JP2001035878A - Thermal printed head - Google Patents

Thermal printed head

Info

Publication number
JP2001035878A
JP2001035878A JP11201784A JP20178499A JP2001035878A JP 2001035878 A JP2001035878 A JP 2001035878A JP 11201784 A JP11201784 A JP 11201784A JP 20178499 A JP20178499 A JP 20178499A JP 2001035878 A JP2001035878 A JP 2001035878A
Authority
JP
Japan
Prior art keywords
layer
electrode layer
heat insulating
individual electrode
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11201784A
Other languages
Japanese (ja)
Other versions
JP3819640B2 (en
Inventor
Hiroaki Hayashi
浩昭 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP20178499A priority Critical patent/JP3819640B2/en
Publication of JP2001035878A publication Critical patent/JP2001035878A/en
Application granted granted Critical
Publication of JP3819640B2 publication Critical patent/JP3819640B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electronic Switches (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a thermal printed head of a structure, wherein while the thickness of electrode layers is made thin, the bonding strength of a wire bonding of the electrode layers to a driving IC can be increased. SOLUTION: This head is a thermal printed head of a structure, wherein the thermal printed head is provided with a substrate 1, a glazed layer 2 formed on the upper surface of the substrate 1, indivisual electrode layers 4 formed on the upper surface of the layer 2, a heating resistor which is formed on the upper surfaces of the layers 4 and generates heat by applying a current to the resistor through the layers 4, and a driving IC 9 which is formed on the upper surface of the layer 2 and controls a current conduction to the resistor 7. The layers 4 and the IC 9 are connected with each other by a wire bonding, and in the bonding parts on the sides of the layers 4, metal layers 121 for ensuring the adhesion of the layers 4 to the layer 2 are made to interpose between the layer 2 and the layers 4.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本願発明は、感熱方式または
熱転写方式によって記録用紙に記録を行うためのサーマ
ルプリントヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal print head for recording on a recording sheet by a heat-sensitive method or a thermal transfer method.

【０００２】[0002]

【従来の技術】周知のように、サーマルプリントヘッド
は、感熱紙や熱転写インクリボンなどの記録媒体に対し
て選択的に熱を付与して、必要な画像情報を形成するも
のであり、通電されることにより発熱する発熱抵抗体の
形成方法により、厚膜型サーマルプリントヘッドと薄膜
型サーマルプリントヘッドとに大別される。2. Description of the Related Art As is well known, a thermal printhead selectively applies heat to a recording medium such as thermal paper or a thermal transfer ink ribbon to form necessary image information. Depending on the method of forming the heat generating resistor that generates heat, a thick film type thermal print head and a thin film type thermal print head are roughly classified.

【０００３】ここで、従来より用いられている厚膜型サ
ーマルプリントヘッドの構成を、図９および図１０を参
照して説明する。このサーマルプリントヘッドは、たと
えばアルミナセラミックなどからなる基板２１上に、保
温層としてのグレーズ層２２が形成され、グレーズ層２
２には、共通電極層２３および個別電極層２４が形成さ
れるとともに、複数の駆動ＩＣ２５が搭載されている。Here, a configuration of a conventionally used thick film type thermal print head will be described with reference to FIGS. 9 and 10. FIG. In this thermal print head, a glaze layer 22 as a heat insulating layer is formed on a substrate 21 made of, for example, alumina ceramic.
2, a common electrode layer 23 and an individual electrode layer 24 are formed, and a plurality of drive ICs 25 are mounted.

【０００４】共通電極層２３は、櫛歯状に形成された櫛
歯部２６と、各櫛歯部２６の基端同士を接続するコモン
ライン２７とを有し、個別電極層２４は、互いに隣接す
る櫛歯部２６の間に配置されている。櫛歯部２６および
個別電極層２４の一端部の上には、これらを跨ぐよう
に、発熱抵抗体２９が形成されており、発熱抵抗体２９
は保護層３０に覆われている。そして、個別電極層２４
の他端部は、駆動ＩＣ２５に金ワイヤ２８によるボンデ
ィングによって接続されている。The common electrode layer 23 has comb teeth 26 formed in a comb shape and a common line 27 connecting the base ends of the comb teeth 26, and the individual electrode layers 24 are adjacent to each other. Are disposed between the comb teeth portions 26. A heating resistor 29 is formed on one end of the comb teeth portion 26 and one end of the individual electrode layer 24 so as to straddle them.
Are covered with a protective layer 30. Then, the individual electrode layer 24
Is connected to the driving IC 25 by bonding with a gold wire 28.

