JP2000286370A - Heat radiation member of electronic component - Google Patents
Heat radiation member of electronic componentInfo
- Publication number
- JP2000286370A JP2000286370A JP11092302A JP9230299A JP2000286370A JP 2000286370 A JP2000286370 A JP 2000286370A JP 11092302 A JP11092302 A JP 11092302A JP 9230299 A JP9230299 A JP 9230299A JP 2000286370 A JP2000286370 A JP 2000286370A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- reinforcing layer
- rear face
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の放熱部
材に関する。詳しくは、表面に補強層を有する取扱い性
の大なる放熱部材において、電子機器に組み込む際の発
熱性電子部品への負荷が小さく、高度な放熱特性を実現
することができる放熱部材に関する。The present invention relates to a heat radiating member for an electronic component. More specifically, the present invention relates to a heat-dissipating member having a reinforcing layer on its surface and having a large handleability, which can reduce the load on a heat-generating electronic component when incorporated into an electronic device and can realize advanced heat-dissipating characteristics.
【０００２】[0002]
【従来の技術】トランジスタやサイリスタ等の発熱性電
子部品を組み込んだ電子機器においては、使用時に発生
した熱を如何にして除去するかが重要な課題となってい
る。従来、その熱の除去方法として、発熱性電子部品を
電気絶縁性の熱伝導性シートを介して放熱フィンや金属
板に取り付けて熱を除去している。このような熱伝導性
シートとしては、シリコーンゴムに窒化硼素等の熱伝導
性フィラーの充填されたものが使用されている。2. Description of the Related Art In electronic devices incorporating heat-generating electronic components such as transistors and thyristors, it is important to remove heat generated during use. Conventionally, as a method of removing the heat, a heat-generating electronic component is attached to a radiating fin or a metal plate via an electrically insulating heat conductive sheet to remove the heat. As such a heat conductive sheet, a sheet in which a heat conductive filler such as boron nitride is filled in silicone rubber is used.
【０００３】一方、最近の電子機器の高密度化に伴い、
放熱フィン等を付けるスペースがない場合や、電子機器
が密閉されていてその内部にある放熱フィンから外部へ
の放熱が困難な場合などでは、発熱性電子部品から発生
した熱を電子機器のケース等に直接伝熱する方式が取ら
れる場合がある。この伝熱を行うために、発熱性電子部
品とケースとの間に、その隙間を埋めるだけの厚みを有
した高柔軟性放熱スペーサーが用いられる。On the other hand, with the recent increase in the density of electronic devices,
If there is no space for the radiation fins, etc., or if the electronic equipment is sealed and it is difficult to radiate heat from the radiation fins inside to the outside, the heat generated from the heat-generating electronic components will be transferred to the case of the electronic equipment. There is a case where a method of directly transferring heat is used. In order to perform this heat transfer, a highly flexible heat radiation spacer having a thickness sufficient to fill the gap between the heat generating electronic component and the case is used.
【０００４】また、ＩＣ化やＬＳＩ化された発熱性電子
部品がプリント基板に実装される際の放熱においても、
プリント基板と放熱フィンとの間に高柔軟性放熱スペー
サーが用いられる。[0004] In addition, heat dissipation when a heat-generating electronic component made into an IC or an LSI is mounted on a printed circuit board is also required.
A highly flexible heat radiation spacer is used between the printed board and the heat radiation fins.
【０００５】このような高柔軟性放熱スペーサーは、ア
スカーＣ硬度が５０以下という極めて柔らかいものであ
るため、その装着時等における取扱い性が劣るので、そ
の表面ないしは表面内部にシート、ガラスクロス等の補
強層を設けることが提案されている。（特開平２−１９
６４５３号公報、特開平６−１５５５１７号公報、特開
平７−１４９５０号公報、特開平７−２６６３５６号公
報等）[0005] Such a high-flexibility heat-radiating spacer is extremely soft, having an Asker C hardness of 50 or less, and is inferior in handling at the time of mounting or the like. It has been proposed to provide a reinforcing layer. (Japanese Patent Laid-Open No. 2-19
6453, JP-A-6-155517, JP-A-7-14950, JP-A-7-266356, etc.)
