JP2000277644A - Manufacture of optical semiconductor element housing package - Google Patents
Manufacture of optical semiconductor element housing packageInfo
- Publication number
- JP2000277644A JP2000277644A JP11080524A JP8052499A JP2000277644A JP 2000277644 A JP2000277644 A JP 2000277644A JP 11080524 A JP11080524 A JP 11080524A JP 8052499 A JP8052499 A JP 8052499A JP 2000277644 A JP2000277644 A JP 2000277644A
- Authority
- JP
- Japan
- Prior art keywords
- fixing member
- metal fixing
- plating layer
- base
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光半導体素子を収容
するための光半導体素子収納用パッケージに関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element.
【０００２】[0002]
【従来の技術】従来、光半導体素子を収容するための光
半導体素子収納用パッケージは、一般に酸化アルミニウ
ム質焼結体等のセラミックス材から成り、上面に光半導
体素子を収容するための凹部を有する基体と、該基体の
側部に形成された貫通孔と、前記基体の貫通孔周辺の外
表面にロウ付け取着され、内部に光信号が伝達される空
間を有する鉄ーニッケル合金（鉄：５０重量％、ニッケ
ル：５０重量％）等の金属材料から成る筒状の固定部材
と、前記筒状固定部材の内部にガラスを介して取着され
た筒状固定部材の内部を塞ぐ透光性部材と、前記基体の
凹部内側から外表面にかけて被着導出されているタング
ステンやモリブデン、マンガン等から成り、光半導体素
子の電極がボンディングワイヤ等の電気的接続手段を介
して接続される複数個の配線導体層と、前記基体の上面
に取着され、前記凹部を塞ぐ蓋体とから構成されてお
り、前記基体の凹部内に光半導体素子をガラス、樹脂、
ロウ材等の接着剤を介して接着固定するとともに該光半
導体素子の各電極をボンディングワイヤ等の電気的接続
手段を介して配線導体層に電気的に接続し、しかる後、
前記基体の上面に蓋体をガラス、樹脂、ロウ材等から成
る封止材を介して接合させ、基体と蓋体とから成る容器
内部に光半導体素子を気密に収容するとともに筒状固定
部材に光ファイバー部材をＹＡＧ等のレーザー光線を使
用して溶接接続させることによって製品としての光半導
体装置となる。2. Description of the Related Art Conventionally, an optical semiconductor element housing package for housing an optical semiconductor element is generally made of a ceramic material such as an aluminum oxide sintered body and has a concave portion for housing the optical semiconductor element on an upper surface. An iron-nickel alloy (iron: 50) which has a base, a through hole formed in a side portion of the base, and a space which is brazed and attached to an outer surface around the through hole of the base and has a space for transmitting an optical signal therein. (Weight%, nickel: 50% by weight) or the like, and a translucent member for closing the inside of the cylindrical fixing member attached to the inside of the cylindrical fixing member via glass. And tungsten, molybdenum, manganese, etc., which are attached and led from the inside of the concave portion to the outer surface of the base, and the electrodes of the optical semiconductor element are connected via electrical connection means such as bonding wires. Pieces of the wiring conductor layer, is attached to the upper surface of the substrate, are composed of a lid for closing said recess, glass optical semiconductor elements in a recess of the base body resin,
Each electrode of the optical semiconductor element is electrically connected to a wiring conductor layer via an electrical connection means such as a bonding wire while being fixedly adhered through an adhesive such as a brazing material, and thereafter,
A lid is bonded to the upper surface of the base via a sealing material made of glass, resin, brazing material, or the like, and the optical semiconductor element is hermetically accommodated inside a container formed of the base and the lid, and is attached to the cylindrical fixing member. An optical semiconductor device as a product is obtained by welding and connecting the optical fiber member using a laser beam such as YAG.
【０００３】かかる光半導体装置は外部電気回路から供
給される駆動信号に基づいて光半導体素子に所定の光励
起を起こさせ、該励起した光を透光性部材を介し光ファ
イバー部材に授受させるとともに該光ファイバー部材の
光ファイバー内を伝達させることによって高速通信等に
使用される。In such an optical semiconductor device, a predetermined optical excitation is caused in an optical semiconductor element based on a drive signal supplied from an external electric circuit, and the excited light is transmitted to and received from an optical fiber member through a light transmitting member. It is used for high-speed communication and the like by transmitting the light through the optical fiber of the member.
【０００４】また上述の光半導体素子収納用パッケージ
は、筒状固定部材の基体へのロウ付け取着が下記の方法
によって行われている。即ち、 （１）まず筒状固定部材の表面に、基体へのロウ付け取
着を確実、強固とするためにニッケルめっき層及び金め
っき層を順次被着させる。In the above-mentioned package for housing an optical semiconductor element, the cylindrical fixing member is brazed to the base by the following method. That is, (1) First, a nickel plating layer and a gold plating layer are sequentially applied on the surface of the cylindrical fixing member in order to securely and firmly attach to the base by brazing.
【０００５】前記ニッケルめっき層は筒状固定部材への
金めっき層の被着を強固とするための下地部材であり、
電解めっき法や無電解めっき法を採用することによって
筒状固定部材の外表面に約０．５〜５μｍの厚みに被着
される。The nickel plating layer is a base member for firmly attaching the gold plating layer to the cylindrical fixing member,
By adopting the electrolytic plating method or the electroless plating method, it is attached to the outer surface of the cylindrical fixing member to a thickness of about 0.5 to 5 μm.
【０００６】また前記金めっき層は筒状固定部材に対す
るロウ材の濡れ性を良好とする作用をなし、電解めっき
法や無電解めっき法を採用することによってニッケルめ
っき層上に約１〜３μｍの厚みに被着される。The gold plating layer has an effect of improving the wettability of the brazing material to the cylindrical fixing member, and is formed on the nickel plating layer by an electrolytic plating method or an electroless plating method. Deposited in thickness.
【０００７】（２）次に前記筒状固定部材の内部に透光
性部材をガラスを介して取着し、筒状固定部材の内部を
塞ぐ。(2) Next, a translucent member is attached to the inside of the cylindrical fixing member via glass, and the inside of the cylindrical fixing member is closed.
