JP2001018240A - Resin casting apparatus - Google Patents
Resin casting apparatusInfo
- Publication number
- JP2001018240A JP2001018240A JP11197766A JP19776699A JP2001018240A JP 2001018240 A JP2001018240 A JP 2001018240A JP 11197766 A JP11197766 A JP 11197766A JP 19776699 A JP19776699 A JP 19776699A JP 2001018240 A JP2001018240 A JP 2001018240A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- dielectric
- sensor
- casting apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010125 resin casting Methods 0.000 title claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 202
- 239000011347 resin Substances 0.000 claims abstract description 202
- 238000002156 mixing Methods 0.000 claims abstract description 41
- 238000005266 casting Methods 0.000 claims abstract description 39
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 238000012544 monitoring process Methods 0.000 claims abstract description 12
- 238000002347 injection Methods 0.000 claims description 41
- 239000007924 injection Substances 0.000 claims description 41
- 238000005259 measurement Methods 0.000 claims description 27
- 230000008859 change Effects 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 5
- 230000006698 induction Effects 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000000499 gel Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/44—Resins; Plastics; Rubber; Leather
- G01N33/442—Resins; Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/21—Measuring
- B01F35/213—Measuring of the properties of the mixtures, e.g. temperature, density or colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0288—Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/42—Casting under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/221—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance by investigating the dielectric properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
- B01F2101/2805—Mixing plastics, polymer material ingredients, monomers or oligomers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Electrochemistry (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、例えばガス遮断
器等電力機器に用いるブッシング、絶縁スペーサや樹脂
モールドコイル、モールドバルブなどのエポキシ樹脂注
型品を短時間で高速注型するのに適する樹脂注型装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin suitable for high-speed injection of an epoxy resin, such as a bushing, an insulating spacer, a resin molded coil, and a molded valve, for use in power equipment such as a gas circuit breaker. For casting devices.
【０００２】[0002]
【従来の技術】高速注型とは、エポキシ樹脂注型品を短
時間で硬化成形する製造手法であり、一般に樹脂混合タ
ンクと真空室を介して配管で接続された注型金型と、金
型を駆動する金型開閉装置で構成される。2. Description of the Related Art High-speed casting is a manufacturing method in which an epoxy resin casting is cured and molded in a short time. Generally, a casting mold connected to a resin mixing tank and a pipe via a vacuum chamber is connected to a molding die. It consists of a mold opening and closing device that drives the mold.
【０００３】注型樹脂にはシリカ粉やアルミナ粉を充填
した反応性の高いエポキシ樹脂が用いられる。その成型
手順の概要は、樹脂を混合タンク内で真空脱泡しながら
硬化剤と攪拌混合する。金型内には、予め樹脂注型品内
に埋設する予熱乾燥した金属導体やインサートを設置し
ておき、金型を真空室内で金型開閉装置によって閉鎖
し、真空室を真空にした後、金型底部に設けられた注入
口から、樹脂混合タンク内を加圧することによって、樹
脂注入を行う。金型に樹脂が充填された後は、樹脂混合
タンク側から０．１〜０．５ＭＰａ程度の樹脂圧力を与
えたまま加熱硬化させる。通常、高速注型では注入前の
樹脂温度をポットライフ（可使時間）を確保するために
４０〜６０℃と低温に設定し、一方の金型には、短時間
に硬化物を得るために１２０℃以上の高温が設定され
る。これにより、樹脂量１０ｋｇ以上の大型の樹脂注型
品を、２０〜６０分という非常に短時間で離型すること
ができる。As the casting resin, a highly reactive epoxy resin filled with silica powder or alumina powder is used. The outline of the molding procedure is to stir and mix the resin with the curing agent while vacuum defoaming the resin in the mixing tank. In the mold, pre-heated and dried metal conductors and inserts to be embedded in the resin casting are installed in advance, and the mold is closed by the mold opening and closing device in the vacuum chamber, and the vacuum chamber is evacuated. The resin is injected by pressurizing the inside of the resin mixing tank from an injection port provided at the bottom of the mold. After the mold is filled with the resin, the resin is cured by heating while applying a resin pressure of about 0.1 to 0.5 MPa from the resin mixing tank side. Usually, in high-speed casting, the resin temperature before injection is set to a low temperature of 40 to 60 ° C. in order to secure a pot life (usable time), and one mold is used to obtain a cured product in a short time. A high temperature of 120 ° C. or higher is set. Thereby, a large-sized resin casting having a resin amount of 10 kg or more can be released in a very short time of 20 to 60 minutes.
【０００４】金型を開放し離型した樹脂注型品は、２次
硬化炉に投入され、樹脂の反応が終了するまで完全に硬
化される。[0004] The resin cast product from which the mold is opened and released is put into a secondary curing furnace, where it is completely cured until the reaction of the resin is completed.
【０００５】[0005]
【発明が解決しようとする課題】高速注型技術で、品質
の高い樹脂注型品を得るためには、温度や圧力、時間な
どの製造条件を最適化するとともに、決定した製造条件
を精密に管理し、硬化中の樹脂の粘弾性を正確に知る必
要がある。高速注型技術は、樹脂の反応性が高く硬化発
熱も大きくなるため、注入する樹脂の温度、圧力、注入
速度などの条件の偏差や、金型の温度バランス、離型タ
イミングなどの製造条件の僅かなばらつきによって、樹
脂注型品の耐クラック性、寸法精度、部分放電特性が大
きく左右され、不良率の上昇を招く。金型内部の樹脂硬
化のバランスがくずれると、樹脂注型品の残留応力は増
大し、収縮マーク等の発生によって、耐クラック性能や
寸法精度が低下し、応力による導体と樹脂間の剥離によ
って部分放電特性等の電気特性が著しく低下する。ま
た、電界緩和用Ｕ字溝などの複雑な形状の樹脂注型品の
場合には、特に、離型のタイミングが重要となる。離型
のタイミングが早すぎると、離型に十分な強度を確保す
ることができない。一方、離型タイミングが遅れ金型内
で過剰に硬化を与えると、金型に拘束されれたまま樹脂
の硬化収縮が進行するため、残留ひずみが生じ導体部の
剥離によって部分放電特性が低下したり、クラックに至
ることがある。In order to obtain high-quality resin cast products by high-speed casting technology, it is necessary to optimize manufacturing conditions such as temperature, pressure, and time, and to precisely determine the determined manufacturing conditions. It is necessary to control and accurately know the viscoelasticity of the resin being cured. High-speed casting technology has high reactivity of resin and high heat generation during curing.Therefore, deviation of conditions such as temperature, pressure and injection speed of resin to be injected, and manufacturing conditions such as mold temperature balance and mold release timing. The slight variation greatly affects the crack resistance, dimensional accuracy, and partial discharge characteristics of the resin-cast product, resulting in an increase in the defective rate. If the balance of resin curing inside the mold is lost, the residual stress of the resin cast product increases, the occurrence of shrinkage marks, etc., lowers crack resistance and dimensional accuracy. Electrical characteristics such as discharge characteristics are significantly reduced. Also, in the case of a resin casting having a complicated shape such as a U-shaped groove for electric field relaxation, the timing of release is particularly important. If the release timing is too early, it is not possible to secure sufficient strength for release. On the other hand, if the mold release timing is delayed and excessive curing is performed in the mold, the curing shrinkage of the resin proceeds while being restrained by the mold, so residual strain occurs and the partial discharge characteristics deteriorate due to peeling of the conductor. Or cracks.
【０００６】高速注型技術において、製造条件を管理す
るには、金型内部の樹脂の硬化状態を正確に把握するこ
とが重要となるために、各種センサーによって検知する
試みがある。例えば、圧力センサーを金型面に配置し、
金型内圧を計測する場合があるが、樹脂のゲル化以降の
硬化検出精度が悪くなる。また、熱電対などの温度セン
サーでは、製品を非破壊で硬化発熱を計測することが難
しいという課題が残る。In the high-speed casting technique, it is important to accurately grasp the cured state of the resin inside the mold in order to control the manufacturing conditions, and therefore there are attempts to detect the cured state by various sensors. For example, place a pressure sensor on the mold surface,
In some cases, the internal pressure of the mold is measured, but the accuracy of curing detection after gelling of the resin deteriorates. Further, with a temperature sensor such as a thermocouple, there remains a problem that it is difficult to measure the heat generated by curing without destruction of the product.