【０００６】[0006]
【発明が解決しようとする課題】これらの補強層によっ
て、取扱い性は改善された。しかし、それを電子機器に
組み込むには、発熱性電子部品と補強層とが当接させた
状態で締め付けしなければならないが、補強層が高柔軟
性放熱スペーサーよりも高硬度であるので、それを考慮
して発熱性電子部品が損傷しないように締め付け力を加
減すると、十分な接触面積を確保することができず、折
角の高柔軟性スペーサーの高熱伝導性を最大限に発現さ
せることが困難である場合が多かった。The handleability has been improved by these reinforcing layers. However, in order to incorporate it into an electronic device, it must be tightened with the heat-generating electronic component and the reinforcing layer in contact with each other. If the tightening force is adjusted so as not to damage the heat-generating electronic components, sufficient contact area cannot be secured, and it is difficult to maximize the high thermal conductivity of the highly flexible spacers Was often the case.
【０００７】本発明は、上記に鑑みてなされたものであ
り、その目的は、表面に補強層を有する取扱い性の大な
る放熱部材において、電子機器に組み込む際の発熱性電
子部品への負荷が小さく、高度な放熱特性を実現するこ
とができる放熱部材を提供することである。The present invention has been made in view of the above, and an object of the present invention is to provide a heat-dissipating member having a reinforcing layer on its surface and having a large handleability, which reduces the load on a heat-generating electronic component when incorporated into an electronic device. An object of the present invention is to provide a heat radiating member which is small and can realize high heat radiating characteristics.
【０００８】[0008]
【課題を解決するための手段】すなわち、本発明は、ア
スカーＣ硬度が５０以下の高柔軟性放熱基材の表面及び
／又は裏面に、発熱性電子部品が上記高柔軟性放熱基材
と接触する領域を少なくとも残し、その領域からその領
域に対応する放熱方向側の反対面までの間には、いかな
る補強層をも形成させないで、上記高柔軟性放熱基材の
表面、裏面及び／又は内部に補強層を設けてなることを
特徴とする電子部品の放熱部材である。That is, according to the present invention, a heat-generating electronic component is brought into contact with the high-flexibility heat-radiating substrate on the front and / or back surface of the high-flexibility heat-radiating substrate having Asker C hardness of 50 or less. The surface, the back surface, and / or the inside of the high-flexibility heat-radiating base material is not formed between the region and the opposite surface on the heat radiation direction side corresponding to the region without forming any reinforcing layer. A heat radiation member for an electronic component, wherein a reinforcement layer is provided on the electronic component.
【０００９】[0009]
【発明の実施の形態】以下、更に詳しく本発明について
説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail.
【００１０】本発明の基材をなす高柔軟性放熱基材（以
下、単に「基材」ともいう。）は、アスカーＣ硬度が５
０以下の柔らかさを有するものであり、それよりも硬い
と、発熱性電子部品が損傷しないように締め付け力を加
えてもヒートシンク等との接触面積を十分に確保するこ
とができず、折角の優れた基材の高熱伝導性を高度に発
現させることが困難となる。好ましいアスカーＣ硬度
は、３０以下、特に１５以下である。The highly flexible heat-radiating base material (hereinafter simply referred to as "base material") constituting the base material of the present invention has an Asker C hardness of 5 or less.
If it is harder than that, the contact area with the heat sink or the like cannot be sufficiently secured even if a tightening force is applied so as not to damage the heat-generating electronic components. It becomes difficult to express the high thermal conductivity of an excellent base material to a high degree. The preferred Asker C hardness is 30 or less, particularly 15 or less.
【００１１】このような基材の一例は、付加反応型シリ
コーンに窒化硼素粉末等の熱伝導性フィラーを１０〜７
０体積％、好ましくは２０〜６０体積％を充填し、固化
させることによって得ることができる。付加反応型シリ
コーンの具体例としては、一分子中にビニル基とＨ−Ｓ
ｉ基の両方を有する一液型のシリコーン又は末端あるい
は側鎖にビニル基を有するオルガノポリシロキサンと末
端あるいは側鎖に２個以上のＨ−Ｓｉ基を有するオルガ
ノポリシロキサンとの二液性のシリコーンなどをあげる
ことができる。この場合において、柔軟性は、シリコー
ンの架橋密度、熱伝導性フィラーの充填量によって調整
することができる。One example of such a base material is to add a thermally conductive filler such as boron nitride powder to
It can be obtained by filling and solidifying 0% by volume, preferably 20 to 60% by volume. Specific examples of the addition reaction type silicone include a vinyl group and an HS
One-part silicone having both i groups or two-part silicone comprising an organopolysiloxane having a vinyl group at the terminal or side chain and an organopolysiloxane having two or more H-Si groups at the terminal or side chain And so on. In this case, the flexibility can be adjusted by the crosslink density of the silicone and the filling amount of the thermally conductive filler.
