JP2000258702A - Optical switch - Google Patents
Optical switchInfo
- Publication number
- JP2000258702A JP2000258702A JP5742799A JP5742799A JP2000258702A JP 2000258702 A JP2000258702 A JP 2000258702A JP 5742799 A JP5742799 A JP 5742799A JP 5742799 A JP5742799 A JP 5742799A JP 2000258702 A JP2000258702 A JP 2000258702A
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- movable electrode
- substrate
- optical switch
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は可動電極板にミラ
ーを立て、可動電極板と固定電極との間に静電引力を作
用させたり、除去させたりしてミラーを変位させ、ミラ
ーに向かう光束を通過又は反射させる光スイッチに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method in which a mirror is set up on a movable electrode plate, and the mirror is displaced by applying or removing an electrostatic attraction between the movable electrode plate and the fixed electrode, and a light beam directed to the mirror is provided. To an optical switch that passes or reflects light.
【０００２】[0002]
【従来の技術】図７に提案されている光スイッチを示
す。方形シリコン基板１１に方形凹部１２が形成され、
方形凹部１２の中央部と対向して方形可動電極板１３が
配され、可動電極板１３の対向辺の中点がそれぞれフレ
クチュア部１４，１５を介して基板１１上に連結され、
フレクチュア部１４，１５により、可動電極板１３は、
基板１１の表面に対して垂直方向に変位自在に基板１１
に支持されている。可動電極板１３の基板１１と反対側
の面上にミラー１６が立てられている。2. Description of the Related Art FIG. 7 shows a proposed optical switch. A square recess 12 is formed in a square silicon substrate 11,
A rectangular movable electrode plate 13 is disposed facing the center of the rectangular recess 12, and the midpoints of the opposite sides of the movable electrode plate 13 are connected to the substrate 11 via the flexure portions 14 and 15, respectively.
Due to the flexure portions 14 and 15, the movable electrode plate 13
The substrate 11 is displaceable in the vertical direction with respect to the surface of the substrate 11.
It is supported by. A mirror 16 is set up on the surface of the movable electrode plate 13 opposite to the substrate 11.
【０００３】可動電極板１３、フレクチュア部１４，１
５はシリコン基板１１と一体に形成され、シリコン基板
１１、可動電極板１３にそれぞれ不純物が混入されて導
電性が与えられている。よって基板１１の可動電極板１
３と対向する部分は固定電極として作用させることがで
きる。入射側光ファイバ又は光導波路１７よりの光束１
８が基板１１の表面と平行にミラー１６に斜めに入射さ
れ、その反射光が出射側光ファイバ又は光導波路１９に
入射される。この状態で基板１１と可動電極板１３との
間に電圧が印加されると、基板１１と可動電極板１３と
の間に静電引力が作用し、可動電極板１３が基板１１側
に変位し、入射側光ファイバ又は光導波路１７よりの光
束１８はミラー１６に入射することなく、ミラー１６上
を通過し、他方の出射側光ファイバ又は光導波路２１に
入射する。[0003] The movable electrode plate 13, the flexure parts 14, 1
5 is formed integrally with the silicon substrate 11, and the silicon substrate 11 and the movable electrode plate 13 are mixed with impurities to give conductivity. Therefore, the movable electrode plate 1 of the substrate 11
The portion facing 3 can serve as a fixed electrode. Light flux 1 from incident side optical fiber or optical waveguide 17
8 is obliquely incident on the mirror 16 in parallel with the surface of the substrate 11, and the reflected light is incident on the output side optical fiber or the optical waveguide 19. When a voltage is applied between the substrate 11 and the movable electrode plate 13 in this state, an electrostatic attraction acts between the substrate 11 and the movable electrode plate 13 and the movable electrode plate 13 is displaced toward the substrate 11. The light beam 18 from the incident side optical fiber or the optical waveguide 17 passes through the mirror 16 without entering the mirror 16 and enters the other exit side optical fiber or the optical waveguide 21.
【０００４】このように基板１１と可動電極板１３との
間に電圧を印加するかしないかにより、入射側光ファイ
バ又は光導波路１７よりの光束１８を出射側光ファイバ
又は光導波路１９と出射側光ファイバ又は光導波路２１
との一方に切替え入射させることができる。[0004] Depending on whether or not a voltage is applied between the substrate 11 and the movable electrode plate 13, the light beam 18 from the incident side optical fiber or the optical waveguide 17 is transmitted to the exit side optical fiber or the optical waveguide 19 and the exit side. Optical fiber or optical waveguide 21
And can be switched to one of them.
【０００５】[0005]
【発明が解決しようとする課題】図７に示した提案され
ている光スイッチにおいては、比較的大きな駆動電圧を
必要とする。駆動電圧を低減するにはフレクチュア部１
４，１５を含む支持部材の基板１１と可動電極板１３と
の間の長さを長くして柔らかにするか、可動電極板１３
の面積を大きくする必要がある。このようにフレクチュ
ア部を含む支持部材を長くしたり、可動電極板１３の面
積を大きくすると、光スイッチの大きさが大型化してし
まう。この大型化は、Ｎ×Ｍマトリックス状に個々の光
スイッチを配置した大規模な光スイッチ装置（マトリッ
クス光スイッチ）では、顕著な大型化を招くことにな
る。The proposed optical switch shown in FIG. 7 requires a relatively large driving voltage. Flexure unit 1 to reduce drive voltage
The length between the substrate 11 and the movable electrode plate 13 of the supporting member including the movable electrode plate 13 and the movable electrode plate 13 is increased.
It is necessary to increase the area of. When the length of the support member including the flexure portion is increased or the area of the movable electrode plate 13 is increased, the size of the optical switch is increased. This increase in size leads to a significant increase in a large-scale optical switch device (matrix optical switch) in which individual optical switches are arranged in an N × M matrix.
【０００６】この発明の目的は小型に構成でき、しかも
低電圧駆動が可能な、マトリックス光スイッチに適する
光スイッチを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an optical switch suitable for a matrix optical switch, which can be made compact and can be driven at a low voltage.
【０００７】[0007]
【課題を解決するための手段】この発明によれば、可動
電極板を基板上に支持する支持体は可動電極板とほぼ平
行な面内で、折り返しビーム状に形成され、支持体が占
める領域と可動電極板が占める領域とが全体として方形
領域を構成している。According to the present invention, a support for supporting a movable electrode plate on a substrate is formed in a folded beam shape in a plane substantially parallel to the movable electrode plate, and an area occupied by the support is provided. The region occupied by the movable electrode plate and the movable electrode plate constitute a rectangular region as a whole.
【０００８】[0008]
【発明の実施の形態】図１にこの発明の実施例を示す。
方形基板３１と間隔をおいてこれと平行に可動電極板３
２が配され、可動電極板３２は弾性を有する支持体３３
〜３６により基板３１に支持されている。各支持体３３
〜３６はそれぞれ、可動電極板３２がなす平面とほぼ同
一平面上で折り返しビーム状に形成されている。支持体
３３〜３６がそれぞれ占める領域３７〜４０と、可動電
極板３２が占める領域とは全体としてほぼ方形、この例
では正方形領域を構成する。FIG. 1 shows an embodiment of the present invention.
The movable electrode plate 3 is spaced apart from and parallel to the rectangular substrate 31.
The movable electrode plate 32 is provided with a support 33 having elasticity.
Are supported by the substrate 31. Each support 33
36 to 36 are formed in a folded beam shape on substantially the same plane as the plane formed by the movable electrode plate 32. The regions 37 to 40 occupied by the supports 33 to 36 and the region occupied by the movable electrode plate 32 as a whole are substantially square, in this example, square.
【０００９】つまりこの実施例では、正方形状の可動電
極板３２の各辺の中央部に長方形の切除部４１〜４４が
形成され、その切除部４１〜４４にそれぞれ支持体３３
〜３６が配され、各支持体３３〜３６はそれぞれその各
外端は、可動電極板３２の各辺の中点と対応して、基板
３１上に立てられた固定部４５〜４８と連結され、内端
は切除部４１〜４４の内端の中点にて可動電極板３２に
連結され、これら外端と内端間においてそれぞれ切除部
４１〜４４の幅方向にほぼ一杯に延長して折り返すこと
が繰り返されて繰り返しビーム状支持体３３〜３６が構
成されている。In other words, in this embodiment, rectangular cutouts 41 to 44 are formed at the center of each side of the square movable electrode plate 32, and the cutouts 41 to 44 are respectively provided with supports 33.
To 36, and each outer end of each of the supports 33 to 36 is connected to a fixed part 45 to 48 erected on the substrate 31 corresponding to the midpoint of each side of the movable electrode plate 32. , The inner end is connected to the movable electrode plate 32 at the midpoint of the inner ends of the cutouts 41 to 44, and between the outer end and the inner end, it is extended almost completely in the width direction of the cutouts 41 to 44 and folded back. This is repeated to form the beam-shaped supports 33 to 36 repeatedly.
【００１０】つまり可動電極板３２の中央正方形部３２
ａの各辺の中点にそれぞれ支持体３３〜３６の内端が連
結され、それぞれ折り返されながら互いに外側へ延長さ
れて、それぞれ固定部４５〜４８に連結される。これら
支持体３３〜３６の各両側に可動電極板３２の周辺正方
形部３２ｂ，３２ｃ，３２ｄ，３２ｅが中央正方形部３
２ａの各頂角部分と一部、一つの頂角部分を共通として
配されている。支持体３３〜３６の各折り返し幅Ｌ２は
切除部４１〜４４の各幅Ｗ１よりわずか小とされてい
る。That is, the central square portion 32 of the movable electrode plate 32
The inner ends of the supports 33 to 36 are connected to the midpoints of the sides a, respectively, are extended outwardly while being folded, and are connected to the fixing portions 45 to 48, respectively. The peripheral square portions 32b, 32c, 32d, and 32e of the movable electrode plate 32 are provided on both sides of each of the supports 33 to 36 with the central square portion 3.
Each vertex portion of 2a is partially shared with one vertex portion. Each folded width L2 of the supports 33 to 36 is slightly smaller than each width W1 of the cutouts 41 to 44.
【００１１】支持体３３〜３６は基板３１上の固定部４
５〜４８の上端と連結され、これにより可動電極板３２
は基板３１と間隔Ｄ１を保って保持され、また支持体３
３〜３６の折り返しビーム状構造により、支持体３３〜
３６は弾性を有し、可動電極板３２は基板３１に対し垂
直に変位可能とされている。基板３１、可動電極板３
２、支持体３３〜３６、固定部４５〜４８は一体物とし
て構成することができる。The supports 33 to 36 are fixed to the fixing portions 4 on the substrate 31.
5 to 48, thereby connecting the movable electrode plate 32
Is held at a distance D1 from the substrate 31, and the support 3
With the folded beam-shaped structure of 3-36, the support 33-
36 has elasticity, and the movable electrode plate 32 is vertically displaceable with respect to the substrate 31. Substrate 31, movable electrode plate 3
2. The supports 33 to 36 and the fixing portions 45 to 48 can be configured as an integral body.
【００１２】この構造は例えば図２に示すように作るこ
とができる。図２Ａに示すようにシリコン基板３１ａ上
にＳｉＯ2 の保護膜５１を形成し、フォトリゾグラフィ
により、固定部４３〜４８が設けられる位置の保護膜５
１を図２Ｂに示すように除去して***５２を形成する。
図２Ｃに示すように、可動電極板３２となる多結晶シリ
コン層５３を全体の上に形成し、多結晶シリコン層５３
に対し、図２Ｄに示すようにフォトリゾグラフィにより
パターンニングして可動電極板３２、支持体３３〜３
６、固定部４５〜４８を形成する。This structure can be made, for example, as shown in FIG. As shown in FIG. 2A, a protective film 51 of SiO 2 is formed on a silicon substrate 31a, and the protective film 5 is provided by photolithography at a position where the fixing portions 43 to 48 are provided.
1 is removed as shown in FIG. 2B to form small holes 52.
As shown in FIG. 2C, a polycrystalline silicon layer 53 serving as the movable electrode plate 32 is formed on the whole, and the polycrystalline silicon layer 53 is formed.
On the other hand, as shown in FIG. 2D, the movable electrode plate 32 and the supports 33 to 3 are patterned by photolithography.
6, forming the fixing parts 45-48.
【００１３】次に図２Ｅに示すようにＳｉＯ2 の保護膜
５４，５５を可動電極板３２を含む全面と、基板３１ａ
の底面とにそれぞれ形成し、図２Ｆに示すようにその底
面の保護膜５５を周辺部を残して除去し、これをマスク
として基板３１ａをＫＯＨ溶液でエッチングし、図２Ｇ
に示すように可動電極板３２と対応する部分に大きな穴
５６を開け、基板３１ａは枠のみ残す。その後、化学的
エッチングによりＳｉＯ2 の保護膜５１，５４，５５を
除去し、図２Ｈに示すように、枠状基板３１ａ上に可動
電極板３２が支持された構造体を得る。図２Ｉに示すよ
うに、この枠状基板３１ａの枠内を、可動電極板３２と
反対側からシリコン基板３１ｂで塞ぎ、基板３１ａ，３
１ｂを接合させる。基板３１ａと３１ｂとにより図１中
の基板３１が構成される。Next, as shown in FIG. 2E, protective films 54 and 55 of SiO 2 are formed on the entire surface including the movable electrode plate 32 and the substrate 31a.
2F, the protective film 55 on the bottom surface is removed while leaving the peripheral portion as shown in FIG. 2F, and using this as a mask, the substrate 31a is etched with a KOH solution, and FIG.
A large hole 56 is made in a portion corresponding to the movable electrode plate 32 as shown in FIG. Thereafter, the protective films 51, 54, and 55 of SiO 2 are removed by chemical etching to obtain a structure in which the movable electrode plate 32 is supported on the frame-shaped substrate 31a as shown in FIG. 2H. As shown in FIG. 2I, the inside of the frame of the frame-shaped substrate 31a is closed with a silicon substrate 31b from the side opposite to the movable electrode plate 32, and the substrates 31a, 3
1b is joined. The substrate 31 in FIG. 1 is constituted by the substrates 31a and 31b.
【００１４】可動電極板３２上に図１に示すようにミラ
ー４９が立てられる。ミラー４９の鏡面は、例えば支持
体３３，３４を結ぶ方向と４５度をなすようにされる。
可動電極板３２が静電引力により基板３１側に変位する
ことができるようにされる。つまり可動電極板３２は導
電性体で構成され、例えばシリコンに適当に不純物が混
入されて導電性が与えられ、また基板３１もシリコンに
不純物が混入されて導電性体とされ、基板３１自体を固
定電極とされる。基板３１上に導電膜を形成して固定電
極としてもよい。A mirror 49 is set up on the movable electrode plate 32 as shown in FIG. The mirror surface of the mirror 49 is formed, for example, at an angle of 45 degrees with the direction connecting the supports 33 and 34.
The movable electrode plate 32 can be displaced toward the substrate 31 by electrostatic attraction. That is, the movable electrode plate 32 is made of a conductive material, for example, silicon is appropriately mixed with an impurity to give conductivity, and the substrate 31 is also made of a conductive material by mixing an impurity into silicon. It is a fixed electrode. A conductive film may be formed on the substrate 31 to serve as a fixed electrode.
【００１５】ミラー４９は可動電極板３２と一体に形成
してもよいし、別体のミラー４９を可動電極板３２に固
着してもよい。可動電極板３２、支持体３３〜３６の厚
みは例えば２〜５μｍ程度とされる。この光スイッチ
も、図７に示したものと同様に、図１において左側に配
された入射側光ファイバ又は光導波路１７からの光束１
８はミラー４９に入射し、これにて反射され、出射側光
ファイバ又は光導波路１９に入射する。可動電極板３２
と基板３１の間に電圧が印加され、これら間に静電引力
を作用させると、可動電極板３２が基板３１側に変位し
て、入射側光ファイバ又は光導波路１７よりの光束はミ
ラー４９上を通過して反対側の出射側光ファイバ又は光
導波路２１に入射する。よって可動電極板３２と基板３
１との間に電圧を印加するかしないかにより、光ファイ
バ又は光導波路１７からの光束を光ファイバ又は光導波
路１９と光ファイバ又は光導波路２１とに切替え入射さ
せることができる。The mirror 49 may be formed integrally with the movable electrode plate 32, or a separate mirror 49 may be fixed to the movable electrode plate 32. The thicknesses of the movable electrode plate 32 and the supports 33 to 36 are, for example, about 2 to 5 μm. This optical switch also has a light flux 1 from the incident side optical fiber or optical waveguide 17 arranged on the left side in FIG.
8 enters the mirror 49, is reflected by the mirror 49, and enters the output side optical fiber or the optical waveguide 19. Movable electrode plate 32
When a voltage is applied between the substrate and the substrate 31, and an electrostatic attraction is applied between them, the movable electrode plate 32 is displaced toward the substrate 31, and the light beam from the incident side optical fiber or the optical waveguide 17 is reflected on the mirror 49. And enters the opposite output side optical fiber or optical waveguide 21. Therefore, the movable electrode plate 32 and the substrate 3
The light flux from the optical fiber or the optical waveguide 17 can be switched into the optical fiber or the optical waveguide 19 and the optical fiber or the optical waveguide 21 depending on whether or not a voltage is applied between the optical fiber and the optical fiber.
【００１６】この光スイッチの寸法としては例えば可動
電極板３２の１辺の長さＬ４を１０００μｍ、支持体３
３〜３６の各長さＬ１を３００μｍ、その折り返し幅Ｌ
２を２００μｍ、ビーム幅Ｗ２を１０μｍ、固定部４５
〜４８をそれぞれ角柱状とし、その断面を５０μｍ□と
し、中央方形部３２ａと各周辺方形部３２ｂ〜３２ｅと
の各共通部の長さＬ３を３０μｍとする。The dimensions of the optical switch are, for example, the length L4 of one side of the movable electrode plate 32 is 1000 μm,
The length L1 of each of Nos. 3 to 36 is 300 μm, and its folded width L
2 is 200 μm, the beam width W2 is 10 μm,
To 48 are each prismatic, have a cross section of 50 μm square, and the length L3 of each common portion of the central rectangular portion 32a and each of the peripheral rectangular portions 32b to 32e is 30 μm.
【００１７】このように方形電極板３２の一部を切除し
て、その切除部に支持体３３〜３６を配しているため、
方形電極板３２の面積を大きくとることができ、支持体
３３〜３６は折り返しビーム状とされているため、その
長さＬ１に対し、ビームの長さが長くなり、柔らかいも
のとすることができる。図７の考えからすると可動電極
板は中央正方形部３２ａのみであったが、この実施例で
は支持体３３〜３６の部分の両側に周辺正方形部３２ｂ
〜３２ｅを配し、中央正方形部３２ａと連結し、可動電
極板３２の面積が著しく大きくなったと云える。前記数
値例では中央正方形部３２ａの３００×３００μｍ2 に
対し、４つの周辺正方形部３２ｂ〜３２ｅの４×３８０
×３８０μｍ2 分、面積が増加したと云える。あるいは
逆に可動電極板３２に切除部を設け、切除部内に支持体
３３〜３６を配置し、全体の大きさを著しく小さくした
と云える。Since a part of the square electrode plate 32 is cut off and the supports 33 to 36 are arranged at the cut portion,
Since the area of the square electrode plate 32 can be increased, and the supports 33 to 36 are formed in a folded beam shape, the length of the beam is longer than the length L1 and can be made soft. . According to the idea of FIG. 7, the movable electrode plate is only the central square portion 32a, but in this embodiment, the peripheral square portions 32b are provided on both sides of the support members 33 to 36.
~ 32e and connected to the central square portion 32a, it can be said that the area of the movable electrode plate 32 has been significantly increased. In the above numerical example, the center square portion 32a has a size of 300 × 300 μm 2 and the four peripheral square portions 32b to 32e have a size of 4 × 380.
It can be said that the area increased by × 380 μm 2 minutes. Or, conversely, it can be said that a cut portion is provided in the movable electrode plate 32, and the supports 33 to 36 are arranged in the cut portion, thereby significantly reducing the overall size.
【００１８】図１の実施例では可動電極板３２を、その
中心に対し、９０度角間隔で支持体３３〜３６により４
点支持したが、図３Ａに示すように２つの支持体３３，
３４により１８０度角間隔で２点支持としてもよい。こ
の場合の数値例を示す。可動電極板３２は１辺が１００
０μｍの正方形（ただし二つの長方形切除部４１，４２
がある）、支持体３３，３４の各長さＬ１を３００μ
ｍ、その折り返し幅Ｌ２を２００μｍ、ビーム幅Ｗ２を
１０μｍ、固定部４５，４６の断面を５０μｍ□、切除
部４１と４２の内端間の距離Ｌ３を３００μｍ、切除部
４１，４２の幅Ｗ１を２４０μｍとする。なお図３Ａに
示す実施例では基板３１を、可動電極板３２の正方形形
状とほぼ同一とした場合である。つまりこの光スイッチ
の水平面内の大きさは、可動電極板３２の大きさと一致
し、光スイッチの外形は前記数値例では１０００μｍ４
方となる。In the embodiment of FIG. 1, the movable electrode plate 32 is supported by supports 33 to 36 at 90-degree angular intervals with respect to the center thereof.
It was point supported, but as shown in FIG.
34, two-point support may be provided at 180-degree angle intervals. A numerical example in this case is shown. The movable electrode plate 32 has 100 sides.
0 μm square (however, two rectangular cutouts 41 and 42)
And the length L1 of each of the supports 33 and 34 is set to 300 μm.
m, the folded width L2 is 200 μm, the beam width W2 is 10 μm, the cross section of the fixing portions 45 and 46 is 50 μm □, the distance L3 between the inner ends of the cut portions 41 and 42 is 300 μm, and the width W1 of the cut portions 41 and 42 is 240 μm. The embodiment shown in FIG. 3A is a case where the substrate 31 is substantially the same as the square shape of the movable electrode plate 32. That is, the size of the optical switch in the horizontal plane matches the size of the movable electrode plate 32, and the outer shape of the optical switch is 1000 μm 4 in the above numerical example.
One.
【００１９】図３Ｂに示すように可動電極板３２を１点
支持とさせることもできる。つまり、可動電極板３２の
一辺に沿って二つの支持体３３，３４が配され、支持体
３３，３４の離れた端が固定部４５，４６を介して基板
３１に連結され、接近した端が互いに連結され、その連
結点が連結部６１を介して可動電極板３２の隣接辺の中
点に連結される。つまりこの連結部６１との連結点で可
動電極板３２は支持体３３，３４により片持支持され
る。正方形可動電極板３２の一辺に沿ってその一部が切
除された切除部６２が形成され、その切除部６２に支持
体３３，３４が配されていると云える。As shown in FIG. 3B, the movable electrode plate 32 can be supported at one point. That is, two supports 33 and 34 are arranged along one side of the movable electrode plate 32, the separated ends of the supports 33 and 34 are connected to the substrate 31 via the fixing portions 45 and 46, and the approached ends are The movable electrode plate 32 is connected to a middle point of the adjacent side of the movable electrode plate 32 via a connection portion 61. That is, the movable electrode plate 32 is cantilevered at the connection point with the connection portion 61 by the supports 33 and 34. It can be said that a cutout portion 62 is formed by cutting a part of the square movable electrode plate 32 along one side thereof, and the supports 33 and 34 are arranged in the cutout portion 62.
【００２０】この場合の数値例は、可動電極板３２の長
い辺Ｌ４を１０００μｍ、短い辺Ｌ５を７８０μｍ、支
持体３３，３４の各長さＬ１を４５０μｍ、折り返し幅
Ｌ２を２００μｍ、ビーム幅Ｗ１を１０μｍ、連結部６
１の長さＬ３を１１５μｍ、幅Ｗ２を１０μｍ、固定部
４５，４６の断面を５０μｍ□とする。光スイッチの外
形は１０００μｍ４方となる。The numerical examples in this case are as follows: the long side L4 of the movable electrode plate 32 is 1000 μm, the short side L5 is 780 μm, the length L1 of each of the supports 33 and 34 is 450 μm, the folded width L2 is 200 μm, and the beam width W1 is 10 μm, connecting part 6
1 has a length L3 of 115 μm, a width W2 of 10 μm, and cross sections of the fixing portions 45 and 46 of 50 μm □. The outer shape of the optical switch is 1000 μm4.
【００２１】１点支持であるが図４Ａに示すように構成
することもできる。即ち、長方形可動電極板３２の二つ
の長辺にそれぞれ沿った支持体３３，３４が配され、支
持体３３，３４の同一側の一端が固定部４５，４６をそ
れぞれ介して基板３１に連結され、支持体３３，３４の
他端が連結ビーム６２の両端に連結され、連結ビーム６
２の中点が可動電極板３２の一つの短辺の中点に連結さ
れる。つまり支持体３３，３４と連結ビーム６２によ
り、可動電極板３２がその一つの短辺を残して囲まれて
いる。正方形の可動電極板３２の両側辺部を切除し、そ
の切除部に支持体３３，３４が配されているとも云え
る。このようにすると支持体３３，３４の長さを長くす
ることができる。Although it is a one-point support, it can be configured as shown in FIG. 4A. That is, supports 33 and 34 are respectively arranged along two long sides of the rectangular movable electrode plate 32, and one ends of the supports 33 and 34 on the same side are connected to the substrate 31 via the fixing portions 45 and 46, respectively. The other ends of the supports 33 and 34 are connected to both ends of the connection beam 62, and the connection beams 6
The two midpoints are connected to the midpoint of one short side of the movable electrode plate 32. That is, the movable electrode plate 32 is surrounded by the supports 33 and 34 and the connection beam 62 except for one short side thereof. It can also be said that both sides of the square movable electrode plate 32 are cut off, and the supports 33 and 34 are arranged at the cut-off portions. In this way, the lengths of the supports 33 and 34 can be increased.
【００２２】この場合の数値例を示す。支持体３３，３
４の各長さＬ１を９４０μｍ、折り返し幅Ｌ２を２００
μｍ、ビーム幅Ｗ１を１０μｍ、連結ビーム６２の長さ
Ｌ３を８１０μｍ、幅Ｗ２を１０μｍ、固定部４５，４
６の断面を５０μｍ□、可動電極板３２の長辺Ｌ４を９
７０μｍ、短辺Ｌ５を５６０μｍとする。光スイッチの
各形が１０００μｍ４方となる。A numerical example in this case is shown. Supports 33, 3
4 each have a length L1 of 940 μm and a folded width L2 of 200
μm, the beam width W1 is 10 μm, the length L3 of the connection beam 62 is 810 μm, the width W2 is 10 μm, and the fixing portions 45 and 4
6 is 50 μm square, and the long side L4 of the movable electrode plate 32 is 9
70 μm, and the short side L5 is 560 μm. Each shape of the optical switch is 1000 μm4.
【００２３】図４Ｂに示すように、図４Ａ中の連結ビー
ム６２を省略して支持体３３，３４の各一端を連結部６
３，６４で可動電極板３２の短辺の両端に連結してもよ
い。この場合の数値例は、支持体３３，３４の長さＬ１
が９４０μｍ、折り返し幅Ｌ２が２００μｍ、ビーム幅
Ｗ１が１０μｍ、連結部６３，６４の長さＬ３が１２５
μｍ、幅Ｗ２が１０μｍ、固定部４５，４６の端面が５
０μｍ□、可動電極板３２の長辺Ｌ４が１０００μｍ、
短辺Ｌ５が５６０μｍ、光スイッチの外形が１０００μ
ｍ４方となる。As shown in FIG. 4B, one end of each of the supports 33 and 34 is connected to the connecting portion 6 by omitting the connecting beam 62 in FIG. 4A.
3, 64 may be connected to both ends of the short side of the movable electrode plate 32. A numerical example in this case is the length L1 of the supports 33 and 34.
Is 940 μm, the folding width L2 is 200 μm, the beam width W1 is 10 μm, and the length L3 of the connecting portions 63 and 64 is 125
μm, the width W2 is 10 μm, and the end faces of the fixing portions 45 and 46 are 5 μm.
0 μm □, the long side L4 of the movable electrode plate 32 is 1000 μm,
The short side L5 is 560 μm, and the optical switch has an outer shape of 1000 μm.
m4.
【００２４】図５Ａに示すように、図３Ｂに対し、支持
体３３，３４と可動電極板３２と反対側に同様に支持体
３５，３６を設け、その支持体３５，３６を連結し、そ
の連結点を可動電極板３２に連結して、可動電極板３２
を２点支持とすることもできる。図５Ｂに示すように正
方形スイッチ外形６５に内接して９０度回転された正方
形可動電極板３２を配し、可動電極板３２の各辺の中点
に、支持体３３〜３６の各一端を連結し、支持体３３〜
３６の各他端を、光スイッチ外形６５の各コーナ部で基
板３１に立てた固定部４５〜４８に連結する。各支持体
３３〜３６はその折り返しビームの幅を、可動電極板３
２側で大きく、固定部側で小さくなるようにして、可動
電極板３２と光スイッチ外形６５との空き領域を有効に
使用する。この場合も、可動電極板３２は光スイッチ外
形６５と同様であった所を各コーナ部を切除し、その切
除部を埋めるように支持体３３〜３６を配したと云うこ
とができる。As shown in FIG. 5A, similarly to FIG. 3B, supports 35 and 36 are similarly provided on the opposite sides of the supports 33 and 34 and the movable electrode plate 32, and the supports 35 and 36 are connected. The connection point is connected to the movable electrode plate 32 so that the movable electrode plate 32
May be supported at two points. As shown in FIG. 5B, a square movable electrode plate 32 rotated by 90 degrees is inscribed in the square switch outer shape 65, and one end of each of the supports 33 to 36 is connected to the midpoint of each side of the movable electrode plate 32. And support 33 ~
The other end of 36 is connected to fixing portions 45 to 48 erected on the substrate 31 at each corner of the optical switch outer shape 65. Each of the supports 33 to 36 sets the width of the folded beam to the movable electrode plate 3.
The free space between the movable electrode plate 32 and the optical switch outer shape 65 is effectively used so that the space is larger on the second side and smaller on the fixed portion side. Also in this case, it can be said that the corners of the movable electrode plate 32 which are similar to the optical switch outer shape 65 are cut off at the respective corner portions, and the supports 33 to 36 are arranged so as to fill the cut portions.
【００２５】図６に示すように、可動電極板３２の外形
を、光スイッチ外形６５とほぼ一致させ、可動電極板３
２の各コーナ部より中心に向って長方形の切除部４１〜
４４を設け、これら切除部４１〜４４に支持体３３〜３
６を配し、支持体３３〜３６の各内端を可動電極板３２
に連結し、各外端を固定部４５〜４８を介して基板３１
に連結する。As shown in FIG. 6, the outer shape of the movable electrode plate 32 substantially matches the outer shape 65 of the optical switch.
Rectangular cutouts 41 to 41 from each corner toward the center
44, and the support members 33-3
6 and the inner ends of the supports 33 to 36 are connected to the movable electrode plate 32.
And each outer end is connected to the substrate 31 via fixing portions 45 to 48.
Connect to
【００２６】上述では支持体として折り返しビーム状の
ものを用いたが、弾性をもつものであればよく、例えば
図７に示した方形状部を設けたフレクチュア部でもよ
い。In the above description, the folded back beam is used as the support. However, any support may be used as long as it has elasticity. For example, it may be a flexure portion provided with a square portion shown in FIG.
【００２７】[0027]
【発明の効果】この発明によれば可動電極板と支持体が
占める領域との全体が占める領域が方形状となっている
ため、マトリックス光スイッチを構成した場合スペース
を無駄なく利用できる。可動電極板の切除部に支持体が
配されているため、小型に構成でき、かつ可動電極板の
面積を大きくすることができ、つまり光スイッチ外形面
積が無駄なく有効に利用され、低電圧駆動が可能であ
る。According to the present invention, since the entire area occupied by the movable electrode plate and the area occupied by the support is rectangular, the space can be efficiently used when a matrix optical switch is constructed. Since the support is provided at the cutout of the movable electrode plate, it can be made compact and the area of the movable electrode plate can be increased, that is, the outer area of the optical switch can be effectively used without waste, and low-voltage driving can be performed. Is possible.
【図面の簡単な説明】[Brief description of the drawings]
【図１】Ａはこの発明の実施例を示す平面図、Ｂは図１
ＡのＡ−Ａ線断面図。FIG. 1A is a plan view showing an embodiment of the present invention, and FIG.
A sectional view on the AA line of A.
【図２】図１の実施例の製造工程を示す断面図。FIG. 2 is a sectional view showing a manufacturing process of the embodiment of FIG. 1;
【図３】この発明の他の実施例を示す平面図。FIG. 3 is a plan view showing another embodiment of the present invention.
【図４】この発明の更に他の実施例を示す平面図。FIG. 4 is a plan view showing still another embodiment of the present invention.
【図５】この発明の更に他の実施例を示す平面図。FIG. 5 is a plan view showing still another embodiment of the present invention.
【図６】この発明の更に他の実施例を示す平面図。FIG. 6 is a plan view showing still another embodiment of the present invention.
【図７】Ａに提案されている光スイッチの平面図、Ｂは
ＡのＡ−Ａ線断面図である。FIG. 7 is a plan view of an optical switch proposed in A, and FIG. 7B is a cross-sectional view of A in AA line.
Claims (4)
垂直に変位できる可動電極板と、 その可動電極板上に直立されたミラーと、 上記可動電極板に一端が、他端が上記基板にそれぞれ連
結され、可動電極板を基板上に支持する弾性を有する支
持体とを具備し、 可動電極板と基板の固定電極との間に電圧印加、その除
去により可動電極板及びミラーを変位させ、ミラーに向
かう光束を通過又は反射させる光スイッチにおいて、 上記支持体が占める領域と上記可動電極板が占める領域
とが、全体として方形領域を形成していることを特徴と
する光スイッチ。1. A substrate, a movable electrode plate disposed parallel to and opposed to the substrate surface and capable of being displaced vertically with respect to the substrate surface; a mirror standing upright on the movable electrode plate; One end is connected to the substrate at the other end, and has a resilient support for supporting the movable electrode plate on the substrate. A voltage is applied between the movable electrode plate and the fixed electrode of the substrate, and the voltage is removed. In an optical switch for displacing a movable electrode plate and a mirror to pass or reflect a light beam directed to the mirror, a region occupied by the support and a region occupied by the movable electrode plate form a rectangular region as a whole. Optical switch characterized.
その少くとも１辺の中央部から中心部に向う切除部が形
成され、その切除部にその領域をほぼ埋めるように支持
体が位置されていることを特徴とする請求項１記載の光
スイッチ。2. The movable electrode plate has a substantially rectangular shape.
2. The optical switch according to claim 1, wherein a cutout portion is formed from at least a center portion of one side toward the center portion, and the support is positioned so as to substantially fill the cutout portion.
上記支持体は上記可動電極板の一辺に沿って配されてい
ることを特徴とする請求項１記載の光スイッチ。3. The movable electrode plate has a substantially rectangular shape.
The optical switch according to claim 1, wherein the support is disposed along one side of the movable electrode plate.
ッチにおいて、 上記支持体は可動電極板と平行な面内で折り返しビーム
状に形成されていることを特徴とする光スイッチ。4. The optical switch according to claim 1, wherein the support is formed in a folded beam shape in a plane parallel to the movable electrode plate.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5742799A JP3721420B2 (en) | 1999-03-04 | 1999-03-04 | Light switch |
| DE2000621638 DE60021638T2 (en) | 1999-03-04 | 2000-03-02 | Optical switch and method of making such a switch |
| CA 2299832 CA2299832C (en) | 1999-03-04 | 2000-03-02 | Optical switch and method of making the same |
| EP00104411A EP1033601B1 (en) | 1999-03-04 | 2000-03-02 | Optical switch and method of making the same |
| US09/519,883 US6463190B1 (en) | 1998-10-16 | 2000-03-06 | Optical switch and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5742799A JP3721420B2 (en) | 1999-03-04 | 1999-03-04 | Light switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000258702A true JP2000258702A (en) | 2000-09-22 |
| JP3721420B2 JP3721420B2 (en) | 2005-11-30 |
Family
ID=13055367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5742799A Expired - Fee Related JP3721420B2 (en) | 1998-10-16 | 1999-03-04 | Light switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3721420B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002221673A (en) * | 2001-01-26 | 2002-08-09 | Olympus Optical Co Ltd | Optical unit equipped with actuator |
| US6463190B1 (en) * | 1998-10-16 | 2002-10-08 | Japan Aviation Electronics Industry Limited | Optical switch and method of making the same |
| WO2003056380A1 (en) * | 2001-12-26 | 2003-07-10 | Nikon Corporation | Light beam switching/adjusting apparatus and manufacturing method thereof |
| KR100402991B1 (en) * | 2001-10-26 | 2003-10-23 | 한국과학기술연구원 | Micro optical switching device |
| JP2006211767A (en) * | 2005-01-26 | 2006-08-10 | Japan Aerospace Exploration Agency | Inertially driving actuator |
-
1999
- 1999-03-04 JP JP5742799A patent/JP3721420B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6463190B1 (en) * | 1998-10-16 | 2002-10-08 | Japan Aviation Electronics Industry Limited | Optical switch and method of making the same |
| JP2002221673A (en) * | 2001-01-26 | 2002-08-09 | Olympus Optical Co Ltd | Optical unit equipped with actuator |
| KR100402991B1 (en) * | 2001-10-26 | 2003-10-23 | 한국과학기술연구원 | Micro optical switching device |
| WO2003056380A1 (en) * | 2001-12-26 | 2003-07-10 | Nikon Corporation | Light beam switching/adjusting apparatus and manufacturing method thereof |
| EP1486814A1 (en) * | 2001-12-26 | 2004-12-15 | Nikon Corporation | Light beam switching/adjusting apparatus and manufacturing method thereof |
| EP1486814A4 (en) * | 2001-12-26 | 2005-11-16 | Nikon Corp | Light beam switching/adjusting apparatus and manufacturing method thereof |
| US7010200B2 (en) | 2001-12-26 | 2006-03-07 | Nikon Corporation | Light-beam switching/adjusting apparatus and manufacturing method thereof |
| CN100376918C (en) * | 2001-12-26 | 2008-03-26 | 株式会社尼康 | Light-beam switching/adjusting apparatus and manufacturing method thereof |
| JP2006211767A (en) * | 2005-01-26 | 2006-08-10 | Japan Aerospace Exploration Agency | Inertially driving actuator |
| JP4686784B2 (en) * | 2005-01-26 | 2011-05-25 | 独立行政法人 宇宙航空研究開発機構 | Inertial drive actuator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3721420B2 (en) | 2005-11-30 |
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