JP2000343026A - Coating liquid feeding device - Google Patents
Coating liquid feeding deviceInfo
- Publication number
- JP2000343026A JP2000343026A JP11160587A JP16058799A JP2000343026A JP 2000343026 A JP2000343026 A JP 2000343026A JP 11160587 A JP11160587 A JP 11160587A JP 16058799 A JP16058799 A JP 16058799A JP 2000343026 A JP2000343026 A JP 2000343026A
- Authority
- JP
- Japan
- Prior art keywords
- coating liquid
- tank
- pump
- liquid supply
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体、液晶表示
装置やカラーフィルタ等の高精細パターンの製造工程に
おいて、基板上にレジスト、着色層などの種々の薄膜を
塗布するための塗布装置に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for coating various thin films such as a resist and a colored layer on a substrate in a process of manufacturing a high definition pattern such as a semiconductor, a liquid crystal display and a color filter. .
【０００２】[0002]
【従来の技術】例えば、カラーフィルタの製造工程は、
ガラス基板上に真空成膜法を用いてクロムを成膜する工
程、フォトレジストを塗布しフォトマスクを配置して露
光、現像、クロムエッチング、フォトレジスト剥離を行
いストライプ状パターンあるいは格子状パターン等から
なるブラック遮光層を形成する工程、ブラック遮光層の
上から着色用感材を塗布した後、フォトマスクを配置し
露光した後、現像を行い着色パターンを形成し、この着
色パターンをＲ、Ｇ、Ｂ３色について繰り返して複数の
着色層を形成する工程、これら着色層の上に酸化インジ
ウム錫を成膜し、透明電極層を形成する工程等からな
る。2. Description of the Related Art For example, the manufacturing process of a color filter is as follows.
A process of forming chromium on a glass substrate by using a vacuum film forming method, applying a photoresist and arranging a photomask, exposing, developing, chromium etching, removing the photoresist to form a stripe pattern or a lattice pattern, etc. Forming a black light-shielding layer, applying a photosensitive material for coloring from above the black light-shielding layer, arranging a photomask and exposing, developing and forming a colored pattern, and forming this colored pattern as R, G, The method includes a step of repeatedly forming a plurality of colored layers for the B3 color, a step of forming indium tin oxide on these colored layers, and forming a transparent electrode layer.
【０００３】上記着色用感材の塗布装置としてダイコー
トヘッドやカーテンコートヘッド等に見られるように液
吐出スリットから加圧された液を押し出して基板上にコ
ーティングする方式が知られている。この方式の従来の
塗布液供給装置を図２により説明する。[0003] As a coating apparatus for the coloring light-sensitive material, a system is known in which a pressurized liquid is extruded from a liquid discharge slit and coated on a substrate as seen in a die coat head, a curtain coat head and the like. A conventional coating liquid supply device of this type will be described with reference to FIG.
【０００４】図２（Ａ）において、基板１の下面には塗
布ヘッド２が設置され、基板１と塗布装置２は図示矢印
Ｘ方向に相対移動される。塗布ヘッド２には、塗布液タ
ンク３、ポンプＰ、フィルタＦを介して塗布液が供給さ
れる。ポンプＰは、チューブポンプ、ダイヤフラムポン
プ、シリンジポンプ等の精密吐出ポンプであり、電磁弁
Ｖ１が開き、Ｖ２が閉じることにより液を吸入し、電磁
弁Ｖ１が閉じ、Ｖ２が開くことにより液を吐き出すよう
に制御され、基板１上に厚さ数μｍの薄膜が塗布され
る。In FIG. 2A, a coating head 2 is provided on the lower surface of a substrate 1, and the substrate 1 and the coating device 2 are relatively moved in the direction of the arrow X in the drawing. The coating liquid is supplied to the coating head 2 via a coating liquid tank 3, a pump P, and a filter F. The pump P is a precision discharge pump such as a tube pump, a diaphragm pump, a syringe pump, etc., which sucks liquid when the solenoid valve V1 opens and V2 closes, and discharges liquid when the solenoid valve V1 closes and V2 opens. In this manner, a thin film having a thickness of several μm is applied on the substrate 1.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来の塗布液供給装置においては、ポンプＰの吐出側にフ
