JP2000261038A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JP2000261038A JP2000261038A JP11064461A JP6446199A JP2000261038A JP 2000261038 A JP2000261038 A JP 2000261038A JP 11064461 A JP11064461 A JP 11064461A JP 6446199 A JP6446199 A JP 6446199A JP 2000261038 A JP2000261038 A JP 2000261038A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- face
- emitting element
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004347 surface barrier Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光反射用凹部の底面
に端面発光素子を搭載した発光ダイオードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode in which an end face light emitting element is mounted on the bottom of a light reflecting recess.
【０００２】[0002]
【従来の技術】発光ダイオードは、素子の発光層で得ら
れた光を発光する方向で、面発光型、裏面発光型および
端面発光型の３つに分類することができる。2. Description of the Related Art Light emitting diodes can be classified into three types, a surface emitting type, a back side emitting type, and an edge emitting type, in a direction of emitting light obtained from a light emitting layer of an element.
【０００３】このうち、端面発光型の発光ダイオード
は、素子の端面から表面障壁を構成する面に対して平行
する方向に発光するものであり、通常、光反射用凹部に
搭載し、素子主面と垂直する方向に発光するように構成
されている。[0003] Among them, the edge-emitting type light-emitting diode emits light in a direction parallel to a surface constituting a surface barrier from an end face of the element. It is configured to emit light in a direction perpendicular to.
【０００４】図５は端面発光素子を用いた発光ダイオー
ドの斜視図であり、リードフレーム（図示省略）の端面
に光反射用凹部２が形成され、この凹部２の底面２１に
端面発光素子１が搭載されている。光反射用凹部２はカ
ップ状、あるいはパラボラ状と呼ばれる椀状体であり、
端面発光素子１の端面１１から発光した光を凹部２の内
壁２２で反射してランプ５から光を出射するようになっ
ている。FIG. 5 is a perspective view of a light emitting diode using an end face light emitting element. A light reflecting recess 2 is formed on an end face of a lead frame (not shown). It is installed. The concave portion 2 for light reflection is a bowl-shaped body called a cup shape or a parabolic shape.
Light emitted from the end face 11 of the end face light emitting element 1 is reflected by the inner wall 22 of the concave portion 2 and emitted from the lamp 5.
【０００５】図６は光反射用凹部２の拡大上面図であ
り、端面発光素子１を搭載した光反射用凹部２の底面２
１および内壁２２は真円であるのに対し、端面発光素子
１の主面１２は正方形であるため、端面発光素子１の端
面１１から光反射用凹部２の内壁２２までの距離が相対
的に長い第１の距離ａと相対的に短い第２の距離ｂがで
きることとなる。FIG. 6 is an enlarged top view of the light reflecting recess 2, and shows the bottom surface 2 of the light reflecting recess 2 on which the edge light emitting element 1 is mounted.
1 and the inner wall 22 are perfect circles, while the main surface 12 of the end face light emitting element 1 is square, so that the distance from the end face 11 of the end face light emitting element 1 to the inner wall 22 of the light reflecting recess 2 is relatively large. A long first distance a and a relatively short second distance b are created.
【０００６】[0006]
【発明が解決しようとする課題】上記説明したように従
来の発光ダイオードは、端面発光素子の端面から光反射
用凹部の内壁までの距離が不均一であるため、凹部の内
壁からの反射光の出力にばらつきが生じ、ランプから出
射される光の出力が低下するという不都合がある。As described above, in the conventional light emitting diode, since the distance from the end face of the end face light emitting element to the inner wall of the light reflecting recess is not uniform, the light reflected from the inner wall of the recess is not uniform. There is a disadvantage that the output varies, and the output of the light emitted from the lamp is reduced.