【００１２】熱伝導性フィラーとしては、例えば窒化硼
素、窒化珪素、窒化アルミニウム、酸化アルミニウム、
マグネシア、炭化珪素、アルミニウム、銅、銀等から選
ばれた一種又は二種以上が使用される。As the heat conductive filler, for example, boron nitride, silicon nitride, aluminum nitride, aluminum oxide,
One or more selected from magnesia, silicon carbide, aluminum, copper, silver and the like are used.
【００１３】熱伝導性フィラーの形状は、破砕形状、球
状、粉状、繊維状、針状、鱗片状などの如何なるもので
もよく、その粒度は、平均粒径０．５〜１００μｍ程度
であることが好ましい。The shape of the heat conductive filler may be any shape such as a crushed shape, a spherical shape, a powdery shape, a fibrous shape, a needle shape, and a scale shape, and the average particle size is about 0.5 to 100 μm. Is preferred.
【００１４】本発明で使用される基材の厚みとしては、
０．５〜２０ｍｍが一般適である。また、その平面形状
は、三角形、四角形、五角形等の多角形、円形、楕円形
等のいずれであってもよい。The thickness of the substrate used in the present invention is as follows:
0.5 to 20 mm is generally suitable. The planar shape may be any of polygons such as a triangle, a quadrangle, and a pentagon, a circle, an ellipse, and the like.
【００１５】本発明の放熱部材は、基材の表面、裏面及
び／又は内部に、補強層を設けたことにおいては、従来
構造と同じであるが、その際、発熱性電子部品が基材と
接触する領域を少なくとも残し、しかもその領域からそ
の領域に対応する放熱方向側の反対面までの間には、い
かなる補強層をも形成させないで、補強層を設けたこと
が特徴である。The heat dissipating member of the present invention is the same as the conventional structure in that a reinforcing layer is provided on the front surface, the back surface, and / or the inside of the base material. The present invention is characterized in that a reinforcing layer is provided without leaving any contact layer, and without forming any reinforcing layer between the area and the opposite surface on the heat radiation direction side corresponding to the area.
【００１６】その補強層の形成位置の例としては、
（１）基材の表面及び／又は裏面に、発熱性電子部品と
基材とが接触する領域を残し、その領域からその領域に
対応する放熱方向側の反対面までの間には、いかなる補
強層をも形成させないで、基材周囲付近の表面、裏面及
び／又は内部の全体又は部分に補強層を設ける、（２）
発熱性電子部品の平面形状とほぼ同じか又はわずかに大
きな領域を基材の表面（又は裏面、又は表面と裏面）に
残し、残りの全ての表面（又は裏面、又は表面と裏面）
に設ける、（３）基材の内部のみに設けるが、その際、
発熱性電子部品の平面形状よりもわずかに大きな領域を
内部に設け、その領域からその領域に対応する放熱方向
側の表面及び裏面までの間にはいかなる補強層をも設け
ない、等である。Examples of the formation position of the reinforcing layer include:
(1) A region where the heat-generating electronic component and the substrate come into contact with each other is left on the front surface and / or the back surface of the substrate, and any reinforcement is provided between the region and the surface opposite to the heat radiation direction corresponding to the region. (2) providing a reinforcing layer on the whole or part of the surface, the back surface, and / or the inside in the vicinity of the substrate without forming any layer.
A region almost the same as or slightly larger than the planar shape of the heat-generating electronic component is left on the front surface (or the back surface, or the front and back surface) of the base material, and all the remaining front surfaces (or the back surface, or the front and back surfaces)
(3) It is provided only inside the base material.
For example, a region slightly larger than the planar shape of the heat-generating electronic component is provided inside, and no reinforcing layer is provided between the region and the front and back surfaces in the heat radiation direction corresponding to the region.
