 is
Is formed slightly smaller than the cross-sectional size of. Note that the entire size of the insertion hole 4 does not necessarily need to be smaller than the cross-sectional size of the lead 5. For example, at least one of the diameters of the insertion hole 4 in two directions orthogonal to each other corresponds to the lead 5. It may be only slightly smaller than the diameter. In addition, the surface of the lead 5 is plated with gold (rhodium plating is also possible) for improving conductivity.
【００１９】更に、ハウジング１には、前記挿通孔４と
連続する挿通孔６が形成されている。この挿通孔６は、
リード５の断面形状よりも若干大きく、リード５との間
に摩擦抵抗が生じない。Further, the housing 1 has an insertion hole 6 continuous with the insertion hole 4. This insertion hole 6
It is slightly larger than the cross-sectional shape of the lead 5, and no frictional resistance is generated between the lead 5 and the lead.
【００２０】そして、発光ダイオード２を固定する際
は、まず金属プレート配線３の下側を図示せぬ治具で押
さえておく。次に、発光ダイオード２のリード５をハウ
ジング１の挿通孔６内に表面１ａ側から挿入した後、金
属プレート配線３の挿通孔４内に挿入する。金属プレー
ト配線３の挿通孔４の方がリード５よりも若干小サイズ
のため、挿入の際に抵抗あるが、発光ダイオード２全体
に力を入れて押し込むことにより挿入可能となる。従っ
て、リード５の抜けは、この金属プレート配線３の挿通
孔４との圧入状態により防止され、発光ダイオード２の
確実な固定状態が得られる。また、リード５と金属プレ
ート配線３との導通状態も、この挿通孔４との圧入部分
で得られる。When fixing the light emitting diode 2, first, the lower side of the metal plate wiring 3 is held down by a jig (not shown). Next, the lead 5 of the light emitting diode 2 is inserted into the insertion hole 6 of the housing 1 from the front surface 1 a side, and then inserted into the insertion hole 4 of the metal plate wiring 3. Since the insertion hole 4 of the metal plate wiring 3 is slightly smaller in size than the lead 5, it has resistance during insertion. However, it can be inserted by applying pressure to the entire light emitting diode 2. Therefore, the detachment of the lead 5 is prevented by the press-fitting state of the metal plate wiring 3 into the insertion hole 4, and a reliable fixing state of the light emitting diode 2 is obtained. In addition, a conductive state between the lead 5 and the metal plate wiring 3 is also obtained at the press-fit portion of the insertion hole 4.
【００２１】このように、発光ダイオード２のリード５
を両挿通孔４、６に挿入するだけで、発光ダイオード２
の固定が行えるため、従来のような半田付け作業が不要
になる。従って、作業工程が簡略で、専用設備も不要
で、部品も安価となり、コスト的に有利となる。更に、
有害物質を含む半田を利用しないため、環境面での影響
もない。また、発光ダイオード２は強く引けば簡単に取
り外せるため、発光ダイオード２の交換が容易で、そし
てハウジング１、発光ダイオード２、金属プレート配線
３の三部品に解体可能なため、リサイクルの面でも有利
である。As described above, the lead 5 of the light emitting diode 2
Is simply inserted into the insertion holes 4 and 6, the light emitting diode 2
Can be fixed, so that the conventional soldering work becomes unnecessary. Therefore, the working process is simple, no special equipment is required, the parts are inexpensive, and the cost is advantageous. Furthermore,
Since it does not use solder containing harmful substances, there is no environmental impact. Further, since the light emitting diode 2 can be easily removed by pulling it hard, it is easy to replace the light emitting diode 2. Further, since the light emitting diode 2 can be disassembled into three parts of the housing 1, the light emitting diode 2, and the metal plate wiring 3, it is advantageous in terms of recycling. is there.
【００２２】図５及び図６は、この発明の第２実施形態
を示す図である。この実施形態では、金属プレート配線
３の挿通孔４で互いに向かい合う一対の対向縁４ａ、４
ｂをスリットＳにより弾性変形可能にしたものである。
従って、リード５を挿入した際に、その対向縁４ａがリ
ード５に弾接した圧入状態となり、十分な導通性の確保
と確実な抜け防止が図られる。FIGS. 5 and 6 show a second embodiment of the present invention. In this embodiment, a pair of opposing edges 4 a, 4
b is made elastically deformable by a slit S.