【０００７】図７を参照して説明すると、端面発光素子
１の端面１１から光反射用凹部２の内壁２２までの距離
が相対的に長い第１の距離ａを経て反射する反射光Ａと
相対的に短い第２の距離ｂを経て反射する反射光Ｂとで
光の出力が異なり、両者の輝度バランスがくずれる。こ
のため、ランプ５から平行に出射しない出射光Ｃの占め
る割合が大きくなり、発光ダイオードとしての出力が低
下する。近年、特にパッケージサイズおよび素子サイズ
の小型化が要望され、十分な平行光を出力することが困
難となってきている。Referring to FIG. 7, the distance from the end face 11 of the end face light emitting element 1 to the inner wall 22 of the light reflecting recess 2 is relatively larger than the reflected light A reflected through a first distance a. The output of light is different between the reflected light B reflected through the second distance b, which is relatively short, and the luminance balance between the two is lost. Therefore, the proportion of the outgoing light C that does not exit in parallel from the lamp 5 increases, and the output as a light emitting diode decreases. In recent years, in particular, reduction in package size and element size has been demanded, and it has become difficult to output sufficient parallel light.
【０００８】また、真円の底面に正方形の端面発光素子
を搭載するため、搭載可能な素子サイズに制限を受け、
素子サイズを小型化せざるを得ず、発光ダイオードとし
ての出力が低下するという不都合もある。In addition, since a square edge light emitting element is mounted on the bottom surface of a perfect circle, the size of the mountable element is limited.
There is also a disadvantage that the element size must be reduced, and the output as a light emitting diode is reduced.
【０００９】本発明は上記問題点を解決するためのもの
であり、光反射用凹部の底面に搭載した端面発光素子か
ら出射する平行光の出力を高めることができ、かつパッ
ケージサイズを大型化することなく出力を高めることが
できる発光ダイオードを提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and can increase the output of parallel light emitted from an edge light emitting element mounted on the bottom surface of a light reflecting recess, and increase the package size. It is an object of the present invention to provide a light emitting diode capable of increasing the output without using the light emitting diode.
【００１０】[0010]
【課題を解決するための手段】上記問題を解決するため
に本発明は、光反射用凹部の底面に端面発光素子を搭載
した発光ダイオードであって、前記光反射用凹部の底面
と前記端面発光素子の主面とが相似形または略相似形と
したものである。また、本発明は光反射用凹部の底面を
真円とし、この底面に断面が五角形以上の正多角形、好
適には正六角形または正八角形の端面発光素子を搭載し
たものである。光反射用凹部の底面および内壁が真円で
ある場合、端面発光素子の主面を六角形など真円に近い
形状とすることにより、素子の端面から内壁までの距離
のばらつきが小さくなるため、反射光の出力にばらつき
が生じることなく輝度バランスを保つことができる。こ
のため、ランプから出射する平行光の占める割合を大き
くすることができ、発光ダイオードとしての出力を高め
ることができる。また、端面発光素子の主面を真円また
は真形に近い形状にすることで、光反射用凹部の底面に
搭載可能な素子サイズを大型化することができ、結果と
して発光ダイオードの出力を高めることができる。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a light emitting diode having an edge light emitting element mounted on the bottom surface of a light reflecting recess. The main surface of the element has a similar shape or a substantially similar shape. Further, in the present invention, the bottom surface of the concave portion for light reflection is a perfect circle, and an end surface light emitting element having a regular polygon having a cross section of pentagon or more, preferably a regular hexagon or regular octagon is mounted on the bottom surface. When the bottom surface and the inner wall of the concave portion for light reflection are a perfect circle, by making the main surface of the edge emitting element a shape close to a perfect circle such as a hexagon, the variation in the distance from the end face of the element to the inner wall is reduced, Luminance balance can be maintained without variation in the output of the reflected light. For this reason, the ratio of the parallel light emitted from the lamp can be increased, and the output as the light emitting diode can be increased. Further, by making the main surface of the edge light emitting element a perfect circle or a shape close to a perfect shape, the size of the element that can be mounted on the bottom surface of the light reflecting recess can be increased, and as a result, the output of the light emitting diode can be increased. be able to.