【０００８】前記筒状固定部材への透光性部材の取着は
筒状固定部材の内部に透光性部材の融点より低い融点を
有する、例えば、低融点ハンダガラスを塗布するととも
に該塗布した低融点ハンダガラス上に透光性部材を載置
し、しかる後、これを大気中、約４５０℃の温度に加熱
し、低融点ガラスを溶融させることによって行われる。The light-transmitting member is attached to the cylindrical fixing member by applying a low-melting point solder glass having a melting point lower than the melting point of the light-transmitting member, for example, to the inside of the cylindrical fixing member. This is performed by placing a light-transmissive member on low-melting-point solder glass and then heating it to a temperature of about 450 ° C. in air to melt the low-melting-point glass.
【０００９】（３）そして最後に前記基体の貫通孔周辺
の外表面に金―錫合金等からなる低融点ロウ材を介して
筒状固定部材をロウ付け取着し、これによって製品とし
ての光半導体素子収納用パッケージが完成する。(3) Finally, a cylindrical fixing member is brazed and attached to the outer surface of the substrate around the through hole through a low melting point brazing material made of a gold-tin alloy or the like. The package for housing the semiconductor element is completed.
【００１０】前記基体への筒状固定部材のロウ付けは基
体の貫通孔周辺の外表面に筒状固定部材を、間に金―錫
合金（金：８０重量％、錫：２０重量％）等からなる低
融点ロウ材を挟んで載置し、しかる後、これを約３００
℃の温度に加熱し、低融点ロウ材を溶融させることによ
って行われる。[0010] The cylindrical fixing member is brazed to the base by mounting the cylindrical fixing member on the outer surface around the through-hole of the base, with a gold-tin alloy (gold: 80% by weight, tin: 20% by weight) or the like. Is placed with a low melting point brazing material consisting of
It is performed by heating to a temperature of ° C. to melt the low melting point brazing material.
【００１１】[0011]
【発明が解決しようとする課題】しかしながら、この従
来の光半導体素子収納用パッケージの製造方法において
は、筒状固定部材の内部に透光性部材をガラスを介して
取着させる際、ガラス付けの熱及び雰囲気によって筒状
固定部材の外表面に被着されているニッケルめっき層の
一部が金めっき層中を拡散するとともに金めっき層表面
に露出し、これが酸化されて金めっき層表面に酸化ニッ
ケルが多量に形成されていまい、その結果、前記酸化ニ
ッケルはロウ材との濡れ性が悪いことから筒状固定部材
に対するロウ材の接合強度が大幅に低下し、基体に筒状
固定部材を強固にロウ付け取着することができないとい
う欠点を有していた。However, in this conventional method of manufacturing a package for housing an optical semiconductor element, when a light-transmitting member is attached to the inside of a cylindrical fixing member via glass, the glass is attached. Due to heat and atmosphere, part of the nickel plating layer adhered to the outer surface of the cylindrical fixing member diffuses in the gold plating layer and is exposed on the gold plating layer surface, and is oxidized and oxidized on the gold plating layer surface. A large amount of nickel may be formed. As a result, since the nickel oxide has poor wettability with the brazing material, the joining strength of the brazing material to the cylindrical fixing member is significantly reduced, and the cylindrical fixing member is firmly attached to the base. Has the disadvantage that it cannot be brazed and attached.
【００１２】そこで上記欠点を解消するために筒状固定
部材の内部に透光性部材をガラスを介して取着させた後
に筒状固定部材の表面にニッケルめっき層及び金めっき
層を順次被着させることが考えられる。In order to solve the above-mentioned drawback, a translucent member is attached to the inside of the cylindrical fixing member via glass, and then a nickel plating layer and a gold plating layer are sequentially deposited on the surface of the cylindrical fixing member. It is possible to make it.
【００１３】しかしながら、前記筒状固定部材の内部に
透光性部材を取着させるガラスは低融点ハンダガラスで
あり、該低融点ハンダガラスは耐薬品性に劣ることから
筒状固定部材の内部に透光性部材をガラスを介して取着
させた後、筒状固定部材の表面にニッケルめっき層及び
金めっき層を被着させるとガラスがめっき液の薬品によ
って溶け、その結果、透光性部材が筒状固定部材より外
れてしまうという欠点が誘発される。However, the glass for attaching the translucent member inside the cylindrical fixing member is a low melting point solder glass, and since the low melting point solder glass is inferior in chemical resistance, the glass is fixed inside the cylindrical fixing member. After attaching the translucent member via the glass, and then applying a nickel plating layer and a gold plating layer on the surface of the cylindrical fixing member, the glass is melted by the chemical of the plating solution, and as a result, the translucent member Is detached from the cylindrical fixing member.
【００１４】本発明は上記欠点に鑑み案出されたもの
で、その目的は基体に筒状固定部材を強固にロウ付け取
着し、信頼性を極めて高いものとなした光半導体素子収
納用パッケージの製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to provide a highly reliable optical semiconductor device housing package in which a cylindrical fixing member is firmly brazed and attached to a base. It is to provide a manufacturing method of.
【００１５】[0015]
【課題を解決するための手段】本発明は、上面に光半導
体素子を収容するための凹部を有する基体と、該基体の
側部に形成された貫通孔と、前記基体の貫通孔周辺の外
表面にロウ付けされ、一端に光ファイバー部材が接続さ
れる筒状の金属製固定部材と、前記筒状の金属製固定部
材の内部に取着され、金属製固定部材の内部を塞ぐ透光
性部材と、前記基体の上面に取着され、前記凹部を塞ぐ
蓋体とから成る光半導体素子収納用パッケージであっ
て、前記筒状の金属製固定部材が下記（ａ）乃至（ｄ）
の工程によって基体の貫通孔周辺の外表面にロウ付けさ
れていることを特徴とするものである。According to the present invention, there is provided a base having a concave portion for accommodating an optical semiconductor element on an upper surface, a through hole formed in a side portion of the base, and an outer portion around the through hole of the base. A cylindrical metal fixing member brazed to the surface and having one end connected to an optical fiber member; and a translucent member attached to the inside of the cylindrical metal fixing member and closing the inside of the metal fixing member. And a lid attached to the upper surface of the base and closing the recess, wherein the cylindrical metal fixing member is formed of the following (a) to (d).