Accordingly, when the lead 5 is inserted, the opposing edge 4a is in a press-fit state in which the lead 5 is elastically contacted with the lead 5, so that sufficient conductivity is ensured and reliable removal is prevented.
【００２３】図７及び図８は、この発明の第３実施形態
を示す図である。この実施形態では、金属プレート配線
３の変形例としての挿通孔８、９を示すものである。す
なわち、図７に示すように四角の挿通孔８の縁に沿って
井形状態にスリットＳを形成しても良く、図８に示すよ
うに円形の挿通孔９に放射状のスリットＳを形成しても
良い。要は、挿通孔８、９の一部がリードに対して弾接
した圧入状態になれば良い。FIGS. 7 and 8 are views showing a third embodiment of the present invention. In this embodiment, insertion holes 8 and 9 as modified examples of the metal plate wiring 3 are shown. That is, the slit S may be formed in a well shape along the edge of the rectangular insertion hole 8 as shown in FIG. 7, and the radial slit S is formed in the circular insertion hole 9 as shown in FIG. Is also good. In short, it is only necessary that a part of the insertion holes 8 and 9 be in a press-fit state in which the holes are in elastic contact with the lead.
【００２４】図９及び図１０は、この発明の第４実施形
態を示す図である。この実施形態では 金属プレート配
線３の挿通孔４における一対の対向縁４ａ、４ｃのうち
の一方側の対応縁４ａだけを互い違いに弾性変形可能に
したものである。このようにしても、その対向縁４ａが
リード５に弾接した圧入状態となり、十分な導通性の確
保と確実な抜け防止が図られる。また、弾性変形しない
方の対向縁４ｃの端面がリード５の側面に当接するた
め、リード５と挿通孔４との間の接触面積が増加し、導
通性が向上する。FIGS. 9 and 10 are views showing a fourth embodiment of the present invention. In this embodiment, only one corresponding edge 4a of the pair of opposed edges 4a and 4c in the insertion hole 4 of the metal plate wiring 3 is alternately elastically deformable. Even in this case, the opposing edge 4a is in a press-fit state in which it resiliently contacts the lead 5, so that sufficient conductivity is ensured and reliable removal is prevented. In addition, since the end face of the opposite edge 4c that does not elastically deform abuts the side surface of the lead 5, the contact area between the lead 5 and the insertion hole 4 increases, and the conductivity improves.
【００２５】図１１及び図１２は、この発明の第５実施
形態を示す図である。この実施形態では 金属プレート
配線３をハウジング１の表面１ａ側に重ね合わせ、金属
プレート配線３に挿通孔４を形成すると共に、ハウジン
グ１に非貫通状の挿通孔６ａを形成した。金属プレート
配線３の挿通孔４はリード５の断面形状と同形で、リー
ド５に接触して導通状態が得られる。ハウジング１の挿
通孔６ａはリード５の先端部７よりも小径で、先端部７
を挿通孔６ａ内に挿入することにより圧入状態となり、
リード５の抜けが防止される。FIGS. 11 and 12 show a fifth embodiment of the present invention. In this embodiment, the metal plate wiring 3 is overlapped on the front surface 1a side of the housing 1, the insertion hole 4 is formed in the metal plate wiring 3, and the non-penetrating insertion hole 6a is formed in the housing 1. The insertion hole 4 of the metal plate wiring 3 has the same shape as the cross-sectional shape of the lead 5 and comes into contact with the lead 5 to obtain a conductive state. The insertion hole 6 a of the housing 1 has a smaller diameter than the tip 7 of the lead 5,
Is inserted into the insertion hole 6a to be in a press-fit state,
The detachment of the lead 5 is prevented.
