JP2000317813A - Sheet type polishing machine - Google Patents
Sheet type polishing machineInfo
- Publication number
- JP2000317813A JP2000317813A JP13098899A JP13098899A JP2000317813A JP 2000317813 A JP2000317813 A JP 2000317813A JP 13098899 A JP13098899 A JP 13098899A JP 13098899 A JP13098899 A JP 13098899A JP 2000317813 A JP2000317813 A JP 2000317813A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- work
- polishing
- joined
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は枚葉式研磨機に関
し、特に板状ワークがこれを挟持する研磨パッド間へ円
滑に進入するようにした研磨機の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single-wafer polishing machine, and more particularly to a structure of a polishing machine in which a plate-like work smoothly enters between polishing pads sandwiching the same.
【０００２】[0002]
【従来の技術】図３〜図５に従来の枚葉式研磨機の一例
を示す。各図において、円形の定盤１Ａ，１Ｂが所定の
間隙で対向して設けられており、各定盤１Ａ，１Ｂは背
面中心の回転軸１１，１２に支持されて図３の矢印で示
すように同方向へ回転している。定盤１Ａ，１Ｂの対向
面には凹状となった内周部１３，１４（図４）を除いて
研磨パッド２が接合されており、研磨パッド２間にガラ
ス基板等の円環状の板状ワークＷがその略上半部を挟持
されている。上記板状ワークＷは外周を二ヶ所でローラ
３１，３２（図５）によって支持されており、定盤１
Ａ，１Ｂの回転方向とは反対方向へ図５の矢印のように
回転させられて、板状ワークＷの板面が順次研磨パッド
２間に進入する。これにより、研磨パッド２が板状ワー
クＷの板面各部を交差方向へ相対移動してワーク板面が
均一に研磨される。2. Description of the Related Art FIGS. 3 to 5 show an example of a conventional single-wafer polishing machine. In each figure, circular surface plates 1A and 1B are provided to face each other with a predetermined gap, and each of the surface plates 1A and 1B is supported by rotating shafts 11 and 12 at the center of the back surface, as shown by arrows in FIG. In the same direction. The polishing pads 2 are joined to the opposing surfaces of the surface plates 1A and 1B except for the concave inner peripheral portions 13 and 14 (FIG. 4). The work W is clamped substantially at its upper half. The plate-shaped work W is supported by rollers 31 and 32 (FIG. 5) at two places on the outer periphery.
The plate-like work W is rotated in the direction opposite to the rotation directions of A and 1B as shown by the arrow in FIG. As a result, the polishing pad 2 relatively moves in the intersecting direction on each part of the plate surface of the plate-shaped work W, and the work plate surface is uniformly polished.
【０００３】[0003]
【発明が解決しようとする課題】ところで、板状ワーク
Ｗが研磨パッド２の間に進入する際の抵抗を軽減して円
滑な進入を可能とすることにより、板状ワークＷの表面
に研磨時に生じる傷を最小限にするため、従来、図６に
示すように各研磨パッド２の外周部を、対向する内方へ
傾斜する傾斜面２１としてある。この傾斜面２１は、研
磨パッド２を原材から円形に切り出して定盤１Ａ，１Ｂ
に接合した後にその外周部をカッタで斜めに切除するこ
とによって形成される。ところが、研磨パッドは厚さ１
mm程度の薄いものであるため切除の際の角度を確実に定
めることが困難であり、傾斜面２１の形成に難渋すると
ともに、傾斜面２１の角度が定盤１Ａ，１Ｂの各部で、
あるいは定盤１Ａ，１Ｂ毎にバラツクため板状ワークＷ
が研磨パッド２間へ進入する際の円滑さが部分的に損な
われるという問題があった。By reducing the resistance when the plate-like work W enters the space between the polishing pads 2 and enabling the plate-like work W to smoothly enter, the surface of the plate-like work W can be polished during polishing. Conventionally, as shown in FIG. 6, the outer peripheral portion of each polishing pad 2 is formed as an inclined surface 21 which is inclined inward and opposed to each other in order to minimize the generated scratches. This inclined surface 21 is obtained by cutting the polishing pad 2 from the raw material into a circle and forming the platens 1A and 1B.
After joining, the outer peripheral portion is formed by cutting obliquely with a cutter. However, the polishing pad has a thickness of 1
It is difficult to reliably determine the angle at the time of resection because it is a thin material of about mm, and it is difficult to form the inclined surface 21, and the angle of the inclined surface 21 is set at each part of the surface plates 1 </ b> A and 1 </ b> B.