【００１７】補強層の厚みと材質については、特に制限
はなく、２０〜５００μｍ程度のＰＥＴ（ポリエチレン
テレフタレート）、ＰＥ（ポリエチレン）、ポリアミ
ド、ポリイミド、フッ素樹脂、ＰＥＩ（ポリエーテルイ
ミド）等の樹脂フィルム、銅、アルミニウム等の金属
箔、更には、熱伝導性フィラーの充填されたシリコーン
樹脂等の熱伝導性樹脂シート又はゴムシートである。The thickness and the material of the reinforcing layer are not particularly limited, and a resin film such as PET (polyethylene terephthalate), PE (polyethylene), polyamide, polyimide, fluororesin, PEI (polyetherimide) having a thickness of about 20 to 500 μm. , Copper, aluminum, and the like, and a heat conductive resin sheet or a rubber sheet such as a silicone resin filled with a heat conductive filler.
【００１８】本発明の放熱部材の製造方法の一例を示す
と、一液性のシリコーン又は末端あるいは側鎖にビニル
基を有するオルガノポリシロキサンと末端あるいは側鎖
に２個以上のＨ−Ｓｉ基を有するオルガノポリシロキサ
ンとの二液性のシリコーンに、窒化硼素粉末を混合して
スラリーを調整した後、該スラリーをドクターブレード
法により塗布した後、ベルト式乾燥機で加熱・固化して
基材を作製し、次いで、その表面に、発熱性電子部品の
平面積よりもわずかに大きな開口を打ち抜いた樹脂フィ
ルムを貼り付ける方法があげられる。An example of the method for producing the heat radiation member of the present invention is as follows. One-part silicone or an organopolysiloxane having a vinyl group at a terminal or side chain and two or more H-Si groups at a terminal or side chain are shown. After mixing a two-part silicone with an organopolysiloxane having a boron nitride powder to prepare a slurry, the slurry is applied by a doctor blade method, and then heated and solidified by a belt dryer to solidify the base material. A method in which the resin film is formed, and then a resin film having an opening slightly larger than the plane area of the heat-generating electronic component is punched on the surface thereof is used.
【００１９】基材を作製するためのスラリ−粘度として
は、ドクターブレード法の場合は１０万ｃｐｓ以下、押
出し法の場合は１０万ｃｐｓ以上であることが望まし
い。増粘に際しては、十〜数百μｍのシリコーン微粉や
アエロジル等の超微粉や等が使用される。The slurry viscosity for preparing the substrate is desirably 100,000 cps or less for the doctor blade method and 100,000 cps or more for the extrusion method. For thickening, tens to hundreds of μm of silicone fine powder or ultrafine powder such as Aerosil are used.
【００２０】[0020]
【実施例】以下、実施例と比較例をあげて更に具体的に
本発明を説明する。The present invention will be described more specifically below with reference to examples and comparative examples.
【００２１】実施例１〜２ Ａ液（ビニル基を有するオルガノポリシロキサン）とＢ
液（Ｈ−Ｓｉ基を有するオルガノポリシロキサン）の二
液性の付加反応型シリコーン（東レダウコーニング
（株）社製「商品名］ＳＥ−１８８５）をＡ液対Ｂ液の
混合比を表１に示す配合（体積％）で混合し、これに平
均粒子径１４μｍのアルミナ（住友化学（株））社製
「商品名ＡＳ−４０」）及び平均粒子径２８μｍの窒化
珪素粉（電気化学工業（株）製「商品名Ｆ−２」）を表
１に示す割合にて混合し、スラリーを調製した。Examples 1-2 Liquid A (organopolysiloxane having a vinyl group) and liquid B
Table 1 shows the mixing ratio of the two-component addition reaction type silicone (trade name SE-1885, manufactured by Toray Dow Corning Co., Ltd.) of the liquid (organopolysiloxane having an H-Si group) to the liquid A and the liquid B. And an alumina having an average particle size of 14 μm (“AS-40” manufactured by Sumitomo Chemical Co., Ltd.) and a silicon nitride powder having an average particle size of 28 μm (Denki Kagaku Kogyo Co., Ltd.) (Trade name: F-2) manufactured by the same company in the ratio shown in Table 1 to prepare a slurry.
【００２２】スラリーをドクターブレード法により、表
１に示す厚みに成形後、遠赤外乾燥機に入れ、１５０℃
で５分間加熱し、更に熱風乾燥機で１５０℃で２２時間
加熱してシリコーンを固化させた。After the slurry was formed into a thickness shown in Table 1 by a doctor blade method, the slurry was placed in a far-infrared dryer and heated at 150 ° C.
For 5 minutes and further heated at 150 ° C. for 22 hours with a hot air drier to solidify the silicone.