ィルタＦを配置しているため、フィルタＦの目詰まりが
進行すると、塗布液の吐出タイミングが遅れたり、吐出
しの停止がきかなくなったり、全体の吐出量も少なくな
ってしまい、均一な薄膜の形成が困難になるという問題
を有している。また、図２（Ｂ）に示すように、ポンプ
Ｐの吸入側にフィルタＦを配置した場合、フィルタＦの
目詰まりが進行すると、吸入時にレスポンスが悪くなり
吐出量が変化するとともに、吸入時にフィルタＦ内部が
負圧になりキャビテーション効果により液中に気泡が発
生し、配管内にエアが発生してしまうという問題を有し
ている。However, in the above-mentioned conventional coating liquid supply apparatus, since the filter F is disposed on the discharge side of the pump P, when the clogging of the filter F progresses, the discharge timing of the coating liquid is increased. However, there is a problem that it becomes difficult to stop the discharge, that the discharge cannot be stopped, and that the entire discharge amount is reduced, so that it is difficult to form a uniform thin film. Further, as shown in FIG. 2B, when the filter F is disposed on the suction side of the pump P, if the filter F becomes clogged, the response becomes poor at the time of suction, the discharge amount changes, and the filter F at the time of suction. There is a problem in that the inside of F becomes negative pressure, bubbles are generated in the liquid due to the cavitation effect, and air is generated in the piping.
【０００６】本発明は、上記従来の問題を解決するもの
であって、吐出量のバラツキ、変動および気泡の発生を
抑え、均一な薄膜を形成することができる塗布液供給装
置を提供することを目的とする。An object of the present invention is to solve the above-mentioned conventional problems, and to provide a coating liquid supply apparatus capable of forming a uniform thin film while suppressing the variation and fluctuation of the discharge amount and the generation of bubbles. Aim.
【０００７】[0007]
【課題を解決するための手段】そのために本発明の塗布
液供給装置は、塗布液を塗布ヘッド９に供給するポンプ
Ｐと、ポンプの吸込側に接続される塗布液供給タンク５
およびフィルタＦを備え、前記塗布液供給タンク５は、
塗布液が供給される密閉構造の主タンク５ｄと、溶剤が
充填された副タンク５ｅからなり、該副タンクは底部が
連通する区画壁５ｇにより区画され、区画された一方の
空間が主タンクに連通され、他方の空間が大気に開放さ
れていることを特徴とする。なお、上記構成に付加した
番号は、本発明の理解を容易にするために図面と対比さ
せるものであり、これにより本発明の構成が何ら限定さ
れるものではない。For this purpose, a coating liquid supply apparatus according to the present invention comprises a pump P for supplying a coating liquid to a coating head 9 and a coating liquid supply tank 5 connected to a suction side of the pump.
And a filter F, and the coating liquid supply tank 5 includes:
A main tank 5d having a closed structure to which the coating liquid is supplied, and a sub-tank 5e filled with a solvent, the sub-tank is partitioned by a partition wall 5g whose bottom communicates with one another, and one of the partitioned spaces serves as the main tank. And the other space is open to the atmosphere. Note that the numbers added to the above configuration are compared with the drawings for easy understanding of the present invention, and the configuration of the present invention is not limited by this.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しつつ説明する。図１は、本発明の塗布液供給装
置の１実施形態を示す構成図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing one embodiment of a coating liquid supply device of the present invention.
【０００９】ポンプＰの吸込側は、バルブＶ１を介して
塗布液供給タンク５に接続され、塗布液供給タンク５は
フィルタＦを介して貯留タンク６、７に接続されてい
る。また、ポンプＰの吐出側は、バルブＶ２を介して塗
布ヘッド９に接続され、塗布ヘッド９はバルブＶ３を介
して廃液タンク１０に接続されている。The suction side of the pump P is connected to a coating liquid supply tank 5 via a valve V1, and the coating liquid supply tank 5 is connected to storage tanks 6 and 7 via a filter F. The discharge side of the pump P is connected to a coating head 9 via a valve V2, and the coating head 9 is connected to a waste liquid tank 10 via a valve V3.
