JP2000248050A - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor deviceInfo
- Publication number
- JP2000248050A JP2000248050A JP11053671A JP5367199A JP2000248050A JP 2000248050 A JP2000248050 A JP 2000248050A JP 11053671 A JP11053671 A JP 11053671A JP 5367199 A JP5367199 A JP 5367199A JP 2000248050 A JP2000248050 A JP 2000248050A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- group
- resin composition
- carbon atoms
- integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、低吸水率、成形性
及び難燃性に優れた半導体封止用エポキシ樹脂組成物、
及びこれを用いた半導体装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation having a low water absorption, excellent moldability and flame retardancy.
And a semiconductor device using the same.
【０００２】[0002]
【従来の技術】半導体を機械的、化学的作用から保護す
るために、従来からエポキシ樹脂組成物が開発、生産さ
れてきた。この樹脂組成物に要求される項目は、半導体
の種類、封止される半導体装置の種類、使用される環境
等によって変化しつつある。表面実装パッケージの増加
から低吸水化されたエポキシ樹脂組成物が要求されてお
り、非常に多くの樹脂組成物が提案されている。更に現
在、環境問題のクローズアップにより、臭素化合物、酸
化アンチモンを含まないエポキシ樹脂組成物が強く要求
されている。又各種の難燃剤が提案されているが、これ
らの難燃剤さえ使用しない樹脂組成物も提案されいる
が、現在のところ封止用エポキシ樹脂組成物として良好
な成形性あるいは耐半田性等も完全に満足させるもの
は、未だ提案されていない。2. Description of the Related Art Epoxy resin compositions have conventionally been developed and produced for protecting semiconductors from mechanical and chemical actions. Items required for this resin composition are changing depending on the type of semiconductor, the type of semiconductor device to be sealed, the environment in which it is used, and the like. Due to the increase in surface mount packages, epoxy resin compositions with low water absorption are required, and very many resin compositions have been proposed. Further, at present, due to environmental issues, epoxy resin compositions containing no bromine compound and antimony oxide are strongly demanded. Although various flame retardants have been proposed, resin compositions not using even these flame retardants have been proposed, but at present, the molding epoxy resin composition has good moldability or complete solder resistance. There are no suggestions for satisfying the question.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、低吸水率、
成形性及び難燃性に優れた半導体封止用エポキシ樹脂組
成物、及びこれを用いた半導体装置を提供するものであ
る。SUMMARY OF THE INVENTION The present invention provides a low water absorption,
An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation excellent in moldability and flame retardancy, and a semiconductor device using the same.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）一般式
（１）で示されるエポキシ樹脂、（Ｂ）フェノール樹脂
（Ｃ）硬化促進剤、及び（Ｄ）全エポキシ樹脂組成物中
に７０〜９４重量％含有される無機充填材を必須成分と
することを特徴とする半導体封止用エポキシ樹脂組成物
で、特にフェノール樹脂が、一般式（２）及び／又は
（３）で、更に石油系重質油又はピッチ類とホルムアル
デヒド重縮合物とフェノール類を縮合させた重縮合物、
及びこれを用いて半導体素子を封止してなる半導体装置
である。According to the present invention, there are provided an epoxy resin (A) represented by the general formula (1), a phenolic resin (B), a curing accelerator (C), and a total epoxy resin composition (D). An epoxy resin composition for semiconductor encapsulation, comprising an inorganic filler contained in an amount of 70 to 94% by weight as an essential component, and in particular, a phenolic resin represented by the general formula (2) and / or (3): Polycondensate obtained by condensing petroleum heavy oil or pitches with formaldehyde polycondensate and phenols,
And a semiconductor device in which a semiconductor element is sealed using the same.
