JP2000307214A - Boring method of copper clad laminated board and jig plate for boring - Google Patents

Boring method of copper clad laminated board and jig plate for boring

Info

Publication number
JP2000307214A
JP2000307214A JP11154244A JP15424499A JP2000307214A JP 2000307214 A JP2000307214 A JP 2000307214A JP 11154244 A JP11154244 A JP 11154244A JP 15424499 A JP15424499 A JP 15424499A JP 2000307214 A JP2000307214 A JP 2000307214A
Authority
JP
Japan
Prior art keywords
laminate
paper
boring
unsaturated polyester
polyester resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11154244A
Other languages
Japanese (ja)
Inventor
Haruki Yokono
春樹 横野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP11154244A priority Critical patent/JP2000307214A/en
Publication of JP2000307214A publication Critical patent/JP2000307214A/en
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve warp of an entry board and a backup board by using an unsaturated polyester resin laminated board where uniform heating is performed and warp is negligible. SOLUTION: In this boring method, boring is performed by using a drill in the state that a laminated board which is composed of unsaturated polyester resin and paper and 0.1-2.0 mm in thickness is brought into closely contact with the surface of a copper clad laminated board.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、銅貼り積層板を用いた
電子回路用印刷配線板の製造において、スルーホールや
バイヤホールなどの孔をドリルを用いて銅貼り積層板に
明けるとき、銅貼り積層板の上下面にあてる治具板に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing printed wiring boards for electronic circuits using a copper-clad laminate when drilling holes such as through holes and via holes in the copper-clad laminate using a drill. The present invention relates to a jig plate applied to the upper and lower surfaces of a laminated laminate.

【0002】[0002]

【従来の技術】電子回路用印刷配線板には、ガラス繊維
基材の銅貼り積層板が広く用いられている。この銅貼り
積層板は回路加工に際し、ドリルやレーザ光などを用い
て孔が明けられている。このうちドリルによる開孔は、
数枚の銅貼り積層板を図1の2および3に示すように、
上下から治具板で挾み固定した状態で行われる。上面の
治具板2はエントリーボードと呼ばれ、ドリルの刃の接
触開始時の衝撃を受けとめ、ドリルの回転に伴い銅貼り
積層板の表面が孔縁部分で持ち上がる、いわゆる“かえ
り”現象を回避するために用いるものである。現在は厚
さ0.1ないし0.5mmのアルミニウム板や紙基材フ
ェノール樹脂積層板が用いられている。
2. Description of the Related Art A glass-fiber-based copper-clad laminate is widely used as a printed wiring board for electronic circuits. Holes are drilled in the copper-clad laminate using a drill, a laser beam, or the like during circuit processing. Of these, drill holes are
As shown in FIGS. 1 and 2, several copper-clad laminates were
It is carried out in a state where it is sandwiched and fixed from above and below by a jig plate. The jig plate 2 on the upper surface is called an entry board, which receives the impact at the start of the contact of the drill blade and avoids the so-called "burr" phenomenon in which the surface of the copper-clad laminate rises at the edge of the hole as the drill rotates. It is used for At present, an aluminum plate having a thickness of 0.1 to 0.5 mm or a phenolic resin-laminated paper substrate is used.

【0003】下面の治具板はバックアップボードと呼ば
れ、ドリルの刃が貫通したとき刃先が孔明け機の金属製
下面定盤に接触して破損するのを防止するとともに、ド
リルの刃が貫通した時に、銅貼り積層板の最下面銅はく
が、かえりを生ずる事のないようにするために使用され
る。現在は、厚さ0.8ないし1.5mmの紙基材フェ
ノール樹脂積層板が広く使用されている。
[0003] The jig plate on the lower surface is called a backup board, and when the drill blade penetrates, it prevents the blade edge from being damaged by contacting the metal lower surface plate of the drilling machine, and the drill blade penetrates. When this is done, the lowermost copper foil of the copper-clad laminate is used to prevent burrs. At present, a paper-based phenolic laminate having a thickness of 0.8 to 1.5 mm is widely used.