Is brazed to the outer surface around the through-hole of the substrate by the step of.
【００１６】（ａ）金属製固定部材の内部に透光性部材
をガラスを介して取着する工程と、（ｂ）前記ガラスの
露出面を保護膜で被覆する工程と、（ｃ）筒状の金属製
固定部材の露出表面にニッケルめっき層と金めっき層を
順次被着させる工程と、（ｄ）金属製固定部材を基体の
貫通孔周辺の外表面にロウ材を介してロウ付け取着する
工程。(A) attaching a translucent member to the inside of the metal fixing member via glass; (b) covering the exposed surface of the glass with a protective film; (C) sequentially depositing a nickel plating layer and a gold plating layer on the exposed surface of the metal fixing member, and (d) brazing the metal fixing member to the outer surface around the through hole of the base via a brazing material. Process.
【００１７】本発明の光半導体素子収納用パッケージの
製造方法によれば、金属製固定部材の内部に透光性部材
を取着しているガラスの露出表面を保護膜で被覆したこ
とから透光性部材がガラスを介して取着されている金属
製固定部材の表面にニッケルめっき層及び金めっき層を
順次被着させたとしてもガラスは前記保護膜により保護
されていることからめっき液の薬品によって溶けること
はなく、また金属製固定部材の内部に透光性部材を取着
した後に金属製固定部材の表面にニッケルめっき層及び
金めっき層を被着させたことから金めっき層表面にニッ
ケルめっき層の一部が拡散露出し、これが酸化されて酸
化ニッケルを形成することはなく、その結果、金属製固
定部材への透光性部材の取着強度が強固となり、かつ金
めっき層のロウ材に対する濡れ性が良好となって、透光
性部材が取着されている筒状の金属製固定部材を基体に
極めて強固にロウ付け取着することが可能となる。According to the method of manufacturing a package for housing an optical semiconductor element of the present invention, the exposed surface of the glass having the light-transmitting member attached inside the metal fixing member is covered with the protective film. Even if a nickel plating layer and a gold plating layer are sequentially applied to the surface of a metal fixing member to which a conductive member is attached via glass, the glass is protected by the protective film. After the translucent member was attached to the inside of the metal fixing member, the nickel plating layer and the gold plating layer were applied to the surface of the metal fixing member. A portion of the plating layer is diffused and exposed, and is not oxidized to form nickel oxide. As a result, the strength of the light-transmitting member attached to the metal fixing member is increased, and the brazing of the gold plating layer is performed. Lumber Against becoming wettability improved, it is possible to very firmly brazed attaching a cylindrical metal securing member translucent member is attached to the substrate.
【００１８】[0018]
【発明の実施の形態】次に、本発明を添付図面に基づき
詳細に説明する。図１乃至図４は本発明の製造方法によ
って作製された光半導体素子収納用パッケージの一実施
例を示し、１は基体、２は蓋体である。この基体１と蓋
体２とで内部に光半導体素子３を収容するための容器が
構成される。Next, the present invention will be described in detail with reference to the accompanying drawings. 1 to 4 show an embodiment of an optical semiconductor element housing package manufactured by the manufacturing method of the present invention, wherein 1 is a base, and 2 is a lid. The base 1 and the lid 2 constitute a container for housing the optical semiconductor element 3 therein.
【００１９】前記基体１はその上面に光半導体素子３を
収容するための空所を形成する凹部１ａが設けてあり、
該凹部１ａ底面には光半導体素子３が搭載固定される。The base 1 is provided on its upper surface with a concave portion 1a forming a space for accommodating the optical semiconductor element 3,
The optical semiconductor element 3 is mounted and fixed on the bottom surface of the concave portion 1a.
【００２０】前記基体１は、例えば、酸化アルミニウム
質焼結体等のセラミックスより成り、酸化アルミニウ
ム、酸化珪素、酸化マグネシウム、酸化カルシウム等の
原料粉末に適当な有機バインダー、溶剤等を添加混合し
て泥漿物を作るとともに、該泥漿物をドクターブレード
法やカレンダーロール法を採用することによってセラミ
ックグリーンシート（セラミック生シート）となし、し
かる後、前記セラミックグリーンシートに適当な打ち抜
き加工を施すとともにこれを複数枚積層し、約１５００
℃の温度で焼成することによって製作される。The base 1 is made of, for example, ceramics such as an aluminum oxide sintered body, and is mixed with a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide by adding an appropriate organic binder, a solvent, and the like. The slurry is made into a ceramic green sheet (ceramic green sheet) by employing a doctor blade method or a calender roll method, and then the ceramic green sheet is subjected to an appropriate punching process, and then the slurry is formed. Laminate multiple sheets, about 1500
It is manufactured by firing at a temperature of ° C.
【００２１】また前記基体１は凹部１ａの内面から基体
１の外側面にかけて複数個の配線層４が被着形成されて
おり、該配線層４の凹部１ａ内に露出する領域には光半
導体素子３の各電極がボンディングワイヤ５を介して電
気的に接続され、また基体１の外側面に形成されている
領域には外部電気回路と接続される外部リード端子６が
銀ロウ等のロウ材を介してロウ付け取着されている。A plurality of wiring layers 4 are formed on the substrate 1 from the inner surface of the concave portion 1a to the outer surface of the substrate 1, and a region of the wiring layer 4 exposed in the concave portion 1a has an optical semiconductor element. 3 are electrically connected to each other through bonding wires 5, and external lead terminals 6 connected to an external electric circuit are made of a brazing material such as silver brazing in a region formed on the outer surface of the base 1. It is attached via brazing.
【００２２】前記配線層４は光半導体素子３の各電極を
外部電気回路に接続する際の導電路として作用し、タン
グステンやモリブデン、マンガン等の高融点金属粉末に
より形成されている。The wiring layer 4 functions as a conductive path for connecting each electrode of the optical semiconductor element 3 to an external electric circuit, and is formed of a high melting point metal powder such as tungsten, molybdenum, and manganese.
