JP2001015876A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JP2001015876A JP2001015876A JP11186531A JP18653199A JP2001015876A JP 2001015876 A JP2001015876 A JP 2001015876A JP 11186531 A JP11186531 A JP 11186531A JP 18653199 A JP18653199 A JP 18653199A JP 2001015876 A JP2001015876 A JP 2001015876A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- adhesive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来か
らフレキシブル基板用フィルム１上に第一部材２（接着
剤）を介して銅箔で形成された回路３が設けられ、この
回路３上に第二部材４（接着剤）を介してカバーレイフ
ィルム５が設けられた構造のフレキシブルプリント配線
板（本実施例と同一構成部分には同一符号を付した。）
が提案されており、このフレキシブルプリント配線板は
用途により屈曲特性（該フレキシブルプリント配線板を
垂直に立て、両端を把持し、該両端を交互に上下移動さ
せたとき、該フレキシブルプリント配線板や回路３が折
曲したり、切断したりしないか否かの特性のことであっ
て、摺動特性ともいわれる。）が良好なフレキシブルプ
リント配線板が望まれている。例えば、常温下において
屈曲特性が秀れていても、高温下（４０°Ｃ〜８０°Ｃ
程度）において屈曲特性が悪く、回路３が断線してしま
うフレキシブルプリント配線板が多い。2. Description of the Related Art Conventionally, a circuit 3 made of copper foil is provided on a film 1 for a flexible substrate via a first member 2 (adhesive). A flexible printed wiring board having a structure in which a coverlay film 5 is provided via a second member 4 (adhesive) (the same components as those in the present embodiment are denoted by the same reference numerals).
The flexible printed wiring board has a bending characteristic depending on the application (when the flexible printed wiring board is set up vertically, both ends are gripped, and the both ends are alternately moved up and down, the flexible printed wiring board or circuit is 3 is a characteristic of whether or not it is bent or cut, which is also called a sliding characteristic. For example, even if the bending characteristics are excellent at room temperature, even under high temperature (40 ° C. to 80 ° C.)
), There are many flexible printed wiring boards in which the bending characteristics are poor and the circuit 3 is disconnected.
【０００３】ところで、フレキシブルプリント配線板の
高温下における屈曲特性はフレキシブルプリント配線板
の弾性率により決定されるものであるが、フレキシブル
プリント配線板の弾性率は、その構成部材の弾性率によ
り決定されることを本発明者等は、フレキシブルプリン
ト配線板の構成部材であるフレキシブル基板用フィルム
１，銅箔，基板フィルム用の接着剤，カバーレイフィル
ム用の接着剤及びカバーレイフィルム５を種々変えて実
験し、確認した。即ち、高温下におけるフレキシブルプ
リント配線板の屈曲特性は、使用される基板フィルム用
の接着剤，カバーレイフィルム用の接着剤の弾性率に著
しく依存していることを本発明者等は確認したのであ
る。The bending characteristics of a flexible printed wiring board at high temperatures are determined by the elastic modulus of the flexible printed wiring board, and the elastic modulus of the flexible printed wiring board is determined by the elastic modulus of its constituent members. That is, the present inventors changed variously the flexible substrate film 1, the copper foil, the adhesive for the substrate film, the adhesive for the cover lay film, and the cover lay film 5 which are the components of the flexible printed wiring board. Experimented and confirmed. In other words, the present inventors have confirmed that the bending characteristics of the flexible printed wiring board at high temperatures are significantly dependent on the elastic modulus of the adhesive for the substrate film and the adhesive for the coverlay film used. is there.
【０００４】本発明は高温下における屈曲特性が極めて
良好なフレキシブルプリント配線板を提供するものであ
る。The present invention is to provide a flexible printed wiring board having extremely good bending characteristics at high temperatures.
【０００５】[0005]
【課題を解決するための手段】添付図面を参照して本発
明の要旨を説明する。The gist of the present invention will be described with reference to the accompanying drawings.