【００１０】塗布液供給タンク５は、密閉されたタンク
本体５ａを備え、タンク本体５ａの底壁には上部に連通
路５ｂを有する仕切り壁５ｃが立設され、これにより主
タンク５ｄと副タンク５ｅが形成されている。また、副
タンク５ｅの上壁には下部に連通路５ｆを有する区画壁
５ｇが形成され、区画壁５ｇで区画された一方の空間
は、バルブＶ４を介して大気に開放可能にされ、他方の
空間は主タンク５ｄの上部に連通されている。そして、
主タンク５ｄ内には塗布液が供給され、副タンク５ｅ内
には塗布液の溶剤が充填されている。The coating liquid supply tank 5 has a closed tank body 5a, and a partition wall 5c having a communication passage 5b is provided upright on the bottom wall of the tank body 5a. 5e are formed. In addition, a partition wall 5g having a communication passage 5f at the lower portion is formed on the upper wall of the sub tank 5e, and one space defined by the partition wall 5g can be opened to the atmosphere via a valve V4, and the other space can be opened. The space communicates with the upper part of the main tank 5d. And
The main tank 5d is supplied with a coating liquid, and the sub tank 5e is filled with a solvent for the coating liquid.
【００１１】バルブＶ１〜Ｖ４およびその他のバルブ
は、電磁弁ユニット１１により開閉駆動される。電磁弁
ユニット１１内には複数の電磁弁〜が備えられ、制
御装置１２およびポンプコントローラ１３の制御信号に
より各バルブへのエアの供給、遮断を図ることにより、
各バルブの開閉を制御している。また、主タンク５ｄに
は液面センサ１４が設けられ、センサ１４からの信号に
より制御装置１２は、バルブＶ７を制御し、主タンク５
ｄへの塗布液供給を行う。また、貯留タンク６、７の下
部には重量センサ（図示せず）が設けられており、先に
使用していた貯留タンクが空になった場合に信号を出力
し、制御装置１２は自動的にバルブＶ５、Ｖ６を制御し
貯留タンク６、７の切り替えを行う。また、ポンプＰに
は圧力センサ１５が設けられ、このセンサからの信号は
ポンプコントローラ１３によりドライバー１６に送ら
れ、ポンプの過負荷防止を検出するようにしている。The valves V1 to V4 and other valves are driven to open and close by an electromagnetic valve unit 11. The electromagnetic valve unit 11 is provided with a plurality of electromagnetic valves to supply and shut off air to each valve by control signals of the control device 12 and the pump controller 13.
Controls the opening and closing of each valve. Further, a liquid level sensor 14 is provided in the main tank 5d, and the control device 12 controls the valve V7 based on a signal from the sensor 14, and
The application liquid is supplied to d. A weight sensor (not shown) is provided below the storage tanks 6 and 7, and outputs a signal when the previously used storage tank becomes empty, and the control device 12 automatically operates. Then, the valves V5 and V6 are controlled to switch the storage tanks 6 and 7. Further, the pump P is provided with a pressure sensor 15, and a signal from this sensor is sent to a driver 16 by a pump controller 13 so as to detect the overload prevention of the pump.
【００１２】上記構成からなる本発明の作用について説
明する。ポンプＰは、バルブＶ１が開き、Ｖ２が閉じる
ことにより塗布液供給タンク５の主タンク５ｄから塗布
液を吸入し、バルブＶ１が閉じ、Ｖ２が開くことにより
塗布液を塗布ヘッド９側に吐き出すように制御される。
このとき、主タンク５ｄは、副タンク５ｅ内の溶剤を介
して大気に連通されているため、塗布液内にごみや異物
が入ることがなく、フィルタＦを塗布液供給タンク５の
上流側に設けることができる。The operation of the present invention having the above configuration will be described. The pump P sucks the coating liquid from the main tank 5d of the coating liquid supply tank 5 by opening the valve V1 and closing V2, and discharges the coating liquid to the coating head 9 side by closing the valve V1 and opening V2. Is controlled.
At this time, since the main tank 5d is communicated with the atmosphere via the solvent in the sub tank 5e, no dirt or foreign matter enters the application liquid, and the filter F is moved upstream of the application liquid supply tank 5. Can be provided.