Alternatively, a plate-like work W is used for dispersion of the platens 1A and 1B.
However, there is a problem in that the smoothness when entering between the polishing pads 2 is partially lost.
【０００４】そこで本発明はこのような課題を解決する
もので、研磨パッドの外周部を均一かつ適正に傾斜させ
ることができ、研磨時における研磨パッド間への板状ワ
ークの円滑な進入を可能とした枚葉式研磨機を提供する
ことを目的とする。Accordingly, the present invention has been made to solve such a problem, and can uniformly and appropriately incline the outer peripheral portion of a polishing pad so that a plate-like work can smoothly enter between polishing pads during polishing. It is an object of the present invention to provide a single-wafer polishing machine.
【０００５】[0005]
【課題を解決するための手段】本第１発明では、回転す
る一対の定盤（１Ａ，１Ｂ）の対向面にそれぞれ接合さ
れた一定厚の研磨パッド（２）で板状ワーク（Ｗ）の一
部を両面から挟んで研磨する枚葉式研磨機において、各
定盤（１Ａ，１Ｂ）の対向面の外周縁（１５，１６）
を、外方へ向かうにつれて漸次互いに離間する方向へ湾
曲する曲面となすとともに、上記研磨パッド（２）の外
周縁（２１）を上記曲面に沿ってこれに接合する。According to the first aspect of the present invention, a plate-like work (W) is fixed by a polishing pad (2) having a constant thickness, which is respectively joined to opposing surfaces of a pair of rotating platens (1A, 1B). In a single-wafer polishing machine in which a part is sandwiched between both surfaces, an outer peripheral edge (15, 16) of a facing surface of each platen (1A, 1B).
Is formed into a curved surface that gradually curves outwardly away from each other and the outer peripheral edge (21) of the polishing pad (2) is joined to the polishing pad (2) along the curved surface.
【０００６】本第１発明において、研磨パッド間に板状
ワークを挟持して研磨動作を行なうと、研磨パッド間へ
の板状ワークの進入は、研磨パッドの外周縁が滑らかな
曲面となって適正に傾斜していることによって、大きな
抵抗を生じることなく円滑に行なわれる。そして、上記
外周縁の曲面形状は定盤の全周で、あるいは全ての定盤
で適正に保たれているから、板状ワークの進入の円滑さ
が部分的に損なわれる等の不具合は生じない。この結
果、研磨時に板状ワークの板面に生じる傷を大幅に低減
することができる。In the first aspect of the present invention, when the polishing operation is performed by sandwiching the plate-like work between the polishing pads, the plate-like work enters between the polishing pads, and the outer peripheral edge of the polishing pad becomes a smooth curved surface. Proper tilting allows for smooth operation without significant resistance. Further, since the curved shape of the outer peripheral edge is properly maintained on the entire circumference of the surface plate or on all the surface plates, problems such as a partial impairment of the smoothness of the entry of the plate-like work do not occur. . As a result, scratches on the plate surface of the plate-like work during polishing can be significantly reduced.
【０００７】本第２発明では、上記各定盤（１Ａ，１
Ｂ）の対向面のうち凹状とした内周部（１３，１４）の
周壁（１７，１８）を、内方へ向かうにつれて漸次互い
に離間する方向へ湾曲する曲面となすとともに、研磨パ
ッド（２）の内周縁（２２）を上記曲面に沿ってこれに
接合する。In the second aspect of the present invention, each of the surface plates (1A, 1A)
The opposing surfaces of (B) are formed such that the peripheral walls (17, 18) of the concave inner peripheral portions (13, 14) are curved surfaces that gradually curve away from each other as they go inward, and the polishing pad (2). Is joined to this along the curved surface.
【０００８】本第２発明においては、研磨パッド間への
板状ワークの進入がさらに円滑に行なわれて、板状ワー
クに生じる傷をさらに少なくすることができる。[0008] In the second aspect of the present invention, the plate-like work can be more smoothly entered between the polishing pads, and the damage to the plate-like work can be further reduced.
【０００９】なお、上記カッコ内の符号は、後述する実
施形態に記載の具体的手段との対応関係を示すものであ
る。The reference numerals in parentheses indicate the correspondence with the specific means described in the embodiments described later.