【０００５】個別電極層２４側のボンディングでは、金
ワイヤ２８を熱圧着した後に切断する、いわゆるステッ
チ法が採用されている。個別電極層２４には、通常、酸
化物を含有する金（以下「有機金」という）が用いられ
るが、金ワイヤ２８との接着力を向上させるために、個
別電極層２４の上に、ガラスフリットを含有する金（以
下「無機金」という）からなる金属層３１を形成し、こ
の金属層３１に金ワイヤ２８をボンディングしている
（たとえば、特開平１−３２１６４４号公報、特開平７
−３２９３２９号公報参照）。The bonding on the individual electrode layer 24 side employs a so-called stitching method, in which the gold wire 28 is cut after thermocompression bonding. Usually, gold containing an oxide (hereinafter referred to as “organic gold”) is used for the individual electrode layer 24. However, in order to improve the adhesive force with the gold wire 28, glass is placed on the individual electrode layer 24. A metal layer 31 made of gold containing frit (hereinafter referred to as “inorganic gold”) is formed, and a gold wire 28 is bonded to the metal layer 31 (for example, JP-A-1-321644, JP-A-7-216).
-329329).

【０００６】ところが、有機金には、一般にグレーズ層
２２に含まれているガラス成分が含有されていないた
め、個別電極層２４は、グレーズ層２２との密着性がよ
くないといった問題点があった。However, since the organic gold generally does not contain the glass component contained in the glaze layer 22, the individual electrode layer 24 has a problem that the adhesion to the glaze layer 22 is not good. .

【０００７】また、上記の構成において、駆動ＩＣ２５
がオンされると、それに対応する発熱抵抗体２９の所定
領域が発熱する。この場合、発熱抵抗体２９に接続され
た個別電極層２４における熱の放散を抑えるため、個別
電極層２４の厚みをできる限り薄くすることが望まれて
いる。個別電極層２４の厚みを薄くできれば、個別電極
層２４の材料である高価な金の使用量を削減することも
可能である。Further, in the above configuration, the driving IC 25
Is turned on, a predetermined area of the heating resistor 29 corresponding to the switch is heated. In this case, it is desired to reduce the thickness of the individual electrode layer 24 as much as possible in order to suppress heat dissipation in the individual electrode layer 24 connected to the heating resistor 29. If the thickness of the individual electrode layer 24 can be reduced, the amount of expensive gold used as the material of the individual electrode layer 24 can be reduced.

【０００８】しかしながら、個別電極層２４の厚みを薄
く（たとえば０．５μｍ以下に）すると、ボンディング
部において、グレーズ層２２との界面における接合強度
が低下し、場合によっては、ワイヤボンディング後にお
いて、個別電極層２４がグレーズ層２２から剥離してし
まうことがある（以下「ステッチ剥がれ」という）。こ
れは、有機金に含まれる、接着剤として機能する酸化物
の絶対量が、個別電極層２４の厚みを薄くすることによ
り減少することに起因する。However, if the thickness of the individual electrode layer 24 is reduced (for example, to 0.5 μm or less), the bonding strength at the bonding portion at the interface with the glaze layer 22 is reduced. The electrode layer 24 may peel off from the glaze layer 22 (hereinafter referred to as “stitch peeling”). This is because the absolute amount of the oxide functioning as an adhesive contained in the organic gold decreases as the thickness of the individual electrode layer 24 is reduced.

【０００９】[0009]

【発明の開示】本願発明は、上記した事情のもとで考え
出されたものであって、個別電極層の厚みを薄くしつ
つ、かつワイヤボンディングの接合強度を高めることの
できるサーマルプリントヘッドを提供することを、その
課題とする。DISCLOSURE OF THE INVENTION The present invention has been conceived in view of the above-mentioned circumstances, and provides a thermal print head capable of increasing the bonding strength of wire bonding while reducing the thickness of an individual electrode layer. The task is to provide.

【００１０】上記の課題を解決するため、本願発明で
は、次の技術的手段を講じている。In order to solve the above problems, the present invention takes the following technical measures.

【００１１】本願発明の第１の側面によれば、基板と、
基板の上面に形成された保温層と、保温層の上面に形成
された電極層と、電極層の上面に形成され、電極層によ
って通電されることにより発熱する抵抗層と、保温層の
上面に形成され、抵抗層への通電を制御する駆動素子と
を備え、電極層と駆動素子とがワイヤボンディングによ
って接続されるサーマルプリントヘッドであって、電極
層側のボンディング部において、保温層と電極層との間
に、保温層との密着性を確保するための金属層が介在さ
れたことを特徴とする、サーマルプリントヘッドが提供
される。According to a first aspect of the present invention, a substrate comprises:
A heat insulating layer formed on the upper surface of the substrate, an electrode layer formed on the upper surface of the heat insulating layer, a resistive layer formed on the upper surface of the electrode layer and generating heat when energized by the electrode layer; A thermal printhead formed and provided with a drive element for controlling the conduction to the resistance layer, wherein the electrode layer and the drive element are connected by wire bonding. A thermal print head, wherein a metal layer for ensuring adhesion to the heat insulating layer is interposed between the thermal print head and the thermal print head.