【００２３】前記配線層４は、例えば、タングステンや
モリブデン、マンガン等の高融点金属粉末に適当な有機
バインダー、溶剤等を添加混合して得た金属ペーストを
基体１となるセラミックグリーンシートに予め従来周知
のスクリーン印刷法により所定パターンに印刷塗布して
おくことによって基体１の凹部１ａ内から基体１の外側
面にかけて被着形成される。The wiring layer 4 is formed by adding a metal paste obtained by adding a suitable organic binder, a solvent, and the like to a high melting point metal powder such as tungsten, molybdenum, manganese, or the like to a ceramic green sheet serving as the base 1 beforehand. By printing and applying a predetermined pattern by a well-known screen printing method, the coating is formed from the inside of the concave portion 1 a of the base 1 to the outer surface of the base 1.
【００２４】また前記配線層４はその露出する表面にニ
ッケル、金等の耐蝕性に優れ、かつロウ材との濡れ性に
優れる金属を１μｍ乃至２０μｍの厚みにメッキ法によ
り被着させておくと、配線層４の酸化腐蝕を有効に防止
することができるとともに配線層４への外部リード端子
６のロウ付けを強固となすことができる。従って、前記
配線層４はその露出する表面にニッケル、金等の耐蝕性
に優れ、かつロウ材との濡れ性に優れる金属を１μｍ乃
至２０μｍの厚みに被着させておくことが好ましい。The wiring layer 4 is preferably provided with a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with a brazing material to a thickness of 1 μm to 20 μm by a plating method on the exposed surface. In addition, the oxidation corrosion of the wiring layer 4 can be effectively prevented, and the brazing of the external lead terminals 6 to the wiring layer 4 can be firmly performed. Therefore, it is preferable that a metal having excellent corrosion resistance, such as nickel and gold, and excellent in wettability with a brazing material is applied to the exposed surface of the wiring layer 4 to a thickness of 1 μm to 20 μm.
【００２５】更に前記配線層４には外部リード端子６が
銀ロウ等のロウ材を介してロウ付け取着されており、該
外部リード端子６は容器内部に収容する光半導体素子３
の各電極を外部電気回路に電気的に接続する作用をな
し、外部リード端子６を外部電気回路に接続することに
よって容器内部に収容される光半導体素子３は配線層４
及び外部リード端子６を介して外部電気回路に接続され
ることとなる。Further, an external lead terminal 6 is attached to the wiring layer 4 by brazing via a brazing material such as silver brazing, and the external lead terminal 6 is connected to the optical semiconductor element 3 contained in the container.
The optical semiconductor element 3 accommodated in the container by connecting the external lead terminals 6 to the external electric circuit is electrically connected to the external electric circuit.
And the external lead terminal 6 is connected to an external electric circuit.
【００２６】前記外部リード端子６は鉄ーニッケルーコ
バルト合金や鉄ーニッケル合金等の金属材料からなり、
例えば、鉄ーニッケルーコバルト合金等の金属材料から
成るインゴット（塊）に圧延加工法や打ち抜き加工法
等、従来周知の金属加工法を施すことによって所定の形
状に形成される。The external lead terminal 6 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy.
For example, an ingot made of a metal material such as an iron-nickel-cobalt alloy is formed into a predetermined shape by applying a conventionally known metal working method such as a rolling method or a punching method.
【００２７】前記外部リード端子６はまたその露出する
表面にニッケル、金等の耐蝕性に優れ、かつロウ材との
濡れ性に優れる金属を１μｍ乃至２０μｍの厚みにメッ
キ法により被着させておくと、外部リード端子６の酸化
腐蝕を有効に防止することができるとともに外部リード
端子６を外部電気回路に接続する際、その接続を確実、
強固となすことができる。従って、前記外部リード端子
６はその露出する表面にニッケル、金等の耐蝕性に優
れ、かつロウ材との濡れ性に優れる金属を１μｍ乃至２
０μｍの厚みに被着させておくことが好ましい。The external lead terminal 6 is coated with a metal having excellent corrosion resistance and excellent wettability with a brazing material to a thickness of 1 μm to 20 μm by a plating method on the exposed surface thereof. In addition, when the external lead terminal 6 is connected to an external electric circuit, the connection can be reliably prevented.
It can be made strong. Therefore, the external lead terminal 6 is made of a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with a brazing material of 1 μm to 2 μm on the exposed surface.
Preferably, it is applied to a thickness of 0 μm.
【００２８】前記外部リード端子６が取着された基体１
はまたその側部に貫通孔１ｂが形成されており、貫通孔
１ｂには筒状の金属製固定部材８が挿入固定され、更に
金属製固定部材８の内側の一部には透光性部材９が取着
されている。The base 1 on which the external lead terminals 6 are attached
Further, a through hole 1b is formed in a side portion thereof. A cylindrical metal fixing member 8 is inserted and fixed in the through hole 1b, and a translucent member is further provided in a part of the inside of the metal fixing member 8. 9 is attached.
【００２９】前記基体１の側部に形成されている貫通孔
１ｂは、例えば、基体１となるセラミッググリーンシー
トに予め打ち抜き加工法により孔を形成しておくことに
よって、或いは基体１の側部に孔あけ加工を施すことに
よって基体１の側部に所定形状に形成される。The through-hole 1b formed in the side of the base 1 may be formed, for example, by forming a hole in a ceramic green sheet to be the base 1 in advance by a punching method, or Is formed into a predetermined shape on the side portion of the base 1 by performing a drilling process.
【００３０】また前記基体１の外側面で貫通孔１ｂの周
辺には筒状の金属製固定部材８が取着されており、該金
属製固定部材８は、光ファイバー部材１１を基体１に固
定する際の下地固定部材として作用するとともに光半導
体素子３が励起した光を光ファイバー部材１１に伝達さ
せる作用をなし、鉄ーニッケルーコバルト合金や鉄ーニ
ッケル合金等の金属材料で形成されている。A cylindrical metal fixing member 8 is attached to the outer surface of the base 1 around the through hole 1b, and the metal fixing member 8 fixes the optical fiber member 11 to the base 1. It functions as a base fixing member at the time and transmits light excited by the optical semiconductor element 3 to the optical fiber member 11, and is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy.