【0004】[0004]

【発明が解決しようとする課題】フェノール樹脂を用い
たエントリーボードおよびバックアップボードに共通し
た欠点として板の“反り”がある。反りがあると、治具
板と銅貼り積層板の密着性が悪くなり、開孔時にドリル
によって発生した切り粉が排出され難くなり、孔位置精
度も悪くなる。エントリーボードについては、銅貼り積
層板との密着性を向上させるためにアルミニウム板を使
用することが多いが、紙基材フェノール樹脂積層板に比
べて高価でドリルにたいする摩擦抵抗も大きくなるとい
う欠点がある。バックアップボードについては、前述の
反りの問題が最大の課題となっているほか、コストの低
減が強く求められている。
A drawback common to entry boards and backup boards using phenolic resin is "warpage" of the board. If there is a warp, the adhesion between the jig plate and the copper-clad laminate deteriorates, cutting chips generated by drilling at the time of opening are less likely to be discharged, and the hole positioning accuracy also deteriorates. For the entry board, an aluminum plate is often used to improve the adhesion to the copper-clad laminate, but the drawback is that it is more expensive than the paper-based phenol resin laminate and the frictional resistance to the drill increases. is there. For the backup board, the above-described warpage problem is the biggest problem, and cost reduction is strongly demanded.

【0005】[0005]

【課題を解決するための手段】本発明者は鋭意研究の結
果、不飽和ポリエステル樹脂を結合剤とし紙を基材とし
た積層板が、反りが少なく、かつ積層板の表面に微かな
粘着性を有するので、銅貼り積層板との密着性に優れた
治具板が得られる事を見出した。不飽和ポリエステル樹
脂は、化粧板用あるいはFRP用などに使用される汎用
タイプのものでよい。注型用などの特殊品も使用可能で
あるが、コスト的に不利となる。不飽和ポリエステル樹
脂に、各種充填剤、収縮防止剤、変性剤、潤滑剤、水な
どの添加剤を添加することも可能である。充填剤には、
使用済みの治具板を粉砕したものを加えることも可能で
ある。潤滑剤や水は、ドリルの摩擦抵抗を低減するのに
役立つ。紙は、新聞用紙や雑誌用紙などのメカニカルパ
ルプを用いたものや、再生紙、未晒クラフト紙などが適
している。
Means for Solving the Problems As a result of diligent research, the present inventors have found that a laminate made of paper using an unsaturated polyester resin as a binder has a small warpage and a slight adhesion to the surface of the laminate. It has been found that a jig plate having excellent adhesion to the copper-clad laminate can be obtained. The unsaturated polyester resin may be a general-purpose type used for decorative boards or FRP. Although special products such as those for casting can be used, they are disadvantageous in terms of cost. It is also possible to add various fillers, anti-shrinkage agents, modifiers, lubricants, water and other additives to the unsaturated polyester resin. Fillers include
It is also possible to add a crushed used jig plate. Lubricants and water help reduce the frictional resistance of the drill. As the paper, paper using mechanical pulp such as newsprint or magazine paper, recycled paper, unbleached kraft paper, and the like are suitable.

【0006】紙基材不飽和ポリエステル樹脂積層板は、
例えば特開昭−126418(特公昭62−6513)
特開平3−268928、特開平3−268929に示
されるようなロールプレス法により、一枚のシート状に
成型される方法で製造されることが過去に行われたが、
設備費が高く生産速度が遅いためコスト高となり、品質
も板厚偏差や反りが、競合する他の成型法による合成樹
脂積層板に比べ劣るため現在では行われていない。
[0006] Paper-based unsaturated polyester resin laminates are:
For example, JP-A-126418 (JP-B-62-6513)
In the past, it was manufactured by a method of being formed into a single sheet by a roll press method as shown in JP-A-3-268929 and JP-A-3-268929.
Since the equipment cost is high and the production speed is slow, the cost is high, and the quality is not performed at present because the thickness deviation and the warpage are inferior to those of the synthetic resin laminates by other competing molding methods.