【化４】 （ｎは０〜５の整数）Embedded image (N is an integer from 0 to 5)
【０００５】[0005]
【化５】 （Ｒ1はフェニレン基、ジフェニレン基、ジフェニレン
エーテル基、ジフェニレンメタン基、又はそれらの基に
置換基とし炭素数１〜５のアルキル基のついたもの、
（Ｒ2）lのｌは０〜３の整数で、Ｒ2は炭素数１〜４の
アルキル基、ｎは０〜５の整数を示す。）Embedded image (R 1 is a phenylene group, a diphenylene group, a diphenylene ether group, a diphenylenemethane group, or a group in which an alkyl group having 1 to 5 carbon atoms is used as a substituent;
(R 2 ) l is an integer of 0 to 3, R 2 is an alkyl group having 1 to 4 carbon atoms, and n is an integer of 0 to 5. )
【０００６】[0006]
【化６】 （Ｒ3はフェニレン基、ジフェニレン基、ジフェニレン
エーテル基、ジフェニレンメタン基、又はそれらの基に
置換基とし炭素数１〜５のアルキル基のついたもの、
（Ｒ4）mのｍは０〜２の整数で、Ｒ4は炭素数１〜４の
アルキル基、ｎは０〜５の整数を示す。）Embedded image (R 3 is a phenylene group, a diphenylene group, a diphenylene ether group, a diphenylenemethane group, or a group in which an alkyl group having 1 to 5 carbon atoms is used as a substituent;
(R 4 ) m is an integer of 0 to 2, R 4 is an alkyl group having 1 to 4 carbon atoms, and n is an integer of 0 to 5. )
【０００７】[0007]
【発明の実施の形態】本発明に用いられる一般式（１）
のエポキシ樹脂とは、融点が約６０〜６５℃、エポキシ
当量が２３０前後で、常温では固体の結晶性エポキシ樹
脂である。又、１５０℃での溶融粘度が０．４５ポイズ
（ＩＣＩ粘度計）程度で溶融粘度が低く、ビフェニル型
エポキシ樹脂等の他の結晶性エポキシ樹脂と同様に無機
充填材を多く配合することができる。更に、常温で固体
のため取り扱い作業性についてもなんら問題ない。一般
式（１）のエポキシ樹脂は、他の結晶性エポキシ樹脂と
異なり１分子中に含まれる芳香環が多いため、難燃性に
優れるという特徴を有している。難燃性に優れているた
め、後述するフェノール樹脂と組み合わせた場合、臭素
化合物、酸化アンチモン等の難燃剤を含まない樹脂組成
物でも高い難燃性を有し、ＵＬ−９４のＶ−０レベルを
達成できる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The general formula (1) used in the present invention
The epoxy resin is a crystalline epoxy resin having a melting point of about 60 to 65 ° C. and an epoxy equivalent of about 230, and which is solid at ordinary temperature. Further, the melt viscosity at 150 ° C. is about 0.45 poise (ICI viscometer), the melt viscosity is low, and a large amount of inorganic filler can be blended like other crystalline epoxy resins such as biphenyl type epoxy resin. . Furthermore, since it is a solid at normal temperature, there is no problem in handling workability. Unlike other crystalline epoxy resins, the epoxy resin represented by the general formula (1) has many aromatic rings contained in one molecule, and thus has an excellent flame retardancy. Because of its excellent flame retardancy, when combined with a phenol resin described below, even a resin composition that does not contain a flame retardant such as a bromine compound or antimony oxide has high flame retardancy, and has a V-0 level of UL-94. Can be achieved.
【０００８】一般式（１）のエポキシ樹脂の特性を損な
わない範囲で、他のエポキシ樹脂と併用してもよい。併
用する場合、一般式（１）のエポキシ樹脂は、全エポキ
シ樹脂中少なくとも１０重量％以上、より好ましくは３
０重量％以上である。１０重量％未満だと難燃性が不十
分となるおそれがある。併用できるエポキシ樹脂として
は、例えばビフェニル型エポキシ樹脂、スチルベン型エ
ポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフ
ェノールＦ型エポキシ樹脂、オルソクレゾールノボラッ
ク型エポキシ樹脂、ジシクロペンタジエン変性フノール
型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂
等が挙げられる。なお、本発明の一般式（１）のエポキ
シ樹脂は、難燃性の高い樹脂であり、必要によって臭素
化エポキシ樹脂等の難燃成分を配合してもなんら問題な
いが、各種の特性向上のためには添加しない方がより好
ましい。The epoxy resin of the general formula (1) may be used in combination with another epoxy resin as long as the properties of the epoxy resin are not impaired. When used in combination, the epoxy resin of the general formula (1) accounts for at least 10% by weight or more, preferably 3% by weight of the total epoxy resin.
0% by weight or more. If it is less than 10% by weight, the flame retardancy may be insufficient. Examples of epoxy resins that can be used in combination include biphenyl epoxy resins, stilbene epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, orthocresol novolak epoxy resins, dicyclopentadiene-modified phenolic epoxy resins, and triphenolmethane epoxy resins. Epoxy resins and the like can be mentioned. The epoxy resin of the general formula (1) of the present invention is a highly flame-retardant resin. There is no problem if a flame-retardant component such as a brominated epoxy resin is blended if necessary. Therefore, it is more preferable not to add.
【０００９】本発明に用いられるフェノール樹脂は、１
分子中に２個以上のフェノール性水酸基を有するモノマ
ー、オリゴマー、ポリマーであれば特に限定しない。例
えば、フェノールノボラック樹脂、トリフェノールメタ
ン型樹脂、ジシクロペンタジエン変性フェノール樹脂、
一般式（２）のフェノール樹脂、一般式（３）のフェノ
ール樹脂、石油系重質油又はピッチ類とホルムアルデヒ
ド重縮合物とフェノール類を重縮合させたフェノール樹
脂等が挙げられる。これらの内では、一般式（２）のフ
ェノール樹脂、一般式（３）のフェノール樹脂、石油系
重質油又はピッチ類とホルムアルデヒド重縮合物とフェ
ノール類を重縮合させたフェノール樹脂で、分子中の芳
香環由来の炭素原子が全炭素原子中の８０重量％以上
で、かつ水酸基当量が１４０以上のフェノール樹脂が好
ましい。一般式（２）のフェノール樹脂、一般式（３）
のフェノール樹脂の具体的な構造を以下に示す。The phenolic resin used in the present invention comprises 1
There is no particular limitation as long as it is a monomer, oligomer or polymer having two or more phenolic hydroxyl groups in the molecule. For example, phenol novolak resin, triphenolmethane type resin, dicyclopentadiene modified phenol resin,
Examples of the phenol resin include a phenol resin represented by the general formula (2), a phenol resin represented by the general formula (3), a phenol resin obtained by polycondensing a phenol with a petroleum heavy oil or pitches, a formaldehyde polycondensate, and the like. Among these, a phenol resin of the general formula (2), a phenol resin of the general formula (3), a phenol resin obtained by polycondensing petroleum heavy oil or pitches with a formaldehyde polycondensate and phenols, A phenol resin having a carbon atom derived from an aromatic ring of 80% by weight or more of all carbon atoms and a hydroxyl equivalent of 140 or more is preferable. Phenol resin of general formula (2), general formula (3)
The specific structure of the phenolic resin is shown below.
