JP2000334590A - Machining head for laser beam machine - Google Patents
Machining head for laser beam machineInfo
- Publication number
- JP2000334590A JP2000334590A JP11143286A JP14328699A JP2000334590A JP 2000334590 A JP2000334590 A JP 2000334590A JP 11143286 A JP11143286 A JP 11143286A JP 14328699 A JP14328699 A JP 14328699A JP 2000334590 A JP2000334590 A JP 2000334590A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- laser
- processing apparatus
- processing head
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はレーザ加工装置に関
する。[0001] The present invention relates to a laser processing apparatus.
【０００２】[0002]
【従来の技術】例えば、特開昭６２−２１４９３号公報
の図１に示される様に、従来のレーザ加工装置において
は、レーザ発振器からのレーザ光（ＬＢ）は、被加工物
（Ｗ）の直前で集光レンズ（１７）で集光され、被加工
物（Ｗ）上に焦点が来るように調整する。2. Description of the Related Art For example, as shown in FIG. 1 of Japanese Unexamined Patent Publication No. 62-21493, in a conventional laser processing apparatus, a laser beam (LB) from a laser oscillator emits a laser beam (LB) of a workpiece (W). Immediately before, the light is condensed by the condenser lens (17) and adjusted so that the focal point comes on the workpiece (W).
【０００３】上述の如く、集光レンズ（１７）で集光す
る場合、被加工物（Ｗ）上面から焦点が多少とも上下に
ずれると、焦点深度が浅いので集光スポット径が変化し
て加工能力が低下することになる。As described above, when the light is condensed by the condensing lens (17), if the focal point deviates somewhat upward or downward from the upper surface of the workpiece (W), the focal spot diameter changes because the focal depth is small because the focal depth is small. The ability will be reduced.
【０００４】従って、三次元的な形状を有する被加工物
（Ｗ）の加工を行う場合、常に被加工物上に焦点が来る
ように集光レンズ（１７）の位置を制御する必要があ
る。Therefore, when processing a workpiece (W) having a three-dimensional shape, it is necessary to control the position of the condenser lens (17) so that the focal point always comes on the workpiece.
【０００５】[0005]
【発明が解決しようとする課題】上述の如く、集光レン
ズでレーザ光を集光して加工を行うレーザ加工装置にお
いては、焦点位置に対する上下方向の位置的余裕が小さ
いため、一般的には加工ヘッドに設けられる集光レンズ
の三次元的位置制御なしに三次元的形状を有する物体の
加工を行うのは難しい。As described above, in a laser processing apparatus that performs processing by condensing laser light with a condensing lens, since a vertical position margin with respect to a focal position is small, generally a laser processing apparatus is generally used. It is difficult to process an object having a three-dimensional shape without controlling the three-dimensional position of the condenser lens provided in the processing head.
【０００６】本発明は上述の如き問題を解決するために
成されたものであり、本発明の課題は、焦点位置に対す
る上下方向の位置的余裕を大きくでき、高さの相違する
三次元的形状を有する被加工材を容易に加工できるレー
ザ加工装置を提供することである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to increase the vertical position margin with respect to the focal position, and to provide a three-dimensional shape having different heights. An object of the present invention is to provide a laser processing apparatus capable of easily processing a workpiece having a laser beam.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決する手段
として請求項１に記載のレーザ加工装置の加工ヘッド
は、被加工材へレーザ光を集光照射するレーザ加工装置
の加工ヘッドにして、前記加工ヘッドの底部にレーザ光
が入射する集光レンズを設け、該集光レンズを境界にし
て集光レンズの下方にレーザ光を透過する高圧な液体を
被加工材表面へ液体ビームとして噴射する液体噴射ノズ
ルを設けたことを要旨とするものである。According to a first aspect of the present invention, there is provided a laser processing apparatus, comprising: a laser processing apparatus configured to collect a laser beam onto a workpiece; A condensing lens into which laser light is incident is provided at the bottom of the processing head, and a high-pressure liquid that transmits the laser light with the condensing lens as a boundary and below the condensing lens is jetted as a liquid beam onto the surface of the workpiece. The gist is to provide a liquid ejection nozzle.