【0007】そこで本発明者は、設備費が安く生産性に
優れた方法で、板厚精度のよい、反りの少ない紙基材不
飽和ポリエステル樹脂積層板の製造法の研究を進め、治
具板として実用化に成功した。
Accordingly, the present inventor has conducted research on a method of manufacturing a paper-based unsaturated polyester resin laminate having good thickness accuracy and low warpage in a method with low equipment cost and excellent productivity. It was successfully commercialized.

【0008】本発明の治具板の製造は、紙に樹脂を塗布
含浸させる工程から始まる。その方法は、紙を硬化剤、
促進剤および添加剤を配合された液状の不飽和ポリエス
テル樹脂の中に浸せきしたり、ロールやフローコータあ
るいはバーコータなどの塗布装置を用いて塗布すること
によって行われる。塗布含浸される樹脂量は、樹脂と紙
の合計重量の25ないし60%、好ましくは30ないし
35%の範囲がよい。樹脂量の調整は、常法により絞り
ロールを用いて行う。塗布含浸は、紙を連続シート状で
も所望の大きさに切断した状態でもよい。樹脂液は、低
温では保存性は良いが含浸に時間がかかる。高温では含
浸は早いが保存性が悪いので、作業性を考慮して10な
いし40℃に保つ。含浸は1ないし10分程度で完了す
る。例えば、厚さ1.5mmで仕上げ前の大きさが10
50×1050mmの積層板の場合は、重量は2.15
kg、樹脂量は2.15kgの30%の645g、紙は
1505gとなる。使用する紙の枚数を7枚とすると、
一枚あたり215g、一平方メートルあたり195gと
なる。
[0008] The manufacture of the jig plate of the present invention starts with a step of coating and impregnating a paper with a resin. The method is to harden the paper,
It is carried out by dipping in a liquid unsaturated polyester resin in which an accelerator and an additive are blended, or by using a coating device such as a roll, a flow coater or a bar coater. The amount of the resin to be applied and impregnated is in the range of 25 to 60%, preferably 30 to 35% of the total weight of the resin and the paper. The adjustment of the resin amount is performed by using a squeezing roll by a conventional method. The coating and impregnation may be performed in a state where the paper is cut into a continuous sheet or cut into a desired size. The resin solution has good storage stability at low temperatures but takes a long time to be impregnated. At a high temperature, the impregnation is fast, but the storage stability is poor. The impregnation is completed in about 1 to 10 minutes. For example, if the thickness before finishing is 10 mm and the thickness is 1.5 mm
For a 50 × 1050 mm laminate, the weight is 2.15
kg, resin amount is 645 g, which is 30% of 2.15 kg, and paper is 1505 g. Assuming that the number of papers used is seven,
It is 215 g per sheet and 195 g per square meter.

【0009】このように所望の厚さの積層板になるよう
に紙および樹脂量を調節された含浸紙は、必要な枚数を
重ね合わせ、樹脂を硬化し積層板とする。このとき樹脂
含浸紙と未含浸紙を交互に重ね合わせ、硬化する過程で
未含浸紙に樹脂が含浸するようにしても良い。硬化は、
次のように行う。所望の重量に調整され重ね合わされた
含浸紙は、その両表面をPVA,PP,PET,PV
F,テフロン、アセテート、セロファン、離型剤塗布ア
ルミニウムはくなどのフイルムで覆う。フイルム類の厚
さは、10ないし100μmで、長さは含浸紙より大き
く積層板の端部が隠れる程度のものを用いる。これは作
業性及び経済性を考慮して決める。さらに、これらのフ
イルムの表面に、平滑な鉄板を重ねる。鉄板は、厚さ
1.0ないし2.0mmのステンレス板が長期間繰返し
使用できて都合が良い。鉄板の表面に離型剤を塗布した
場合は、これらのフイルム類を省略することも可能であ
る。
[0009] The required number of impregnated papers in which the amount of paper and the resin is adjusted so as to obtain a laminate having a desired thickness is laminated, and the resin is cured to form a laminate. At this time, the resin-impregnated paper and the non-impregnated paper may be alternately overlapped, and the resin may be impregnated in the unimpregnated paper during the curing process. Curing is
Proceed as follows. The impregnated paper adjusted to the desired weight and superimposed has PVA, PP, PET, PV
F, cover with a film of Teflon, acetate, cellophane, aluminum foil coated with a release agent or the like. The thickness of the film is 10 to 100 μm, and the length of the film is larger than that of the impregnated paper and the end of the laminate is hidden. This is determined in consideration of workability and economy. Further, a smooth iron plate is placed on the surface of these films. As the iron plate, a stainless plate having a thickness of 1.0 to 2.0 mm can be used repeatedly for a long period of time, which is convenient. When a release agent is applied to the surface of the iron plate, these films can be omitted.