【０００６】フレキシブル基板用フィルム１上に第一部
材２を介して回路３が設けられ、この回路３上に第二部
材４を介してカバーレイフィルム５が設けられているフ
レキシブルプリント配線板であって、回路３は第一部材
２及び第二部材４で囲繞されており、第一部材２若しく
は／及び第二部材４として２０°Ｃ〜８０°Ｃの使用温
度雰囲気下での弾性率が４０kgf/mm2以上の部材が採用
されていることを特徴とするフレキシブルプリント配線
板に係るものである。[0006] A flexible printed wiring board in which a circuit 3 is provided on a film 1 for a flexible substrate via a first member 2 and a coverlay film 5 is provided on the circuit 3 via a second member 4. The circuit 3 is surrounded by the first member 2 and the second member 4, and the first member 2 and / or the second member 4 have a modulus of elasticity of 40 kgf at an operating temperature of 20 ° C. to 80 ° C. The present invention relates to a flexible printed wiring board characterized in that a member of / mm 2 or more is adopted.
【０００７】また、請求項１記載のフレキシブルプリン
ト配線板において、第一部材２及び第二部材４が接着剤
であることを特徴とするフレキシブルプリント配線板に
係るものである。Further, in the flexible printed wiring board according to the first aspect, the first member 2 and the second member 4 are adhesives.
【０００８】また、請求項１，２いずれか１項に記載の
フレキシブルプリント配線板において、フレキシブル基
板用フィルム１及びカバーレイフィルム５として、ポリ
イミドフィルムが採用されていることを特徴とするフレ
キシブルプリント配線板に係るものである。Further, in the flexible printed wiring board according to any one of claims 1 and 2, a polyimide film is employed as the flexible substrate film 1 and the coverlay film 5. Pertaining to a plate.
【０００９】また、請求項１〜３いずれか１項に記載の
フレキシブルプリント配線板において、回路３が圧延銅
箔若しくは特殊電解銅箔（ＨＴＥ箔）により形成されて
いることを特徴とするフレキシブルプリント配線板に係
るものである。The flexible printed wiring board according to any one of claims 1 to 3, wherein the circuit 3 is formed of a rolled copper foil or a special electrolytic copper foil (HTE foil). It relates to a wiring board.
【００１０】[0010]
【発明の作用及び効果】図１に示す構成のフレキシブル
プリント配線板において、構成部材であるフレキシブル
基板用フィルム１，銅箔，基板フィルム用の接着剤，カ
バーレイフィルム用の接着剤及びカバーレイフィルム５
を種々変えて高温下（４０°Ｃ〜８０°Ｃ程度）におい
て秀れた屈曲特性を発揮するフレキシブルプリント配線
板を得るべく実験したところ、フレキシブル基板用フィ
ルム１，カバーレイフィルム５及び銅箔はそれほど屈曲
特性向上に寄与しておらず、基板フィルム用の接着剤及
びカバーレイフィルム用の接着剤が高温下におけるフレ
キシブルプリント配線板の屈曲特性を支配することを確
認した。In the flexible printed wiring board having the structure shown in FIG. 1, a film for a flexible substrate 1, a copper foil, an adhesive for a substrate film, an adhesive for a cover lay film, and a cover lay film are used. 5
Experiments were carried out to obtain a flexible printed wiring board exhibiting excellent bending characteristics at high temperatures (about 40 ° C. to 80 ° C.) by changing various conditions. It was confirmed that the adhesive for the substrate film and the adhesive for the coverlay film do not significantly contribute to the improvement of the bending characteristics of the flexible printed wiring board at a high temperature.
【００１１】屈曲特性が劣悪なフレキシブルプリント配
線板とは、結局、フレキシブルプリント配線板を垂直に
立て、両端を把持し、該両端を上下に交互に移動させた
場合、銅箔に応力集中がおこるフレキシブルプリント配
線板のことであり、従って、回路にヒビ，亀裂等が入っ
て断線してしまうものである。よって、これを解決する
為には高温下において銅箔への応力集中を分散させれば
よく、従って、その手段として銅箔を所定の弾性率の部
材で囲繞すればよいのではないかと仮説を立て、実験し
たところ、良好な屈曲特性が得られた。例えば、高温下
においてゴム状弾性状態となる部材では銅箔への応力集
中は分散されず、また、銅箔の表面に当接する部材のみ
を高温下で所定の弾性率を有する部材にしても、裏面に
高温下で所定の弾性率を有する部材にしなければ、銅箔
の応力集中を適確には回避できない。[0011] A flexible printed wiring board having poor bending characteristics means that, when the flexible printed wiring board is set up vertically, both ends are gripped, and both ends are alternately moved up and down, stress concentration occurs on the copper foil. It is a flexible printed wiring board, and therefore a circuit is broken due to cracks, cracks and the like. Therefore, in order to solve this, it is only necessary to disperse the stress concentration on the copper foil at a high temperature, and it is hypothesized that the copper foil may be surrounded by a member having a predetermined elastic modulus as a means for solving the problem. As a result of an upright experiment, good bending characteristics were obtained. For example, in a member that is in a rubbery elastic state at a high temperature, stress concentration on the copper foil is not dispersed, and only a member that contacts the surface of the copper foil is a member having a predetermined elastic modulus at a high temperature. Unless the back surface is made of a member having a predetermined elastic modulus at a high temperature, stress concentration of the copper foil cannot be properly avoided.