【０００８】請求項２に記載のレーザ加工装置の加工ヘ
ッドは、請求項１に記載のレーザ加工装置の加工ヘッド
において、前記液体噴射ノズルの噴射口に直線的液体ガ
イド部を設けたこと要旨とするものである。According to a second aspect of the present invention, there is provided a processing head of a laser processing apparatus according to the first aspect, wherein a linear liquid guide portion is provided at an ejection opening of the liquid ejection nozzle. Is what you do.
【０００９】請求項３に記載のレーザ加工装置の加工ヘ
ッドは、請求項２に記載のレーザ加工装置の加工ヘッド
において、前記液体噴射ノズルの噴射口と同軸の気体噴
射口を備えた気体噴射ノズルを液体噴射ノズルの外側に
設けたことを要旨とするものである。According to a third aspect of the present invention, there is provided a processing head of a laser processing apparatus according to the second aspect, wherein the processing head of the laser processing apparatus has a gas injection port coaxial with an injection port of the liquid injection nozzle. Is provided outside the liquid jet nozzle.
【００１０】請求項４に記載のレーザ加工装置の加工ヘ
ッドは、請求項１、請求項２、または請求項３に記載の
レーザ加工装置の加工ヘッドにおいて、前記液体が水で
あることを要旨とするものである。According to a fourth aspect of the present invention, in the processing head of the laser processing apparatus according to the first, second, or third aspect, the liquid is water. Is what you do.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態を図面
によって説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１２】図１は本発明に係るレーザ加工装置の加工
ヘッドを示す図である。なお、レーザ加工装置の全体の
構成は周知のものと同様であるので図示省略してある。FIG. 1 is a view showing a processing head of a laser processing apparatus according to the present invention. The overall configuration of the laser processing apparatus is the same as that of a known laser processing apparatus, and is not shown.
【００１３】加工ヘッド１には中空筒状のレンズホルダ
ー２の底部にレーザ光３が入射する集光レンズ１１が設
けてある。この集光レンズ１１を境界にして集光レンズ
１１の下方には、レーザ光３に対して透明な液体を液体
ビーム７として被加工材６へ高圧で噴射する液体噴射ノ
ズル８が設けてある。The processing head 1 is provided with a condenser lens 11 on which a laser beam 3 is incident on the bottom of a hollow cylindrical lens holder 2. Below the condenser lens 11 with the condenser lens 11 as a boundary, there is provided a liquid ejecting nozzle 8 for ejecting a liquid transparent to the laser beam 3 as a liquid beam 7 to the workpiece 6 at a high pressure.
【００１４】上述の液体５には、実施例では水を使用し
ているが、レーザ光に対して透明な液体ならば使用する
ことが可能であり、例えばシリコンオイルなどを使用す
ることも可能である。In the embodiment, water is used as the liquid 5 described above. However, any liquid that is transparent to laser light can be used. For example, silicon oil or the like can be used. is there.
【００１５】上述の液体噴射ノズル８の形状は下方に凸
の漏斗状になっており、水５噴出する噴出口９には、同
径の直線部からなる液体ガイド部１０を設け、ここから
噴出する水５が柱状の液体ビーム７を維持しやすくして
ある。The above-mentioned liquid jet nozzle 8 has a funnel shape which is convex downward, and a jet port 9 for jetting water 5 is provided with a liquid guide portion 10 having a straight portion having the same diameter, from which jetting is performed. The generated water 5 makes it easier to maintain the columnar liquid beam 7.
【００１６】また、液体噴射ノズル８は、レンズホルダ
ー２の外周に設けたノズルホルダー１２に一体的に取付
けてあり、ノズルホルダー１２に設けた管路１３から適
宜な流量の水５が供給される様に設けてある。また、前
記加工ヘッド１は、図示省略のＸＹ座標位置決め装置に
より被加工材６の所望の位置に位置決めできる様に設け
てある。The liquid ejecting nozzle 8 is integrally attached to a nozzle holder 12 provided on the outer periphery of the lens holder 2, and an appropriate flow rate of water 5 is supplied from a conduit 13 provided in the nozzle holder 12. It is provided as follows. The processing head 1 is provided so that it can be positioned at a desired position on the workpiece 6 by an XY coordinate positioning device (not shown).