【０００７】そこで、この発明は、非破壊で樹脂の硬化
状態を正確に把握できる管理制御によって、品質の高い
樹脂注型品が得られるようにした樹脂注型装置を提供す
ることを目的としている。Accordingly, an object of the present invention is to provide a resin casting apparatus capable of obtaining a high-quality resin casting product by management control capable of accurately grasping the cured state of the resin in a non-destructive manner. .
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するため
に、この発明の請求項１によれば、樹脂混合タンクと、
真空室内に配置され前記樹脂混合タンク内からの注型樹
脂が送り込まれる金型と、金型を開閉する金型開閉制御
装置とを備えた樹脂注型装置において、前記金型内部の
樹脂硬化中の反応挙動を検出する誘電センサと、その誘
電センサから得られる誘電率、誘電損失係数、等価抵抗
率等の誘電特性の変化に対応して樹脂の動的粘弾性を換
算し、その換算パラメータに基づいてモニター表示する
監視制御装置とを設ける。According to the first aspect of the present invention, there is provided a resin mixing tank, comprising:
In a resin casting apparatus including a mold arranged in a vacuum chamber and into which a casting resin from the inside of the resin mixing tank is fed, and a mold opening / closing control device for opening and closing the mold, the resin inside the mold is hardened. Sensor that detects the reaction behavior of the resin, and converts the dynamic viscoelasticity of the resin in response to changes in the dielectric properties such as the dielectric constant, dielectric loss coefficient, and equivalent resistivity obtained from the dielectric sensor. And a monitoring control device for displaying a monitor based on the monitoring.
【０００９】これにより、金型内部の樹脂の硬化状態が
誘電特性の変化として計測され、その計測値から樹脂の
粘弾性が、非破壊により正確にリアルタイムでモニター
表示される。Thus, the cured state of the resin inside the mold is measured as a change in the dielectric properties, and the viscoelasticity of the resin is accurately and non-destructively monitored in real time from the measured value.
【００１０】また、この発明の請求項２によれば、モニ
ター表示する監視制御装置は、等価抵抗率から粘弾性へ
の換算パラメータを、動的粘弾性／誘電特性同時計測セ
ンサを用いて取得する。According to a second aspect of the present invention, a monitoring control device for displaying a monitor acquires a conversion parameter from equivalent resistivity to viscoelasticity using a dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor. .
【００１１】これにより、誘電特性による計測値から樹
脂の粘弾性が迅速にリアルタイムで得られると共に、そ
の結果がモニター表示される。。Thus, the viscoelasticity of the resin can be quickly obtained in real time from the measured value based on the dielectric properties, and the result is displayed on the monitor. .
【００１２】また、この発明の請求項３によれば、動的
粘弾性／誘電特性同時計測センサは、粘弾性の複素粘度
と誘電特性の等価抵抗率とを相関パラメータとして扱
う。According to the third aspect of the present invention, the dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor treats the complex viscosity of viscoelasticity and the equivalent resistivity of the dielectric characteristic as correlation parameters.
【００１３】これにより、誘電特性による計測値から樹
脂の粘弾性が迅速にリアルタイムで得られると共に、そ
の結果がモニター表示される。Thus, the viscoelasticity of the resin can be quickly obtained from the measured values based on the dielectric characteristics in real time, and the result is displayed on the monitor.
【００１４】また、この発明の請求項４によれば、動的
粘弾性／誘電特性同時計測センサは、粘弾性の貯蔵剛性
率及び損失剛性率と誘電特性の等価抵抗率とを相関パラ
メータとして扱う。According to a fourth aspect of the present invention, the dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor treats the storage rigidity and loss rigidity of viscoelasticity and the equivalent resistivity of dielectric characteristic as correlation parameters. .
【００１５】これにより、誘電特性による計測値から樹
脂の粘弾性が迅速にリアルタイムで得られると共に、そ
の結果がモニター表示される。Thus, the viscoelasticity of the resin is quickly obtained in real time from the measured value based on the dielectric properties, and the result is displayed on the monitor.
【００１６】また、この発明の請求項５によれば、動的
粘弾性／誘電特性同時計測センサは、センサのプレート
間距離を０．５〜３．０ｍｍとして計測する。According to the fifth aspect of the present invention, the dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor measures the distance between the plates of the sensor at 0.5 to 3.0 mm.
【００１７】これにより、正確な計測結果が得られる。Thus, an accurate measurement result can be obtained.
【００１８】また、この発明の請求項６によれば、動的
粘弾性／誘電特性同時計測センサは、一定の樹脂硬化温
度で相関データを取得する。According to the sixth aspect of the present invention, the dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor acquires correlation data at a fixed resin curing temperature.
【００１９】これにより、実際の金型に近い等温硬化過
程での樹脂の動的粘弾性及び誘電特性をが正確に得られ
る。As a result, the dynamic viscoelasticity and dielectric properties of the resin during the isothermal curing process close to the actual mold can be accurately obtained.
【００２０】また、この発明の請求項７によれば、動的
粘弾性／誘電特性同時計測センサは、測定時の温度環境
に等速昇温のプログラムを与え相関データを取得する。According to the seventh aspect of the present invention, the dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor acquires a correlation data by giving a program of constant temperature rise to the temperature environment at the time of measurement.
【００２１】これにより、粘弾性および誘電特性の温度
依存性を加味した相関データが取得できると共に、試験
の精度・再現性も高くなる。Thus, correlation data considering the temperature dependence of viscoelasticity and dielectric properties can be obtained, and the accuracy and reproducibility of the test can be improved.
【００２２】また、この請求項８によれば、動的粘弾性
／誘電特性同時計測センサを、エポキシ樹脂調合ロット
の品質検査に用いる。According to the present invention, the dynamic viscoelasticity / dielectric property simultaneous measurement sensor is used for quality inspection of an epoxy resin blended lot.
【００２３】これにより、製造ロットの健全性を短時間
で検出できるようになる。Thus, the soundness of the production lot can be detected in a short time.
【００２４】また、この発明の請求項９によれば、誘電
センサを、注型品の注入口部，樹脂体積の大きい肉厚
部、クラックの発生しやすい弱点部に近接する金型に配
置し、その情報に基づき金型開閉制御装置の開閉制御を
行なう。According to the ninth aspect of the present invention, the dielectric sensor is disposed in a mold close to an injection port of a cast product, a thick portion having a large resin volume, and a weak point where cracks are easily generated. The opening / closing control of the mold opening / closing control device is performed based on the information.
【００２５】これにより、樹脂硬化中の反応性や注型工
程の条件に偏差が生じても、常に一定の値になった粘弾
性の時に、樹脂注型品の製品離型が可能となる。Thus, even if there is a deviation in the reactivity during the curing of the resin or in the conditions of the casting process, it is possible to release the product of the resin casting when the viscoelasticity is always a constant value.
【００２６】また、この発明の請求項１０によれば、誘
電センサを、注型品の強度の弱点部に近接する金型に配
置し、その情報に基づき製品離型のノックピンの制御を
行なう。According to the tenth aspect of the present invention, the dielectric sensor is disposed in the mold near the weak point of the strength of the cast product, and the knock pin for product release is controlled based on the information.
【００２７】これにより、樹脂硬化中の反応性や注型工
程上の条件に偏差が生じても、常に一定の値になった粘
弾性の時に、樹脂注型品の製品離型が可能となる。Thus, even if there is a deviation in the reactivity during the curing of the resin or in the conditions in the casting process, it is possible to release the product of the resin cast product when the viscoelasticity is always a constant value. .
【００２８】また、この発明の請求項１１によれば、誘
電センサを、金型以外にも設けると共に、樹脂混合タン
ク内の樹脂硬化時の反応挙動を検出し、得られる等価抵
抗率の変化から樹脂のポットライフを検知する。According to the eleventh aspect of the present invention, the dielectric sensor is provided in addition to the mold, and the reaction behavior during curing of the resin in the resin mixing tank is detected. Detects the pot life of the resin.
【００２９】これにより、樹脂混合タンク内の樹脂のポ
ットライフ（可使時間）を定量的に精密に管理すること
が可能となる。This makes it possible to quantitatively and precisely manage the pot life (usable time) of the resin in the resin mixing tank.
【００３０】また、この発明の請求項１２によれば、樹
脂が金型を満たし、金型上部のエア抜き溝への到達点を
誘電センサで検知し、その検知信号に基づいてストップ
バルブを制御し、樹脂の供給を停止する。According to the twelfth aspect of the present invention, the resin fills the mold, the point reaching the air vent groove at the top of the mold is detected by the dielectric sensor, and the stop valve is controlled based on the detection signal. Then, the supply of the resin is stopped.