【００１１】[0011]
【発明の実態の形態】以下、本発明の実施の形態につい
て図面を参照しながら説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１２】図１は本実施形態による発光ダイオードの
端面発光素子の斜視図であり、１は端面発光素子、１１
は素子の端面、１２は素子の主面、１３は主面電極であ
る。端面発光素子１の主面１２は正六角形であり、周囲
に六面形成された素子の端面１１から光を発光する。端
面発光素子１の主面１２には主面電極１３が形成され、
端面発光素子１の裏面には裏面電極（図示せず）が形成
されている。FIG. 1 is a perspective view of an edge light emitting device of a light emitting diode according to the present embodiment.
Is an end face of the element, 12 is a main surface of the element, and 13 is a main surface electrode. The main surface 12 of the end face light emitting element 1 is a regular hexagon, and emits light from the end face 11 of the element formed around six sides. A main surface electrode 13 is formed on a main surface 12 of the edge light emitting device 1,
A back surface electrode (not shown) is formed on the back surface of the edge light emitting device 1.
【００１３】図２はこの端面発光素子を用いた発光ダイ
オードの斜視図であり、１は端面発光素子、２は光反射
用凹部、３はポストリード、４はボンディングワイヤ、
５はランプである。端面発光素子１は光反射用凹部２の
底面２１に搭載され、端面発光素子１の主面電極（図示
せず）とポストリード３とがボンディングワイヤ４によ
り接続されている。端面発光素子１が搭載された光反射
用凹部２およびポストリード３は透過性の樹脂からなる
ランプ５でモールドされている。FIG. 2 is a perspective view of a light emitting diode using this edge light emitting element, wherein 1 is an edge light emitting element, 2 is a light reflecting recess, 3 is a post lead, 4 is a bonding wire,
5 is a lamp. The end face light emitting element 1 is mounted on the bottom surface 21 of the light reflecting recess 2, and a main surface electrode (not shown) of the end face light emitting element 1 is connected to the post lead 3 by a bonding wire 4. The light reflecting recess 2 and the post lead 3 on which the edge light emitting element 1 is mounted are molded with a lamp 5 made of a transparent resin.
【００１４】図３は光反射用凹部の拡大上面図である。
凹部２の底面２１および内壁２２は真円であるのに対し
端面発光素子１の主面１２は正六角形であるため、従来
の素子の主面が正方形の端面発光素子を搭載した際に比
べて、端面発光素子１の端面１１から光反射用凹部２の
内壁２２までの距離が相対的に長い第１の距離ａと相対
的に短い第２の距離ｂとの差が小さくなる。このため、
光反射用凹部２の底面２１に搭載可能な素子サイズを大
型化することができ、結果としてパッケージサイズを大
型化することなく発光ダイオードの出力を高めることが
できる、もしくは出力を低下させることなくパッケージ
サイズを小型化することができる。本実施の形態では、
凹部２の底面２１の直径が０．６ｍｍである場合に、最
大外形０．５ｍｍの正六角形の端面発光素子を搭載する
ことができた。FIG. 3 is an enlarged top view of the light reflecting recess.
The bottom surface 21 and the inner wall 22 of the recess 2 are perfect circles, whereas the main surface 12 of the end face light emitting element 1 is a regular hexagon, so that the main face of the conventional element has a square main end face light emitting element. The difference between the first distance a where the distance from the end face 11 of the end face light emitting element 1 to the inner wall 22 of the light reflecting recess 2 is relatively long and the second distance b where the distance is relatively short is small. For this reason,
The size of the element that can be mounted on the bottom surface 21 of the light reflecting recess 2 can be increased, and as a result, the output of the light emitting diode can be increased without increasing the package size, or the package can be reduced without decreasing the output. The size can be reduced. In the present embodiment,
When the diameter of the bottom surface 21 of the concave portion 2 was 0.6 mm, a regular hexagonal edge light emitting device having a maximum outer shape of 0.5 mm could be mounted.