【００１７】上記構成の加工ヘッド１において、漏斗状
の液体噴射ノズル８へ高圧な水５を供給すると、水５は
液体噴射ノズル８の噴出口９から液体ビーム７となって
流出する。液体噴射ノズル８から水５が液体ビーム７と
なって流出している状態において、加工ヘッド１に導か
れたレーザ光３を前記集光レンズ１１によって、前記液
体ビーム７内に入射する。When the high-pressure water 5 is supplied to the funnel-shaped liquid jet nozzle 8 in the processing head 1 having the above structure, the water 5 flows out from the jet port 9 of the liquid jet nozzle 8 as a liquid beam 7. In a state where the water 5 flows out of the liquid jet nozzle 8 as the liquid beam 7, the laser beam 3 guided to the processing head 1 is incident on the liquid beam 7 by the condenser lens 11.
【００１８】水５の屈折率は空気より大きいので、液体
ビーム７の側壁に当たったレーザ光３は全反射を繰り返
しながら液体ビーム７の下方に進行し、加工ヘッド１の
下方に設置した被加工材６まで導かれる。Since the refractive index of the water 5 is larger than that of the air, the laser beam 3 hitting the side wall of the liquid beam 7 travels below the liquid beam 7 while repeating total reflection, and the workpiece 5 installed below the processing head 1 It is led to material 6.
【００１９】また、液体ビーム７は容易に拡散しないの
で、上下方向に高さの異なる被加工材でも加工ヘッド１
を高さの変化に合わせて上下させなくても容易にレーザ
加工を行うことができる。Further, since the liquid beam 7 is not easily diffused, even if the workpieces have different heights in the vertical direction, the processing head 1 can be used.
The laser processing can be easily performed without raising and lowering according to the change in height.
【００２０】図２は本発明に係るレーザ加工装置の加工
ヘッド１の別の形態を示すもので、主たる構成は図１の
例と同一であり、同一の部品には同一の符号を付してそ
の説明を省略する。FIG. 2 shows another embodiment of the processing head 1 of the laser processing apparatus according to the present invention. The main structure is the same as that of the example of FIG. 1, and the same parts are denoted by the same reference numerals. The description is omitted.
【００２１】加工ヘッド２０は、前記液体ビーム７の外
側に液体ビーム７と同軸に高圧のガス２１を流す様にし
たものであり、前記漏斗状の液体噴射ノズル８の外側に
同軸にガス噴射用のガスノズル２３を設けてある。The processing head 20 is adapted to flow a high-pressure gas 21 coaxially with the liquid beam 7 outside the liquid beam 7, and coaxially with a gas injection nozzle outside the funnel-shaped liquid injection nozzle 8. Gas nozzle 23 is provided.
【００２２】噴射用のガスには、例えば窒素、アルゴン
などの不活性ガス、または酸素、空気などの活性ガスを
目的に合わせて使用することができる。As the gas for injection, an inert gas such as nitrogen or argon, or an active gas such as oxygen or air can be used according to the purpose.
【００２３】図２に示す様に、ガスノズル２３は前記ノ
ズルホルダー１３の外側に設けたノズルホルダー２５に
設けてあり、管路２７を介してガスノズル２３に供給さ
れたガス２１が、ガスノズル２３の環状の噴射口２９か
ら液体ビーム７と同軸に噴射され、液体ビーム７の周囲
はガス２１で包囲された状態となる。As shown in FIG. 2, the gas nozzle 23 is provided on a nozzle holder 25 provided outside the nozzle holder 13, and the gas 21 supplied to the gas nozzle 23 through a pipe 27 is formed in a circular shape of the gas nozzle 23. Is ejected coaxially with the liquid beam 7 from the ejection port 29 of the liquid crystal 7, and the periphery of the liquid beam 7 is surrounded by the gas 21.
【００２４】従って、液体ビーム７はガス２１で広がり
を押さえられるので、液体ビーム７の距離をより長くす
ることができる。また、ガスはレーザ加工時のアシスト
ガスとしての役目もなすものである。Therefore, the spread of the liquid beam 7 is suppressed by the gas 21, so that the distance of the liquid beam 7 can be made longer. The gas also serves as an assist gas during laser processing.