【００３１】これにより、注型工程での樹脂のゲル化点
を検知することが可能となり、樹脂のリークを阻止す
る。This makes it possible to detect the gel point of the resin in the casting step, thereby preventing the resin from leaking.
【００３２】また、この発明の請求項１３によれば、樹
脂が金型を満たし、金型上部のエア抜き溝への到達点を
誘電センサで検知し、その検知信号に基づき注入側から
の樹脂圧力を制御する。According to the thirteenth aspect of the present invention, the resin fills the mold, the point reaching the air vent groove at the top of the mold is detected by the dielectric sensor, and the resin from the injection side is detected based on the detection signal. Control pressure.
【００３３】これにより、注型工程での樹脂のゲル化点
を検知することが可能となり、樹脂のリークをストップ
バルブを用いることなく阻止する。This makes it possible to detect the gel point of the resin in the casting step, thereby preventing the resin from leaking without using a stop valve.
【００３４】また、この発明の請求項１４によれば、誘
電センサを、金型以外にも設けると共に、樹脂注入用配
管内部の樹脂硬化時の反応挙動を検知し、得られる等価
抵抗率の変化から配管内の樹脂粘度を一定に保つようヒ
ータ温度を制御すると共に、樹脂のポットライフを検知
する。According to a fourteenth aspect of the present invention, the dielectric sensor is provided in addition to the mold, and the reaction behavior of the inside of the resin injection pipe when the resin is cured is detected, and the change in the equivalent resistivity obtained is obtained. The heater temperature is controlled so as to keep the resin viscosity in the pipe constant, and the pot life of the resin is detected.
【００３５】これにより、樹脂注入用配管内部の樹脂の
粘弾性を正確に検知することが可能となり、正確な注入
が行なえる。また、樹脂注入用配管内の樹脂のポットラ
イフ（可使時間）を定量的に精密に管理することが可能
となる。Thus, it is possible to accurately detect the viscoelasticity of the resin inside the resin injection pipe, and to perform accurate injection. Further, it is possible to quantitatively and precisely manage the pot life (usable time) of the resin in the resin injection pipe.
【００３６】また、この発明の請求項１５によりば、誘
電センサを、金型以外にも設けると共に、ダイナミック
ミキサーの混合状態を検知し、その検知信号に基づき、
混合状態を管理する。According to the fifteenth aspect of the present invention, the dielectric sensor is provided in addition to the mold, and the mixing state of the dynamic mixer is detected.
Manage the mixed state.
【００３７】これにより、ダイナミックミキサー内の最
適な樹脂の混合状態を知ることが可能となり、注入時間
や硬化時間を安定化させることができる。As a result, it is possible to know the optimum resin mixing state in the dynamic mixer, and it is possible to stabilize the injection time and the curing time.
【００３８】また、この発明の請求項１６によれば、誘
導センサを、金型以外にも設けると共に、スタティック
ミキサーの混合状態を検知し、その検知信号に基づき、
混合状態を管理することを特徴とする。According to the sixteenth aspect of the present invention, the induction sensor is provided in addition to the mold, and detects the mixing state of the static mixer.
The mixed state is managed.
【００３９】これにより、スタティックミキサー内の最
適な樹脂の混合状態を知ることが可能となり、注入時間
や硬化時間を安定化させることができる。Thus, it is possible to know the optimum mixing state of the resin in the static mixer, and it is possible to stabilize the injection time and the curing time.
【００４０】また、この発明の請求項１７によれば、誘
電センサを、金型以外にも設けると共に、樹脂混合タン
ク内と樹脂注入用配管内部の樹脂硬化時の反応挙動を検
出し、得られる等価抵抗率の変化から樹脂の金型への注
入時間をコントロールする。Further, according to the seventeenth aspect of the present invention, the dielectric sensor can be provided in addition to the mold, and the reaction behavior during the curing of the resin in the resin mixing tank and the resin injection pipe can be detected and obtained. The injection time of the resin into the mold is controlled from the change in the equivalent resistivity.
【００４１】これにより、樹脂注入用配管内部の樹脂硬
化状態が適格に把握できるようになり、注入時間や硬化
時間を安定化させることが可能となる。As a result, the cured state of the resin inside the resin injection pipe can be properly grasped, and the injection time and the curing time can be stabilized.
【００４２】また、この発明の請求項１８によれば、誘
電センサを、注型品の注入口部、樹脂体積の大きい肉厚
部、クラックの発生し易い弱点部に近接する金型に配置
し、その情報に基づき樹脂硬化条件の時間的な偏差を金
型ヒータの可変制御によって補償する。According to the eighteenth aspect of the present invention, the dielectric sensor is arranged in a mold close to an injection port of a cast product, a thick portion having a large resin volume, and a weak point where cracks easily occur. Based on the information, the time deviation of the resin curing condition is compensated by the variable control of the mold heater.
【００４３】これにより、弱点部領域の樹脂硬化状態が
適格に把握できるようになり、注入時間や硬化時間を安
定化させることが可能となる。As a result, the cured state of the resin in the weak point region can be properly grasped, and the injection time and the curing time can be stabilized.
【００４４】また、この発明の請求項１９によれば、誘
電センサを、注型品の注入口部やバリ部に設け、離型後
の２次硬化工程の反応挙動を検出し、得られる等価抵抗
率の変化から樹脂の剛性率をモニターし硬化の終点を検
出する。Further, according to the nineteenth aspect of the present invention, a dielectric sensor is provided at an injection port or a burr of a cast product to detect a reaction behavior in a secondary curing step after release, and to obtain an equivalent sensor. From the change in resistivity, the rigidity of the resin is monitored to detect the end point of curing.
【００４５】これにより、２次硬化工程時の硬化状態を
定量的に監視することが可能となり、樹脂の硬化終点を
確実に正確に知ることができる。As a result, it is possible to quantitatively monitor the curing state during the secondary curing step, and it is possible to reliably and accurately know the curing end point of the resin.
【００４６】[0046]
【発明の実施の形態】以下、図１乃至図３の図面を参照
しながらこの発明の実施形態について、請求項に沿って
具体的に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of FIGS.
【００４７】図１は請求項１にかかる樹脂注型装置全体
の概要図を示している。樹脂注型装置は、樹脂混合タン
ク１と、樹脂混合タンク１と真空室３を介して樹脂注入
配管５で接続された金型７と、金型７を開閉制御する一
対の金型開閉制御装置９とで構成され、樹脂混合タンク
１と樹脂注入配管５は、ヒータ１１によって約４０〜６
０℃の範囲内に温度管理されている。FIG. 1 is a schematic diagram of the entire resin casting apparatus according to the first embodiment. The resin casting apparatus includes a resin mixing tank 1, a mold 7 connected to the resin mixing tank 1 via a vacuum chamber 3 via a resin injection pipe 5, and a pair of mold opening and closing control devices for controlling opening and closing of the mold 7. 9, and the resin mixing tank 1 and the resin injection pipe 5 are
The temperature is controlled within the range of 0 ° C.
【００４８】注型樹脂１３は、樹脂混合タンク１内にお
いて、真空ポンプ１５と真空バルブ１７の操作により真
空脱泡しながら攪拌モータ１９の動作により、ダイナミ
ックミキサーとなる攪拌羽根２１によって混合される。
樹脂混合タンク１内の注型樹脂１３は、送り出し用の樹
脂圧力となる加圧バルブ２３の調整によって０．１〜
０．５ＭＰａのエアー圧力が与えられると共に、樹脂注
入バルブ２５を開とすることで、金型７へ向けて注型樹
脂１３が送り出されるようになっている。The casting resin 13 is mixed in the resin mixing tank 1 by the agitating blades 21 serving as a dynamic mixer by the operation of the agitating motor 19, while the vacuum pump 15 and the vacuum valve 17 operate the vacuum defoaming.
The casting resin 13 in the resin mixing tank 1 is adjusted to 0.1 to 0.1 by adjusting a pressure valve 23 which is a resin pressure for feeding.
When the air pressure of 0.5 MPa is applied and the resin injection valve 25 is opened, the casting resin 13 is sent out toward the mold 7.
【００４９】なお、攪拌羽根２１にかえて、主剤，硬化
剤を別の配管からフィードし、多段のスリットを通して
瞬間的に混合するスタティックミキサーであってもよ
い。Instead of the stirring blade 21, a static mixer may be used in which the main agent and the curing agent are fed from another pipe and mixed instantaneously through multi-stage slits.