【0010】この鉄板、フイルム、含浸紙の重ね合わせ
た構成物を一単位とし、この単位構成物をさらに複数繰
返し積み重ねていく。各単位構成物の間の鉄板は共用す
る。この構成状態を図2に示す。単位構成物の繰返し堆
積数は、生産性を考慮して決められるが、5ないし30
0単位、高さにして約800mm以内が良い。
The stacked structure of the iron plate, the film, and the impregnated paper is taken as one unit, and the unit components are further stacked a plurality of times. The iron plate between each unit component is shared. This configuration is shown in FIG. The number of repeated depositions of the unit component is determined in consideration of productivity, but is 5 to 30.
It is preferable that the height is 0 unit and the height is about 800 mm or less.

【0011】このように堆積した構成物は、次に上下か
ら加圧する。圧力は、接触圧ないし5×10Pa好ま
しくは5×10ないし1.0×10Paでよい。加
圧の方法は、油圧式のプレスやネジ締め式のプレスで上
下に定盤を介して加圧する。上部に重量物を載せるよう
な方法でもよい。加圧により含浸された樹脂は、圧力に
垂直方向に流動しやすい。これを防ぐために、加圧は、
1ないし2×10Pa程度の加圧状態の空間で行うと
良い。この場合は、上下からの圧力を接触圧以下とする
ことも可能である。
The components thus deposited are then pressed from above and below. The pressure may be a contact pressure to 5 × 10 5 Pa, preferably 5 × 10 4 to 1.0 × 10 5 Pa. The pressurization is performed by using a hydraulic press or a screw press to apply pressure vertically through the platen. A method of placing a heavy object on the upper part may be used. The resin impregnated by pressure tends to flow in the direction perpendicular to the pressure. To prevent this, pressurization is
It is preferable to perform the treatment in a pressurized space of about 1 to 2 × 10 5 Pa. In this case, the pressure from above and below can be made equal to or less than the contact pressure.