【００１５】図４はこの発光ダイオードからの出射光を
説明する図である。光反射用凹部２の底面２１に端面発
光素子１が搭載され、端面発光素子１の端面１１から発
光した光は凹部２の内壁２２で反射し、ランプ５を介し
て出射される。端面発光素子１の主面１２を正六角形と
したことで、端面発光素子１の端面１１から凹部２の内
壁２２までの距離が相対的に長い第１の距離ａと相対的
に短い第２の距離ｂとの差が、従来の素子の主面が正方
形の端面発光素子１を用いた場合に比べて小さくなる。
このため、第１の距離ａと第２の距離ｂを経て反射した
それぞれの反射光Ａと反射光Ｂとの輝度バランスを保つ
ことができ、ランプ５から出射する平行光Ｃの出力を高
めることができる。FIG. 4 is a diagram for explaining light emitted from the light emitting diode. The end face light emitting element 1 is mounted on the bottom surface 21 of the light reflecting recess 2, and light emitted from the end face 11 of the end face light emitting element 1 is reflected by the inner wall 22 of the recess 2 and emitted through the lamp 5. Since the main surface 12 of the edge light emitting device 1 is a regular hexagon, the distance from the end surface 11 of the edge light emitting device 1 to the inner wall 22 of the concave portion 2 is relatively long, and the second distance a is relatively short. The difference from the distance b is smaller than that of the conventional device in which the edge surface light emitting device 1 having a square main surface is used.
For this reason, the luminance balance between the reflected light A and the reflected light B reflected through the first distance a and the second distance b can be maintained, and the output of the parallel light C emitted from the lamp 5 can be increased. Can be.
【００１６】本実施の形態では、正六角形の端面発光素
子を用いたが、理想的には真円、もしくはより真円に近
い六角形以上の多角形とした方が効果的である。In this embodiment, a regular hexagonal end face light emitting element is used. Ideally, however, it is more effective to use a perfect circle or a polygon having a hexagon or more close to a perfect circle.
【００１７】また、パッケージとしてはリードフレーム
の端面に凹部を形成したパッケージを例に挙げたが、ス
テムを利用したものや、リードフレームの平面に凹部を
形成したチップ型のものでも同様に効果を得ることがで
きる。Further, as the package, a package in which a concave portion is formed on an end surface of a lead frame has been described as an example. However, a package using a stem or a chip type having a concave portion formed in a flat surface of a lead frame has the same effect. Obtainable.
【００１８】[0018]
【発明の効果】以上説明したように本発明によれば、凹
部の内壁で反射した光の輝度バランスを保つことがで
き、発光ダイオードから出射する平行光の出力を高める
ことができる。As described above, according to the present invention, the luminance balance of the light reflected on the inner wall of the concave portion can be maintained, and the output of the parallel light emitted from the light emitting diode can be increased.
【００１９】また、光反射用の凹部に搭載可能な発光素
子サイズを大型化することができ、発光素子サイズおよ
びパッケージサイズを小型化しても、高出力の発光ダイ
オードを得ることができる。Further, the size of the light emitting element that can be mounted in the light reflecting recess can be increased, and a high output light emitting diode can be obtained even if the light emitting element size and the package size are reduced.
【図１】本発明の一実施形態による端面発光素子を示す
斜視図FIG. 1 is a perspective view showing an edge light emitting device according to an embodiment of the present invention.
【図２】本発明の一実施形態による発光ダイオードを示
す斜視図FIG. 2 is a perspective view showing a light emitting diode according to an embodiment of the present invention.
【図３】本発明の一実施形態による発光ダイオードの光
反射用凹部の拡大上面図FIG. 3 is an enlarged top view of a light reflecting recess of a light emitting diode according to an embodiment of the present invention.
【図４】本発明の一実施形態による発光ダイオードから
の出射光の説明図FIG. 4 is an explanatory diagram of light emitted from a light emitting diode according to an embodiment of the present invention.
【図５】従来の発光ダイオードを示す斜視図FIG. 5 is a perspective view showing a conventional light emitting diode.
【図６】従来の発光ダイオードの光反射用凹部の拡大上
面図FIG. 6 is an enlarged top view of a light reflecting recess of a conventional light emitting diode.