【００５０】金型７は、上部にストップバルブ２７を有
するエア抜き溝２９を有し、金型ヒータ３１によって約
１２０℃に温度管理されている。金型７は、真空室３内
に配置されると共に、油圧タイプの金型開閉制御装置９
から延長されたシリンダ３３によって支持ブロック３５
と一緒に、真空室３の上下壁３ａ，３ａに沿って図面左
右に開閉可能となっている。The mold 7 has an air vent groove 29 having a stop valve 27 at the top, and the temperature is controlled to about 120 ° C. by a mold heater 31. The mold 7 is disposed in the vacuum chamber 3 and has a hydraulic mold opening / closing control device 9.
Block 35 extended by a cylinder 33 extended from
Along with the upper and lower walls 3a, 3a of the vacuum chamber 3 can be opened and closed right and left in the drawing.
【００５１】真空室３は、真空ポンプ３７と真空バルブ
３９の操作により所定の真空状態に管理されるようにな
っている。The vacuum chamber 3 is controlled to a predetermined vacuum state by operating a vacuum pump 37 and a vacuum valve 39.
【００５２】金型７内には、上部のエア抜き溝２９の近
接部と底部の注入口４１の近接部に樹脂の硬化状態を検
知する誘電センサ４３が設けられている。In the mold 7, a dielectric sensor 43 for detecting the cured state of the resin is provided in the vicinity of the upper air vent groove 29 and in the vicinity of the injection port 41 at the bottom.
【００５３】誘電センサ４３は、樹脂の粘弾性を誘導
率，誘電損失係数，等価抵抗率等の誘電特性として非破
壊で計測し、その誘電特性の変化に対応して樹脂の動的
粘弾性を換算する。これにより、誘電センサ４３によっ
て換算された換算パラメータに基づき、監視制御装置４
５によってモニター表示するようになっている。The dielectric sensor 43 measures the viscoelasticity of the resin in a non-destructive manner as dielectric properties such as an inductivity, a dielectric loss coefficient, and an equivalent resistivity, and measures the dynamic viscoelasticity of the resin in accordance with the change in the dielectric properties. Convert. Thereby, based on the conversion parameter converted by the dielectric sensor 43, the monitoring control device 4
5 is displayed on the monitor.
【００５４】誘電センサ４３は、図２に示すように、径
の異なる円形状に形成された金属製の櫛型電極４５をセ
ラミック製の基板４７の上に外側から中心へ向かってプ
リント配置した構造となっている。中心部には、熱電対
４９が設置されており、同時に温度計測が可能となって
いる。As shown in FIG. 2, the dielectric sensor 43 has a structure in which metal comb electrodes 45 formed in circular shapes having different diameters are printed on a ceramic substrate 47 from the outside toward the center. It has become. A thermocouple 49 is provided at the center, and the temperature can be measured at the same time.
【００５５】このように構成された樹脂注型装置におい
て、図４の製造工程図に基づいて説明する。The resin casting apparatus thus constructed will be described with reference to the manufacturing process diagram of FIG.
【００５６】まず、材料受入検査を行ない、樹脂・硬化
剤を貯蔵する（ステップ１０１，１０２）。次に、注型
樹脂を予熱した後、注型樹脂１３を樹脂混合タンク１で
真空ポンプ１５と真空バルブ１７の操作により真空脱泡
しながら攪拌モータ１９の動作により攪拌羽根２１によ
って混合する（ステップ１０３，１０４）。この時、樹
脂の脱泡，注入の効率やポットライフ（可使時間）を考
慮して樹脂混合タンク１と樹脂注入配管５をヒータ１１
によって４０〜６０℃に温度調節する。First, a material acceptance inspection is performed, and the resin and the curing agent are stored (steps 101 and 102). Next, after the casting resin is preheated, the casting resin 13 is mixed in the resin mixing tank 1 by the stirring blades 21 by the operation of the stirring motor 19 while performing vacuum defoaming by operating the vacuum pump 15 and the vacuum valve 17 (step). 103, 104). At this time, the resin mixing tank 1 and the resin injection pipe 5 are connected to the heater 11 in consideration of the defoaming and injection efficiency of the resin and the pot life (usable time).
The temperature is adjusted to 40 to 60 ° C.
【００５７】一方、平行して離型処理された金型７を予
熱する（ステップ１０５、１０６）。続いて、金型７内
に注型品内に埋め込む予熱乾燥した金属導体５１をセッ
トし、金型７を真空室３内で金型開閉制御装置９によっ
て閉鎖し、真空ポンプ３７と真空バルブ３９の操作によ
り真空室３を真空にする（ステップ１０７、１０８）。
次いで、樹脂混合タンク１の真空を開放し、加圧バルブ
２３の操作により樹脂混合タンク１内を加圧する。これ
により、金型７底部の注入口４１から注型樹脂１３が注
入される（ステップ１１１、１１２）。金型７への樹脂
充填完了後は、樹脂混合タンク１の加圧バルブ２３を調
整し０．１〜０．５ＭＰａのエアー圧力を与えたまま金
型ヒータ３１の通電により加熱硬化させる（ステップ１
１３）。樹脂の硬化状態は誘電センサ４３により誘電特
性の変化として樹脂の動的粘弾性として換算され、その
換算パラメータに基づき、監視制御装置４５によりリア
ルタイムてモニター表示される。次に、１次硬化後、離
型する（ステップ１１４）。離型後、２次硬化炉内にお
いて２次硬化させ、加工・検査工程で終了となる（ステ
ップ１１５、１１６）。これにより、モニター表示によ
る最適な離型タイミングによって品質の高い樹脂注型品
が得られるようになる。On the other hand, the mold 7 that has been subjected to the mold release processing is preheated in parallel (steps 105 and 106). Subsequently, a preheated and dried metal conductor 51 to be embedded in the casting is set in the mold 7, the mold 7 is closed in the vacuum chamber 3 by the mold opening and closing control device 9, and the vacuum pump 37 and the vacuum valve 39. The vacuum chamber 3 is evacuated by the operation (steps 107 and 108).
Next, the vacuum of the resin mixing tank 1 is released, and the inside of the resin mixing tank 1 is pressurized by operating the pressure valve 23. Thereby, the casting resin 13 is injected from the injection port 41 at the bottom of the mold 7 (steps 111 and 112). After filling the mold 7 with the resin, the pressurizing valve 23 of the resin mixing tank 1 is adjusted to heat and cure by energizing the mold heater 31 while applying an air pressure of 0.1 to 0.5 MPa (step 1).
13). The cured state of the resin is converted into dynamic viscoelasticity of the resin as a change in the dielectric properties by the dielectric sensor 43, and is monitored and displayed in real time by the monitoring control device 45 based on the converted parameters. Next, after the primary curing, the mold is released (step 114). After release, the secondary curing is performed in a secondary curing furnace, and the processing and inspection process is completed (steps 115 and 116). As a result, a high-quality resin casting can be obtained by the optimal release timing based on the monitor display.
【００５８】次に、請求項２記載の実施形態にあって
は、図５に示すように、誘電特性と樹脂の粘弾性の関係
を、動的粘弾性／誘電特性同時計測センサ５３（以下、
ＤＭＡ／ＤＥＡセンサと称す）によって迅速に取得でき
るようにしたものである。Next, in the embodiment of the present invention, as shown in FIG. 5, the relationship between the dielectric property and the viscoelasticity of the resin is determined by a dynamic viscoelasticity / dielectric property simultaneous measurement sensor 53 (hereinafter, referred to as a "viscosity").
DMA / DEA sensor).
【００５９】即ち、動的粘弾性測定治具５５のガイドリ
ング５７に誘電センサ４３をマウントし、ねじ５９によ
り固定する構成である。図６は、ＤＭＡ／ＤＥＡセンサ
５３をＡ−Ａ断面方向にモデル化したものである。測定
の原理について説明する。動的粘弾性はヒータ６１によ
り温度制御されたパラレルプレート６３間のポリマー６
５に正弦波の回転振動を与え、対向するパラレルプレー
ト６３でトルク検出を行い計測するもので、動的粘弾性
測定治具５５にＤＭＡ／ＤＥＡセンサ５３を用い、同一
環境で誘電特性と動的粘弾性を同時に取得する。That is, the configuration is such that the dielectric sensor 43 is mounted on the guide ring 57 of the dynamic viscoelasticity measuring jig 55 and fixed with the screw 59. FIG. 6 illustrates the DMA / DEA sensor 53 modeled in the AA cross section direction. The principle of measurement will be described. The dynamic viscoelasticity of the polymer 6 between the parallel plates 63 controlled by the heater 61
5, a sine wave rotational vibration is applied, and a torque is detected and measured by a parallel plate 63 facing the same. A DMA / DEA sensor 53 is used as a dynamic viscoelasticity measuring jig 55, and dielectric properties and dynamic characteristics are measured in the same environment. Obtain viscoelasticity at the same time.