【0012】加圧状態の堆積構成物は、そのまま室温に
放置すると樹脂の硬化反応による反応熱によって温度が
上昇し、全体が均一に硬化していく。周辺の雰囲気を加
温してこの硬化を促進しても良い。硬化剤の配合量、種
類によっては温度が急上昇し、内部の温度が200℃以
上になることもあるので注意を要する。硬化は、60な
いし120分の範囲内で行うと反りの発生が少なく品質
の良い積層板が得られた。堆積する構成物の数は、一層
では殆ど反応熱による温度上昇はみられず少なくとも二
層以上、好ましくは十層以上重ね合わせると反応による
発熱が充分に得られることが分かった。最外層の構成物
は、温度上昇が内部より低いので、150℃程度の温度
で30分ほど後加熱する必要がある。硬化終了後は堆積
状態の単位構成物を分解すれば、含浸紙は互いに接着し
て一枚の板状物が得られる。この板状物が紙基材不飽和
ポリエステル樹脂積層板で、そのまま、あるいは更に加
熱または加熱加圧して治具板用に供することができる。
本発明は、樹脂の発熱を硬化に利用する事によって、多
量に堆積された積層板の中心部まで均一に加熱し、内部
歪の少ない製品を得ることを主眼とするが、在来の積層
板の加熱法を併用することも可能である。
If the deposited component in the pressurized state is left at room temperature as it is, the temperature rises due to the reaction heat due to the curing reaction of the resin, and the whole is uniformly cured. This curing may be promoted by heating the surrounding atmosphere. It should be noted that the temperature may rise rapidly depending on the amount and type of the curing agent, and the internal temperature may be 200 ° C. or higher. When the curing was carried out within a range of 60 to 120 minutes, a laminate having good quality with little warpage was obtained. Regarding the number of components to be deposited, it was found that the temperature rise due to the reaction heat was hardly observed in one layer, and sufficient heat generation by the reaction was obtained when at least two layers were stacked, and preferably ten layers or more. Since the temperature rise of the constituent of the outermost layer is lower than that of the inside, it is necessary to post-heat at a temperature of about 150 ° C. for about 30 minutes. After the curing is completed, the impregnated papers are adhered to each other to obtain a single plate by decomposing the unit components in a stacked state. This plate-like material is a paper-based unsaturated polyester resin laminate, and can be used as it is or as a jig plate by further heating or heating and pressing.
The present invention is intended to uniformly heat up to the center of a large amount of laminated board by using the heat generated by the resin for curing, and to obtain a product having a small internal strain. Can be used in combination.

【0013】[0013]

【作用】本発明の治具板は、不飽和ポリエステル樹脂を
結合剤としているため、樹脂が硬化するとき反応熱が発
生する。この反応熱を利用することによって均一加熱が
可能となって、内部歪が少なく反りの少ない積層板が多
量生産できる。また積層板の表面は、硬化反応のとき、
ごく僅かに存在する空気のため反応が阻害されるため
か、かすかな粘着性を有する。このため銅貼り積層板の
開孔時に、治具板と銅貼り積層板の密着度が高まり孔位
置精度が良くなる。
Since the jig plate of the present invention uses an unsaturated polyester resin as a binder, reaction heat is generated when the resin is cured. By utilizing this reaction heat, uniform heating becomes possible, and a large number of laminated boards with little internal distortion and little warpage can be produced. In addition, the surface of the laminate, during the curing reaction,
It has a slight stickiness, probably because the reaction is hindered by the presence of very little air. Therefore, when the copper-clad laminate is opened, the degree of adhesion between the jig plate and the copper-clad laminate is increased, and the hole position accuracy is improved.

【0014】[0014]