【００２５】[0025]
【発明の効果】請求項１または請求項２の発明によれ
ば、焦点位置に対する上下方向の位置的余裕が大きいの
で高さの相違する三次元的形状を有する被加工材を容易
に加工できる。According to the first or second aspect of the present invention, since there is a large positional margin in the vertical direction with respect to the focal position, it is possible to easily process workpieces having three-dimensional shapes having different heights.
【００２６】請求項３の発明によれば、液体ビームの周
囲が高圧ガス流で包囲されるので液体ビームの拡散が押
さえられより安定した加工ができる。According to the third aspect of the present invention, since the periphery of the liquid beam is surrounded by the high-pressure gas flow, diffusion of the liquid beam is suppressed, and more stable processing can be performed.
【００２７】請求項４の発明によれば、液体ビームの液
体に水を使用しているので、コストが安価であると共に
取扱いが簡単である。According to the fourth aspect of the present invention, since water is used as the liquid of the liquid beam, the cost is low and the handling is simple.
【図１】本発明に係わるレーザ加工装置の加工ヘッドの
説明図。FIG. 1 is an explanatory view of a processing head of a laser processing apparatus according to the present invention.
【図２】本発明に係わるレーザ加工装置の加工ヘッドの
別の実施例の説明図。FIG. 2 is an explanatory view of another embodiment of the processing head of the laser processing apparatus according to the present invention.
１、２０ 加工ヘッド ２ レンズホルダー ３ レーザ光 ５ 液体 ６ 被加工材 ７ 液体ビーム ８ 液体噴射ノズル ９ 、２９ 噴出口 １０ 液体ガイド部 １１ 集光レンズ １２ ノズルホルダー １３、２７ 管路 ２１ ガス ２３ ガスノズル ２５ ノズルホルダー DESCRIPTION OF SYMBOLS 1, 20 Processing head 2 Lens holder 3 Laser beam 5 Liquid 6 Workpiece 7 Liquid beam 8 Liquid ejection nozzle 9, 29 Spout port 10 Liquid guide part 11 Condensing lens 12 Nozzle holder 13, 27 Pipe line 21 Gas 23 Gas nozzle 25 Nozzle holder
Claims (4)
ザ加工装置の加工ヘッドにして、前記加工ヘッドの底部
にレーザ光が入射する集光レンズを設け、該集光レンズ
を境界にして集光レンズの下方にレーザ光を透過する高
圧な液体を被加工材表面へ液体ビームとして噴射する液
体噴射ノズルを設けたことを特徴とするレーザ加工装置
の加工ヘッド。1. A processing head of a laser processing apparatus for condensing and irradiating a laser beam onto a workpiece, a condensing lens for entering a laser beam at a bottom portion of the processing head, and using the condensing lens as a boundary. A processing head of a laser processing apparatus, further comprising a liquid jet nozzle for jetting a high-pressure liquid transmitting laser light to a surface of a workpiece as a liquid beam below a condenser lens.
体ガイド部を設けたことを特徴とする請求項１に記載の
レーザ加工装置の加工ヘッド。2. The processing head of a laser processing apparatus according to claim 1, wherein a linear liquid guide portion is provided at an ejection port of the liquid ejection nozzle.
体噴射口を備えた気体噴射ノズルを液体噴射ノズルの外
側に設けたことを特徴とする請求項２に記載のレーザ加
工装置の加工ヘッド。3. The processing head of a laser processing apparatus according to claim 2, wherein a gas injection nozzle having a gas injection port coaxial with an injection port of the liquid injection nozzle is provided outside the liquid injection nozzle. .
求項１、請求項２、または請求項３に記載のレーザ加工
装置の加工ヘッド。4. The processing head of a laser processing apparatus according to claim 1, wherein the liquid is water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11143286A JP2000334590A (en) | 1999-05-24 | 1999-05-24 | Machining head for laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11143286A JP2000334590A (en) | 1999-05-24 | 1999-05-24 | Machining head for laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000334590A true JP2000334590A (en) | 2000-12-05 |
Family
ID=15335207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11143286A Pending JP2000334590A (en) | 1999-05-24 | 1999-05-24 | Machining head for laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000334590A (en) |
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-
1999
- 1999-05-24 JP JP11143286A patent/JP2000334590A/en active Pending
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