【００１２】本願発明によれば、電極層側のボンディン
グ部において、保温層と電極層との間に、保温層との密
着性を確保するための金属層が介在される。そのため、
電極層は、実質的に金属層を介してボンディング部にお
ける保温層との接合性を向上させることができるので、
ワイヤボンディングにおける接合強度を高めることがで
きる。According to the present invention, in the bonding portion on the electrode layer side, a metal layer is interposed between the heat insulating layer and the electrode layer to ensure adhesion to the heat insulating layer. for that reason,
Since the electrode layer can substantially improve the bonding property with the heat insulating layer in the bonding portion via the metal layer,
Bonding strength in wire bonding can be increased.

【００１３】本願発明の第２の側面によれば、基板と、
基板の上面に形成された保温層と、保温層の上面に形成
された電極層と、電極層の上に形成され、電極層によっ
て通電されることにより発熱する抵抗層と、保温層の上
面に形成され、抵抗層への通電を制御する駆動素子とを
備え、電極層側と駆動素子とがワイヤボンディングによ
って接続されるサーマルプリントヘッドであって、電極
層側のボンディング部において、保温層の表面に、保温
層との密着性を確保するとともに電極層と導通された金
属層が形成され、金属層は、少なくとも一部がワイヤと
接続されたことを特徴とする、サーマルプリントヘッド
が提供される。According to a second aspect of the present invention, a substrate comprises:
A heat insulating layer formed on the upper surface of the substrate, an electrode layer formed on the upper surface of the heat insulating layer, a resistive layer formed on the electrode layer and generating heat when energized by the electrode layer; A thermal print head formed with a driving element for controlling current flow to the resistance layer, wherein the electrode layer side and the driving element are connected by wire bonding, wherein a bonding portion on the electrode layer side has a surface of the heat insulating layer. A thermal print head, characterized in that a metal layer which is secured to the heat insulating layer and is electrically connected to the electrode layer is formed, and the metal layer is at least partially connected to a wire. .

【００１４】本願発明によれば、電極層側のボンディン
グ部において、保温層の表面に、保温層との密着性を確
保するための金属層が形成され、当該金属層は、その一
部がワイヤに接続される。そのため、電極層は、ワイヤ
ボンディングにおいて直接的に関与しなくなくなるの
で、結果的にワイヤボンディングにおける接合強度を高
めることができる。According to the present invention, in the bonding portion on the electrode layer side, a metal layer for ensuring adhesion to the heat insulating layer is formed on the surface of the heat insulating layer, and a part of the metal layer is a wire. Connected to. Therefore, the electrode layer does not directly participate in the wire bonding, and as a result, the bonding strength in the wire bonding can be increased.

【００１５】本願発明の好ましい実施の形態によれば、
金属層は、ガラスフリットを含有する金からなる。これ
によれば、たとえば保温層がガラス成分を含んでおれ
ば、保温層と金属層との密着性が充分に確保される。According to a preferred embodiment of the present invention,
The metal layer is made of gold containing glass frit. According to this, for example, if the heat insulation layer contains a glass component, the adhesion between the heat insulation layer and the metal layer is sufficiently ensured.

【００１６】本願発明の他の好ましい実施の形態によれ
ば、電極層は、酸化物を含有する金からなり、その厚み
が０．３〜０．５μｍとされる。上記のように、電極層
は、金属層によって保温層との接合性が向上されるの
で、その厚みを薄くしてもワイヤボンディングの接合強
度に影響を及ぼすことはない。したがって、電極層の厚
みを、たとえば０．３〜０．５μｍ程度に薄くでき、電
極層からの熱の放散を抑制することができる。さらに、
電極層の材料である高価な金の使用量を削減することが
できる。According to another preferred embodiment of the present invention, the electrode layer is made of gold containing an oxide and has a thickness of 0.3 to 0.5 μm. As described above, since the bonding property of the electrode layer with the heat insulating layer is improved by the metal layer, the bonding strength of the wire bonding is not affected even if the thickness is reduced. Therefore, the thickness of the electrode layer can be reduced to, for example, about 0.3 to 0.5 μm, and heat dissipation from the electrode layer can be suppressed. further,
The amount of expensive gold used as a material for the electrode layer can be reduced.

【００１７】本願発明のその他の特徴および利点は、添
付図面を参照して以下に行う詳細な説明によって、より
明らかとなろう。[0017] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

【００１８】[0018]

【発明の実施の形態】以下、本願発明の好ましい実施の
形態を、添付図面を参照して具体的に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

【００１９】図１は、本願発明に係るサーマルプリント
ヘッドの要部平面図であり、図２は、図１におけるＡ−
Ａ矢視断面図である。このサーマルプリントヘッドは、
アルミナセラミックなどの絶縁性材料からなる平板状の
基板１を備え、その基板１の上面の全面に亘り、ガラス
を主成分とする保温層としてのグレーズ層２が形成され
ている。グレーズ層２の上面には、共通電極層３および
複数の個別電極層４が形成されている。FIG. 1 is a plan view of a principal part of a thermal print head according to the present invention, and FIG.
It is arrow A sectional drawing. This thermal printhead is
A flat substrate 1 made of an insulating material such as alumina ceramic is provided, and a glaze layer 2 as a heat insulating layer mainly composed of glass is formed over the entire upper surface of the substrate 1. On the upper surface of the glaze layer 2, a common electrode layer 3 and a plurality of individual electrode layers 4 are formed.