【００２６】図１３〜図１７は、この発明の第６実施形
態を示す図である。この実施形態では 第５実施形態と
同じ金属プレート配線３の配置において、ハウジング１
側の挿通孔６ｂを貫通状態にし、且つリード５の先端部
７ａ、７ｂ、７ｃ、７ｄを、挿通孔６ａの内面に対して
抜き方向で係合する形状にしたものである。たとえば、
図１３及び図１４に示す先端部７ａは、両側に突起した
部分を有するヤジリ状の先尖り形状となっている。図１
５の先端部７ｂは、外向きに突起した部分を有する先尖
り形状となっている。図１６の先端部７ｃは、内向きに
突起した部分を有する先尖り形状となっている。図１７
の先端部７ｄは、先尖り形状になっていないが、内向き
の返し爪１０を有する形状になっている。このような形
状により、リード５の抜け防止効果が更に大きくなる。FIGS. 13 to 17 show a sixth embodiment of the present invention. In this embodiment, in the same arrangement of the metal plate wiring 3 as in the fifth embodiment, the housing 1
The insertion hole 6b on the side is formed in a penetrating state, and the distal ends 7a, 7b, 7c, 7d of the lead 5 are shaped to engage with the inner surface of the insertion hole 6a in the pulling-out direction. For example,
The distal end portion 7a shown in FIGS. 13 and 14 has a fuzzy pointed shape having protruding portions on both sides. FIG.
5 has a pointed shape having an outwardly protruding portion. The tip portion 7c in FIG. 16 has a pointed shape having a portion protruding inward. FIG.
The tip 7d is not pointed, but has an inward turning claw 10. Such a shape further enhances the effect of preventing the lead 5 from coming off.
【００２７】図１８及び図１９は、この発明の第６実施
形態を示す図である。図１８は、金属プレート配線３に
おける一対の対向縁４ａ、４ｂを弾性変形可能にしたも
のである。対向縁４ａ、４ｂの下方のハウジング１に
は、対向縁４ａ、４ｂの下側への弾性変形を許容する凹
部１１ａが形成されている。図１９は、金属プレート配
線３における一対の対向縁４ａ、４ｃの片方だけを弾性
変形可能にしたものである。この場合も、対向縁４ａの
下方のハウジング１に凹部１１ｂが形成されている。こ
の実施形態では、リード５の抜け防止は、リード５とハ
ウジング１の挿通孔６ｂとの圧入状態により得られてお
り、前記対向縁４ａ、４ｂ、４ｃがリードに対して弾接
・当接することにより、十分な導通性が確保されてい
る。FIGS. 18 and 19 show a sixth embodiment of the present invention. FIG. 18 shows a pair of opposing edges 4a and 4b of the metal plate wiring 3 that can be elastically deformed. A recess 11a is formed in the housing 1 below the opposing edges 4a, 4b to allow elastic deformation to the lower side of the opposing edges 4a, 4b. In FIG. 19, only one of the pair of opposed edges 4a and 4c of the metal plate wiring 3 is made elastically deformable. Also in this case, a recess 11b is formed in the housing 1 below the opposing edge 4a. In this embodiment, the lead 5 is prevented from coming off by the press-fit state of the lead 5 and the insertion hole 6b of the housing 1, and the opposing edges 4a, 4b, 4c are elastically contacted with the lead. Thereby, sufficient conductivity is ensured.
【００２８】[0028]
【発明の効果】請求項１記載の発明によれば、ハウジン
グの挿通孔に挿入した発光ダイオードのリードを、ハウ
ジングの裏面側に重ね合わせた金属プレート配線の挿通
孔に圧入した構造にしているため、リードが金属プレー
ト配線の挿通孔から抜けず、発光ダイオードの確実な固
定状態が得られる。従って、従来ようなプリント基板に
半田付けする構造に比べて、作業工程が簡略で、専用設
備も不要で、部品も安価なため、コスト的に有利であ
る。According to the first aspect of the present invention, the structure is such that the lead of the light emitting diode inserted into the insertion hole of the housing is press-fitted into the insertion hole of the metal plate wiring overlapped on the back side of the housing. Also, the lead does not come out of the insertion hole of the metal plate wiring, and the light emitting diode can be securely fixed. Therefore, as compared with the conventional structure of soldering to a printed circuit board, the working process is simple, no special equipment is required, and the parts are inexpensive, which is advantageous in cost.