【実施例】ロール状未晒クラフト紙(米国ウエストバコ
社製、1050mm幅、185g/m)と不飽和ポリ
エステル樹脂(長興化学製、エターセット2200A
P,BPO 0.75%含む)を準備する。まづ未晒ク
ラフト紙を長さ1050mmに切断し7枚ずつ取り揃え
る。これを前記不飽和ポリエステル樹脂に室温で30分
浸せきする。その後、圧力1000kg/mで加圧され
た径250mmの2本の鉄製ロールの間を7枚ずつ通
す。これによって樹脂量が全体重量の33%に調整され
た含浸紙が得られる。この含浸紙の上下面に厚さ50μ
mのPVAフイルムを載せる。フイルムの大きさは11
00×1100mmとし、含浸紙の端部が隠れるように
した。さらに、その下に厚さ1.2mm大きさ1050
×1050mmのステンレス板(硬質301タイプ)を
敷く。これを単位構成物として30単位堆積する。最上
構成物の上にもステンレス板を載せる。この30単位の
構成物の上下面に、厚さ15mmのベニヤ合板を当て、
上下のベニヤ合板をネジ式の万力で締める。締め付け圧
は、1000Nにした。これを温度80℃の空間に60
分放置すると、15単位目の構成物の温度は、150℃
となった。さらに60分放置した後、構成物を除圧し分
解して厚さ1.5mmの不飽和ポリエステル樹脂積層板
を得た。この積層板は、反りが1mにつき3mm以下の
平坦な板状物で、銅貼り積層板の治具板として好適であ
った。
Example: Roll-shaped unbleached kraft paper (manufactured by West Bako Co., USA, 1050 mm width, 185 g / m 2 ) and unsaturated polyester resin (manufactured by Choko Chemical Co., Ltd., Eterset 2200A)
P, BPO 0.75%) is prepared. First, unbleached kraft paper is cut to a length of 1050 mm and seven sheets are prepared. This is immersed in the unsaturated polyester resin at room temperature for 30 minutes. After that, seven iron rolls each having a diameter of 250 mm pressed at a pressure of 1000 kg / m are passed through each of the seven rolls. Thereby, an impregnated paper in which the amount of resin is adjusted to 33% of the total weight is obtained. 50μ thickness on the upper and lower surfaces of this impregnated paper
m of PVA film. The size of the film is 11
The size was set to 00 × 1100 mm so that the end of the impregnated paper was hidden. Furthermore, a thickness of 1.2 mm and a size of 1050
Spread a stainless steel plate (hard 301 type) of × 1050 mm. This is used as a unit component to deposit 30 units. A stainless steel plate is also placed on the top component. A 15 mm-thick veneer plywood is applied to the upper and lower surfaces of the 30-unit structure,
Tighten the upper and lower veneer plywood with a screw vise. The tightening pressure was 1000N. Place this in a space at a temperature of 80 ° C for 60
After standing for 15 minutes, the temperature of the 15th unit constituent is 150 ° C.
It became. After standing for 60 minutes, the components were decompressed and decomposed to obtain a 1.5 mm thick unsaturated polyester resin laminate. This laminate was a flat plate-like product having a warp of 3 mm or less per 1 m, and was suitable as a jig plate for a copper-clad laminate.

【0015】[0015]

【発明の効果】本発明の主要な課題は、エントリーボー
ドおよびバックアップボードの反りの改善である。本発
明の不飽和ポリエステル樹脂積層板は従来のフェノール
樹脂積層板に較べて、均一な加熱が行われ反りが少なく
なる。また不飽和ポリエステル樹脂は、無溶剤のものが
使用でき、フェノール樹脂のように溶剤の乾燥や廃ガス
の処理が不要となリコスト低減に役立つ。潤滑剤を含有
させることも自由に行うことが可能であり、ドリルの寿
命を長くする事もできる。
The main object of the present invention is to improve the warpage of an entry board and a backup board. In the unsaturated polyester resin laminate of the present invention, uniform heating is performed and warpage is reduced as compared with a conventional phenol resin laminate. Unsaturated polyester resin can be used without solvent, which contributes to cost reduction by eliminating the need for solvent drying and waste gas treatment like phenol resin. It is possible to freely add a lubricant, and the life of the drill can be extended.

【0016】[0016]

【図面の簡単な説明】[Brief description of the drawings]

【図 1】銅貼り積層板のドリルによる孔明け方法の説
明図。
FIG. 1 is an explanatory view of a method for drilling a copper-clad laminate by a drill.

【図 2】不飽和ポリエステル樹脂積層板の加熱成型に
用いられる含浸紙と鉄板の構成説明図。
FIG. 2 is a configuration explanatory view of an impregnated paper and an iron plate used for heat molding of an unsaturated polyester resin laminate.

【符号の説明】[Explanation of symbols]

図1 1:ドリルチャック、2:エントリーボード、
3:バックアップボード、4:銅貼り積層板(1.6t
3枚重ねの場合)、5:定盤、6:ドリル、図2 1:
ボルト、2:上定盤、3:鉄板、4:ナット、5:不飽
和ポリエステル樹脂含浸紙積み重ね構成品、6:下定
盤、
Figure 11 1: Drill chuck, 2: Entry board,
3: Backup board 4: Copper-laminated laminate (1.6t
5: surface plate, 6: drill, Fig. 21:
Bolt, 2: Upper platen, 3: Iron plate, 4: Nut, 5: Unsaturated polyester resin impregnated paper stacking component, 6: Lower platen,