【図７】従来の発光ダイオードからの出射光の説明図FIG. 7 is an explanatory diagram of light emitted from a conventional light emitting diode.
１ 端面発光素子 ２ 光反射用凹部 ３ ポストリード ４ ボンディングワイヤ ５ ランプ １１ 素子の端面 １２ 素子の主面 １３ 主面電極 ２１ 凹部の底面 ２２ 凹部の内壁 REFERENCE SIGNS LIST 1 end surface light emitting element 2 light reflection concave portion 3 post lead 4 bonding wire 5 lamp 11 element end surface 12 element main surface 13 main surface electrode 21 bottom surface of concave portion 22 inner wall of concave portion
Claims (2)
載した発光ダイオードであって、前記凹部の底面と前記
端面発光素子の主面とが相似形または略相似形であるこ
とを特徴とする発光ダイオード。1. A light emitting diode having an end face light emitting element mounted on a bottom surface of a light reflecting recess, wherein the bottom surface of the recess and a main surface of the end face light emitting element are similar or substantially similar. Light emitting diode.
記端面発光素子の主面を五角形以上の正多角形とした請
求項１記載の発光ダイオード。2. The light emitting diode according to claim 1, wherein the bottom surface of the light reflecting recess is a perfect circle, and the main surface of the end face light emitting element is a pentagon or more regular polygon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11064461A JP2000261038A (en) | 1999-03-11 | 1999-03-11 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11064461A JP2000261038A (en) | 1999-03-11 | 1999-03-11 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000261038A true JP2000261038A (en) | 2000-09-22 |
Family
ID=13258909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11064461A Pending JP2000261038A (en) | 1999-03-11 | 1999-03-11 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000261038A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1505660A1 (en) * | 2003-08-05 | 2005-02-09 | C.R.F. Società Consortile per Azioni | Illumination arrangement with reduced depth for a vehicle headlight |
| JP2008004948A (en) * | 2006-06-09 | 2008-01-10 | Philips Lumileds Lightng Co Llc | Low profile side emitting led |
| JP2008042160A (en) * | 2006-08-09 | 2008-02-21 | Yiguang Electronic Ind Co Ltd | Sealing structure of side-emission light-emitting diode |
| KR20170022349A (en) * | 2015-08-20 | 2017-03-02 | 엘지이노텍 주식회사 | light emitting device package |
| JP2017117867A (en) * | 2015-12-22 | 2017-06-29 | 日亜化学工業株式会社 | Light-emitting device |
| US9761764B2 (en) | 2015-02-05 | 2017-09-12 | Nichia Corporation | Light emitting device |
-
1999
- 1999-03-11 JP JP11064461A patent/JP2000261038A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1505660A1 (en) * | 2003-08-05 | 2005-02-09 | C.R.F. Società Consortile per Azioni | Illumination arrangement with reduced depth for a vehicle headlight |
| JP2008004948A (en) * | 2006-06-09 | 2008-01-10 | Philips Lumileds Lightng Co Llc | Low profile side emitting led |
| JP2008042160A (en) * | 2006-08-09 | 2008-02-21 | Yiguang Electronic Ind Co Ltd | Sealing structure of side-emission light-emitting diode |
| US9761764B2 (en) | 2015-02-05 | 2017-09-12 | Nichia Corporation | Light emitting device |
| KR20170022349A (en) * | 2015-08-20 | 2017-03-02 | 엘지이노텍 주식회사 | light emitting device package |
| KR102424726B1 (en) * | 2015-08-20 | 2022-07-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | light emitting device package |
| JP2017117867A (en) * | 2015-12-22 | 2017-06-29 | 日亜化学工業株式会社 | Light-emitting device |
| US10121948B2 (en) | 2015-12-22 | 2018-11-06 | Nichia Corporation | Light emitting device including different shapes of light emitting element having higher light extraction efficiency |
| US10431725B2 (en) | 2015-12-22 | 2019-10-01 | Nichia Corporation | Light emitting device including different shapes of light emitting element having higher light extraction efficiency |
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