【００２９】また、発光ダイオードを強く引き抜けば、
取り外すことが可能となるため、発光ダイオードの交換
が可能で、更に発光ダイオード、ハウジング、金属プレ
ート配線の三部品に解体可能なため、リサイクルの面で
も有利である。If the light emitting diode is pulled out strongly,
Since the light emitting diode can be removed, the light emitting diode can be replaced, and furthermore, the light emitting diode, the housing, and the metal plate wiring can be disassembled into three parts, which is advantageous in terms of recycling.
【００３０】更に、有害物質を含む半田を利用しないた
め、環境面での影響もない。Furthermore, since no solder containing harmful substances is used, there is no environmental impact.
【００３１】加えて、発光ダイオードを固定する対象が
単なる合成樹脂製のハウジングで、プリント基板のよう
に表面に金属配線が印刷されていないため、ハウジング
を任意の三次元形状に成形することができる。従って、
そのハウジングに対して、発光ダイオードを三次元的に
並べて固定することができる。In addition, since the object to which the light emitting diode is fixed is a mere synthetic resin housing, and no metal wiring is printed on the surface unlike a printed circuit board, the housing can be formed into an arbitrary three-dimensional shape. . Therefore,
The light emitting diodes can be three-dimensionally arranged and fixed to the housing.
【００３２】請求項２記載の発明によれば、金属プレー
ト配線の挿通孔における径の一部を若干小さくしたた
め、リードを挿入することで圧入状態となり、十分な導
通性の確保と確実な抜け防止が図られる。According to the second aspect of the present invention, since a part of the diameter of the through hole of the metal plate wiring is slightly reduced, the lead is inserted into the press-fit state, and sufficient conductivity is ensured and reliable prevention of detachment. Is achieved.
【００３３】請求項３記載の発明によれば、リードを挿
入することで、金属プレート配線の挿通孔の一部がリー
ドに弾接した圧入状態となるため、十分な導通性の確保
と確実な抜け防止が図られる。According to the third aspect of the present invention, by inserting the lead, a part of the insertion hole of the metal plate wiring is brought into a press-fit state in which the lead is elastically contacted with the lead. Prevention of falling off is achieved.
【００３４】請求項４記載の発明によれば、金属プレー
ト配線をハウジングの表面側に重ね合わせても、リード
とハウジングの挿通孔との圧入状態により抜けが防止さ
れ、またリードと金属プレート配線の挿通孔の接触によ
り十分な導通状態が得られる。According to the fourth aspect of the present invention, even when the metal plate wiring is superimposed on the front surface side of the housing, the lead is prevented from coming off due to the press-fit state between the lead and the insertion hole of the housing. A sufficient conduction state can be obtained by contact of the insertion holes.
【００３５】請求項５記載の発明によれば、ハウジング
の挿通孔が非貫通形状であるため、挿通孔の形成が容易
である。According to the fifth aspect of the present invention, since the insertion hole of the housing has a non-penetrating shape, it is easy to form the insertion hole.
【００３６】請求項６記載の発明によれば、ハウジング
の挿通孔が貫通形状であるため、リードを深く圧入する
ことができる。According to the sixth aspect of the present invention, since the insertion hole of the housing has a penetrating shape, the lead can be pressed deeply.
【００３７】請求項７記載の発明によれば、リードが挿
通孔から更に抜けにくくなる。According to the seventh aspect of the present invention, it becomes more difficult for the lead to fall out of the insertion hole.
【００３８】請求項８記載の発明によれば、リードを挿
入することで、金属プレート配線の挿通孔の一部がリー
ドに弾接した圧入状態となるため、十分な導通性の確保
と確実な抜け防止が図られる。また、下側に凹部が形成
されているため、挿通孔の弾性変形を邪魔しない。According to the eighth aspect of the present invention, by inserting the lead, a part of the insertion hole of the metal plate wiring is brought into a press-fit state in which the lead is elastically contacted with the lead. Prevention of falling off is achieved. Further, since the concave portion is formed on the lower side, the elastic deformation of the insertion hole is not hindered.
【図１】第１実施形態に係る発光ダイオードの固定前の
状態を示す断面図。FIG. 1 is a sectional view showing a state before fixing a light emitting diode according to a first embodiment.