【００１０】[0010]
【発明の実施の形態】図１には枚葉式研磨機の断面図を
示し、円形の定盤１Ａ，１Ｂが所定の間隙で対向して設
けられている。各定盤１Ａ，１Ｂは背面中心の回転軸１
１，１２に支持されて同方向へ回転している。定盤１
Ａ，１Ｂの対向面には凹状となった内周部１３，１４を
除いて円環状の研磨パッド２が接合されており、研磨パ
ッド２間にガラス基板等の円環状の板状ワークＷがその
略上半部を挟持されている。板状ワークＷは外周の二ヶ
所をローラ３１（一方のみ図示）で支持されており、定
盤１Ａ，１Ｂの回転方向とは反対方向へ回転させられ
て、板状ワークＷの板面が順次研磨パッド２間に進入す
る。これにより、研磨パッド２が板状ワークＷの板面各
部を交差方向へ相対移動してワーク板面が研磨される。FIG. 1 is a sectional view of a single-wafer polishing machine, in which circular platens 1A and 1B are provided facing each other at a predetermined gap. Each surface plate 1A, 1B is a rotating shaft 1 centered on the back.
It is supported by 1 and 12 and rotates in the same direction. Surface plate 1
An annular polishing pad 2 is joined to the opposing surfaces of A and 1B except for the concave inner peripheral portions 13 and 14, and an annular plate-like work W such as a glass substrate is interposed between the polishing pads 2. Its upper half is clamped. The plate-shaped work W is supported at two locations on the outer periphery by rollers 31 (only one is shown), and is rotated in a direction opposite to the rotation direction of the platens 1A and 1B, so that the plate surface of the plate-shaped work W is sequentially formed. It enters between the polishing pads 2. As a result, the polishing pad 2 relatively moves in the crossing direction on each part of the plate surface of the plate-shaped work W, and the work plate surface is polished.
【００１１】ここで、各定盤１Ａ，１Ｂは対向面の外周
縁１５，１６が砥石加工によって、外方へ向かうにつれ
て漸次互いに離間する方向へ湾曲する曲面としてあり、
対向面に接合された研磨パッド２はその外周縁２１が上
記曲面に沿って接合されている。その詳細を図２に示
す。図２において、定盤１Ａ，１Ｂの対向面外周縁１
５，１６は幅Ｌ1の間で、Ｌ2だけ互いに離間する方向へ
滑らかに湾曲する曲面となっており、この曲面上に一定
厚Ｄの研磨パッド２の外周縁２１が接合されて、板状ワ
ークＷに接する外周縁２１の表面は上記曲面に倣った滑
らかな曲面となっている。なお、上記Ｌ1，Ｌ2，Ｄの一
例はそれぞれ、Ｌ1＝５mm，Ｌ2＝０．５mm〜１mm，Ｄ＝
０．９５mm〜１mmである。Here, each of the surface plates 1A, 1B is a curved surface whose outer peripheral edges 15, 16 of the opposing surfaces are gradually curved away from each other as they go outward by grinding.
The outer peripheral edge 21 of the polishing pad 2 bonded to the facing surface is bonded along the curved surface. The details are shown in FIG. In FIG. 2, the outer peripheral edge 1 of the facing surfaces of the surface plates 1A and 1B
Reference numerals 5 and 16 each have a curved surface smoothly curved in a direction away from each other by L2 between the widths L1, and the outer peripheral edge 21 of the polishing pad 2 having a constant thickness D is joined to this curved surface to form a plate-like work. The surface of the outer peripheral edge 21 in contact with W is a smooth curved surface following the curved surface. Examples of L1, L2, and D are L1 = 5 mm, L2 = 0.5 mm to 1 mm, and D =
0.95 mm to 1 mm.
【００１２】また、本実施形態では、定盤１Ａ，１Ｂの
対向面のうち凹状とした内周部１３，１４(図１）の周
壁１７，１８も、上記外周縁１５，１６と同形の、内方
へ向かうにつれて漸次互いに離間する方向へ湾曲する曲
面としてあり、この曲面上に研磨パッド２の内周縁２２
が接合されてこれに倣った曲面となっている。Further, in the present embodiment, the peripheral walls 17, 18 of the concave inner peripheral portions 13, 14 (FIG. 1) of the opposing surfaces of the surface plates 1A, 1B also have the same shape as the outer peripheral edges 15, 16. The inner surface 22 of the polishing pad 2 has a curved surface that gradually curves in a direction away from each other as it goes inward.