【００２０】共通電極層３は、基板１の幅方向の他端側
に向かって突出する櫛歯部５と、櫛歯部５の基端同士を
接続するコモンライン部６とを有しており、上記櫛歯部
５と個別電極層４とは基板１の長手方向のほぼ全長に亘
り交互に配されている。櫛歯部５および個別電極層４の
上には、これらを跨ぐように、基板１の長手方向のほぼ
全長に亘り、共通電極層３および個別電極層４によって
通電されることにより発熱する発熱抵抗体７が形成され
ている。The common electrode layer 3 has a comb tooth portion 5 protruding toward the other end of the substrate 1 in the width direction, and a common line portion 6 connecting the base ends of the comb tooth portions 5 to each other. The comb portions 5 and the individual electrode layers 4 are arranged alternately over substantially the entire length of the substrate 1 in the longitudinal direction. On the comb-teeth portion 5 and the individual electrode layer 4, a heating resistance that is generated by being energized by the common electrode layer 3 and the individual electrode layer 4 over the substantially entire length in the longitudinal direction of the substrate 1 so as to straddle them. A body 7 is formed.

【００２１】発熱抵抗体７、櫛歯部５および個別電極層
４の一部は、耐摩耗性を有する材料からなる保護層８に
よって覆われている。また、グレーズ層２の上には、基
板１の幅方向他端部の位置に、複数の駆動ＩＣ９が基板
１の長手方向に一列に搭載されている。駆動ＩＣ９と各
個別電極層４とは、ボンディングされた金からなるワイ
ヤ１０を介して接続されている。The heating resistor 7, the comb teeth 5, and a part of the individual electrode layer 4 are covered with a protective layer 8 made of a material having wear resistance. A plurality of drive ICs 9 are mounted on the glaze layer 2 at one end in the width direction of the substrate 1 in a line in the longitudinal direction of the substrate 1. The driving IC 9 and each individual electrode layer 4 are connected via a bonded wire 10 made of gold.

【００２２】駆動ＩＣ９は、印字データに応じて発熱抵
抗体７への通電を制御するものであり、各個別電極層４
に対応して駆動ＩＣ９に内蔵されているスイッチング素
子（図示せず）がオンすると、電源の陽極（図示せ
ず）、共通電極層３、櫛歯部５、発熱抵抗体７、個別電
極層４、ワイヤ１０、駆動ＩＣ９のスイッチング素子、
および電源の陰極（図示せず）からなる閉ループが形成
され、個別電極層４とその両側の櫛歯部５との間の発熱
抵抗体７に通電される。The drive IC 9 controls the energization of the heating resistor 7 in accordance with the print data.
When a switching element (not shown) built in the drive IC 9 is turned on in response to the above, an anode (not shown) of a power supply, a common electrode layer 3, a comb tooth portion 5, a heating resistor 7, an individual electrode layer 4 , Wire 10, switching element of drive IC 9,
A closed loop composed of a power source and a cathode (not shown) is formed, and power is supplied to the heating resistor 7 between the individual electrode layer 4 and the comb teeth 5 on both sides thereof.

【００２３】図３は、個別電極層４のボンディング部に
おける要部拡大断面図である。同図によれば、個別電極
層４のボンディング部では、グレーズ層２と個別電極層
４との間に、金属層１１が介装され、金属層１１の上方
にある個別電極層４とワイヤ１０とがボンディングされ
ている。FIG. 3 is an enlarged sectional view of a main part of the bonding portion of the individual electrode layer 4. According to the figure, in the bonding portion of the individual electrode layer 4, a metal layer 11 is interposed between the glaze layer 2 and the individual electrode layer 4, and the individual electrode layer 4 and the wire 10 above the metal layer 11 are interposed. Are bonded.

【００２４】金属層１１は、接着剤として機能するガラ
スフリットを含有する無機金からなり、厚みは１μｍ程
度である。一方、個別電極層４は、接着剤として機能す
る酸化物、たとえば酸化珪素、酸化鉛等を含有する有機
金からなり、厚みは、０．６μｍ程度である。The metal layer 11 is made of inorganic gold containing glass frit that functions as an adhesive, and has a thickness of about 1 μm. On the other hand, the individual electrode layer 4 is made of organic gold containing an oxide functioning as an adhesive, for example, silicon oxide, lead oxide, or the like, and has a thickness of about 0.6 μm.