【００６０】これにより、金型内部の樹脂の動的粘弾性
を非破壊で迅速に把握できる。Thus, the dynamic viscoelasticity of the resin inside the mold can be quickly and nondestructively grasped.
【００６１】次に、請求項３記載の実施形態にあって
は、図７に示すように、Ｒｈｅｏｍｅｔｒｉｃｓ社（米
国ニュージャージー州）製動的粘弾性測定装置（商品
名：ＡＲＥＳ）を用い計測した注型樹脂硬化過程の動的
粘弾性変化である。Ｇ−１は貯蔵剛性率、Ｇ−２は損失
剛性率、ηは複素粘度をそれぞれ表す。図８は、ＤＭＡ
／ＤＥＡセンサ５３によって図７と同一環境下で測定し
た等価抵抗率の変化を示したものである。誘電計測には
Ｍｉｃｒｏｍｅｔ社製誘電体特性測定装置（商品名：ユ
ーメトリックシステム３）を用いた。計測周波数を低く
選択した場合、等価抵抗率Ｒは、 Ｒ＝１／σ＝１／（ε″ε0 ω） …（式１） σ：電気伝導率 ε″：誘電損失係数 ω：角周波数 ε0 ：真空の誘電率 で示される。同時計測によって、硬化中の注型樹脂の等
価抵抗率は、粘弾性とよく似た挙動をとることが分か
り、両時間軸を相殺し、粘弾性と誘電特性パラメータ間
の相関性を求めたのが図９である。動的粘弾性と等価抵
抗率は、比較的簡単な式２で表される。Next, in the embodiment of the present invention, as shown in FIG. 7, a dynamic viscoelasticity measuring device (trade name: ARES) manufactured by Rheometrics (New Jersey, USA) is used. It is a dynamic viscoelastic change during the curing of the mold resin. G-1 represents the storage rigidity, G-2 represents the loss rigidity, and η represents the complex viscosity. FIG.
9 shows a change in equivalent resistivity measured by the / DEA sensor 53 under the same environment as in FIG. A dielectric property measuring device (trade name: Umetric System 3) manufactured by Micromet was used for the dielectric measurement. When the measurement frequency is selected to be low, the equivalent resistivity R is as follows: R = 1 / σ = 1 / (ε ″ ε 0 ω) (Equation 1) σ: Electric conductivity ε ″: Dielectric loss coefficient ω: Angular frequency ε 0 : Shown by the dielectric constant of vacuum. Simultaneous measurements showed that the equivalent resistivity of the casting resin during curing was very similar to viscoelasticity, offsetting both time axes and determining the correlation between viscoelasticity and dielectric property parameters. Is shown in FIG. The dynamic viscoelasticity and the equivalent resistivity are expressed by a relatively simple equation (2).
【００６２】 ｌｏｇＧ＝ＡｌｏｇＲ＋Ｂ …（式２） Ｇ：貯蔵剛性率Ｇ−１，損失剛性率Ｇ−２，複素粘度η Ａ，Ｂ：定数 この実施形態では、図９における複素粘度と等価抵抗率
との関係６７によって求めた式２を用いることで、樹脂
の粘弾性を迅速にモニター表示することが可能となる。LogG = AlogR + B (Equation 2) G: storage stiffness G-1, loss stiffness G-2, complex viscosity η A, B: constant In this embodiment, the complex viscosity and the equivalent resistivity in FIG. By using the equation 2 obtained by the relationship 67, it is possible to quickly monitor and display the viscoelasticity of the resin.
【００６３】次に、請求項４の実施形態にあっては、図
９によって得られた等価抵抗率と剛性率の相関関係６
９，７１と式２を用い、金型内部の樹脂の硬化状態を貯
蔵剛性率および損失剛性率として樹脂の粘弾性を迅速に
モニター表示することが可能となる。Next, in the fourth embodiment, the correlation 6 between the equivalent resistivity and the rigidity obtained in FIG.
Using Equations 9, 9 and 71, it is possible to quickly monitor and display the viscoelasticity of the resin as the storage rigidity and the loss rigidity of the cured state of the resin inside the mold.
【００６４】次に請求項５の実施形態にあっては、ＤＭ
Ａ／ＤＥＡセンサ５３を用いて誘電特性と粘弾性を同時
計測する時に、センサのプレート間距離を０．５〜３．
０ｍｍとして計測することで、正確な計測結果が可能と
なる。Next, in the fifth embodiment, the DM
When the dielectric properties and the viscoelasticity are measured simultaneously using the A / DEA sensor 53, the distance between the plates of the sensor is set to 0.5 to 3.
By measuring at 0 mm, accurate measurement results are possible.
【００６５】次に、請求項６の実施形態にあっては、樹
脂の硬化過程における誘電特性および粘弾性の相関関係
をＤＭＡ／ＤＥＡセンサ５３を用い取得する際に、一定
の樹脂硬化温度で相関データを取得する。図６における
ヒータ６１に樹脂注型装置の金型７に与える温度に近似
した等温制御を与え図７〜９に相当する相関データを得
る。図７および図８の実施形態では樹脂硬化時間６００
秒以降を金型温度の１２０℃に制御し硬化特性を計測す
ることで、正確な測定結果がリアルタイムで得られると
共に、樹脂の粘弾性を迅速にモニター表示することが可
能となる。Next, in the sixth embodiment, when the correlation between the dielectric properties and the viscoelasticity in the curing process of the resin is obtained using the DMA / DEA sensor 53, the correlation is obtained at a fixed resin curing temperature. Get the data. The heater 61 in FIG. 6 is given isothermal control close to the temperature given to the mold 7 of the resin casting apparatus to obtain correlation data corresponding to FIGS. In the embodiment of FIGS. 7 and 8, the resin curing time 600
By controlling the mold temperature to 120 ° C. after the second and measuring the curing characteristics, accurate measurement results can be obtained in real time, and the viscoelasticity of the resin can be quickly displayed on the monitor.
【００６６】次に、請求項７の実施形態にあっては、樹
脂の硬化過程における誘電特性および粘弾性の相関関係
をＤＭＡ／ＤＥＡセンサ５３を用い取得する際に、セン
サ５３の温度環境に等速昇温のプログラムを与える。図
６におけるヒータ６１に昇温制御を与えると、樹脂の粘
弾性および等価抵抗率はよく似た温度依存性を示す。図
７および図８の実施形態では、樹脂硬化時間６００秒ま
でに５℃／ｍｉｎの昇温を与え同時計測を行うことで、
正確な測定結果が得られると共に、樹脂の粘弾性が迅速
にモニター表示することが可能となる。Next, in the seventh embodiment, when the correlation between the dielectric properties and the viscoelasticity in the curing process of the resin is acquired by using the DMA / DEA sensor 53, the correlation between the temperature environment of the sensor 53 and the like is obtained. Give a program of rapid heating. When the temperature rise control is given to the heater 61 in FIG. 6, the viscoelasticity and the equivalent resistivity of the resin show similar temperature dependency. In the embodiment of FIG. 7 and FIG. 8, the simultaneous measurement is performed by applying a temperature rise of 5 ° C./min before the resin curing time 600 seconds.
An accurate measurement result can be obtained, and the viscoelasticity of the resin can be quickly displayed on a monitor.
【００６７】次に、請求項８の実施形態にあっては、材
料受け入れ検査工程で使用することで、正確に調合され
た材料となる。このことは、常に同じ粘弾性と誘電特性
および両者の相関関係を持つ性質を利用することによる
もので、製造ロットの健全性を短時間で検出可能とな
る。Next, according to the embodiment of the present invention, by using in the material receiving inspection step, the material can be accurately prepared. This is due to the fact that the same viscoelasticity and dielectric properties and properties having a correlation between both are always used, and the soundness of the production lot can be detected in a short time.
【００６８】次に、請求項９の実施形態にあっては、注
型品の注入口部、樹脂体積の大きい肉厚部、クラックの
発生しやすい弱点部に近接する金型７にセンサを選択し
て配置することで、モニター表示により、製品は材料の
反応性や各工程での条件偏差によらず常に同じ弾性率で
製品を取り出すことが可能となる。Next, in the ninth embodiment, a sensor is selected for the mold 7 which is close to the injection port of the cast product, the thick portion having a large resin volume, and the weak point where cracks are easily generated. With this arrangement, it is possible to always take out the product with the same elastic modulus by the monitor display regardless of the reactivity of the material or the condition deviation in each step.