Are joined to form a curved surface following this.
【００１３】このような研磨パッド２間に板状ワークＷ
の略上半部を挟持して、従来技術で既に説明したような
研磨動作を行なうと、研磨パッド２間への板状ワークＷ
の進入は、研磨パッド２の外周縁２１および内周縁２２
が滑らかな曲面となって適正に傾斜していることによ
り、大きな抵抗を生じることなく円滑に行なわれる。上
記外周縁２１および内周縁２２の曲面形状は定盤１Ａ，
１Ｂの全周で、あるいは全ての定盤１Ａ，１Ｂで適正に
保たれているから、板状ワークＷの進入の円滑さが部分
的に損なわれる等の不具合は生じない。A plate-like work W is placed between such polishing pads 2.
When the polishing operation as already described in the related art is performed while holding the substantially upper half of the workpiece, the plate-shaped work W between the polishing pads 2 is formed.
Of the polishing pad 2 by the outer peripheral edge 21 and the inner peripheral edge 22.
Is smoothly curved without generating a large resistance because it has a smooth curved surface and is appropriately inclined. The curved shape of the outer peripheral edge 21 and the inner peripheral edge 22 is a surface plate 1A,
Since it is properly maintained on the entire circumference of 1B or on all of the surface plates 1A and 1B, problems such as a partial impairment of the smoothness of the entry of the plate-like work W do not occur.
【００１４】そこで、以下の研磨条件で、本発明の研磨
機と、外周縁および内周縁を曲面形状としていない従来
の研磨機とで２．５インチのガラス基板を研磨した際の
ガラス表面に生じる、長さ２．５μm，幅０．４μm，深
さ１３nm程度の傷の数を比較すると、本発明では９個〜
１０個以下であり、従来の１８個〜２０個の約半分以下
に大きく減少する。Therefore, under the following polishing conditions, a 2.5-inch glass substrate is polished on a glass surface when the polishing machine of the present invention and a conventional polishing machine whose outer peripheral edge and inner peripheral edge are not curved are formed. Comparing the number of flaws with a length of about 2.5 μm, a width of about 0.4 μm, and a depth of about 13 nm, according to the present invention, 9 to
The number is 10 or less, which is greatly reduced to about half or less of the conventional 18 to 20 pieces.
【００１５】 研磨条件 定盤回転数 １０００ｒｐｍ 加工荷重 ５０ｇ／cm2 加工時間 ３０秒 研磨パッド ポリッシュ用研磨布 研磨剤 酸化セリウム 平均粒径１μm 研磨剤流量 ２００cc／min 研磨剤濃度 ５重量％Polishing conditions Surface plate rotation speed 1000 rpm Processing load 50 g / cm 2 Processing time 30 seconds Polishing pad Polishing cloth Polishing agent Cerium oxide Average particle size 1 μm Abrasive flow rate 200 cc / min Abrasive concentration 5% by weight
【００１６】なお、上記実施形態では、定盤１Ａ，１Ｂ
の対向面のうち凹状とした内周部１３，１４の周壁１
７，１８を、内方へ向かうにつれて漸次互いに離間する
方向へ湾曲する曲面としたが、この部分は板状ワークＷ
との相対速度が対向面外周縁１５，１６における相対速
度と較べて小さいから、必ずしも曲面にする必要はな
い。In the above embodiment, the surface plates 1A, 1B
Peripheral wall 1 of concave inner peripheral portions 13 and 14 of the opposing surfaces of
The curved surfaces 7 and 18 are curved in such a manner that they gradually curve away from each other as they go inward.
It is not always necessary to make the surface curved since the relative speed with respect to the outer peripheral edges 15 and 16 of the opposed surfaces is smaller than the relative speed.
【００１７】[0017]
【発明の効果】以上のように、本発明の枚葉式研磨機に
よれば、研磨パッドの外周部を均一かつ適正に傾斜させ
ることができ、研磨時における研磨パッド間への板状ワ
ークの円滑な進入を可能として板状ワーク表面に生じる
傷を大幅に低減することができる。As described above, according to the single-wafer polishing machine of the present invention, the outer peripheral portion of the polishing pad can be uniformly and appropriately inclined, and the plate-like work is placed between the polishing pads during polishing. Smooth entry is possible, and scratches generated on the surface of the plate-like work can be significantly reduced.
