JP2000336274A5 - - Google Patents

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Publication number
JP2000336274A5
JP2000336274A5 JP1999148881A JP14888199A JP2000336274A5 JP 2000336274 A5 JP2000336274 A5 JP 2000336274A5 JP 1999148881 A JP1999148881 A JP 1999148881A JP 14888199 A JP14888199 A JP 14888199A JP 2000336274 A5 JP2000336274 A5 JP 2000336274A5
Authority
JP
Japan
Prior art keywords
mass
content
amount
resin composition
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999148881A
Other languages
Japanese (ja)
Other versions
JP2000336274A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP14888199A priority Critical patent/JP2000336274A/en
Priority claimed from JP14888199A external-priority patent/JP2000336274A/en
Publication of JP2000336274A publication Critical patent/JP2000336274A/en
Publication of JP2000336274A5 publication Critical patent/JP2000336274A5/ja
Pending legal-status Critical Current

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Description

【請求項６】
（Ｒ）または（Ｒ）の硬化前駆体に請求項１〜５いずれか記載の組成物を（Ｕ）の含量が０．０５〜１質量％となる量含有させてなる樹脂配合物。
6.
A resin composition comprising (R) or the curing precursor of (R) and the composition according to any one of claims 1 to 5 in an amount such that the content of (U) is 0.05 to 1% by mass.

JP14888199A 1999-05-27 1999-05-27 Modifier composition for resin molded article and resin molded article Pending JP2000336274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14888199A JP2000336274A (en) 1999-05-27 1999-05-27 Modifier composition for resin molded article and resin molded article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14888199A JP2000336274A (en) 1999-05-27 1999-05-27 Modifier composition for resin molded article and resin molded article

Publications (2)

Publication Number Publication Date
JP2000336274A JP2000336274A (en) 2000-12-05
JP2000336274A5 true JP2000336274A5 (en) 2006-07-06

Family

ID=15462816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14888199A Pending JP2000336274A (en) 1999-05-27 1999-05-27 Modifier composition for resin molded article and resin molded article

Country Status (1)

Country Link
JP (1) JP2000336274A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10152228A1 (en) * 2001-10-20 2003-05-08 Clariant Gmbh Mixtures of waxes and polymer additives
JP5098002B2 (en) * 2005-09-28 2012-12-12 北川工業株式会社 Urethane resin material and heat conductive material
JP2008063588A (en) * 2007-11-26 2008-03-21 Tosoh Corp Chloroprene rubber

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2831815B2 (en) * 1990-07-13 1998-12-02 東燃化学株式会社 Antimicrobial polyolefin composition
JPH05222312A (en) * 1992-02-12 1993-08-31 Sanyo Kako Kk Pigment composition for thermoplastic synthetic resin
JP3052038B2 (en) * 1993-06-30 2000-06-12 出光石油化学株式会社 Resin composition for plating, method for plating molded article, and plated molded article

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