【００３１】なお、前記金属製固定部材８は、例えば、
鉄ーニッケルーコバルト合金等のインゴット（塊）をプ
レス加工により筒状とすることによって形成される。The metal fixing member 8 is, for example,
It is formed by forming an ingot (lump) such as an iron-nickel-cobalt alloy into a tubular shape by press working.
【００３２】また前記金属製固定部材８の基体１外側面
への取着は、基体１の外側面で貫通孔１ｂの周辺に予め
タングステンやモリブデン等からなる金属層を被着させ
ておき、該金属層に筒状の金属製固定部材８に設けたフ
ランジをロウ付けすることによって行われる。In attaching the metal fixing member 8 to the outer surface of the base 1, a metal layer made of tungsten, molybdenum, or the like is previously applied to the outer surface of the base 1 around the through hole 1b. This is performed by brazing a flange provided on the cylindrical metal fixing member 8 to the metal layer.
【００３３】更に前記筒状の金属製固定部材８は、その
内側の一部に透光性部材９が取着されており、該透光性
部材９は金属製固定部材８の内側を塞ぎ、基体１と蓋体
２とからなる容器の気密封止を保持させるとともに金属
製固定部材８の内部空間を伝達する光半導体素子３の励
起した光をそのまま金属製固定部材８に取着接続される
光ファイバー部材１１に伝達させる作用をなす。Further, a light-transmitting member 9 is attached to a part of the inside of the cylindrical metal fixing member 8, and the light-transmitting member 9 closes the inside of the metal fixing member 8. Light excited by the optical semiconductor element 3 that transmits the internal space of the metal fixing member 8 is attached and connected to the metal fixing member 8 as it is while maintaining the hermetic sealing of the container including the base 1 and the lid 2. It functions to transmit the light to the optical fiber member 11.
【００３４】前記透光性部材９は、例えば、酸化珪素、
酸化鉛を主成分とした鉛系及びホウ酸、ケイ砂を主成分
としたホウケイ酸系の非晶質ガラスで形成されており、
該非晶質ガラスは結晶軸が存在しないことから光半導体
素子３の励起する光を透光性部材９を通過させて光ファ
イバー部材１１に授受させる場合、光半導体素子３の励
起した光は透光性部材９で複屈折を起こすことはなくそ
のまま光ファイバー部材１１に授受されることとなり、
その結果、光半導体素子３が励起した光の光ファイバー
部材１１への授受が高効率となって光信号の伝送効率を
高いものとなすことができる。The light transmitting member 9 is made of, for example, silicon oxide,
It is made of lead-based and boric acid containing lead oxide as a main component, and borosilicate-based amorphous glass containing silica sand as a main component.
Since the amorphous glass has no crystal axis, the light excited by the optical semiconductor element 3 is transmitted and received by the optical fiber member 11 through the light transmitting member 9. The birefringence does not occur in the member 9 and is transmitted and received to the optical fiber member 11 as it is,
As a result, the transmission and reception of the light excited by the optical semiconductor element 3 to and from the optical fiber member 11 becomes high, and the transmission efficiency of the optical signal can be made high.
【００３５】前記筒状の金属製固定部材８は更にその外
側の一端に光ファイバー部材１１に取着されているフラ
ンジがＹＡＧ等のレーザー光線を使用して溶接され、こ
れによって光半導体素子３に光信号を伝達するための光
ファイバー部材１１が基体１に固定されることとなる。The flange fixed to the optical fiber member 11 is welded to the outer end of the cylindrical metal fixing member 8 using a laser beam such as YAG. The optical fiber member 11 for transmitting the light is fixed to the base 1.
【００３６】また更に前記基体１の上面には、例えば、
鉄ーニッケルーコバルト合金や鉄ーニッケル合金等の金
属材料から成る蓋体２が接合され、これによって基体１
と蓋体２とからなる容器の内部に光半導体素子３が気密
に封止されることとなる。Further, on the upper surface of the substrate 1, for example,
A lid 2 made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy is joined, and
The optical semiconductor element 3 is hermetically sealed inside a container formed of the cover 2 and the cover 2.
【００３７】前記蓋体２は、例えば、鉄ーニッケルーコ
バルト合金等のインゴット（塊）に圧延加工法や打ち抜
き加工法等、従来周知の金属加工法を施すことによって
所定の形状に形成される。The lid 2 is formed in a predetermined shape by subjecting an ingot such as an iron-nickel-cobalt alloy to a conventionally known metal working method such as a rolling method or a punching method. .
【００３８】かくして本発明の光半導体素子収納用パッ
ケージによれば、基体１の凹部１ａに光半導体素子３を
載置固定するとともに光半導体素子３の各電極をボンデ
イングワイヤ５を介して配線層４に電気的に接続し、次
に基体１の上面に蓋体２を接合させ、基体１と蓋体２と
から成る容器内部に光半導体素子３を収容し、最後に基
体１に取着させた筒状の金属製固定部材８に光ファイバ
ー部材１１を取着接続させることによって最終製品とし
ての光半導体装置となる。Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element 3 is placed and fixed in the concave portion 1a of the base 1, and each electrode of the optical semiconductor element 3 is connected to the wiring layer 4 via the bonding wire 5. Then, the lid 2 was joined to the upper surface of the base 1, and the optical semiconductor element 3 was accommodated in a container composed of the base 1 and the lid 2, and finally attached to the base 1. By attaching and connecting the optical fiber member 11 to the tubular metal fixing member 8, an optical semiconductor device as a final product is obtained.
【００３９】かかる光半導体装置は外部電気回路から供
給される駆動信号に基づいて光半導体素子３に所定の光
励起を起こさせ、該励起した光を透光性部材９を介し光
ファイバー部材１１に授受させるとともに該光ファイバ
ー部材１１の光フアイバー内を伝達させることによって
高速通信等に使用される。The optical semiconductor device causes the optical semiconductor element 3 to perform predetermined light excitation based on a drive signal supplied from an external electric circuit, and transmits and receives the excited light to and from the optical fiber member 11 through the translucent member 9. In addition, by transmitting the light through the optical fiber of the optical fiber member 11, it is used for high-speed communication and the like.