【００１３】なお、本発明は上記実施形態に限定される
ものではなく種々の変更が可能である。例えば、上記実
施形態においては、主タンク５ｄと副タンク５ｅを一体
に形成しているが、主タンク５ｄと副タンク５ｅを別体
に配置するようにしてもよい。Note that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above embodiment, the main tank 5d and the sub tank 5e are formed integrally, but the main tank 5d and the sub tank 5e may be arranged separately.
【００１４】[0014]
【発明の効果】以上の説明から明らかなように本発明に
よれば、フィルタの目詰まりに起因する吐出量のバラツ
キ、変動および気泡の発生を抑え、均一な薄膜を形成す
ることができる。また、フィルタの交換寿命を従来の３
〜１０倍に延ばすことが可能となる。As is apparent from the above description, according to the present invention, it is possible to suppress the variation and fluctuation of the discharge amount and the generation of bubbles due to the clogging of the filter, and to form a uniform thin film. In addition, the replacement life of the filter is
It becomes possible to extend it up to 10 times.
【図１】本発明の塗布液供給装置の１実施形態を示す構
成図である。FIG. 1 is a configuration diagram showing one embodiment of a coating liquid supply device of the present invention.
【図２】従来の塗布液供給装置を示す図である。FIG. 2 is a diagram showing a conventional coating liquid supply device.
Ｐ…ポンプ Ｆ…フィルタ ５…塗布液供給タンク ５ｄ…主タンク ５ｅ…副タンク ５ｇ…区画壁 ９…塗布ヘッド P: pump F: filter 5: coating liquid supply tank 5d: main tank 5e: sub-tank 5g: partition wall 9: coating head
Claims (1)
ポンプの吸込側に接続される塗布液供給タンクおよびフ
ィルタを備え、前記塗布液供給タンクは、塗布液が供給
される密閉構造の主タンクと、溶剤が充填された副タン
クからなり、該副タンクは底部が連通する区画壁により
区画され、区画された一方の空間が主タンクに連通さ
れ、他方の空間が大気に開放されていることを特徴とす
る塗布液供給装置。A pump for supplying a coating liquid to a coating head;
A coating liquid supply tank and a filter connected to the suction side of the pump, wherein the coating liquid supply tank comprises a main tank having a closed structure to which the coating liquid is supplied, and a sub tank filled with a solvent; Is a coating liquid supply device defined by a partition wall that communicates with the bottom, one of the partitioned spaces is connected to the main tank, and the other space is open to the atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16058799A JP4349536B2 (en) | 1999-06-08 | 1999-06-08 | Coating liquid supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16058799A JP4349536B2 (en) | 1999-06-08 | 1999-06-08 | Coating liquid supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000343026A true JP2000343026A (en) | 2000-12-12 |
| JP4349536B2 JP4349536B2 (en) | 2009-10-21 |
Family
ID=15718190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16058799A Expired - Fee Related JP4349536B2 (en) | 1999-06-08 | 1999-06-08 | Coating liquid supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4349536B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005052717A (en) * | 2003-08-01 | 2005-03-03 | Toppan Printing Co Ltd | Coating solution supply device |
| JP2008053689A (en) * | 2006-07-26 | 2008-03-06 | Shibaura Mechatronics Corp | Apparatus of processing substrate |
| KR101010253B1 (en) | 2002-10-23 | 2011-01-21 | 도판 인사츠 가부시키가이샤 | Coating liquid supply device and slit coat type coating apparatus with the same |
-
1999
- 1999-06-08 JP JP16058799A patent/JP4349536B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101010253B1 (en) | 2002-10-23 | 2011-01-21 | 도판 인사츠 가부시키가이샤 | Coating liquid supply device and slit coat type coating apparatus with the same |
| JP2005052717A (en) * | 2003-08-01 | 2005-03-03 | Toppan Printing Co Ltd | Coating solution supply device |
| JP4506122B2 (en) * | 2003-08-01 | 2010-07-21 | 凸版印刷株式会社 | Coating liquid supply device |
| JP2008053689A (en) * | 2006-07-26 | 2008-03-06 | Shibaura Mechatronics Corp | Apparatus of processing substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4349536B2 (en) | 2009-10-21 |
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