【図２】第１実施形態に係る発光ダイオードの固定状態
を示す断面図。FIG. 2 is a sectional view showing a fixed state of the light emitting diode according to the first embodiment.
【図３】第１実施形態に係る金属プレート配線を示す平
面図。FIG. 3 is a plan view showing a metal plate wiring according to the first embodiment.
【図４】第１実施形態に係る発光ダイオードの固定状態
を示す異なった方向での断面図。FIG. 4 is a cross-sectional view in a different direction showing a fixed state of the light emitting diode according to the first embodiment.
【図５】第２実施形態に係る発光ダイオードの固定状態
を示す断面図。FIG. 5 is a sectional view showing a fixed state of the light emitting diode according to the second embodiment.
【図６】第２実施形態に係る金属プレート配線を示す平
面図。FIG. 6 is a plan view showing a metal plate wiring according to a second embodiment.
【図７】第３実施形態に係る金属プレート配線（その
１）を示す平面図。FIG. 7 is a plan view showing a metal plate wiring (part 1) according to a third embodiment.
【図８】第３実施形態に係る金属プレート配線（その
２）を示す平面図。FIG. 8 is a plan view showing a metal plate wiring (part 2) according to the third embodiment.
【図９】第４実施形態に係る発光ダイオードの固定状態
を示す断面図。FIG. 9 is a sectional view showing a fixed state of a light emitting diode according to a fourth embodiment.
【図１０】第４実施形態に係る金属プレート配線を示す
平面図。FIG. 10 is a plan view showing a metal plate wiring according to a fourth embodiment.
【図１１】第５実施形態に係る発光ダイオードの固定前
の状態を示す断面図。FIG. 11 is a sectional view showing a state before fixing a light emitting diode according to a fifth embodiment.
【図１２】第５実施形態に係る発光ダイオードの固定状
態を示す断面図。FIG. 12 is a sectional view showing a fixed state of a light emitting diode according to a fifth embodiment.
【図１３】第６実施形態に係る発光ダイオード（その
１）を固定する前の状態を示す断面図。FIG. 13 is a sectional view showing a state before fixing a light-emitting diode (No. 1) according to a sixth embodiment.
【図１４】第６実施形態に係る発光ダイオード（その
１）の固定状態を示す断面図。FIG. 14 is a sectional view showing a fixed state of a light emitting diode (part 1) according to a sixth embodiment.
【図１５】第６実施形態に係る発光ダイオード（その
２）を示す断面図。FIG. 15 is a sectional view showing a light emitting diode (part 2) according to the sixth embodiment.
【図１６】第６実施形態に係る発光ダイオード（その
３）を示す断面図。FIG. 16 is a sectional view showing a light emitting diode (part 3) according to the sixth embodiment.
【図１７】第６実施形態に係る発光ダイオード（その
４）を示す断面図。FIG. 17 is a sectional view showing a light emitting diode (part 4) according to the sixth embodiment.
【図１８】第７実施形態に係る発光ダイオード（その
１）の固定状態を示す断面図。FIG. 18 is a sectional view showing a fixed state of a light emitting diode (part 1) according to a seventh embodiment.
【図１９】第７実施形態に係る発光ダイオード（その
２）の固定状態を示す断面図。FIG. 19 is an exemplary sectional view showing a fixed state of a light-emitting diode (part 2) according to a seventh embodiment;
１ ハウジング １ａ 表面 １ｂ 裏面 ２ 発光ダイオード ３ 金属プレート配線 ４ 挿通孔 ５ リード ６ 挿通孔 ７ａ，７ｂ，７ｃ，７ｄ 先端部 ８ 挿通孔 ９ 挿通孔 １０ 返し爪 １１ａ、１１ｂ 凹部 REFERENCE SIGNS LIST 1 housing 1a front surface 1b back surface 2 light emitting diode 3 metal plate wiring 4 insertion hole 5 lead 6 insertion hole 7a, 7b, 7c, 7d tip 8 insertion hole 9 insertion hole 10 return claw 11a, 11b recess
Claims (8)
レート配線を重ね合わせた状態で配索すると共に、ハウ
ジング及び金属プレート配線にそれぞれ対応する挿通孔
を設け、両挿通孔に対して発光ダイオードのリードを表
面側から挿入し、リードを少なくとも金属プレート配線
の挿通孔に対して圧入状態にしたことを特徴とする発光
ダイオードの固定構造。1. A wiring board in which metal plate wiring is superimposed on a back surface of a synthetic resin housing, and insertion holes corresponding to the housing and the metal plate wiring are provided. A fixing structure for a light-emitting diode, wherein a lead is inserted from the front side and the lead is pressed into at least an insertion hole of a metal plate wiring.