【００４０】次に前記光半導体素子収納用パッケージに
おける金属製固定部材の基体への取着について図５
（ａ）乃至（ｃ）に基づき説明する。まず図５（ａ）に
示すごとく、金属製固定部材８の内部に透光性部材９を
ガラス１４を介して取着し、金属製固定部材８の内部を
塞ぐ。Next, the attachment of the metal fixing member to the base in the package for housing an optical semiconductor element will be described with reference to FIG.
A description will be given based on (a) to (c). First, as shown in FIG. 5A, a light transmitting member 9 is attached to the inside of the metal fixing member 8 via the glass 14, and the inside of the metal fixing member 8 is closed.
【００４１】前記金属製固定部材８への透光性部材９の
取着は金属製固定部材８の内部に透光性部材９の融点よ
り低い融点を有する、例えば、低融点ハンダガラス１４
を塗布するとともに該塗布した低融点ハンダガラス１４
上に透光性部材９を載置し、しかる後、これを大気中、
約４５０℃の温度に加熱し、低融点ハンダガラス１４を
溶融させることによって行われる。The attachment of the light-transmitting member 9 to the metal fixing member 8 has a melting point lower than the melting point of the light-transmitting member 9 inside the metal fixing member 8.
And the applied low melting point solder glass 14
The translucent member 9 is placed on the upper part, and thereafter, this is
This is performed by heating to a temperature of about 450 ° C. to melt the low melting point solder glass 14.
【００４２】次に前記透光性部材９を金属製固定部材８
に取着しているガラス１４の露出表面を保護膜Ｐで被覆
する。Next, the light transmitting member 9 is replaced with the metal fixing member 8.
Is covered with a protective film P.
【００４３】前記保護膜Ｐとしては耐薬品性に優れる光
学膜として使用可能な酸化珪素、フッ化マグネシウム、
酸化チタンの少なくとも１種が好適に使用され、真空蒸
着法、イオンビーム蒸着法等によりガラス１４の露出表
面に光学透過率を向上させる厚みに被着される。As the protective film P, silicon oxide, magnesium fluoride, and the like, which can be used as an optical film having excellent chemical resistance,
At least one kind of titanium oxide is suitably used, and is applied to the exposed surface of the glass 14 to a thickness that improves optical transmittance by a vacuum evaporation method, an ion beam evaporation method, or the like.
【００４４】次に図５（ｂ）に示すごとく、筒状の金属
製固定部材８の表面に、基体１へのロウ付け取着を確
実、強固とするためにニッケルめっき層１２及び金めっ
き層１３を順次被着させる。Next, as shown in FIG. 5B, a nickel plating layer 12 and a gold plating layer are formed on the surface of the cylindrical metal fixing member 8 in order to securely and firmly attach it to the base 1 by brazing. 13 are sequentially applied.
【００４５】前記ニッケルめっき層１２は金属製固定部
材８への金めっき層１３の被着を強固とするための下地
部材であり、電解めっき法や無電解めっき法を採用する
ことによって金属製固定部材８の表面に約０．５〜５μ
ｍの厚みに被着される。The nickel-plated layer 12 is a base member for firmly attaching the gold-plated layer 13 to the metal fixing member 8, and is made of metal by applying electrolytic plating or electroless plating. About 0.5 to 5μ on the surface of the member 8
m.
【００４６】前記ニッケルめっき層１２はこれを電解め
っき法を採用することによって形成する場合、金属製固
定部材８を、例えば、硫酸ニッケル、塩化ニッケル、ホ
ウ酸（ＮｉＳＯ4 ・６Ｈ2 Ｏ＋ＮｉＣｌ2 ・６Ｈ2 Ｏ＋
Ｈ3 ＢＯ3 ）からなるニッケルめっき浴中に浸漬すると
ともに金属製固定部材８に電流密度０．１〜２Ａ／ｄｍ
2 のめっき用電力を印加することによって行われる。When the nickel plating layer 12 is formed by employing an electrolytic plating method, the metal fixing member 8 may be made of, for example, nickel sulfate, nickel chloride, boric acid (NiSO 4 .6H 2 O + NiCl 2 .6H). 2 O +
H 3 BO 3 ) and a current density of 0.1 to 2 A / dm on the metal fixing member 8.
This is performed by applying the plating power of 2 .
【００４７】また前記金めっき層１３は金属製固定部材
８に対するロウ材の濡れ性を良好とする作用をなし、電
解めっき法や無電解めっき法を採用することによってニ
ッケルめっき層上に約０．５〜３μｍの厚みに被着され
る。The gold plating layer 13 has an effect of improving the wettability of the brazing material with respect to the metal fixing member 8. Deposited to a thickness of 5 to 3 μm.
【００４８】前記金めっき層１３はこれを電解めっき法
を採用することによって形成する場合、表面にニッケル
めっき層１２が被着された金属製固定部材８を、例え
ば、シアン化金カリウムおよび燐酸カリウムからなる金
めっき浴中に浸漬するとともに金属製固定部材８に０．
２〜１．５Ａ／ｄｍ2 のめっき用電力を印加することに
よって行われる。When the gold plating layer 13 is formed by adopting the electrolytic plating method, the metal fixing member 8 having the nickel plating layer 12 adhered to the surface thereof may be formed by, for example, gold potassium cyanide and potassium phosphate. And dipped in a gold plating bath made of
This is performed by applying a plating power of 2 to 1.5 A / dm 2 .