【００２５】このように、金属層１１およびグレーズ層
２は、ともにガラス成分を含んでいるため、個別電極層
４のボンディング部において、グレーズ層２の上面に無
機金からなる金属層１１を形成することにより、金属層
１１はグレーズ層２に対して良好に密着する。そのた
め、個別電極層が直接グレーズ層の上面に形成されてい
た従来の構成に比べ、ワイヤボンディングの接合強度が
高められ、たとえばステッチ剥がれなどの発生を抑制す
ることができる。また、金属層１１には、比較的軟質の
性質を有する無機金が用いられるので、ワイヤボンディ
ングされる際に、金属層１１はクッションとしての機能
し、ボンディングの際の押圧力を分散させて個別電極層
４の損傷などを抑制することができる。As described above, since both the metal layer 11 and the glaze layer 2 contain a glass component, the metal layer 11 made of inorganic gold is formed on the upper surface of the glaze layer 2 at the bonding portion of the individual electrode layer 4. As a result, the metal layer 11 adheres well to the glaze layer 2. For this reason, the bonding strength of wire bonding is increased as compared with the conventional configuration in which the individual electrode layer is formed directly on the upper surface of the glaze layer, and for example, occurrence of stitch peeling can be suppressed. Further, since the metal layer 11 is made of inorganic gold having relatively soft properties, the metal layer 11 functions as a cushion when wire bonding is performed, and disperses the pressing force during bonding to individually Damage of the electrode layer 4 can be suppressed.

【００２６】また、金属層１１がグレーズ層２に対して
良好に密着される結果、個別電極層４は、ボンディング
部において、直接、グレーズ層２と接しなくなるので、
個別電極層４とグレーズ層２との密着性の問題は解消さ
れる。それゆえ、個別電極層４の厚みを薄く、たとえば
０．３〜０．５μｍに形成することができる。そのた
め、個別電極層４からの熱の放散を抑えることができる
ので、消費電力の低減が図られる。また、個別電極層４
の厚みを薄く形成できることにより、個別電極層４の材
料の使用量を節約できるので、部品コストの低減を図る
ことができる。Also, as a result of the metal layer 11 being in good contact with the glaze layer 2, the individual electrode layer 4 does not come into direct contact with the glaze layer 2 at the bonding portion.
The problem of the adhesion between the individual electrode layer 4 and the glaze layer 2 is solved. Therefore, the thickness of the individual electrode layer 4 can be reduced, for example, to 0.3 to 0.5 μm. Therefore, heat dissipation from the individual electrode layer 4 can be suppressed, and power consumption can be reduced. In addition, the individual electrode layer 4
Since the thickness of the individual electrodes 4 can be reduced by reducing the thickness of the individual electrodes 4, the cost of parts can be reduced.

【００２７】なお、上記した上層に個別電極層４、下層
に金属層１１を形成した構成において、ステッチ剥がれ
の有無、ステッチ剥がれ率、およびワイヤボンディング
の接合強度の各項目について実験した結果を表１に示
す。また、従来の、上層に金属層１１、下層に個別電極
層４を形成した構成について実験した結果も、比較例と
して表１に示す。Table 1 shows the results of experiments conducted on the above-described configuration in which the individual electrode layer 4 was formed as the upper layer and the metal layer 11 was formed as the lower layer, with or without stitch peeling, stitch peeling rate, and bonding strength of wire bonding. Shown in Table 1 also shows the results of an experiment conducted on a conventional configuration in which the metal layer 11 was formed in the upper layer and the individual electrode layer 4 was formed in the lower layer.

【００２８】なお、個別電極層４の厚みは０．４μｍ、
金属層１１の厚みは１．０μｍにそれぞれ設定した。ま
た、ワイヤボンディングの接合強度の実験は、たとえ
ば、図４に示すように、一般的なばね秤１２を、ボンデ
ィングされたワイヤ１０に引っかけて牽引することによ
り行い、ワイヤボンディングの接合強度は、ワイヤ１０
が個別電極層４から剥離したときのばね秤１２の目盛り
の値について、試料２０個の平均をとることにより求め
た。The thickness of the individual electrode layer 4 is 0.4 μm,
The thickness of the metal layer 11 was set to 1.0 μm. Further, the experiment of the bonding strength of the wire bonding is performed by, for example, hooking a general spring balance 12 on the bonded wire 10 and pulling the wire, as shown in FIG. 10
Was measured by taking the average of 20 samples for the scale value of the spring balance 12 when peeled off from the individual electrode layer 4.

【００２９】[0029]

【表１】 [Table 1]

【００３０】表１に示すように、比較例の構成では、１
４４個の試料の全てにおいてステッチ剥がれが生じたの
に対し、本実施形態の構成では、１４４個の試料に対し
てステッチ剥がれは全く起こらなかった。また、ワイヤ
ボンディングの接合強度については、本実施形態の構成
では、比較例の構成に比べ、３．７ｇ高い７．７ｇとい
う数値が得られ、密着性が格段に向上したことがわかっ
た。As shown in Table 1, in the configuration of the comparative example, 1
While stitch peeling occurred in all 44 samples, stitch peeling did not occur in 144 samples in the configuration of the present embodiment. As for the bonding strength of the wire bonding, in the configuration of the present embodiment, a value of 7.7 g, which is 3.7 g higher than that of the configuration of the comparative example, was obtained, and it was found that the adhesion was significantly improved.