【００１２】フレキシブルプリント配線板の屈曲特性は
フレキシブルプリント配線板の構成部材である接着剤の
Ｔｇ点（ガラス転移点）により決まるという考え方もあ
るが、所定の弾性率を有しない接着剤はＴｇ点以下の温
度で使用しても銅箔への応力集中を回避できず、断線等
が生じることを本発明者等は実験により確認している。There is an idea that the bending characteristic of the flexible printed wiring board is determined by the Tg point (glass transition point) of the adhesive which is a constituent member of the flexible printed wiring board. However, the adhesive having no predetermined elastic modulus has a Tg point. The present inventors have confirmed through experiments that the stress concentration on the copper foil cannot be avoided even when used at the following temperature, and disconnection or the like occurs.
【００１３】以上を総合すると、本発明者等は接着剤の
弾性率によりフレキシブルプリント配線板の屈曲特性が
決まるという知見を得た。In summary, the present inventors have found that the bending characteristic of the flexible printed wiring board is determined by the elastic modulus of the adhesive.
【００１４】[0014]
【発明の実施の形態】本実施例に係るフレキシブルプリ
ント配線板は、プリンター，フロッピー（登録商標）デ
ィスクドライブ，ハードディスクドライブ等の機械本体
と可動部品の接続に使用されるもので、その構成は図１
に示す通りである。尚、図１中、符号１，２，３の部分
を合わせて一般的にはフレキシブル基板といわれ、ま
た、符号４，５の部分を合わせて一般的にはカバーレイ
フィルムといわれる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A flexible printed wiring board according to this embodiment is used for connecting a movable part with a machine body such as a printer, a floppy (registered trademark) disk drive, or a hard disk drive. 1
As shown in FIG. In FIG. 1, the portions denoted by reference numerals 1, 2, and 3 are generally referred to as a flexible substrate, and the portions denoted by reference numerals 4 and 5 are generally referred to as a coverlay film.
【００１５】フレキシブル基板用フィルム１としては耐
熱性に秀れたポリイミドフィルムが、銅箔としては公知
の圧延銅箔若しくは特殊電解銅箔（ＨＴＥ箔）が、第一
部材２としての第一接着剤及び第二部材４としての第二
接着剤としては後記のものが、カバーレイフィルム５と
しては上記同様ポリイミドフィルムが採用されている。A polyimide film excellent in heat resistance is used as the film 1 for a flexible substrate, a rolled copper foil or a special electrolytic copper foil (HTE foil) is used as a copper foil, and a first adhesive as a first member 2 is used. The second adhesive as the second member 4 is as described below, and the cover lay film 5 is a polyimide film as described above.
【００１６】また、本実施例に係るフレキシブルプリン
ト配線板の使用温度は２０°Ｃ〜８０°Ｃ程度であり、
以下に示すように本実施例は８０°Ｃ程度の高温下にお
いて秀れた屈曲特性を示すものである。The working temperature of the flexible printed wiring board according to this embodiment is about 20 ° C. to 80 ° C.,
As shown below, this embodiment shows excellent bending characteristics at a high temperature of about 80 ° C.
【００１７】フレキシブル基板用フィルム１の作製方法
は次の通りである。The method for producing the film 1 for a flexible substrate is as follows.
【００１８】溶解混合された後記第一接着剤を厚さ２５
μｍのポリイミドフィルム（東レ・デュポン社製、カプ
トン１００Ｖ）に接着剤厚さ１０μｍとなるように連続
で塗布したものを１５０°Ｃで５分乾燥・Ｂステージ化
を行い、これを３５μｍ圧延銅箔（ジャパンエナジー社
製、ＢＨＹ）の化学処理面と接着剤面が合わさるように
連続でラミネート圧着し、さらに１６０°Ｃで５時間の
硬化を行い、ポリイミドフレキシブル基板用フィルム１
を得る。The first adhesive melted and mixed is applied to a thickness of 25.