【図１】本発明の一実施形態を示す、枚葉式研磨機の要
部断面図である。FIG. 1 is a cross-sectional view of a main part of a single-wafer polishing machine showing an embodiment of the present invention.
【図２】本発明の一実施形態を示す、ワーク研磨時の定
盤外周部の断面図で、図１のＡ部拡大図である。FIG. 2 is a cross-sectional view of an outer peripheral portion of a surface plate during polishing of a work, showing an embodiment of the present invention, and is an enlarged view of a portion A in FIG. 1;
【図３】従来例を示す、枚葉式研磨機の全体斜視図であ
る。FIG. 3 is an overall perspective view of a single-wafer polishing machine showing a conventional example.
【図４】従来例を示す、枚葉式研磨機の断面図である。FIG. 4 is a cross-sectional view of a single-wafer polishing machine showing a conventional example.
【図５】従来例を示す、枚葉式研磨機の定盤の正面図で
ある。FIG. 5 is a front view of a surface plate of a single wafer polishing machine showing a conventional example.
【図６】従来例を示す、ワーク研磨時の定盤外周部の断
面図で、図４のＢ部拡大図である。6 is a cross-sectional view of an outer peripheral portion of a surface plate during polishing of a work, showing a conventional example, and is an enlarged view of a portion B in FIG. 4;
１Ａ，１Ｂ…定盤、１３，１４…内周部、１５，１６…
外周縁、１７，１８…周壁、２…研磨パッド、２１…外
周縁、２２…内周縁。1A, 1B: Surface plate, 13, 14: Inner circumference, 15, 16 ...
Outer peripheral edge, 17, 18 peripheral wall, 2 polishing pad, 21 outer peripheral edge, 22 inner peripheral edge.
Claims (2)
接合された一定厚の研磨パッドで板状ワークの一部を両
面から挟んで研磨する枚葉式研磨機において、前記各定
盤の対向面の外周縁を、外方へ向かうにつれて漸次互い
に離間する方向へ湾曲する曲面となすとともに、前記研
磨パッドの外周縁を前記曲面に沿ってこれに接合したこ
とを特徴とする枚葉式研磨機。1. A single-wafer polishing machine which polishes a part of a plate-like work by sandwiching a part of a plate-like work from both sides with polishing pads having a constant thickness joined to opposing surfaces of a pair of rotating platens, respectively. A single-wafer polishing method, wherein the outer peripheral edge of the facing surface is formed into a curved surface that gradually curves in a direction away from each other as going outward, and the outer peripheral edge of the polishing pad is joined to the curved surface along the curved surface. Machine.
周部の周壁を、内方へ向かうにつれて漸次互いに離間す
る方向へ湾曲する曲面となすとともに、前記研磨パッド
の内周縁を前記曲面に沿ってこれに接合した請求項１に
記載の枚葉式研磨機。2. The opposed peripheral surface of each of the surface plates, wherein the peripheral wall of the concave inner peripheral portion is formed into a curved surface that gradually curves in a direction away from each other as it goes inward, and the inner peripheral edge of the polishing pad is The single-wafer polishing machine according to claim 1, wherein the single-wafer polishing machine is joined along the curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13098899A JP2000317813A (en) | 1999-05-12 | 1999-05-12 | Sheet type polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13098899A JP2000317813A (en) | 1999-05-12 | 1999-05-12 | Sheet type polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000317813A true JP2000317813A (en) | 2000-11-21 |
Family
ID=15047307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13098899A Pending JP2000317813A (en) | 1999-05-12 | 1999-05-12 | Sheet type polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000317813A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011020186A (en) * | 2009-07-13 | 2011-02-03 | Koyo Mach Ind Co Ltd | Method and apparatus for double-ended surface grinding |
| WO2018012097A1 (en) * | 2016-07-13 | 2018-01-18 | 株式会社Sumco | Dual-surface polishing device |
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1999
- 1999-05-12 JP JP13098899A patent/JP2000317813A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011020186A (en) * | 2009-07-13 | 2011-02-03 | Koyo Mach Ind Co Ltd | Method and apparatus for double-ended surface grinding |
| WO2018012097A1 (en) * | 2016-07-13 | 2018-01-18 | 株式会社Sumco | Dual-surface polishing device |
| US11440157B2 (en) | 2016-07-13 | 2022-09-13 | Sumco Corporation | Dual-surface polishing device and dual-surface polishing method |
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