【００３１】次に、上記サーマルプリントヘッドの製造
方法について説明する。まず、アルミナセラミックから
なる基板１の上に、ガラスを印刷し、１２００℃程度で
焼成することによりグレーズ層２を形成する。Next, a method of manufacturing the thermal print head will be described. First, a glass is printed on a substrate 1 made of alumina ceramic and baked at about 1200 ° C. to form a glaze layer 2.

【００３２】次いで、グレーズ層２の上面において、個
別電極層４のボンディング部に、無機金を印刷し焼成す
ることにより金属層１１を形成する。その後、金属層１
１を覆うように、有機金を印刷焼成し、フォトエッチン
グにより有機金の不要部を除去することにより、個別電
極層４と共通電極層３とを形成する。Next, on the upper surface of the glaze layer 2, a metal layer 11 is formed by printing and firing inorganic gold on the bonding portion of the individual electrode layer 4. Then, the metal layer 1
The individual electrode layer 4 and the common electrode layer 3 are formed by printing and baking the organic gold so as to cover 1 and removing unnecessary portions of the organic gold by photoetching.

【００３３】次に、個別電極層４と共通電極層３の櫛歯
部５との上から抵抗体ペーストを帯状に印刷し、４００
℃程度で焼成することにより発熱抵抗体７を形成する。
そして、発熱抵抗体７の上に、耐摩耗性物質を含有した
保護膜ペーストを帯状に印刷し、４００℃程度で焼成す
ることにより保護層８を形成する。Next, a resistor paste is printed on the individual electrode layer 4 and the comb tooth portion 5 of the common electrode layer 3 in a strip shape, and
The heating resistor 7 is formed by firing at about ° C.
Then, a protective film paste containing an abrasion-resistant substance is printed in a belt shape on the heating resistor 7 and baked at about 400 ° C. to form the protective layer 8.

【００３４】この後、基板１の幅方向他端部の部位にて
グレーズ層２上に、所定数の駆動ＩＣ９を搭載（ボンデ
ィング）し、駆動ＩＣ９と個別電極層４とをワイヤ１０
により接続する。Thereafter, a predetermined number of drive ICs 9 are mounted (bonded) on the glaze layer 2 at the other end in the width direction of the substrate 1, and the drive IC 9 and the individual electrode layers 4 are connected to the wires 10.
Connect with

【００３５】まず、駆動ＩＣ９に、ワイヤ１０の一端部
をボンディングする。具体的には、基板１を図示しない
ヒーティングブロックに載置して、基板１を所定温度に
加熱しておく。そして、図５に示すように、キャピラリ
１３と呼称される治具にワイヤ１０を通し、キャピラリ
１３の先端部からワイヤ１０の一端部を突出させる。こ
のとき、一端部は水素炎により加熱してボール状に形成
しておく。First, one end of the wire 10 is bonded to the drive IC 9. Specifically, the substrate 1 is placed on a heating block (not shown), and the substrate 1 is heated to a predetermined temperature. Then, as shown in FIG. 5, the wire 10 is passed through a jig called a capillary 13, and one end of the wire 10 is projected from the tip of the capillary 13. At this time, one end is heated by a hydrogen flame to form a ball.

【００３６】そして、図６に示すように、キャピラリ１
３を下動させて、ワイヤ１０の先端部を駆動ＩＣ９のボ
ンディング部に圧し付けることにより、駆動ＩＣ９上に
ワイヤ１０の一端部を熱圧着する（１次ボンディン
グ）。Then, as shown in FIG.
3 is moved downward, and the distal end of the wire 10 is pressed against the bonding portion of the drive IC 9, whereby one end of the wire 10 is thermocompressed onto the drive IC 9 (primary bonding).

【００３７】続いて、図７に示すように、ワイヤ１０を
引き出しつつキャピラリ１３を移動させて、ワイヤ１０
を個別電極層４の所定位置に押し付ける。すなわち、図
示しないヒーティングブロックによって供給される熱
と、キャピラリ１３による押圧力とによってワイヤ１０
を個別電極層４の上面に熱圧着する（２次ボンディン
グ）。さらに、キャピラリ１３を個別電極層４に押し付
けながらスライドさせるようにして移動させてワイヤ１
０を圧し切り、ワイヤボンディング工程を終了する。こ
のようにして、図１および図２に示すサーマルプリント
ヘッドを得る。Subsequently, as shown in FIG. 7, the capillary 13 is moved while pulling out the wire 10 so that the wire 10
Is pressed to a predetermined position of the individual electrode layer 4. That is, the heat supplied by the heating block (not shown) and the pressing force of the capillary 13 cause the wire 10
Is thermocompression-bonded to the upper surface of the individual electrode layer 4 (secondary bonding). Further, the capillary 13 is moved while being slid while being pressed against the individual electrode layer 4 so that the wire 1 is moved.
0 is depressed and the wire bonding step is completed. Thus, the thermal print head shown in FIGS. 1 and 2 is obtained.