【００６９】次に、請求項１０の実施形態にあっては、
注型品の強度の弱点部に近接する金型７にセンサを配置
することで、剛性率の発現を、モニター確認しながら離
型ポイントを制御し、金型７を開閉した後、金型７から
製品を離型するノックピンを制御する。これにより、モ
ニター表示によって、製品は材料の反応性や各工程での
条件偏差によらず常に同じ剛性率で製品を完全離型する
ことが可能となる。Next, in the tenth embodiment,
By arranging a sensor in the mold 7 close to the weak point of the strength of the cast product, the release point is controlled while monitoring the development of the rigidity, and the mold 7 is opened and closed. Control the knock pin to release the product from the. As a result, the product can be completely released from the product with the same rigidity regardless of the reactivity of the material or the condition deviation in each step.
【００７０】次に、請求項１１の実施形態にあっては、
図１０に示すように、樹脂混合タンク１内部の樹脂の反
応挙動を、誘導センサ７５によって粘弾性の１つである
複素粘度をモニター管理することで、樹脂混合タンク１
内の樹脂のポットライフ（可使時間）を精密に管理する
ことが可能となる。Next, in the eleventh embodiment,
As shown in FIG. 10, the reaction behavior of the resin in the resin mixing tank 1 is monitored and managed by an induction sensor 75 for complex viscosity, which is one of viscoelasticity, so that the resin mixing tank 1 is monitored.
It is possible to precisely manage the pot life (usable time) of the resin in the inside.
【００７１】次に、請求項１２の実施形態にあっては、
エポキシ樹脂注型品の注型工程において、注入された樹
脂が金型７を満たし金型７上部のエアー抜き溝２９を通
過する点を誘電センサ４３で検知することで、その情報
からストップバルブ２７を制御することによって、充填
後の樹脂リークを防止することが可能となる。Next, in the twelfth embodiment,
In the casting process of the epoxy resin casting, the dielectric sensor 43 detects a point at which the injected resin fills the mold 7 and passes through the air vent groove 29 above the mold 7. , It is possible to prevent resin leakage after filling.
【００７２】次に、請求項１３の実施形態にあっては、
エポキシ樹脂注型品の注型工程において、注入された樹
脂が金型７を満たし金型７上部のエアー抜き溝２９を通
過する点を誘電センサ４３で検知することで、その情報
から樹脂注入バルブ２５の制御と、続いて加圧バルブ２
３の制御とによって、充填後の樹脂リークを防止するこ
とが可能となる。Next, in the thirteenth embodiment,
In the casting process of the epoxy resin casting product, the point at which the injected resin fills the mold 7 and passes through the air vent groove 29 on the top of the mold 7 is detected by the dielectric sensor 43. 25 and then the pressure valve 2
By the control of 3, it becomes possible to prevent resin leakage after filling.
【００７３】即ち、誘電センサ４３によって得られる等
価抵抗率の変化を、モニター表示することにより、樹脂
のゲル化点を検知する。一般に樹脂のゲル化は貯蔵剛性
率と損失剛性率が一致する図７中の点７７を指す。樹脂
がゲル化を生じる前に過剰な圧力を与えると樹脂が金型
上部からリークするため、前記の如く樹脂注入バルブ２
５を絞る。モニター表示により樹脂のゲル化点７７を確
認した後、再び樹脂注入バルブ２５を開放し加圧バルブ
２３を調整し、樹脂圧力を高めるもので、本実施形態で
は樹脂注入自体を制御するため、ストップバルブ２７を
省略できるメリットが得られる。That is, the change in the equivalent resistivity obtained by the dielectric sensor 43 is displayed on a monitor to detect the gel point of the resin. Generally, gelling of the resin indicates a point 77 in FIG. 7 where the storage rigidity and the loss rigidity coincide. If an excessive pressure is applied before the resin gels, the resin leaks from the upper part of the mold.
Squeeze 5. After confirming the gel point 77 of the resin on the monitor display, the resin injection valve 25 is opened again, the pressure valve 23 is adjusted, and the resin pressure is increased. In this embodiment, the stop is performed to control the resin injection itself. The advantage that the valve 27 can be omitted is obtained.
【００７４】次に、請求項１４の実施形態にあっては、
図１０に示す如く樹脂注入用配管５内部に誘電センサ７
９を配置し、得られる等価抵抗率の変化からの樹脂の複
素粘度を推定しモニター表示することによって、配管内
の樹脂粘度を一定に保たれるようヒータ１１のヒータ温
度を制御管理する。またモニター表示された樹脂粘度に
よって、配管５内の樹脂のポットライフ（可使時間）を
正確に検知できるため、配管５の洗浄、交換の時期を正
確に把握することが可能となる。Next, in the fourteenth embodiment,
As shown in FIG.
By arranging 9 and estimating the complex viscosity of the resin based on the obtained change in equivalent resistivity and displaying it on a monitor, the heater temperature of the heater 11 is controlled and controlled so that the resin viscosity in the pipe is kept constant. Further, since the pot life (usable time) of the resin in the pipe 5 can be accurately detected based on the resin viscosity displayed on the monitor, it is possible to accurately grasp the timing of cleaning and replacement of the pipe 5.
【００７５】次に、請求項１５，１６の実施形態にあっ
ては、樹脂混合タンク１の注型樹脂７を、攪拌羽根２１
を持ったダイナミックミキサーで混合を行なうようにし
た請求項１５に対し、請求項１６では、ダイナミックミ
キサーにかえて、スタティックミキサーを用いたもので
ある。特に、スタティックミキサーは、注型樹脂１３の
主剤、硬化剤を別の配管からフィードし多段のスリット
を通して瞬間的に混合するもので、混合の信頼性を確保
するためには、センサ７５によるモニター管理が有効と
なる。Next, according to the fifteenth and sixteenth embodiments, the casting resin 7 in the resin mixing tank 1 is
In contrast to claim 15 in which mixing is carried out by a dynamic mixer having a dynamic mixer, claim 16 uses a static mixer instead of the dynamic mixer. In particular, the static mixer feeds the main agent and the curing agent of the casting resin 13 from another pipe and mixes them instantaneously through multi-stage slits. Becomes effective.
【００７６】次に、請求項１７の実施形態にあっては、
エポキシ樹脂注型品の注型工程における樹脂混合タンク
１、配管５系から粘度情報を各センサ７５，７７で検出
しモニター表示する。これらの情報を元に注型工程上、
製品品質に影響する樹脂注入時間の制御を行うことで、
樹脂の予反応による粘度上昇は、樹脂注入時間を遅延さ
せるため、モニター表示された粘度特性を元に樹脂混合
タンク１の加圧バルブ２３を開閉操作することにより、
タンク１内の樹脂押し出し圧力を可変制御して注入時間
が一定の幅になるよう制御を行うことが可能となる。Next, in the seventeenth embodiment,
The viscosity information is detected by the respective sensors 75 and 77 from the resin mixing tank 1 and the piping 5 system in the casting process of the epoxy resin casting product and displayed on the monitor. Based on this information, in the casting process,
By controlling the resin injection time that affects product quality,
The increase in viscosity due to the pre-reaction of the resin is performed by opening and closing the pressure valve 23 of the resin mixing tank 1 based on the viscosity characteristics displayed on the monitor in order to delay the resin injection time.
The resin extrusion pressure in the tank 1 can be variably controlled so that the injection time can be controlled to have a certain width.
【００７７】次に、請求項１８の実施形態によれば、注
型工程中の離型ポイントを精密に管理するもので、離型
までの時間（１次硬化時間）の偏差を捉え、一定の時間
幅に押さえる制御を行う。即ち、一般の注型工程では混
合した樹脂の予反応によって１次硬化時間が短縮される
傾向がある。この変化は、監視制御装置４５によって正
確にモニター表示される。硬化時間が変化する分を金型
ヒータ３１の温度を可変制御することにより、反応速度
の偏差を金型温度によって補償することで、製品製作ご
との１次硬化時間を最小のふれ幅に管理するこができ
る。本実施形態では、金型温度を３〜５℃変化させるこ
とによって、硬化時間の偏差を１分以内に納めることが
可能となる。Next, according to an embodiment of the present invention, the release point during the casting process is precisely controlled, and the deviation of the time (primary curing time) until the release is detected and the constant. Control to keep the time width. That is, in the general casting process, the primary curing time tends to be shortened by the pre-reaction of the mixed resin. This change is accurately displayed on the monitor by the monitoring control device 45. By controlling the temperature of the mold heater 31 variably for the change in the curing time, the deviation of the reaction speed is compensated by the mold temperature, so that the primary curing time for each product production is managed to the minimum deflection width. I can do this. In the present embodiment, by changing the mold temperature by 3 to 5 ° C., it is possible to keep the deviation of the curing time within 1 minute.