μm polyimide film (manufactured by Dupont Toray, Kapton 100V) was applied continuously so as to have an adhesive thickness of 10 μm, dried at 150 ° C. for 5 minutes, B-staged, and rolled into a 35 μm rolled copper foil (Japan Energy Co., Ltd., BHY) Laminated and pressure-bonded continuously so that the chemically treated surface and the adhesive surface match, and further cured at 160 ° C. for 5 hours to obtain a polyimide flexible substrate film 1
Get.
【００１９】また、カバーレイフィルム５の作製方法は
次の通りである。The method for producing the cover lay film 5 is as follows.
【００２０】溶解混合され後記第二接着剤を厚さ２５μ
ｍのポリイミドフィルム（東レ：デュポン社製、カプト
ン１００Ｖ）に接着剤厚さ３０μｍとなるように連続で
塗布したもの１５０°Ｃで５分乾燥・Ｂステージ化を行
い、ポリイミドカバーレイフィルム５を得る。The second adhesive is dissolved and mixed to a thickness of 25 μm.
m, a polyimide film (manufactured by Du Pont, Kapton 100V) continuously applied so as to have an adhesive thickness of 30 μm, dried at 150 ° C. for 5 minutes and B-staged to obtain a polyimide coverlay film 5 .
【００２１】次に本実施例と比較例とを詳述する。Next, this embodiment and a comparative example will be described in detail.
【００２２】 〈比較例〉 第一接着剤の配合 ビスフェノールＡ型エポキシ樹脂(旭チバ(株)製のAER260) ３０部 臭素化ビスフェノールＡ型エポキシ樹脂(東都化成(株)製のYDB500) ５０部 臭素化ビスフェノールＡ型エポキシ樹脂(東都化成(株)製のＹＤＢ４０
０） ３０部 ＮＢＲ（日本ゼオン（株)製のニッポール1072) ４０部 水酸化アルミニウム ２４部 三酸化アンチモン １８部 ジアミノジフェニルスルホン ６部 三フッ化硼素モノエチルアミン ０.５部 第二接着剤の配合 ビスフェノールＡ型エポキシ樹脂(旭チバ(株)製のAER260) １２部 臭素化ビスフェノールＡ型エポキシ樹脂(東都化成(株)製のYDB500) ４６部 臭素化ビスフェノールＡ型エポキシ樹脂(東都化成(株)製のYDB400) ４２部 ＮＢＲ（日本ゼオン(株)製のニッポール1072） ４４部 水酸化アルミニウム ３８部 ジアミノジフェニルスルホン ７部 三フッ化硼素モノエチルアミン ０.５部 〈実施例１〉 第一接着剤の配合 ビスフェノールＡ型エポキシ樹脂（旭チバ(株)製のAER260) ３０部 臭素化ビスフェノールＡ型エポキシ樹脂(東都化成(株)製のYDB500) ５０部 臭素化ビスフェノールＡ型エポキシ樹脂(東都化成(株)製のYDB400) ３０部 ＮＢＲ（日本ゼオン(株)製のニッポール1072） ２２部 水酸化アルミニウム ２４部 三酸化アンチモン １８部 ジアミノジフェニルスルホン １４.４部 三フッ化硼素モノエチルアミン ０.５部 第二接着剤の配合 〈比較例〉と同じ 〈実施例２〉 第一接着剤の配合 〈比較例〉と同じ 第二接着剤の配合 臭素化フェノキシ樹脂（東都化成(株)製のYPB40） １００部 ビスフェノールＦ型エポキシ樹脂（大日本インキ化学工業(株)製のエピク ロン830) ２５部 ジシアンジアミド １部 ２−エチル−４−メチルイミダゾール ０.２部 〈実施例３〉 第一接着剤の配合 〈実施例１〉と同じ 第二接着剤の配合 〈実施例２〉と同じ 以上の配合により高弾性率の接着剤が得られた。Comparative Example Formulation of First Adhesive Bisphenol A type epoxy resin (AER260 manufactured by Asahi Chiba Co., Ltd.) 30 parts Brominated bisphenol A type epoxy resin (YDB500 manufactured by Toto Kasei Co., Ltd.) 50 parts Bromine Bisphenol A epoxy resin (YDB40 manufactured by Toto Kasei Co., Ltd.)