【００３８】図８は、個別電極層４のワイヤボンディン
グ部における構成の変形例を示す図である。この変形例
では、グレーズ層２の表面に、グレーズ層２との密着性
を確保するとともに個別電極層４と導通された金属層１
１が形成され、金属層１１は、一部が金ワイヤ１０と接
続されている。FIG. 8 is a diagram showing a modification of the configuration of the individual electrode layer 4 at the wire bonding portion. In this modification, on the surface of the glaze layer 2, the metal layer 1 which is secured to the glaze layer 2 and is electrically connected to the individual electrode layer 4 is provided.
1 is formed, and a part of the metal layer 11 is connected to the gold wire 10.

【００３９】すなわち、グレーズ層２の表面に形成され
た金属層１１の上面部が外部に露出するように、金属層
１１の周囲を取り囲んで個別電極層４が形成される。そ
して、金属層１１の露出部分とワイヤ１０とが直接ボン
ディングされる。その他の構成は、上記した実施形態と
同様である。なお、個別電極層４は、金属層１１の周囲
に形成されるのではなく、金属層１１の一端部のみに接
触されるように形成されてもよい。That is, the individual electrode layer 4 is formed so as to surround the metal layer 11 so that the upper surface of the metal layer 11 formed on the surface of the glaze layer 2 is exposed to the outside. Then, the exposed portion of the metal layer 11 and the wire 10 are directly bonded. Other configurations are the same as those of the above-described embodiment. The individual electrode layer 4 may not be formed around the metal layer 11 but may be formed so as to contact only one end of the metal layer 11.

【００４０】このサーマルプリントヘッドの製造に際し
ては、グレーズ層２の上に金属層１１を印刷焼成して形
成し、その後、金属層１１の一部が外部に露出するよう
に、個別電極層４を印刷焼成して形成する。その他の製
造工程は、上記した実施形態と同様である。In manufacturing the thermal print head, a metal layer 11 is formed on the glaze layer 2 by printing and baking, and then the individual electrode layer 4 is formed so that a part of the metal layer 11 is exposed to the outside. It is formed by printing and baking. Other manufacturing steps are the same as in the above-described embodiment.

【００４１】この構成によっても、金属層１１がグレー
ズ層２に上面に形成されるので、上記の実施形態と同様
に、ワイヤボンディングにおける接合強度を高めること
ができる。さらに、金属層１１は直接ワイヤ１０に接続
されるので、結果的に個別電極層４はワイヤボンディン
グに関与しなくなるので、ワイヤ１０との接着性がより
向上する。また、金属層１１の上面を露出させるので、
上記実施形態に比べ、個別電極層４の材料の使用量を削
減することができる。According to this structure, the metal layer 11 is formed on the upper surface of the glaze layer 2, so that the bonding strength in wire bonding can be increased as in the above embodiment. Furthermore, since the metal layer 11 is directly connected to the wire 10, the individual electrode layer 4 is not involved in the wire bonding as a result, so that the adhesion to the wire 10 is further improved. Also, since the upper surface of the metal layer 11 is exposed,
Compared with the above embodiment, the amount of material used for the individual electrode layer 4 can be reduced.

【００４２】もちろん、この発明の範囲は上述した実施
の形態に限定されるものではない。たとえば、個別電極
層４のボンディング部において、グレーズ層２の上面に
金属層１１を形成し、それを覆うように個別電極層４を
形成し、さらに個別電極層４の上面に無機金による層を
形成してボンディングしてもよい。Of course, the scope of the present invention is not limited to the above embodiment. For example, in the bonding portion of the individual electrode layer 4, a metal layer 11 is formed on the upper surface of the glaze layer 2, the individual electrode layer 4 is formed so as to cover the metal layer 11, and a layer made of inorganic gold is further formed on the upper surface of the individual electrode layer 4. It may be formed and bonded.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本願発明に係るサーマルプリントヘッドの要部
平面図である。FIG. 1 is a plan view of a main part of a thermal print head according to the present invention.

【図２】図１におけるＡ−Ａ矢視断面図である。FIG. 2 is a sectional view taken along the line AA in FIG.

【図３】サーマルプリントヘッドの要部拡大断面図であ
る。FIG. 3 is an enlarged sectional view of a main part of the thermal print head.

【図４】ワイヤボンディングの接合強度を調べるための
構成を示す図である。FIG. 4 is a diagram showing a configuration for checking the bonding strength of wire bonding.

【図５】サーマルプリントヘッドの製造工程を説明する
ための図である。FIG. 5 is a diagram for explaining a manufacturing process of the thermal print head.

【図６】サーマルプリントヘッドの製造工程を説明する
ための図である。FIG. 6 is a diagram for explaining a manufacturing process of the thermal print head.

【図７】サーマルプリントヘッドの製造工程を説明する
ための図である。FIG. 7 is a diagram for explaining a manufacturing process of the thermal print head.

【図８】サーマルプリントヘッドの変形例を示す要部拡
大断面図である。FIG. 8 is an enlarged sectional view of a main part showing a modification of the thermal print head.

【図９】従来のサーマルプリントヘッドの要部平面図で
ある。FIG. 9 is a plan view of a main part of a conventional thermal print head.