【００７８】次に、請求項１９の実施形態にあっては、
樹脂注型装置によって製造された注型品は、離型の後、
エポキシ樹脂の反応が終了するまで２次硬化炉内で２次
硬化される。この反応の終点を非破壊で検出するもので
ある。Next, in the nineteenth embodiment,
Casting products manufactured by the resin casting machine, after release,
The secondary curing is performed in a secondary curing furnace until the reaction of the epoxy resin is completed. The end point of this reaction is detected nondestructively.
【００７９】即ち、図１１に示すフィルムセンサ８０を
注型品と同時に発生する余剰樹脂、例えば注入口部やバ
リ部に埋め込み同時硬化させることにより硬化の終点を
監視する。フィルムセンサ８０には櫛形電極４５をポリ
イミドフィルム８１で被覆したものである。２次硬化中
に得られる樹脂の剛性率が完全に飽和し、最終値に到達
した点を終点とする。この管理方法によって使用したフ
ィルムセンサ８０は、加工工程で除去することが可能に
なると共に、樹脂の硬化終点検出値が正確に得られる。That is, the end point of curing is monitored by embedding the film sensor 80 shown in FIG. 11 in a surplus resin which is generated simultaneously with the cast product, for example, an injection port or a burr, and simultaneously curing the resin. The film sensor 80 has a comb-shaped electrode 45 covered with a polyimide film 81. The point at which the rigidity of the resin obtained during the secondary curing is completely saturated and reaches the final value is defined as the end point. The film sensor 80 used by this management method can be removed in the processing step, and the detection value of the curing end point of the resin can be accurately obtained.
【００８０】なお、本実施形態では、誘電計測から得ら
れる等価抵抗率を動的粘弾性に換算する手法として図９
から得られた近似式２を利用した。しかしながら、注型
樹脂は、樹脂成分や充填材組成によっては式２のように
直線関係が得られるケースはまれで、屈曲するケースが
ある。この場合は、適当な導関数を用い回帰することに
よって、また、粘弾性モニターパラメータの代替に、樹
脂の反応率、ガラス転移温度や収縮率等の新しい相関パ
ラメータを導入しても同じ作用、効果がある。この場合
は、示差走査熱量計、ＰＶＴ測定装置等の分析機を用い
等価抵抗率との相関性を予め取っておくことが望まし
い。In this embodiment, FIG. 9 shows a method for converting the equivalent resistivity obtained from the dielectric measurement into dynamic viscoelasticity.
Was used. However, the casting resin rarely obtains a linear relationship as shown in Expression 2 depending on the resin component and the filler composition, and may be bent. In this case, the same action and effect can be obtained by regression using an appropriate derivative and introducing new correlation parameters such as the reaction rate, glass transition temperature, and shrinkage rate of the resin in place of the viscoelasticity monitoring parameter. There is. In this case, it is desirable to use an analyzer such as a differential scanning calorimeter or a PVT measuring device to obtain the correlation with the equivalent resistivity in advance.
【００８１】[0081]
【発明の効果】以上、説明したようにこの発明によれ
ば、注型工程における樹脂の効果状態を精密に定量的に
管理することが可能となるため、製造条件の偏差によら
ず、注型樹脂の耐クラック性、寸法精度、部分放電特性
を改善し、品質の高い樹脂注型品が得られる。As described above, according to the present invention, the effect state of the resin in the casting process can be precisely and quantitatively managed, so that casting can be performed regardless of the deviation of the manufacturing conditions. The crack resistance, dimensional accuracy, and partial discharge characteristics of the resin are improved, and a high-quality resin cast product can be obtained.
【図１】この発明にかかる樹脂注型装置の概要説明図。FIG. 1 is a schematic explanatory view of a resin casting apparatus according to the present invention.
【図２】誘電センサの平面図。FIG. 2 is a plan view of a dielectric sensor.
【図３】誘電センサの側面図。FIG. 3 is a side view of the dielectric sensor.
【図４】樹脂注型品の製造工程図。FIG. 4 is a manufacturing process diagram of a resin cast product.
【図５】ＤＭＡ／ＤＥＡセンサの概要説明図。FIG. 5 is a schematic explanatory diagram of a DMA / DEA sensor.
【図６】ＤＭＡ／ＤＥＡセンサの原理説明図。FIG. 6 is a diagram illustrating the principle of a DMA / DEA sensor.
【図７】注型樹脂硬化中の動的粘弾性の変化を示した説
明図。FIG. 7 is an explanatory diagram showing a change in dynamic viscoelasticity during curing of a casting resin.
【図８】注型樹脂硬化中の等価抵抗率の変化を示した説
明図。FIG. 8 is an explanatory diagram showing a change in equivalent resistivity during casting resin curing.
【図９】注型樹脂硬化中の動的粘弾性と等価抵抗率との
相関性を示した説明図。FIG. 9 is an explanatory diagram showing the correlation between dynamic viscoelasticity during casting resin curing and equivalent resistivity.
【図１０】樹脂混合タンクと樹脂注入配管とに誘電セン
サを設けた図１と同様の説明図。FIG. 10 is an explanatory view similar to FIG. 1 in which a dielectric sensor is provided in a resin mixing tank and a resin injection pipe.
【図１１】フィルムタイプの誘電センサの説明図。FIG. 11 is an explanatory view of a film type dielectric sensor.
１ 樹脂混合タンク ３ 真空室 ７ 金型 ９ 金型開閉制御装置 １３ 注型樹脂 ４３ 誘電センサ ４５ 監視制御装置 REFERENCE SIGNS LIST 1 resin mixing tank 3 vacuum chamber 7 mold 9 mold opening and closing control device 13 casting resin 43 dielectric sensor 45 monitoring and control device
───────────────────────────────────────────────────── フロントページの続き (72)発明者 清水 敏夫 東京都府中市東芝町１番地 株式会社東芝 府中工場内 (72)発明者 木下 晋 東京都府中市東芝町１番地 株式会社東芝 府中工場内 Ｆターム(参考） 2G060 AA09 AA10 AA20 AE24 AE33 AF07 AF11 AG06 AG08 AG10 EB07 HC10 HC18 4F204 AA36 AA39 AH33 AP16 AP20 AR07 EA03 EB01 EF01 EK17 EK26 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Shimizu 1 Toshiba-cho, Fuchu-shi, Tokyo Inside the Toshiba Fuchu Plant, Inc. (72) Inventor Susumu 1-shi Toshiba-cho, Fuchu-shi, Tokyo Inside the Fuchu Plant, Toshiba F Terms (reference) 2G060 AA09 AA10 AA20 AE24 AE33 AF07 AF11 AG06 AG08 AG10 EB07 HC10 HC18 4F204 AA36 AA39 AH33 AP16 AP20 AR07 EA03 EB01 EF01 EK17 EK26
Claims (19)
前記樹脂混合タンク内からの注型樹脂が送り込まれる金
型と、金型を開閉する金型開閉制御装置とを備えた樹脂
注型装置において、前記金型内部の樹脂硬化中の反応挙
動を検出する誘電センサと、その誘電センサから得られ
る誘電率、誘電損失係数、等価抵抗率等の誘電特性の変
化に対応して樹脂の動的粘弾性を換算し、その換算パラ
メータに基づいてモニター表示する監視制御装置とを設
けるようにしたことを特徴とする樹脂注型装置。1. A resin casting apparatus comprising a resin mixing tank, a mold disposed in a vacuum chamber, into which a casting resin is fed from the resin mixing tank, and a mold opening / closing controller for opening and closing the mold. In the above, a dielectric sensor for detecting a reaction behavior during curing of the resin inside the mold, and a dynamic response of the resin corresponding to a change in dielectric characteristics such as a dielectric constant, a dielectric loss coefficient, and an equivalent resistivity obtained from the dielectric sensor. A resin casting apparatus comprising: a monitoring control device that converts viscoelasticity and displays a monitor based on the conversion parameter.
抵抗率から粘弾性への換算パラメータを、動的粘弾性／
誘電特性同時計測センサを用いて取得することを特徴と
する請求項１記載の樹脂注型装置。2. A monitor control device for displaying on a monitor, a conversion parameter from an equivalent resistivity to a viscoelasticity is calculated by a dynamic viscoelasticity / viscoelasticity.