【００２３】次いで、中央部に発熱性電子部品の平面積
（１０×１０ｍｍ）よりも大きな開口（１５×１５ｍ
ｍ）を設けたＰＥＴフィルム（厚み０．１ｍｍ、外寸３
０×３０ｍｍ）に、上記固化物から打ち抜いて得られた
基材（外寸２５×２５ｍｍ）をアクリル系粘着材を用い
て貼り付け、本発明の電子部品の放熱部材を製造した。Next, an opening (15.times.15 m) larger than the plane area (10.times.10 mm) of the heat-generating electronic component is provided at the center.
m) with a PET film (thickness 0.1 mm, outer dimension 3)
(0 × 30 mm), a base material (outside dimensions: 25 × 25 mm) obtained by punching from the solidified material was adhered using an acrylic adhesive to produce a heat dissipation member for an electronic component of the present invention.
【００２４】比較例１ 実施例１で得られた基材そのものを放熱部材とした。Comparative Example 1 The substrate itself obtained in Example 1 was used as a heat radiation member.
【００２５】比較例２ 開口部を有さないＰＥＴフィルムを貼り付けたこと以外
は、実施例１と同様にして放熱部材を製造した。Comparative Example 2 A heat radiation member was manufactured in the same manner as in Example 1 except that a PET film having no opening was adhered.
【００２６】実施例３ 補強層として、ＰＥＴフィルムの代わりに、シリコーン
ゴムに窒化硼素粉末の充填された市販の放熱シート（電
気化学工業社製、商品名「Ｍ−２０」 厚み０．２ｍ
ｍ）に開口を設けたものを用いたこと以外は、実施例１
と同様にして放熱部材を製造した。Example 3 As a reinforcing layer, instead of a PET film, a commercially available heat dissipation sheet (trade name “M-20” manufactured by Denki Kagaku Kogyo Co., Ltd., 0.2 m in thickness) filled with boron nitride powder in silicone rubber.
Example 1 except that m) having an opening was used.
A heat radiation member was manufactured in the same manner as described above.
【００２７】上記で得られた放熱部材について、以下に
従う、圧縮率、熱伝導率、取扱い性を測定した。それら
の結果を表１に示す。With respect to the heat-dissipating member obtained above, the compressibility, thermal conductivity, and handleability were measured as described below. Table 1 shows the results.
【００２８】（１）圧縮率 放熱部材の中央部１ｃｍ2の部分（実施例においては補
強層のない部分）に、精密万能試験機（島津製作所社製
商品名「オートグラフ」）により、厚さ方向に１００ｇ
の荷重をかけ、（１）式により算出した。(1) Compression ratio The thickness of a 1 cm 2 portion (the portion without a reinforcing layer in the embodiment) of the central portion of the heat radiation member was measured by a precision universal testing machine (trade name “Autograph” manufactured by Shimadzu Corporation). 100g in the direction
Was applied, and calculated by the equation (1).
【００２９】[0029]
【数１】 (Equation 1)
【００３０】（２）熱伝導率 放熱部材の中央部（実施例においては補強層のない部
分）を、１２×１２×０．５ｍｍの突起を有する銅製ヒ
ーターケースと銅板とで挟み、放熱部材厚みの１０％を
圧縮した後、銅製ヒーターケースに電力５Ｗをかけて４
分間保持し、銅製ヒーターケースと銅板との温度差
（℃）を測定し、（２）式にて熱抵抗（℃／Ｗ）を算出
し、この熱抵抗値を用いて、（３）式にて熱伝導率（Ｗ
／ｍ・Ｋ）を算出した。(2) Thermal Conductivity The central portion of the heat dissipating member (the portion without the reinforcing layer in the embodiment) is sandwiched between a copper heater case having 12 × 12 × 0.5 mm projections and a copper plate. After compressing 10% of the copper, a 5 W
Hold for one minute, measure the temperature difference (° C) between the copper heater case and the copper plate, calculate the thermal resistance (° C / W) using equation (2), and use this thermal resistance value to calculate equation (3). Thermal conductivity (W
/ M · K) was calculated.
【００３１】[0031]
【数２】 (Equation 2)
【００３２】[0032]
【数３】 (Equation 3)
【００３３】（３）取扱い性 放熱部材を手で持ち上げて判定した。 ○：手で持ち上げても変形しない。 ×：手で持ち上げると変形する。(3) Handleability The heat radiation member was lifted up by hand and judged. ：: No deformation when lifted by hand. ×: Deformed when lifted by hand.