【００４９】更に前記金属製固定部材８の表面にニッケ
ルめっき層１２及び金めっき層１３を順次被着させる
際、めっき液の薬品が金属製固定部材８の内部に透光性
部材９を取着しているガラス１４に作用しようとするが
該ガラス１４はその露出表面が耐薬品性に優れる酸化珪
素、フッ化マグネシウム、酸化チタン等からなる保護膜
Ｐで被覆保護されていることから溶けることはなく、そ
の結果、金属製固定部材８への透光性部材９の取着強度
を極めて強固となすことができる。Further, when the nickel plating layer 12 and the gold plating layer 13 are sequentially deposited on the surface of the metal fixing member 8, the chemical of the plating solution attaches the translucent member 9 inside the metal fixing member 8. However, since the exposed surface of the glass 14 is covered and protected by a protective film P made of silicon oxide, magnesium fluoride, titanium oxide, or the like having excellent chemical resistance, the glass 14 cannot be melted. As a result, the attachment strength of the translucent member 9 to the metal fixing member 8 can be made extremely strong.
【００５０】また更に前記ニッケルめっき層１２及び金
めっき層１３は金属製固定部材８の内部に透光性部材９
をガラス１４を介して取着した後に金属製固定部材８の
表面に被着されることからニッケルめっき層１２及び金
めっき層１３に熱が作用することはなく、その結果、ニ
ッケルめっき層１２の一部が金めっき層１３中を拡散
し、金めっき層１３の表面に露出することはなく、同時
に露出したニッケルが酸化されて酸化ニッケルを形成す
ることもない。従って、金めっき層１３はロウ材に対す
る濡れ性が極めて良好なものとなる。Further, the nickel plating layer 12 and the gold plating layer 13 are provided inside the metal fixing member 8 with the light transmitting member 9.
Is attached to the surface of the metal fixing member 8 after being attached via the glass 14, so that heat does not act on the nickel plating layer 12 and the gold plating layer 13, and as a result, the nickel plating layer 12 Part of the metal does not diffuse into the gold plating layer 13 and is not exposed on the surface of the gold plating layer 13. At the same time, the exposed nickel is not oxidized to form nickel oxide. Therefore, the gold plating layer 13 has extremely good wettability to the brazing material.
【００５１】そして最後に前記金属製固定部材８を基体
１の貫通孔１ｂ周辺に予め被着させておいた金属層にロ
ウ材１５を介しロウ付け取着することによって図５
（ｃ）に示すごとく基体１への金属製固定部材８のロウ
付け取着が完了する。Finally, the metal fixing member 8 is brazed and attached to the metal layer previously applied to the periphery of the through hole 1b of the base 1 through the brazing material 15 as shown in FIG.
As shown in (c), the brazing attachment of the metal fixing member 8 to the base 1 is completed.
【００５２】前記金属製固定部材８の基体１へのロウ付
け取着は基体１の貫通孔１ｂ周辺に被着されている金属
層上に間に金―錫合金（金：８０重量％、錫：２０重量
％）等からなる低融点のロウ材１５を挟んで載置し、し
かる後、これを約３００℃の温度に加熱し、低融点のロ
ウ材１５を溶融させることによって行われる。この場
合、金属製固定部材８に被着されている金めっき層１３
の表面にはロウ材に対し濡れ性が悪い酸化ニッケルの形
成がないことから金めっき層１３とロウ材１５とは極め
て強固に接合し、これによって金属製固定部材８は基体
１に極めて強固にロウ付け取着されることとなる。 な
お、本発明は上述の実施例に限定されるものではなく、
本発明の要旨を逸脱しない範囲であれば種々の変更は可
能であり、例えば、上述の実施例では、光半導体素子３
が光を励起する場合について説明したが、これが光ファ
イバー部材１１を介して伝達された光を光半導体素子３
が電気信号に変換し、該変換された電気信号を外部に取
り出すようにした場合にも適用可能である。The metal fixing member 8 is brazed to the base 1 by mounting a gold-tin alloy (gold: 80% by weight, tin) on a metal layer provided around the through hole 1b of the base 1. : 20% by weight) and the like, and then placed on the low melting point brazing material 15 and then heated to a temperature of about 300 ° C. to melt the low melting point brazing material 15. In this case, the gold plating layer 13 attached to the metal fixing member 8
Since there is no formation of nickel oxide having poor wettability with respect to the brazing material, the gold plating layer 13 and the brazing material 15 are bonded very firmly, so that the metal fixing member 8 is extremely firmly attached to the base 1. It will be brazed and attached. Note that the present invention is not limited to the above-described embodiment,
Various changes can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the optical semiconductor device 3
Described the case where the optical semiconductor device 3 excites the light transmitted through the optical fiber member 11.
Is converted to an electric signal, and the converted electric signal is taken out to the outside.
【００５３】また上述の実施例では基体１を酸化アルミ
ニウム質焼結体等のセラミックスで形成したが、これを
鉄―ニッケル―コバルト合金等の金属材料で形成しても
よい。In the above-described embodiment, the base 1 is formed of ceramics such as an aluminum oxide sintered body, but may be formed of a metal material such as an iron-nickel-cobalt alloy.
【００５４】[0054]
【発明の効果】本発明の光半導体素子収納用パッケージ
の製造方法によれば、金属製固定部材の内部に透光性部
材を取着しているガラスの露出表面を保護膜で被覆した
ことから透光性部材がガラスを介して取着されている金
属製固定部材の表面にニッケルめっき層及び金めっき層
を順次被着させたとしてもガラスは前記保護膜により保
護されていることからめっき液の薬品によって溶けるこ
とはなく、また金属製固定部材の内部に透光性部材を取
着した後に金属製固定部材の表面にニッケルめっき層及
び金めっき層を被着させたことから金めっき層表面にニ
ッケルめっき層の一部が拡散露出し、これが酸化されて
酸化ニッケルを形成することはなく、その結果、金属製
固定部材への透光性部材の取着強度が強固となり、かつ
金めっき層のロウ材に対する濡れ性が良好となって、透
光性部材が取着されている筒状の金属製固定部材を基体
に極めて強固にロウ付け取着することが可能となる。According to the method of manufacturing a package for housing an optical semiconductor element of the present invention, the exposed surface of the glass having the translucent member attached inside the metal fixing member is covered with the protective film. Even if a nickel plating layer and a gold plating layer are sequentially applied to the surface of a metal fixing member to which a translucent member is attached via glass, the glass is protected by the protective film. The nickel plating layer and the gold plating layer are applied to the surface of the metal fixing member after the translucent member is attached inside the metal fixing member, and the gold plating layer surface is not melted. A portion of the nickel plating layer is diffused and exposed to the surface, and is not oxidized to form nickel oxide. As a result, the attachment strength of the translucent member to the metal fixing member becomes strong, and the gold plating layer No row Wettability becomes good for, it is possible to very firmly brazed attaching a cylindrical metal securing member translucent member is attached to the substrate.