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】銅貼り積層板を、その表面に不飽和ポリエ
ステル樹脂と紙からなる厚さ0.1ないし2.0mmの
積層板を密着させた状態で、ドリルを用いて孔を明ける
こと。
(1) Drilling a hole in a copper-clad laminate with a laminate of 0.1 to 2.0 mm thick made of unsaturated polyester resin and paper adhered to the surface of the laminate.
【請求項2】請求項1記載の不飽和ポリエステル樹脂積
層板が、積層硬化のときに、少なくとも2枚以上堆積さ
れて、発生する反応熱を硬化に利用し成型されたもので
あること。
2. The laminate of claim 1, wherein at least two sheets of the unsaturated polyester resin laminate are deposited at the time of lamination curing and molded by utilizing the reaction heat generated.
JP11154244A 1999-04-22 1999-04-22 Boring method of copper clad laminated board and jig plate for boring Pending JP2000307214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11154244A JP2000307214A (en) 1999-04-22 1999-04-22 Boring method of copper clad laminated board and jig plate for boring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11154244A JP2000307214A (en) 1999-04-22 1999-04-22 Boring method of copper clad laminated board and jig plate for boring

Publications (1)

Publication Number Publication Date
JP2000307214A true JP2000307214A (en) 2000-11-02

Family

ID=15579995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11154244A Pending JP2000307214A (en) 1999-04-22 1999-04-22 Boring method of copper clad laminated board and jig plate for boring

Country Status (1)

Country Link
JP (1) JP2000307214A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019640A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
JP2005019642A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
JP2005019641A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
JP2005019643A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
CN106863426A (en) * 2017-04-18 2017-06-20 成都力鑫科技有限公司 A kind of hand punch with positioning action
CN112109137A (en) * 2020-08-19 2020-12-22 豪能电子科技有限公司 Copper-clad laminate processing device suitable for lead-free process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019640A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
JP2005019642A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
JP2005019641A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
JP2005019643A (en) * 2003-06-25 2005-01-20 Jfe Steel Kk Laminated core excellent in dimensional accuracy and its manufacturing method
CN106863426A (en) * 2017-04-18 2017-06-20 成都力鑫科技有限公司 A kind of hand punch with positioning action
CN112109137A (en) * 2020-08-19 2020-12-22 豪能电子科技有限公司 Copper-clad laminate processing device suitable for lead-free process

Similar Documents

Publication Publication Date Title
JPH0147297B2 (en)
JPS6042566B2 (en) Method for continuously manufacturing electrical laminated insulation boards or metal foil clad laminates
US4311419A (en) Method for drilling circuit boards
JP2000307214A (en) Boring method of copper clad laminated board and jig plate for boring
JPS6217532B2 (en)
WO1980002010A1 (en) Method of and device for continuously fabricating laminate
JPH026131A (en) Method and device for continuously manufacturing laminated board
JPH0329393A (en) Metal-clad laminated plate
JP4089090B2 (en) Laminate production method and laminate
JPH08118296A (en) Back-up board for drilling
JPS587345A (en) Manufacture of metallic foil lined laminate
JPS59192567A (en) Manufacture of laminated board
JPS60109836A (en) Manufacture of lainated board
JPH04142338A (en) Preparation of laminated sheet
JPH01136743A (en) Manufacture of laminated plate
JPS5951913B2 (en) Continuous manufacturing method for laminates
JPH0367618B2 (en)
JP2001018104A (en) Entry board for drilling work and manufacture thereof
JPH048515A (en) Manufacture of laminated plate
JPS6144637A (en) Manufacture of unsaturated polyester metallic-foil lined laminated board
JPH0268981A (en) Metal base wiring substrate
JP2000216538A (en) Manufacture of multilayer printed-wiring board
JPH0722982B2 (en) Paper base laminate
JPH0531466B2 (en)
JPH01196339A (en) Preparation of copper-clad laminate sheet