造であって、 金属プレート配線の挿通孔の互いに直交する二方向の径
のうち、少なくとも一方の径を、リードの対応する径よ
りも若干小さくしたことを特徴とする発光ダイオードの
固定構造。2. The fixing structure of a light emitting diode according to claim 1, wherein at least one of the diameters of the through holes of the metal plate wiring in two directions perpendicular to each other is slightly smaller than the corresponding diameter of the lead. A light-emitting diode fixing structure characterized in that it is made smaller.
造であって、 金属プレート配線の挿通孔で互いに向かい合う一対の対
向縁のうち、少なくとも一方の対向縁がリードの挿入時
に弾性変形することを特徴とする発光ダイオードの固定
構造。3. The light-emitting diode fixing structure according to claim 1, wherein at least one of the pair of opposing edges facing each other in the insertion hole of the metal plate wiring is elastically deformed when the lead is inserted. Characteristic light emitting diode fixing structure.
レート配線を重ね合わせた状態で配索すると共に、ハウ
ジング及び金属プレート配線にそれぞれ対応する挿通孔
を設け、両挿通孔に対して発光ダイオードのリードを表
面側から挿入し、リードを金属プレート配線の挿通孔に
対して接触させると共にハウジングの挿通孔に対して圧
入状態にしたことを特徴とする発光ダイオードの固定構
造。4. A wiring board in which metal plate wiring is superposed on a surface of a synthetic resin housing, and insertion holes respectively corresponding to the housing and the metal plate wiring are provided. A fixing structure of a light emitting diode, wherein a lead is inserted from the front side, the lead is brought into contact with an insertion hole of a metal plate wiring, and is pressed into the insertion hole of a housing.
造であって、ハウジングの挿通孔が、非貫通形状である
ことを特徴とする発光ダイオードの固定構造。5. The fixing structure for a light emitting diode according to claim 4, wherein the insertion hole of the housing has a non-penetrating shape.
造であって、 ハウジングの挿通孔が、貫通形状であることを特徴とす
る発光ダイオードの固定構造。6. The fixing structure for a light emitting diode according to claim 4, wherein the insertion hole of the housing has a penetrating shape.
光ダイオードの固定構造であって、 リードの先端部を、ハウジングの挿通孔の内面に対して
抜け方向で係合する形状にしたことを特徴とする発光ダ
イオードの固定構造。7. The fixing structure for a light emitting diode according to claim 4, wherein the distal end of the lead has a shape that engages with the inner surface of the insertion hole of the housing in a detaching direction. A fixing structure for a light-emitting diode, characterized in that:
光ダイオードの固定構造であって、 金属プレート配線の挿通孔で互いに向かい合う一対の対
向縁のうち、少なくとも一方の対向縁がリードの挿入時
に弾性変形すると共に、該弾性変形する対向縁の下方の
ハウジングに凹部を形成したことを特徴とする発光ダイ
オードの固定構造。8. The light-emitting diode fixing structure according to claim 4, wherein at least one of the pair of opposing edges facing each other in the insertion hole of the metal plate wiring has a lead. 3. A fixing structure for a light emitting diode, comprising: a housing which is elastically deformed at the time of insertion and a recess is formed in a housing below the elastically deformed opposing edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11210836A JP2001044506A (en) | 1999-07-26 | 1999-07-26 | Fixation structure for light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11210836A JP2001044506A (en) | 1999-07-26 | 1999-07-26 | Fixation structure for light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001044506A true JP2001044506A (en) | 2001-02-16 |
Family
ID=16595925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11210836A Abandoned JP2001044506A (en) | 1999-07-26 | 1999-07-26 | Fixation structure for light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001044506A (en) |
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