【図１】本発明の光半導体素子収納用パッケージの一実
施例を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a package for housing an optical semiconductor element of the present invention.
【図２】図１に示す光半導体素子収納用パッケージの要
部断面図である。FIG. 2 is a sectional view of a main part of the package for housing an optical semiconductor element shown in FIG. 1;
【図３】図１に示す光半導体素子収納用パッケージの側
面図である。FIG. 3 is a side view of the package for housing an optical semiconductor element shown in FIG. 1;
【図４】図１に示す光半導体素子収納用パッケージの蓋
体を除いた状態の平面図である。FIG. 4 is a plan view of the package for storing an optical semiconductor element shown in FIG. 1 in a state where a lid is removed.
【図５】（ａ）乃至（ｃ）は図１に示す光半導体素子収
納用パッケージの金属製固定部材を基体にロウ付け取着
する際の各工程毎の要部断面図である。5 (a) to 5 (c) are cross-sectional views of main parts in each step when a metal fixing member of the package for storing an optical semiconductor element shown in FIG. 1 is brazed and attached to a base.
１・・・基体 １ａ・・凹部 １ｂ・・貫通孔 ２・・・蓋体 ３・・・光半導体素子 ４・・・配線層 ８・・・筒状の金属製固定部材 ９・・・透光性部材 １１・・・光ファイバー部材 １２・・・ニッケルめっき層 １３・・・金めっき層 １４・・・ガラス １５・・・ロウ材 Ｐ・・・保護膜 DESCRIPTION OF SYMBOLS 1 ... Base 1a ... Depression 1b ... Through-hole 2 ... Lid 3 ... Optical semiconductor element 4 ... Wiring layer 8 ... Cylindrical metal fixing member 9 ... Light transmission Functional member 11: Optical fiber member 12: Nickel plating layer 13: Gold plating layer 14: Glass 15: Brazing material P: Protective film
Claims (2)
を有する基体と、該基体の側部に形成された貫通孔と、
前記基体の貫通孔周辺の外表面にロウ付けされ、一端に
光ファイバー部材が接続される筒状の金属製固定部材
と、前記筒状の金属製固定部材の内部に取着され、金属
製固定部材の内部を塞ぐ透光性部材と、前記基体の上面
に取着され、前記凹部を塞ぐ蓋体とから成る光半導体素
子収納用パッケージであって、前記筒状の金属製固定部
材が下記（ａ）乃至（ｄ）の工程によって基体の貫通孔
周辺の外表面にロウ付けされていることを特徴とする光
半導体素子収納用パッケージの製造方法。 （ａ）金属製固定部材の内部に透光性部材をガラスを介
して取着する工程と、（ｂ）前記ガラスの露出面を保護
膜で被覆する工程と、（ｃ）筒状の金属製固定部材の露
出表面にニッケルめっき層と金めっき層を順次被着させ
る工程と、（ｄ）金属製固定部材を基体の貫通孔周辺の
外表面にロウ材を介してロウ付け取着する工程。1. A base having a concave portion for accommodating an optical semiconductor element on an upper surface, a through hole formed in a side portion of the base,
A cylindrical metal fixing member brazed to the outer surface around the through hole of the base, and an optical fiber member connected to one end; and a metal fixing member attached to the inside of the cylindrical metal fixing member. And a lid attached to the upper surface of the base and closing the recess, wherein the cylindrical metal fixing member is formed of the following (a). And (d) brazing the outer surface around the through hole of the base body to the optical semiconductor element housing package. (A) attaching a translucent member to the inside of the metal fixing member via glass, (b) covering the exposed surface of the glass with a protective film, and (c) forming a cylindrical metal member. A step of sequentially depositing a nickel plating layer and a gold plating layer on the exposed surface of the fixing member; and (d) a step of brazing and attaching the metal fixing member to the outer surface around the through hole of the base via a brazing material.
ム、酸化チタンの少なくとも１種からなることを特徴と
する請求項１に記載の光半導体素子収納用パッケージの
製造方法。2. The method according to claim 1, wherein said protective film is made of at least one of silicon oxide, magnesium fluoride, and titanium oxide.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08052499A JP3715818B2 (en) | 1999-03-24 | 1999-03-24 | Manufacturing method of optical semiconductor element storage package |
| US09/535,288 US6420205B1 (en) | 1999-03-24 | 2000-03-24 | Method for producing package for housing photosemiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08052499A JP3715818B2 (en) | 1999-03-24 | 1999-03-24 | Manufacturing method of optical semiconductor element storage package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000277644A true JP2000277644A (en) | 2000-10-06 |
| JP3715818B2 JP3715818B2 (en) | 2005-11-16 |
Family
ID=13720719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08052499A Expired - Fee Related JP3715818B2 (en) | 1999-03-24 | 1999-03-24 | Manufacturing method of optical semiconductor element storage package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3715818B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007147841A (en) * | 2005-11-25 | 2007-06-14 | Nippon Electric Glass Co Ltd | Manufacturing method of lens component |
| CN113874551A (en) * | 2019-07-31 | 2021-12-31 | 昭和电工株式会社 | Laminate and method for producing same |
-
1999
- 1999-03-24 JP JP08052499A patent/JP3715818B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007147841A (en) * | 2005-11-25 | 2007-06-14 | Nippon Electric Glass Co Ltd | Manufacturing method of lens component |
| CN113874551A (en) * | 2019-07-31 | 2021-12-31 | 昭和电工株式会社 | Laminate and method for producing same |
| CN113874551B (en) * | 2019-07-31 | 2023-10-03 | 株式会社力森诺科 | Laminate and method for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3715818B2 (en) | 2005-11-16 |
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