【００３４】[0034]
【表１】 [Table 1]
【００３５】[0035]
【発明の効果】本発明によれば、表面に補強層を有する
取扱い性の大なる放熱部材において、電子機器に組み込
む際の発熱性電子部品への負荷が小さく、高度な放熱特
性を実現することができる放熱部材が提供される。According to the present invention, in a heat-treating member having a reinforcing layer on the surface and having a large handleability, a load on a heat-generating electronic component when incorporated in an electronic device is small, and a high heat-dissipating characteristic is realized. The heat dissipating member which can be provided.
Claims (1)
熱基材の表面及び／又は裏面に、発熱性電子部品が上記
高柔軟性放熱基材と接触する領域を少なくとも残し、そ
の領域からその領域に対応する放熱方向側の反対面まで
の間には、いかなる補強層をも形成させないで、上記高
柔軟性放熱基材の表面、裏面及び／又は内部に補強層を
設けてなることを特徴とする電子部品の放熱部材。At least a region where the heat-generating electronic component comes into contact with the highly flexible heat radiating substrate is left on the surface and / or the back surface of the highly flexible heat radiating substrate having an Asker C hardness of 50 or less. The reinforcing layer is provided on the front surface, the back surface, and / or the inside of the high-flexibility heat-radiating base material without forming any reinforcing layer up to the surface opposite to the heat radiation direction side corresponding to the region. Heat dissipating member for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09230299A JP4101391B2 (en) | 1999-03-31 | 1999-03-31 | Heat dissipation member for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09230299A JP4101391B2 (en) | 1999-03-31 | 1999-03-31 | Heat dissipation member for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000286370A true JP2000286370A (en) | 2000-10-13 |
| JP4101391B2 JP4101391B2 (en) | 2008-06-18 |
Family
ID=14050627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09230299A Expired - Fee Related JP4101391B2 (en) | 1999-03-31 | 1999-03-31 | Heat dissipation member for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4101391B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000355654A (en) * | 1999-06-15 | 2000-12-26 | Denki Kagaku Kogyo Kk | Heat-conductive silicone molding and its use |
| JP2002299533A (en) * | 2001-03-29 | 2002-10-11 | Denki Kagaku Kogyo Kk | Heat radiation spacer |
| WO2008093440A1 (en) * | 2007-01-30 | 2008-08-07 | Denki Kagaku Kogyo Kabushiki Kaisha | Led light source unit |
| JPWO2007139195A1 (en) * | 2006-05-31 | 2009-10-15 | 電気化学工業株式会社 | LED light source unit |
| JP2011206079A (en) * | 2010-03-26 | 2011-10-20 | Fujifilm Corp | Imaging unit and endoscope |
| JP2016121341A (en) * | 2014-12-25 | 2016-07-07 | デクセリアルズ株式会社 | Production method of heat-conductive sheet, heat-conductive sheet, and semiconductor device |
| WO2023190440A1 (en) * | 2022-03-29 | 2023-10-05 | デンカ株式会社 | Two-pack type curable composition set, cured product and electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07266356A (en) * | 1994-03-29 | 1995-10-17 | Shin Etsu Chem Co Ltd | Heat conductive composite sheet |
| JPH08204072A (en) * | 1995-01-24 | 1996-08-09 | Mitsutoyo Corp | Device for cooling electronic parts |
| JPH091738A (en) * | 1995-06-22 | 1997-01-07 | Shin Etsu Chem Co Ltd | Thermally conductive composite silicone rubber sheet |
| JPH09296114A (en) * | 1996-04-30 | 1997-11-18 | Denki Kagaku Kogyo Kk | Silicone rubber composition and its use |
| JPH10308485A (en) * | 1997-04-28 | 1998-11-17 | Hewlett Packard Co <Hp> | Composite heat interface assembly |
| JPH1187958A (en) * | 1997-09-11 | 1999-03-30 | Denki Kagaku Kogyo Kk | Cooling spacer |
| JP2000204259A (en) * | 1999-01-11 | 2000-07-25 | Shin Etsu Chem Co Ltd | Heat radiation member |
| JP2000256558A (en) * | 1999-03-11 | 2000-09-19 | Shin Etsu Chem Co Ltd | Thermoconductive silicone rubber composition and its production |
-
1999
- 1999-03-31 JP JP09230299A patent/JP4101391B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07266356A (en) * | 1994-03-29 | 1995-10-17 | Shin Etsu Chem Co Ltd | Heat conductive composite sheet |
| JPH08204072A (en) * | 1995-01-24 | 1996-08-09 | Mitsutoyo Corp | Device for cooling electronic parts |