【図１０】図９におけるＢ−Ｂ矢視断面図である。FIG. 10 is a sectional view taken along the line BB in FIG. 9;

【符号の説明】[Explanation of symbols]

１ 基板 ２ 保温層 ４ 個別電極層 ７ 発熱抵抗体 ９ 駆動ＩＣ １０ 金ワイヤ １１ 金属層 DESCRIPTION OF SYMBOLS 1 Substrate 2 Heat insulation layer 4 Individual electrode layer 7 Heating resistor 9 Drive IC 10 Gold wire 11 Metal layer

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 基板と、前記基板の上面に形成された保
温層と、前記保温層の上面に形成された電極層と、前記
電極層の上面に形成され、前記電極層によって通電され
ることにより発熱する抵抗層と、前記保温層の上面に形
成され、前記抵抗層への通電を制御する駆動素子とを備
え、前記電極層と駆動素子とがワイヤボンディングによ
って接続されるサーマルプリントヘッドであって、 前記電極層側のボンディング部において、前記保温層と
電極層との間に、前記保温層との密着性を確保するため
の金属層が介在されたことを特徴とする、サーマルプリ
ントヘッド。1. A substrate, a heat insulating layer formed on an upper surface of the substrate, an electrode layer formed on the upper surface of the heat insulating layer, and an electric current formed on the upper surface of the electrode layer and being energized by the electrode layer. And a drive element formed on the upper surface of the heat insulation layer and controlling the conduction to the resistance layer, wherein the electrode layer and the drive element are connected by wire bonding. A thermal print head, wherein a metal layer for ensuring adhesion to the heat insulating layer is interposed between the heat insulating layer and the electrode layer in the bonding portion on the electrode layer side. 【請求項２】 基板と、前記基板の上面に形成された保
温層と、前記保温層の上面に形成された電極層と、前記
電極層の上に形成され、前記電極層によって通電される
ことにより発熱する抵抗層と、前記保温層の上面に形成
され、前記抵抗層への通電を制御する駆動素子とを備
え、前記電極層側と駆動素子とがワイヤボンディングに
よって接続されるサーマルプリントヘッドであって、 前記電極層側のボンディング部において、前記保温層の
表面に、前記保温層との密着性を確保するとともに前記
電極層と導通された金属層が形成され、 前記金属層は、少なくとも一部が前記ワイヤと接続され
たことを特徴とする、サーマルプリントヘッド。2. A substrate, a heat insulating layer formed on the upper surface of the substrate, an electrode layer formed on the upper surface of the heat insulating layer, and an electric current formed on the electrode layer and being energized by the electrode layer. And a driving element formed on the upper surface of the heat insulating layer and controlling the supply of current to the resistance layer, wherein the electrode layer side and the driving element are connected by wire bonding. In the bonding portion on the side of the electrode layer, a metal layer is formed on a surface of the heat insulating layer, the metal layer being electrically connected to the electrode layer while ensuring adhesion to the heat insulating layer. A thermal printhead, wherein a portion is connected to the wire. 【請求項３】 前記金属層は、ガラスフリットを含有す
る金からなる、請求項１または２に記載のサーマルプリ
ントヘッド。3. The thermal printhead according to claim 1, wherein the metal layer is made of gold containing glass frit. 【請求項４】 前記電極層は、酸化物を含有する金から
なり、その厚みが０．３〜０．５μｍとされる、請求項
１ないし３のいずれかに記載のサーマルプリントヘッ
ド。4. The thermal printhead according to claim 1, wherein said electrode layer is made of gold containing an oxide and has a thickness of 0.3 to 0.5 μm.
JP20178499A 1999-07-15 1999-07-15 Thermal print head Expired - Fee Related JP3819640B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20178499A JP3819640B2 (en) 1999-07-15 1999-07-15 Thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20178499A JP3819640B2 (en) 1999-07-15 1999-07-15 Thermal print head

Publications (2)

Publication Number Publication Date
JP2001035878A true JP2001035878A (en) 2001-02-09
JP3819640B2 JP3819640B2 (en) 2006-09-13

Family

ID=16446891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20178499A Expired - Fee Related JP3819640B2 (en) 1999-07-15 1999-07-15 Thermal print head

Country Status (1)

Country Link
JP (1) JP3819640B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100406265C (en) * 2005-02-07 2008-07-30 阿尔卑斯电气株式会社 Thermal head including bonding pads having irregular surfaces formed by forming irregularities on underlayer
CN110509672A (en) * 2018-05-22 2019-11-29 罗姆股份有限公司 Thermal printing head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100406265C (en) * 2005-02-07 2008-07-30 阿尔卑斯电气株式会社 Thermal head including bonding pads having irregular surfaces formed by forming irregularities on underlayer
CN110509672A (en) * 2018-05-22 2019-11-29 罗姆股份有限公司 Thermal printing head
CN110509672B (en) * 2018-05-22 2020-11-27 罗姆股份有限公司 Thermal print head

Also Published As

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