0) 30 parts NBR (Nippol 1072 manufactured by Nippon Zeon Co., Ltd.) 40 parts Aluminum hydroxide 24 parts Antimony trioxide 18 parts Diaminodiphenyl sulfone 6 parts Boron trifluoride monoethylamine 0.5 part Formulation of second adhesive Bisphenol A type epoxy resin (AER260 manufactured by Asahi Chiba Co., Ltd.) 12 parts Brominated bisphenol A type epoxy resin (YDB500 manufactured by Toto Kasei Co., Ltd.) 46 parts Brominated bisphenol A type epoxy resin (manufactured by Toto Kasei Co., Ltd.) YDB400) 42 parts NBR (Nippol 1072 manufactured by Nippon Zeon Co., Ltd.) 44 parts Aluminum hydroxide 38 parts Diaminodiphenyl sulfone 7 parts Boron trifluoride monoethylamine 0.5 part <Example 1> Formulation of first adhesive Bisphenol A type epoxy resin (AER260 manufactured by Asahi Ciba Co., Ltd.) 30 parts Brominated bisphenol A type epoxy resin (YDB500 manufactured by Toto Kasei Co., Ltd.) 50 parts Bisphenol A type epoxy resin (YDB400 manufactured by Toto Kasei Co., Ltd.) 30 parts NBR (Nippol 1072 manufactured by Nippon Zeon Co., Ltd.) 22 parts Aluminum hydroxide 24 parts Antimony trioxide 18 parts Diaminodiphenyl sulfone 14.4 parts 0.5 parts of boron trifluoride monoethylamine Formulation of second adhesive Same as in Comparative Example <Example 2> Formulation of first adhesive <Same as Comparative Example> Formulation of second adhesive Brominated phenoxy resin ( YPB40 manufactured by Toto Kasei Co., Ltd.) 100 parts Bisphenol F type epoxy resin (Epiclon 830 manufactured by Dainippon Ink and Chemicals, Inc.) 25 parts Dicyandiamide 1 part 2-ethyl-4-methylimidazole 0.2 parts Example 3 Formulation of First Adhesive Same as <Example 1> Formulation of Second Adhesive Same as <Example 2> By the above formula, an adhesive having a high elastic modulus was obtained.
【００２３】比較例及び実施例１，２，３の実験結果を
表１に示す。Table 1 shows the experimental results of the comparative example and Examples 1, 2, and 3.
【００２４】[0024]
【表１】 [Table 1]
【００２５】尚、ポリイミドフレキシブル基板用フィル
ムにＪＩＳ Ｃ ６４７１で開示される耐屈曲性試験試料
のパターンを作製し、これにポリイミドカバーレイフィ
ルム５を１８０°Ｃ×３０kgf/cm2×３０分プレス接着
し、試験試料を得た。これをＦＰＣ高速屈曲試験器（信
越エンジニアリング社製）にて、振動数１５００cpm，
ストローク２０ｍｍ，曲率２.５ｍｍＲ，カバーレイ外
側の条件で各雰囲気温度下で抵抗値の変化を測定した。
屈曲により銅箔にヒビ等の亀裂が生じると、体積減少が
生じ抵抗が上がることを利用して屈曲特性を確認する。A pattern of a flex resistance test sample disclosed in JIS C 6471 was prepared on a polyimide flexible substrate film, and a polyimide coverlay film 5 was press-bonded to the film at 180 ° C. × 30 kgf / cm 2 × 30 minutes. Then, a test sample was obtained. This was tested with a FPC high-speed bending tester (Shin-Etsu Engineering Co., Ltd.) at a frequency of 1500 cpm.
The change in the resistance value was measured at each ambient temperature under the conditions of a stroke of 20 mm, a curvature of 2.5 mmR, and the outside of the coverlay.
When cracks such as cracks occur in the copper foil due to bending, the bending characteristics are confirmed by utilizing the fact that the volume is reduced and the resistance is increased.
【００２６】また、弾性率（引張初期弾性率）の測定方
法は次の通りである。The method for measuring the elastic modulus (initial tensile elastic modulus) is as follows.
【００２７】後記の各接着剤で約１００μｍの硬化樹脂
板を作製し、幅１０ｍｍに切り出し、オートグラフ（島
津製作所社製）にて測定する。A cured resin plate having a thickness of about 100 μm is prepared with each of the adhesives described below, cut into a width of 10 mm, and measured with an autograph (manufactured by Shimadzu Corporation).
【００２８】本発明者等は、実験の結果、第一接着剤及
び第二接着剤のいずれか一方について高温下(４０°Ｃ
〜８０°Ｃ程度)において高弾性率を有する接着剤を採
用することで高温下において屈曲特性を有するフレキシ
ブルプリント配線板が得られることを確認した。As a result of the experiment, the present inventors found that either one of the first adhesive and the second adhesive was subjected to a high temperature (40 ° C.).
(About 80 ° C.), it was confirmed that a flexible printed wiring board having bending characteristics at a high temperature can be obtained by employing an adhesive having a high modulus of elasticity.
【００２９】更に、第一接着剤及び第二接着剤のいずれ
か一方がかなりの高弾性率の場合、他方はそれほど高弾
性率でなくとも良く、また、特に第二接着剤の弾性率が
屈曲特性への寄与度が高いことを確認した。これは第二
接着剤は銅箔の三面に接している為であると推測でき
る。Further, when one of the first adhesive and the second adhesive has a considerably high elastic modulus, the other does not have to have such a high elastic modulus. It was confirmed that the contribution to the characteristics was high. It can be assumed that this is because the second adhesive is in contact with three surfaces of the copper foil.
【００３０】そして、更に、第一接着剤及び第二接着剤
ともにかなりの高弾性率の接着剤を採用すると高温下に
おいて特に秀れたフレキシブルプリント配線板が得られ
ることも確認した。Furthermore, it was also confirmed that when an adhesive having a considerably high elastic modulus was used for both the first adhesive and the second adhesive, a particularly excellent flexible printed wiring board could be obtained at high temperatures.
【００３１】実験によれば高温下（４０°Ｃ〜８０°Ｃ
程度）での弾性率が４０(kgf/mm2)以上の接着剤を第一
接着剤及び第二接着剤いずれか一方に使用すれば、特に
第二接着剤に使用すれば十分秀れた屈曲特性が得られる
ことが判明しているが、弾性率が５００(kgf/mm2)を超
えると耐折性が著しく劣悪となることも確認済みであ
る。According to the experiment, under high temperature (40 ° C to 80 ° C)
Bending that is excellent enough when the adhesive whose elastic modulus is about 40 (kgf / mm 2 ) or more is used for either one of the first adhesive and the second adhesive, especially when used for the second adhesive. It has been found that properties can be obtained, but it has also been confirmed that when the elastic modulus exceeds 500 (kgf / mm 2 ), the folding resistance becomes extremely poor.
【００３２】以上から第一接着剤及び第二接着剤として
弾性率の高い接着剤を使用すればフレキシブルプリント
配線板の屈曲特性が向上することを確認でき、実施例に
係るフレキシブルプリント配線板は８０°Ｃ雰囲気下に
おいて秀れた屈曲特性を有することが明らかといえる。From the above, it can be confirmed that the use of an adhesive having a high elastic modulus as the first adhesive and the second adhesive improves the bending characteristics of the flexible printed wiring board. It can be clearly seen that the material has excellent bending characteristics under an atmosphere of ° C.
【００３３】このことは、結局、銅箔が高温下において
高弾性率の部材で囲繞される為、該銅箔への応力集中が
回避できたものと推論する。This is presumed to be because the copper foil is eventually surrounded by a member having a high elastic modulus at a high temperature, so that stress concentration on the copper foil can be avoided.
【図１】本実施例の構成の説明図である。FIG. 1 is an explanatory diagram of the configuration of the present embodiment.
【図２】本実施例の特性を示すグラフである。FIG. 2 is a graph showing characteristics of the present embodiment.
【図３】本実施例の特性を示すグラフである。FIG. 3 is a graph showing characteristics of the present embodiment.
１ フレキシブル基板用フィルム ２ 第一部材 ３ 回路 ４ 第二部材 ５ カバーレイフィルム DESCRIPTION OF SYMBOLS 1 Film for flexible substrates 2 First member 3 Circuit 4 Second member 5 Coverlay film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 北 和英 新潟県上越市南本町１丁目５番５号 株式 会社有沢製作所内 (72)発明者 藤田 秀一 新潟県上越市南本町１丁目５番５号 株式 会社有沢製作所内 Ｆターム(参考） 4J040 EH031 JA09 JB02 LA06 LA09 MA02 MA10 MB09 NA20 5E314 AA36 BB02 BB11 CC15 FF06 FF19 GG19 5E343 AA18 AA33 BB24 BB67 CC01 DD52 GG02 GG16 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuhide Kita 1-5-5 Minamihonmachi, Joetsu City, Niigata Prefecture Inside Arisawa Works (72) Inventor Shuichi Fujita 1-5-5 Minamihonmachi, Joetsu City, Niigata Prefecture F-term in Arisawa Manufacturing Co., Ltd. (reference) 4J040 EH031 JA09 JB02 LA06 LA09 MA02 MA10 MB09 NA20 5E314 AA36 BB02 BB11 CC15 FF06 FF19 GG19 5E343 AA18 AA33 BB24 BB67 CC01 DD52 GG02 GG16
Claims (4)
材を介して回路が設けられ、この回路上に第二部材を介
してカバーレイフィルムが設けられているフレキシブル
プリント配線板であって、回路は第一部材及び第二部材
で囲繞されており、第一部材若しくは／及び第二部材と
して２０°Ｃ〜８０°Ｃの使用温度雰囲気下での弾性率
が４０kgf/mm2以上の部材が採用されていることを特徴
とするフレキシブルプリント配線板。1. A flexible printed wiring board, wherein a circuit is provided on a film for a flexible substrate via a first member, and a coverlay film is provided on the circuit via a second member. A member which is surrounded by a first member and a second member, and has a modulus of elasticity of 40 kgf / mm 2 or more at an operating temperature of 20 ° C. to 80 ° C. as the first member and / or the second member. A flexible printed wiring board characterized in that:
線板において、第一部材及び第二部材が接着剤であるこ
とを特徴とするフレキシブルプリント配線板。2. The flexible printed wiring board according to claim 1, wherein the first member and the second member are adhesives.
キシブルプリント配線板において、フレキシブル基板用
フィルム及びカバーレイフィルムとして、ポリイミドフ
ィルムが採用されていることを特徴とするフレキシブル
プリント配線板。3. The flexible printed wiring board according to claim 1, wherein a polyimide film is used as the film for the flexible substrate and the coverlay film.
キシブルプリント配線板において、回路が圧延銅箔若し
くは特殊電解銅箔（ＨＴＥ箔）により形成されているこ
とを特徴とするフレキシブルプリント配線板。4. The flexible printed circuit according to claim 1, wherein the circuit is formed of a rolled copper foil or a special electrolytic copper foil (HTE foil). Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18653199A JP3514172B2 (en) | 1999-06-30 | 1999-06-30 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18653199A JP3514172B2 (en) | 1999-06-30 | 1999-06-30 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001015876A true JP2001015876A (en) | 2001-01-19 |
| JP3514172B2 JP3514172B2 (en) | 2004-03-31 |
Family
ID=16190134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18653199A Expired - Lifetime JP3514172B2 (en) | 1999-06-30 | 1999-06-30 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3514172B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6664479B2 (en) | 1999-11-10 | 2003-12-16 | Fujikura Ltd. | Flexible printed circuit board |
| US6911605B2 (en) * | 2001-11-13 | 2005-06-28 | Fujikura Ltd. | Flexible printed circuit |
| JP2005235948A (en) * | 2004-02-18 | 2005-09-02 | Kyocera Chemical Corp | Cover lay for use of flexible wiring board, and flexible wiring board using the same |
| KR100981942B1 (en) | 2007-03-26 | 2010-09-13 | 가부시키가이샤 아리사와 세이사쿠쇼 | Flexible printed circuit board and slide type mobile phone terminal using the same |
-
1999
- 1999-06-30 JP JP18653199A patent/JP3514172B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6664479B2 (en) | 1999-11-10 | 2003-12-16 | Fujikura Ltd. | Flexible printed circuit board |
| US6911605B2 (en) * | 2001-11-13 | 2005-06-28 | Fujikura Ltd. | Flexible printed circuit |
| JP2005235948A (en) * | 2004-02-18 | 2005-09-02 | Kyocera Chemical Corp | Cover lay for use of flexible wiring board, and flexible wiring board using the same |
| JP4716662B2 (en) * | 2004-02-18 | 2011-07-06 | 京セラケミカル株式会社 | Coverlay for flexible wiring board and flexible wiring board using the same |
| KR100981942B1 (en) | 2007-03-26 | 2010-09-13 | 가부시키가이샤 아리사와 세이사쿠쇼 | Flexible printed circuit board and slide type mobile phone terminal using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3514172B2 (en) | 2004-03-31 |
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