| JPH091738A (en) * | 1995-06-22 | 1997-01-07 | Shin Etsu Chem Co Ltd | Thermally conductive composite silicone rubber sheet |
| JPH09296114A (en) * | 1996-04-30 | 1997-11-18 | Denki Kagaku Kogyo Kk | Silicone rubber composition and its use |
| JPH10308485A (en) * | 1997-04-28 | 1998-11-17 | Hewlett Packard Co <Hp> | Composite heat interface assembly |
| JPH1187958A (en) * | 1997-09-11 | 1999-03-30 | Denki Kagaku Kogyo Kk | Cooling spacer |
| JP2000204259A (en) * | 1999-01-11 | 2000-07-25 | Shin Etsu Chem Co Ltd | Heat radiation member |
| JP2000256558A (en) * | 1999-03-11 | 2000-09-19 | Shin Etsu Chem Co Ltd | Thermoconductive silicone rubber composition and its production |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000355654A (en) * | 1999-06-15 | 2000-12-26 | Denki Kagaku Kogyo Kk | Heat-conductive silicone molding and its use |
| JP2002299533A (en) * | 2001-03-29 | 2002-10-11 | Denki Kagaku Kogyo Kk | Heat radiation spacer |
| JP4574885B2 (en) * | 2001-03-29 | 2010-11-04 | 電気化学工業株式会社 | Heat dissipation spacer |
| JPWO2007139195A1 (en) * | 2006-05-31 | 2009-10-15 | 電気化学工業株式会社 | LED light source unit |
| WO2008093440A1 (en) * | 2007-01-30 | 2008-08-07 | Denki Kagaku Kogyo Kabushiki Kaisha | Led light source unit |
| JP5410098B2 (en) * | 2007-01-30 | 2014-02-05 | 電気化学工業株式会社 | LED light source unit |
| JP2011206079A (en) * | 2010-03-26 | 2011-10-20 | Fujifilm Corp | Imaging unit and endoscope |
| JP2016121341A (en) * | 2014-12-25 | 2016-07-07 | デクセリアルズ株式会社 | Production method of heat-conductive sheet, heat-conductive sheet, and semiconductor device |
| WO2023190440A1 (en) * | 2022-03-29 | 2023-10-05 | デンカ株式会社 | Two-pack type curable composition set, cured product and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4101391B2 (en) | 2008-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3976166B2 (en) | PDP panel | |
| JP3480459B2 (en) | Graphite sheet | |
| JP3654743B2 (en) | Heat dissipation spacer | |
| JP5134693B2 (en) | Thermally conductive and conductive interconnect structure | |
| JP2007311770A (en) | Semiconductor device | |
| JP2005150249A (en) | Heat conductive member and heat radiating structure using the same | |
| JP2000286370A (en) | Heat radiation member of electronic component | |
| CN111615746A (en) | Power electronic module and method of manufacturing a power electronic module | |
| JP3401107B2 (en) | Package IC module | |
| JPH07162177A (en) | Radiator | |
| JP3178805B2 (en) | Heat radiation spacer | |
| JP2009076657A (en) | Thermal conductive sheet | |
| JP3283454B2 (en) | Heat radiation spacer | |
| JP2000355654A (en) | Heat-conductive silicone molding and its use | |
| JP4749631B2 (en) | Heat dissipation member | |
| JP4514344B2 (en) | Thermally conductive resin molding and its use | |
| JP2003060140A (en) | Heat sink and heat radiation device | |
| JP3183502B2 (en) | Heat radiation spacer | |
| JP2001160606A (en) | Heat dissipating sheet and its manufacturing method | |
| JP3563590B2 (en) | Heat radiation spacer | |
| JP2004096034A (en) | Method of manufacturing module structure, circuit board and method of fixing the same | |
| JP3640524B2 (en) | Heat dissipation spacer | |
| JP4447155B2 (en) | Electromagnetic wave suppression heat conduction sheet | |
| JP3092699B2 (en) | Heat radiation spacer, its use and silicone composition | |
| JP3558548B2 (en) | Resin molding, method of manufacturing the same, and heat radiating member for electronic component using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060221 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060911 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080220 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080319 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120328 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130328 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140328 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |