JP2000251043A - Ic card and terminal board for ic card - Google Patents
Ic card and terminal board for ic cardInfo
- Publication number
- JP2000251043A JP2000251043A JP11049635A JP4963599A JP2000251043A JP 2000251043 A JP2000251043 A JP 2000251043A JP 11049635 A JP11049635 A JP 11049635A JP 4963599 A JP4963599 A JP 4963599A JP 2000251043 A JP2000251043 A JP 2000251043A
- Authority
- JP
- Japan
- Prior art keywords
- card
- terminal
- nickel
- terminal plate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は，ＩＣカードに関
し，特に，外部機器がＩＣにアクセスするための端子板
に関する。さらに詳細には，ＩＣとの接続のためのボン
ディング性の向上を図ったＩＣカード用端子板およびそ
れを用いたＩＣカードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more particularly to a terminal board for external devices accessing an IC. More particularly, the present invention relates to an IC card terminal plate for improving bonding properties for connection to an IC and an IC card using the same.
【０００２】[0002]
【従来の技術】従来から，ＩＣ（集積回路）を内蔵する
とともにそのＩＣに種々のデータを格納したＩＣカード
が用いられている。従来のＩＣカードは，図３に例示す
る構造のＩＣカード用プリント配線板１００を用いて構
成されている。2. Description of the Related Art Heretofore, an IC card having a built-in IC (integrated circuit) and storing various data in the IC has been used. A conventional IC card is configured using an IC card printed wiring board 100 having the structure illustrated in FIG.
【０００３】図３に示されるＩＣカード用プリント配線
板１００は基本的に，ガラエポ基材１０１の一面にステ
ンレス箔１０２を，他面に銅箔１０３を貼着した基板に
より構成されている。そして，銅箔１０３の側（図３中
下側）の面の一部に凹部１０４が形成されており，そこ
にＩＣ１０５が収納されている。また，銅箔１０３の表
面にはニッケル−金めっき１０６が施されている。そし
て，このニッケル−金めっき面１０６とＩＣ１０５と
が，ボンディングワイヤ１０７により接続されている。
さらに，ガラエポ基材１０１には所々に，表裏を貫通す
るスルーホール１０８が形成されている。スルーホール
１０８は導電ペースト１０９で充填されており，これに
よりステンレス箔１０２と銅箔１０３との導通がとられ
ている。なお，スルーホール１０８における図３中下側
の端部は，オーバコート剤１１０により導電ペースト１
０９が封口されている。The printed wiring board 100 for an IC card shown in FIG. 3 is basically composed of a substrate having a stainless steel foil 102 adhered to one surface of a glass epoxy base material 101 and a copper foil 103 adhered to the other surface. A concave portion 104 is formed in a part of the surface on the side of the copper foil 103 (the lower side in FIG. 3), and the IC 105 is accommodated therein. Further, nickel-gold plating 106 is applied to the surface of the copper foil 103. The nickel-gold plated surface 106 and the IC 105 are connected by a bonding wire 107.
Further, through holes 108 are formed in the glass epoxy substrate 101 in some places so as to penetrate the front and back surfaces. The through-holes 108 are filled with a conductive paste 109, thereby establishing conduction between the stainless steel foil 102 and the copper foil 103. The lower end of the through hole 108 in FIG.
09 is sealed.
【０００４】図３のＩＣカード用プリント配線板１００
は，図３に示される状態の下側に，塩ビ板等のカード基
材を貼り合わせてＩＣカードとされる。その状態では，
ステンレス箔１０２を介して外部機器がＩＣ１０５にア
クセスし，データを読み取ったり書き込んだりすること
ができる。すなわち，ステンレス箔１０２は，外部から
ＩＣ１０５にアクセスするための外部接続端子である。FIG. 3 shows a printed wiring board 100 for an IC card.
Is made into an IC card by bonding a card base such as a PVC plate to the lower side of the state shown in FIG. In that state,
An external device can access the IC 105 via the stainless steel foil 102 to read and write data. That is, the stainless steel foil 102 is an external connection terminal for accessing the IC 105 from outside.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら，前述の
図３に示すＩＣカード用プリント配線板１００を用いた
ＩＣカードには，製造工程が複雑であるという問題点が
あった。これは，ＩＣカード用プリント配線板１００
が，ガラエポ基材１０１にスルーホール１０８を形成し
てなる複雑な構造を有するためである。このスルーホー
ル１０８の形成のため，ドリリングやそのペースト埋
め，封口などの工程を要していたのである。However, the IC card using the IC card printed wiring board 100 shown in FIG. 3 has a problem that the manufacturing process is complicated. This is a printed circuit board for IC cards 100
However, this is because it has a complicated structure in which the through hole 108 is formed in the glass epoxy substrate 101. In order to form the through holes 108, processes such as drilling, filling the paste, and sealing were required.
【０００６】このような複雑な構造および製造工程が必
要だったのは，以下の理由による。すなわち，外部接続
端子たるステンレス箔１０２は，外部機器の端子と頻繁
に接触するものであるから，相応の強度と大気中での耐
食性が必要である。このためにその素材としてステンレ
スが用いられているのである。しかしながら，ステンレ
スの耐食性は，表面に形成される薄いが安定な酸化物の
不動態被膜によるものである。このため，不動態皮膜が
邪魔をして鑞付け性がよくないのである。このために，
図３に示したように，ボンディングワイヤ１０７の鑞付
けをステンレス箔１０２でなく銅箔１０３のニッケル−
金めっき面１０６に行うとともに，ステンレス箔１０２
と銅箔１０３との導通をとるスルーホール１０８が必要
なのである。[0006] Such complicated structures and manufacturing steps were required for the following reasons. That is, since the stainless steel foil 102 serving as the external connection terminal frequently comes into contact with the terminal of the external device, the stainless steel foil 102 needs to have appropriate strength and corrosion resistance in the atmosphere. For this reason, stainless steel is used as the material. However, the corrosion resistance of stainless steel is due to a thin but stable oxide passivation film formed on the surface. Therefore, the passivation film hinders the brazing properties. For this,
As shown in FIG. 3, the brazing of the bonding wire 107 is performed not by the stainless steel foil 102 but by the nickel foil of the copper foil 103.
This is performed on the gold plating surface 106 and the stainless steel foil 102
A through-hole 108 is required to establish electrical continuity between the metal foil and the copper foil 103.
【０００７】本発明は，前記した従来の技術が有する問
題点の解決を目的としてなされたものである。すなわち
その課題とするところは，外部機器の端子と頻繁に接触
するために必要な大気中での耐食性等を有するばかりで
なく，直接にボンディングワイヤを鑞付けできるボンデ
ィング性に優れたＩＣカード用端子板を提供し，ＩＣカ
ードの構造および製造工程を簡略化させることにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art. That is, the object is to provide IC card terminals that have not only corrosion resistance in the atmosphere required for frequent contact with terminals of external equipment, but also have excellent bonding properties that allow direct bonding of a bonding wire. The purpose of the present invention is to provide a board to simplify the structure and manufacturing process of an IC card.
【０００８】[0008]
【課題を解決するための手段】この課題の解決のために
なされた本発明に係るＩＣカード用端子板は，ＩＣとの
接続のためのボンディング面と外部機器との接触のため
の外部端子面とを有する板材であって，大気中で表面に
不動態皮膜を形成する材質の導電性板材を主材とし，大
気中で表面に不動態皮膜を形成しない材質の導電性皮膜
を主材の一面に形成してボンディング面とし，主材の他
面を外部端子面としたものである。Means for Solving the Problems A terminal board for an IC card according to the present invention, which has been made to solve the above problem, has a bonding surface for connection with an IC and an external terminal surface for contact with an external device. The main material is a conductive plate material that forms a passivation film on the surface in the atmosphere, and a conductive film that does not form a passivation film on the surface in the air. To form a bonding surface and the other surface of the main material as an external terminal surface.
【０００９】このＩＣカード用端子板では，外部端子面
は主材そのものであり，不動態皮膜で覆われている。し
たがって，大気中できわめて安定しており，外部機器と
の接触に不具合はない。一方，ボンディング面において
は，主材が直接に大気と接触することはない。したがっ
てボンディング面は不動態皮膜で覆われておらず，ＩＣ
との接続のためのワイヤを鑞付けにより容易にボンディ
ングすることができる。このように，一面が外部端子面
であると同時に他面が直接鑞付け可能である。このた
め，このＩＣカード用端子板を用いると，簡単な構造で
ＩＣカードを実現でき，その際の製造工程も簡単であ
る。In this IC card terminal plate, the external terminal surface is the main material itself and is covered with a passive film. Therefore, it is extremely stable in the atmosphere and there is no problem in contact with external devices. On the other hand, on the bonding surface, the main material does not come into direct contact with the atmosphere. Therefore, the bonding surface is not covered with the passive film,
The wire for connection with the wire can be easily bonded by brazing. In this way, one surface is the external terminal surface and the other surface can be directly brazed. Therefore, by using this IC card terminal plate, an IC card can be realized with a simple structure, and the manufacturing process at that time is also simple.
【００１０】ここにおいて，ボンディング面をなす導電
性皮膜は，主材との間に不動態皮膜を挟むことなく，主
材を構成する素材と直接に密着していることが好まし
い。もし，それらの間に主材の不動態皮膜が介在してい
ると，導電性皮膜の密着性が悪く容易に剥離してしまう
からである。また，導電性皮膜と主材との間の電気抵抗
が上昇してしまうからでもある。したがって，導電性皮
膜の形成の際には，主材の不動態皮膜を除去し，かつ，
再び不動態皮膜が形成されることなく導電性皮膜を形成
するプロセスを用いるべきである。Here, it is preferable that the conductive film forming the bonding surface is in direct contact with the material constituting the main material without interposing a passivation film between the main material and the conductive film. If the passivation film of the main material is interposed between them, the adhesion of the conductive film is poor and the conductive film is easily peeled off. Also, this is because the electric resistance between the conductive film and the main material increases. Therefore, when forming the conductive film, remove the passivation film of the main material, and
A process that forms a conductive film without again forming a passivation film should be used.
【００１１】本発明に係るＩＣカード用端子板におい
て，主材として用いるに適した素材としてはステンレス
鋼が挙げられる。また，導電性皮膜として用いるに適し
ているのは，金めっきもしくはニッケルめっきである。
このめっきは，金とニッケルとの多層めっきや合金めっ
きであってもよい。主材と導電性皮膜とのこの組み合わ
せの場合には，例えば，「Gold Plating of Critical C
omponents for Space Applications:Challenges and So
lutions」（I. Rajagopal et al.,Gold Bull.,1992,25
(2)）に記載されている方法により，ステンレス鋼板の
表面に不動態皮膜を介在させることなくめっき層を形成
することができる。In the terminal board for an IC card according to the present invention, stainless steel is an example of a material suitable for use as a main material. Also, gold plating or nickel plating is suitable for use as the conductive film.
This plating may be multilayer plating of gold and nickel or alloy plating. In the case of this combination of the main material and the conductive film, for example, “Gold Plating of Critical C”
omponents for Space Applications: Challenges and So
lutions "(I. Rajagopal et al., Gold Bull., 1992, 25
By the method described in (2)), the plating layer can be formed on the surface of the stainless steel sheet without interposing a passivation film.
【００１２】また，本発明に係るＩＣカードは，ステン
レス鋼で形成されるとともに一面に金めっきもしくはニ
ッケルめっきが施された端子板と，ＩＣと，端子板にお
ける前述の一面に鑞付けされこれをＩＣに接続するワイ
ヤと，端子板とＩＣとワイヤとを保持する基材とを有
し，端子板における他面が外部に露出して外部機器との
接触のための外部端子面をなしているものである。この
ＩＣカードでは，一方の面（他面）が外部端子面をなす
端子板の裏面（一面）に，ＩＣとの接続のためのワイヤ
が直接に鑞付けされている。このため構造が簡単であ
り，簡単な製造工程で製造できる。Further, an IC card according to the present invention comprises a terminal plate formed of stainless steel and having one surface subjected to gold plating or nickel plating, an IC, and the above-mentioned one surface of the terminal plate which is brazed to the terminal plate. It has a wire connected to the IC, a terminal plate, a base material holding the IC and the wire, and the other surface of the terminal plate is exposed to the outside to form an external terminal surface for contact with an external device. Things. In this IC card, a wire for connection to an IC is directly brazed to the back surface (one surface) of a terminal plate having one surface (the other surface) forming an external terminal surface. Therefore, the structure is simple, and it can be manufactured by a simple manufacturing process.
【００１３】[0013]
【発明の実施の形態】以下，本発明を具体化した実施の
形態について，図面を参照しつつ詳細に説明する。本実
施の形態は，片面にめっきを施したステンレス鋼板を端
子板に用いたＩＣカードである。本実施の形態に係るＩ
Ｃカード１は，図１の断面図に示される構造を有してい
る。図１に示されるＩＣカード１は，ＩＣ１０を中心に
構成されている。ＩＣカード１はこのほか，ＩＣ１０を
保持する端子板１１およびガラエポ基材１２，ＩＣ１０
と端子板１１とを接続するボンディングワイヤ１４，外
観上の大部分を占めるカード基材２０およびカバーフィ
ルム２１等を有している。Embodiments of the present invention will be described below in detail with reference to the drawings. The present embodiment is an IC card using a stainless steel plate plated on one side as a terminal plate. I according to the present embodiment
The C card 1 has a structure shown in the sectional view of FIG. The IC card 1 shown in FIG. The IC card 1 also includes a terminal plate 11 for holding the IC 10, a glass epoxy base material 12,
And a terminal board 11, a bonding wire 14, a card base 20 occupying most of the external appearance, a cover film 21, and the like.
【００１４】端子板１１は，ステンレス鋼製の薄い板材
であって，片側の面（図１中下側の面）１１Ａには後述
するニッケル−金めっきが施されている。しかしその反
対側の面１１Ｂは，めっきが施されていない素面であ
る。端子板１１は，外部の機器がＩＣ１０にアクセスす
るための外部接続端子としての役割を有するものであ
り，そのために面１１Ｂが外部に露出するとともに，適
宜のパターニングが施されている。The terminal plate 11 is a thin plate made of stainless steel, and one surface (lower surface in FIG. 1) 11A is plated with nickel-gold described later. However, the opposite surface 11B is an unplated bare surface. The terminal plate 11 has a role as an external connection terminal for an external device to access the IC 10, so that the surface 11B is exposed to the outside and appropriately patterned.
【００１５】ガラエポ基材１２は，端子板１１とともに
ＩＣカード用配線板をなすものである。図１の状態での
ガラエポ基材１２は，端子板１１と貼り合わせられてい
る。また，ＩＣ１０を収納する穴１２Ａや，ボンディン
グワイヤ１４を通す穴１２Ｂが形成されている。ボンデ
ィングワイヤ１４は，一端がＩＣ１０のピンに鑞付けさ
れており，他端はガラエポ基材１２の穴１２Ｂを通して
端子板１１のニッケル−金めっき面１１Ａに直接鑞付け
されている。The glass epoxy substrate 12 forms a wiring board for an IC card together with the terminal board 11. The glass epoxy substrate 12 in the state of FIG. 1 is bonded to the terminal plate 11. Further, a hole 12A for accommodating the IC 10 and a hole 12B for passing the bonding wire 14 are formed. One end of the bonding wire 14 is brazed to the pin of the IC 10, and the other end is directly brazed to the nickel-gold plated surface 11 </ b> A of the terminal plate 11 through the hole 12 </ b> B of the glass epoxy substrate 12.
【００１６】そしてＩＣカード１の裏面側（図１中下
側）は，カード基材２０で全面が覆われている。ＩＣカ
ード１の表面側（図１中上側）は，端子板１１が占める
部分を除き，カバーフィルム２１で覆われている。ま
た，ＩＣ１０やボンディングワイヤ１４は，封止樹脂１
５で封止されている。The entire back surface (lower side in FIG. 1) of the IC card 1 is covered with a card base material 20. The front side (upper side in FIG. 1) of the IC card 1 is covered with a cover film 21 except for a portion occupied by the terminal plate 11. Further, the IC 10 and the bonding wires 14 are formed of the sealing resin 1.
5 is sealed.
【００１７】かかるＩＣカード１は，概略，以下のよう
な手順で製造される。まず，片面接着剤付きのガラエポ
基材１２に，穴１２Ａおよび穴１２Ｂを形成する。この
とき，ボンディングワイヤ１４を通すための穴１２Ｂは
貫通穴である必要がある。一方，ＩＣ１０を収納するた
めの穴１２Ａは，図１では貫通穴としているが，有底穴
でもよい。有底穴とする場合には，非接着剤面から加工
する。なお，このときのガラエポ基材１２は，銅箔等の
導体箔が貼着されているものを用いる必要はない。The IC card 1 is generally manufactured by the following procedure. First, a hole 12A and a hole 12B are formed in the glass epoxy base material 12 with a single-sided adhesive. At this time, the hole 12B for passing the bonding wire 14 needs to be a through hole. On the other hand, the hole 12A for accommodating the IC 10 is a through hole in FIG. 1, but may be a bottomed hole. When using a hole with a bottom, process from the non-adhesive side. In this case, it is not necessary to use the glass epoxy substrate 12 to which a conductive foil such as a copper foil is adhered.
【００１８】次に，このガラエポ基材１２に，片面１１
Ａにニッケル−金めっきが施された端子板１１を貼り合
わせる。このとき，端子板１１のニッケル−金めっき面
１１Ａと，ガラエポ基材１２の接着剤面とが対面するよ
うにする。そして，端子板１１にパターンエッチングを
施す。次に，穴１２ＡにＩＣ１０を格納して固定する。
そして，ＩＣ１０と端子板１１とをボンディングワイヤ
１４で連結する。このとき，ボンディングワイヤ１４の
一端を，ガラエポ基材１２の穴１２Ｂを通して端子板１
１のニッケル−金めっき面１１Ａに直接に鑞付けする。
したがって，穴１２Ｂについては，内面にめっき皮膜を
形成したり導電ペースト等で充填したり等の煩雑な作業
は不要である。その後，ＩＣ１０やボンディングワイヤ
１４を封止樹脂１５で封止しつつ，カード基材２０およ
びカバーフィルム２１に組み付ける。かくしてＩＣカー
ド１が製造される。Next, the glass epoxy substrate 12 is placed on one side 11
A is bonded to a terminal plate 11 having a nickel-gold plating. At this time, the nickel-gold plated surface 11A of the terminal plate 11 and the adhesive surface of the glass epoxy base material 12 face each other. Then, pattern etching is performed on the terminal plate 11. Next, the IC 10 is stored and fixed in the hole 12A.
Then, the IC 10 and the terminal plate 11 are connected by the bonding wire 14. At this time, one end of the bonding wire 14 is passed through the hole 12B of the
1 is directly brazed to the nickel-gold plated surface 11A.
Therefore, for the hole 12B, a complicated operation such as forming a plating film on the inner surface or filling with a conductive paste is unnecessary. After that, the IC 10 and the bonding wires 14 are assembled with the card base material 20 and the cover film 21 while being sealed with the sealing resin 15. Thus, the IC card 1 is manufactured.
【００１９】ここで，端子板１１である片面めっき付き
ステンレス鋼板（以下，「サンプル」という）のニッケ
ル−金めっき面１１Ａは，素材のステンレス鋼の表面
に，不動態被膜を介在させることなく直接にめっきした
ものである必要がある。以下，そのためのめっき工程に
ついて説明する。このめっきは，図２に示す手順により
行われる。まず，溶剤脱脂を行う（＃１）。これは，ア
セトンあるいはアルコール類等の有機溶媒にサンプルを
浸して超音波加振器で加振する通常の溶剤脱脂を行えば
よい。Here, the nickel-gold plated surface 11A of the stainless steel plate with single-side plating (hereinafter referred to as "sample"), which is the terminal plate 11, is directly connected to the surface of the material stainless steel without interposing a passivation film. Must be plated. Hereinafter, the plating process for that will be described. This plating is performed according to the procedure shown in FIG. First, solvent degreasing is performed (# 1). This can be achieved by immersing the sample in an organic solvent such as acetone or alcohols and subjecting the sample to vibration with an ultrasonic vibrator to perform ordinary solvent degreasing.
【００２０】次に，カソード電解洗浄を行う（＃２）。
すなわち，アルカリ浴にサンプルを浸して，サンプルが
カソードになるように通電する。例えば，１０％水酸化
ナトリウム−１０％リン酸ナトリウム水溶液をアルカリ
浴として使用し，１００ｍＡ／ｃｍ2 の電流密度で２分
間通電すればよい。この，溶剤脱脂とカソード電解洗浄
とにより，サンプルの表面に付着している油脂分が完全
に除去される。この後，蒸留水で徹底的に洗浄する。Next, cathode electrolytic cleaning is performed (# 2).
That is, the sample is immersed in an alkaline bath and energized so that the sample becomes a cathode. For example, a 10% sodium hydroxide-10% sodium phosphate aqueous solution may be used as an alkaline bath, and current may be applied at a current density of 100 mA / cm 2 for 2 minutes. By this solvent degreasing and cathodic electrolytic cleaning, fats and oils adhering to the surface of the sample are completely removed. Thereafter, it is thoroughly washed with distilled water.
【００２１】次に，酸洗を行う（＃３）。すなわち，サ
ンプルの表面の酸化物（不動態被膜）を，酸により除去
する。例えば，サンプルを５０％塩酸に１０秒間浸し，
蒸留水で徹底的に洗浄する。これにより，不動態被膜が
溶解して除去される。そしてその後直ちに，ニッケルス
トライクめっきを行う（＃４）。このときのめっき液と
しては，塩化ニッケル６水和物１００ｇ／Ｌ，塩酸１８
０ｍＬ／Ｌのいわゆるウッド浴を用いることができる。
このめっき液で，２０ｍＡ／ｃｍ2 ，３０秒程度の通電
を行えばよい。このストライクめっきにより，不動態被
膜が再生成する前に薄いニッケル膜が形成され，後に形
成されるめっき被膜の密着性が確保される。Next, pickling is performed (# 3). That is, the oxide (passive film) on the surface of the sample is removed with an acid. For example, immerse the sample in 50% hydrochloric acid for 10 seconds,
Wash thoroughly with distilled water. Thereby, the passivation film is dissolved and removed. Immediately thereafter, nickel strike plating is performed (# 4). The plating solution used at this time was nickel chloride hexahydrate 100 g / L, hydrochloric acid 18
A so-called wood bath of 0 mL / L can be used.
The plating solution may be energized at 20 mA / cm 2 for about 30 seconds. By this strike plating, a thin nickel film is formed before the passivation film is regenerated, and the adhesion of the plating film formed later is ensured.
【００２２】次に，主ニッケルめっきを行う（＃５）。
このときのめっき液としては，硫酸ニッケル１５０ｇ／
Ｌ，塩化ニッケル５ｇ／Ｌ，ホウ酸１０ｇ／Ｌのいわゆ
るワット浴が使用できる。このめっき液で，２.５ｍＡ
／ｃｍ2，５分程度の通電を行えばよい。これにより主
ニッケルめっき層が形成される。この後，蒸留水で徹底
的に洗浄する。Next, main nickel plating is performed (# 5).
The plating solution used at this time was nickel sulfate 150 g /
What is called a Watt bath of L, nickel chloride 5 g / L, and boric acid 10 g / L can be used. 2.5 mA with this plating solution
/ Cm 2 for about 5 minutes. Thereby, a main nickel plating layer is formed. Thereafter, it is thoroughly washed with distilled water.
【００２３】次に，金めっきを行う（＃６）。このとき
のめっき液としては，シアン化金カリウム２０ｇ／Ｌ，
クエン酸アンモニウム７５ｇ／Ｌ，ｐＨ６のクエン酸金
めっき浴が使用できる。このめっき液で，浴温を２５〜
３０℃としつつ，２．５ｍＡ／ｃｍ2 ，３８分程度の通
電を行えばよい。その際のアノードとしては，不溶性の
白金めっき付きチタン電極を使用するのがよい。これに
より金めっき層が形成される。その後，めっき層の引き
剥ぎロスを最小限に押さえるべく，静水洗浄，流水洗
浄，蒸留水洗浄，乾燥の順で仕上げる。Next, gold plating is performed (# 6). At this time, the plating solution was 20 g / L of potassium gold cyanide,
A gold citrate plating bath of 75 g / L ammonium citrate, pH 6 can be used. The bath temperature is 25 ~
The current may be supplied at 2.5 mA / cm 2 for about 38 minutes while maintaining the temperature at 30 ° C. In this case, it is preferable to use an insoluble titanium electrode with platinum plating as the anode. Thereby, a gold plating layer is formed. Thereafter, in order to minimize the peeling loss of the plating layer, finishing is performed in the order of washing with still water, washing with running water, washing with distilled water, and drying.
【００２４】かくして，ステンレス鋼板の表面上に不動
態皮膜を介在させることなく直接にニッケル−金めっき
層１１Ａを形成することができる。かかるめっき層を片
面に有するものが，端子板１１である。したがって端子
板１１においては，ニッケル−金めっき層１１Ａの密着
性がよい。また，ニッケル−金めっき層１１Ａの表面に
は当然ながら不動態被膜は形成されないので，ボンディ
ングワイヤ１４の鑞付け性もよい。その一方，端子板１
１における反対側の面１１Ｂは，通常のステンレス鋼の
表面であるため，大気中での耐食性に優れるとともに，
外部機器の端子との接触の反復に耐える耐摩耗性を有し
ている。なお，＃５の主ニッケルめっきや，＃６の金め
っきの際，通電のオンとオフとを反復するパルス通電を
用いると，より緻密なめっき被膜が得られる。Thus, the nickel-gold plating layer 11A can be formed directly on the surface of the stainless steel sheet without interposing a passivation film. The terminal plate 11 has such a plating layer on one side. Therefore, in the terminal plate 11, the nickel-gold plating layer 11A has good adhesion. In addition, since no passivation film is formed on the surface of the nickel-gold plating layer 11A, the bonding wire 14 has good brazing properties. On the other hand, terminal board 1
The surface 11B on the opposite side of 1 is a normal stainless steel surface, so that it has excellent corrosion resistance in the atmosphere and
It has abrasion resistance to withstand repeated contact with external equipment terminals. In the case of # 5 main nickel plating or # 6 gold plating, a more precise plating film can be obtained by using a pulsed current that repeatedly turns on and off the current.
【００２５】以上詳細に説明したように本実施の形態で
は，ステンレス鋼板の片面に，不動態皮膜を介在させず
にニッケル−金めっき層１１Ａを形成して端子板１１を
得ている。これにより，非めっき面１１Ｂが通常のステ
ンレス鋼としての耐食性と耐摩耗性を有するとともに，
その裏面１１Ａに対しては直接にワイヤボンディングが
できる端子板１１が実現されている。As described above in detail, in this embodiment, the terminal plate 11 is obtained by forming the nickel-gold plating layer 11A on one surface of a stainless steel plate without interposing a passivation film. As a result, the non-plated surface 11B has the corrosion resistance and wear resistance of ordinary stainless steel,
A terminal plate 11 that can be directly wire-bonded to the back surface 11A is realized.
【００２６】そして，この端子板１１を用いることによ
り，ガラエポ基材１２の裏面（図１中下側の面）に銅箔
等のワイヤボンディング用の層を用意したり，穴１２Ｂ
を特殊な工程でスルーホールとしたりする必要なく，Ｉ
Ｃカード１を得ることが可能となっている。これによ
り，構造や製造工程が簡略で，安価に製造できるＩＣカ
ード１が実現されている。By using the terminal plate 11, a wire bonding layer such as a copper foil is prepared on the back surface (the lower surface in FIG. 1) of the glass epoxy base material 12 or the hole 12B is formed.
It is not necessary to make through holes in special processes.
C card 1 can be obtained. As a result, the IC card 1 that has a simple structure and a simple manufacturing process and can be manufactured at low cost is realized.
【００２７】なお，前記実施の形態は単なる例示にすぎ
ず，本発明を何ら限定するものではない。したがって本
発明は当然に，その要旨を逸脱しない範囲内で種々の改
良，変形が可能である。例えば，ニッケル−金めっき層
１１Ａは，ステンレス鋼板に対して不動態皮膜を介在さ
せることなく直接に形成されていればよく，図２で説明
したのと異なるめっきプロセスによるものであってもよ
い。また，ニッケルと金との２層であることも必須では
なく，いずれか一方のみとか，ニッケルと金との合金め
っき，あるいは他の金属成分を含有するものであっても
よい。The above embodiment is merely an example, and does not limit the present invention in any way. Therefore, naturally, the present invention can be variously modified and modified without departing from the gist thereof. For example, the nickel-gold plating layer 11A may be formed directly on a stainless steel plate without interposing a passivation film, and may be formed by a plating process different from that described with reference to FIG. Further, it is not essential that two layers of nickel and gold are used, and only one of them, an alloy plating of nickel and gold, or a layer containing another metal component may be used.
【００２８】[0028]
【発明の効果】以上の説明から明らかなように本発明に
よれば，一方の面が外部機器の端子と頻繁に接触するた
めに必要な大気中での耐食性等を有するとともに，もう
一方の面が直接にボンディングワイヤを鑞付けできるボ
ンディング性に優れたＩＣカード用端子板が提供されて
いる。これにより，ＩＣカードの構造および製造工程が
簡略化されている。As is apparent from the above description, according to the present invention, one surface has corrosion resistance in the atmosphere required for frequent contact with terminals of external equipment, and the other surface. Has provided a terminal board for an IC card which has excellent bonding properties and can directly bond a bonding wire. This simplifies the structure and manufacturing process of the IC card.
【図１】実施の形態に係るＩＣカードの構造を示す断面
図である。FIG. 1 is a sectional view showing a structure of an IC card according to an embodiment.
【図２】端子板の裏面のめっき手順を示す工程図であ
る。FIG. 2 is a process chart showing a plating procedure on the back surface of the terminal plate.
【図３】従来のＩＣカードの構造を示す断面図である。FIG. 3 is a cross-sectional view showing the structure of a conventional IC card.
【符号の説明】 １ ＩＣカード １０ ＩＣ １１ 端子板 １１Ａ ニッケル−金めっき面（ボンディング面） １１Ｂ 素面（外部端子面） １２ ガラエポ基材 １４ ボンディングワイヤ[Description of Signs] 1 IC card 10 IC 11 Terminal plate 11A Nickel-gold plated surface (bonding surface) 11B Raw surface (external terminal surface) 12 Glass epoxy substrate 14 Bonding wire
Claims (3)
外部機器との接触のための外部端子面とを有するＩＣカ
ード用端子板において，大気中で表面に不動態皮膜を形
成する材質の導電性板材を主材とし，大気中で表面に不
動態皮膜を形成しない材質の導電性皮膜を前記主材の一
面に形成してボンディング面とし，前記主材の他面を外
部端子面としたことを特徴とするＩＣカード用端子板。1. An IC card terminal plate having a bonding surface for connection to an IC and an external terminal surface for contact with an external device, a conductive material formed of a passive film on the surface in the atmosphere. A conductive plate made of a main material, a conductive film made of a material that does not form a passive film on the surface in the atmosphere is formed on one surface of the main material to form a bonding surface, and the other surface of the main material is formed as an external terminal surface. A terminal board for an IC card, characterized in that:
において，前記主材がステンレス鋼で形成されており，
前記導電性皮膜が金めっきもしくはニッケルめっきであ
ることを特徴とするＩＣカード用端子板。2. The terminal board for an IC card according to claim 1, wherein said main member is made of stainless steel.
A terminal plate for an IC card, wherein the conductive film is gold plating or nickel plating.
に金めっきもしくはニッケルめっきが施された端子板
と，ＩＣと，前記一面に鑞付けされこれを前記ＩＣに接
続するワイヤと，前記端子板と前記ＩＣと前記ワイヤと
を保持する基材とを有し，前記端子板の他面が外部に露
出して外部機器との接触のための外部端子面をなしてい
ることを特徴とするＩＣカード。3. A terminal plate made of stainless steel and one surface of which is gold-plated or nickel-plated, an IC, a wire brazed on the one surface and connected to the IC, and the terminal plate. An IC card having a base material for holding the IC and the wires, wherein the other surface of the terminal plate is exposed to the outside to form an external terminal surface for contact with an external device. .
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11049635A JP2000251043A (en) | 1999-02-26 | 1999-02-26 | Ic card and terminal board for ic card |
| PCT/JP2000/001083 WO2000051075A1 (en) | 1999-02-26 | 2000-02-24 | Ic card and terminal plate for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11049635A JP2000251043A (en) | 1999-02-26 | 1999-02-26 | Ic card and terminal board for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000251043A true JP2000251043A (en) | 2000-09-14 |
Family
ID=12836686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11049635A Pending JP2000251043A (en) | 1999-02-26 | 1999-02-26 | Ic card and terminal board for ic card |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2000251043A (en) |
| WO (1) | WO2000051075A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5708489B2 (en) * | 2009-08-20 | 2015-04-30 | 日本電気株式会社 | Semiconductor device having metallic power supply side and ground side reinforcing members insulated from each other |
| WO2016131870A1 (en) * | 2015-02-20 | 2016-08-25 | Heraeus Deutschland GmbH & Co. KG | Strip-type substrate for producing chip card modules |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3670175A1 (en) * | 2018-12-18 | 2020-06-24 | Heraeus Deutschland GmbH & Co KG | Substrate and method for producing a substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135790A (en) * | 1988-11-16 | 1990-05-24 | Ibiden Co Ltd | Printed wiring board for ic card |
-
1999
- 1999-02-26 JP JP11049635A patent/JP2000251043A/en active Pending
-
2000
- 2000-02-24 WO PCT/JP2000/001083 patent/WO2000051075A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5708489B2 (en) * | 2009-08-20 | 2015-04-30 | 日本電気株式会社 | Semiconductor device having metallic power supply side and ground side reinforcing members insulated from each other |
| WO2016131870A1 (en) * | 2015-02-20 | 2016-08-25 | Heraeus Deutschland GmbH & Co. KG | Strip-type substrate for producing chip card modules |
| US10176420B2 (en) | 2015-02-20 | 2019-01-08 | Heraeus Deutschland GmbH & Co. KG | Strip-type substrate for producing chip card modules |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000051075A1 (en) | 2000-08-31 |
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