The resin casting apparatus according to claim 1, wherein the resin casting apparatus is obtained by using a dielectric property simultaneous measurement sensor.
は、粘弾性の複素粘度と誘電特性の等価抵抗率とを相関
パラメータとして扱うことを特徴とする請求項２記載の
樹脂注型装置。3. The resin casting apparatus according to claim 2, wherein the dynamic viscoelasticity / dielectric property simultaneous measurement sensor treats the complex viscosity of viscoelasticity and the equivalent resistivity of the dielectric property as correlation parameters.
は、粘弾性の貯蔵剛性率及び損失剛性率と誘電特性の等
価抵抗率とを相関パラメータとして扱うことを特徴とす
る請求項２記載の樹脂注型装置。4. The dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor according to claim 2, wherein the storage rigidity and loss rigidity of viscoelasticity and the equivalent resistivity of dielectric characteristic are treated as correlation parameters. Resin casting equipment.
は、センサのプレート間距離を０．５〜３．０ｍｍとし
て計測することを特徴とする請求項２記載の樹脂注型装
置。5. The resin casting apparatus according to claim 2, wherein the dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor measures the distance between the plates of the sensor at 0.5 to 3.0 mm.
は、一定の樹脂硬化温度で相関データを取得することを
特徴とする請求項２、３、４、５のいずれかに記載の樹
脂注型装置。6. The resin injection according to claim 2, wherein the dynamic viscoelasticity / dielectric property simultaneous measurement sensor acquires correlation data at a fixed resin curing temperature. Mold device.
は、測定時の温度環境に等速昇温のプログラムを与え相
関データを取得することを特徴とする請求項２、３、
４、５のいずれかに記載の樹脂注型装置。7. The dynamic viscoelasticity / dielectric characteristic simultaneous measurement sensor acquires a correlation data by giving a program of constant temperature rise to a temperature environment at the time of measurement.
A resin casting apparatus according to any one of claims 4 and 5.
は、エポキシ樹脂調合ロットの品質検査に用いられるこ
とを特徴とする請求項２記載の樹脂注型装置。8. The resin casting apparatus according to claim 2, wherein the dynamic viscoelasticity / dielectric property simultaneous measurement sensor is used for quality inspection of an epoxy resin preparation lot.
体積の大きい肉厚部、クラックの発生しやすい弱点部に
近接する金型に配置され、その情報に基づき金型開閉制
御装置の開閉制御を行なうことを特徴とする請求項１記
載の樹脂注型装置。9. A mold opening / closing control device based on the information, wherein the dielectric sensor is arranged in a mold close to an injection port of a cast product, a thick portion having a large resin volume, and a weak point where cracks are easily generated. 2. The resin casting apparatus according to claim 1, wherein opening / closing control is performed.
に近接する金型に配置され、その情報に基づき製品離型
のノックピンの制御を行なうことを特徴とする請求項１
記載の樹脂注型装置。10. The dielectric sensor according to claim 1, wherein the dielectric sensor is disposed in a mold close to a weak point of the strength of the cast product, and controls a knock pin for releasing the product based on the information.
The resin casting apparatus described in the above.
ると共に、樹脂混合タンク内の樹脂硬化時の反応挙動を
検出し、得られる等価抵抗率の変化から樹脂のポットラ
イフを検知することを特徴とする請求項１記載の樹脂注
型装置。11. A dielectric sensor is provided in addition to a mold, and detects a reaction behavior during curing of a resin in a resin mixing tank, and detects a pot life of the resin from a change in an equivalent resistivity obtained. The resin casting apparatus according to claim 1, wherein:
金型上部のエア抜き溝への到達点を検知し、その検知信
号に基づいてストップバルブを制御し、樹脂の供給を停
止することを特徴とする請求項１記載の樹脂注型装置。12. The dielectric sensor, wherein the resin fills the mold,
2. The resin casting apparatus according to claim 1, wherein a reaching point to the air vent groove at the upper part of the mold is detected, and a stop valve is controlled based on the detection signal to stop supplying the resin.
金型上部のエア抜き溝への到達点を検知し、その検知信
号に基づき、注入側からの樹脂圧力を制御することを特
徴とする請求項１記載の樹脂注型装置。13. The dielectric sensor, wherein the resin fills the mold,
2. The resin casting apparatus according to claim 1, wherein a point reaching the air vent groove at the upper part of the mold is detected, and the resin pressure from the injection side is controlled based on the detection signal.
ると共に、樹脂注入用配管内部の樹脂硬化時の反応挙動
を検知し、得られる等価抵抗率の変化から配管内の樹脂
粘度を一定に保つようヒータ温度を制御すると共に、樹
脂のポットライフを検知することを特徴とする請求項１
記載の樹脂注型装置。14. A dielectric sensor, which is provided in addition to the mold, detects a reaction behavior during resin curing inside the resin injection pipe, and keeps the resin viscosity in the pipe constant from a change in the equivalent resistivity obtained. 2. The method according to claim 1, wherein the heater temperature is controlled to maintain the temperature, and the pot life of the resin is detected.
The resin casting apparatus described in the above.
ると共に、ダイナミックミキサーの混合状態を検知し、
その検知信号に基づき、混合状態を管理することを特徴
とする請求項１記載の樹脂注型装置。15. A dielectric sensor is provided besides a mold, and detects a mixing state of a dynamic mixer.
The resin casting apparatus according to claim 1, wherein the mixing state is managed based on the detection signal.
ると共に、スタティックミキサーの混合状態を検知し、
その検知信号に基づき、混合状態を管理することを特徴
とする請求項１記載の樹脂注型装置。16. An induction sensor is provided besides a mold, and detects a mixing state of a static mixer.
The resin casting apparatus according to claim 1, wherein the mixing state is managed based on the detection signal.
ると共に、樹脂混合タンク内と樹脂注入用配管内部の樹
脂硬化時の反応挙動を検出し、得られる等価抵抗率の変
化から樹脂の金型への注入時間をコントロールすること
を特徴とする請求項１記載の樹脂注型装置。17. A dielectric sensor is provided in addition to the mold, detects a reaction behavior of the resin in the resin mixing tank and the resin injecting pipe when the resin is cured, and detects a change in the equivalent resistivity of the resin based on a change in the obtained equivalent resistivity. 2. The resin casting apparatus according to claim 1, wherein the injection time into the mold is controlled.
脂体積の大きい肉厚部、クラックの発生し易い弱点部に
近接する金型に配置され、その情報に基づき樹脂硬化条
件の時間的な偏差を金型ヒータの可変制御によって補償
するようにしたことを特徴とする請求項１記載の樹脂注
型装置。18. A dielectric sensor is disposed in a mold close to an injection port of a cast product, a thick portion having a large resin volume, and a weak point where cracks are likely to occur. 2. The resin casting apparatus according to claim 1, wherein the deviation is compensated for by variable control of a mold heater.
リ部に設けられ、離型後の２次硬化工程の反応挙動を検
出し、得られる等価抵抗率の変化から樹脂の剛性率をモ
ニターし硬化の終点を検出することを特徴とする請求項
１記載の樹脂注型装置。19. A dielectric sensor is provided at an injection port or a burr of a cast product, detects a reaction behavior in a secondary curing step after release, and obtains a rigidity of the resin from a change in an equivalent resistivity obtained. 2. The resin casting apparatus according to claim 1, wherein the end point of curing is detected by monitoring the temperature.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19776699A JP3560858B2 (en) | 1999-07-12 | 1999-07-12 | Resin casting machine |
| DE10033702A DE10033702C2 (en) | 1999-07-12 | 2000-07-12 | caster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19776699A JP3560858B2 (en) | 1999-07-12 | 1999-07-12 | Resin casting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001018240A true JP2001018240A (en) | 2001-01-23 |
| JP3560858B2 JP3560858B2 (en) | 2004-09-02 |
Family
ID=16380005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19776699A Expired - Fee Related JP3560858B2 (en) | 1999-07-12 | 1999-07-12 | Resin casting machine |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3560858B2 (en) |
| DE (1) | DE10033702C2 (en) |
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| JP2007248450A (en) * | 2005-12-30 | 2007-09-27 | Depuy Products Inc | Method and apparatus for predicting action timing of bone cement |
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1999
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-
2000
- 2000-07-12 DE DE10033702A patent/DE10033702C2/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| DE10033702A1 (en) | 2001-05-17 |
| DE10033702C2 (en) | 2002-11-14 |
| JP3560858B2 (en) | 2004-09-02 |
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