【化７】 Embedded image
【００１０】[0010]
【化８】 石油系重質油又はピッチ類とホルムアルデヒド重縮合物
とフェノール類を縮合させたフェノール樹脂は、特開平
７−２５２３３９号公報、特開平９−２１６９２７号公
報に開示されている。これらのフェノール樹脂は、分子
中の芳香環の含有量が多く、かつ水酸基当量が大きいた
め、これらを用いたエポキシ樹脂組成物の硬化物の吸水
率が従来の樹脂組成物の硬化物よりも非常に小さくな
り、耐半田性が大幅に向上するという特徴を有する。
又、分子中に芳香環を多く含むことにより難燃性も大幅
に向上し、難燃剤を添加しない樹脂組成物でも難燃性に
優れているという特徴を有する。本発明に用いるフェノ
ール樹脂の融点、軟化点、溶融粘度、イオン性不純物の
含有量等については特に限定しないが、イオン性不純物
の含有量の低い樹脂ほど信頼性が良好であり好ましい。Embedded image Phenol resins obtained by condensing petroleum heavy oil or pitches with a formaldehyde polycondensate and phenols are disclosed in JP-A-7-252339 and JP-A-9-216927. Since these phenolic resins have a large content of aromatic rings in the molecule and a large hydroxyl equivalent, the water absorption of a cured product of an epoxy resin composition using the same is much higher than that of a cured product of a conventional resin composition. And the solder resistance is greatly improved.
Further, by containing a large number of aromatic rings in the molecule, the flame retardancy is greatly improved, and even a resin composition containing no flame retardant is excellent in flame retardancy. The melting point, softening point, melt viscosity, content of ionic impurities, and the like of the phenol resin used in the present invention are not particularly limited, but a resin having a lower content of ionic impurities has better reliability and is preferable.
【００１１】本発明に用いられる全エポキシ樹脂のエポ
キシ基と全フェノール樹脂のフェノール性水酸基の当量
比は、好ましくは０．５〜２であり、特に０．７〜１．
５がより好ましい。０．５〜２の範囲を外れると、耐湿
性、硬化性等が低下するので好ましくない。本発明に用
いられる硬化促進剤は、エポキシ基とフェノール性水酸
基の反応を促進するものであれば特に限定はしないが、
例えば、１，８−ジアザビシクロ（５，４，０）ウンデ
セン−７、トリフェニルホスフィン、テトラフェニルホ
スホニウム・テトラフェニルボレート、テトラフェニル
ホスホニウム・テトラ安息香酸ボレート、テトラフェニ
ルホスホニウム・テトラナフトイックアシッドボレート
等が挙げられ、これらは単独でも混合して用いてもよ
い。The equivalent ratio of the epoxy groups of all epoxy resins used in the present invention to the phenolic hydroxyl groups of all phenolic resins is preferably 0.5-2, especially 0.7-1.
5 is more preferred. If the ratio is out of the range of 0.5 to 2, the moisture resistance, the curability and the like are undesirably reduced. The curing accelerator used in the present invention is not particularly limited as long as it accelerates the reaction between the epoxy group and the phenolic hydroxyl group.
For example, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / tetrabenzoic acid borate, tetraphenylphosphonium / tetranaphthoic acid borate, and the like. These may be used alone or as a mixture.
【００１２】本発明に用いられる無機充填材の種類につ
いては特に制限はなく、一般に封止材料に用いられてい
るものを使用することができる。例えば、溶融破砕シリ
カ粉末、溶融球状シリカ粉末、結晶シリカ粉末、２次凝
集シリカ粉末、アルミナ、チタンホワイト、水酸化アル
ミニウム、タルク、クレー、ガラス繊維等が挙げられ、
特に溶融球状シリカ粉末が好ましい。形状は限りなく真
球状であることが好ましく、又、粒子の大きさの異なる
ものを混合することにより充填量を多くすることができ
る。無機充填材の含有量は、全エポキシ樹脂組成物中に
７０〜９４重量％が好ましく、より好ましくは８５〜９
２重量％である。無機充填材の量が多いと、樹脂組成物
の硬化物の吸水率が低減すると共に、燃焼しない無機充
填材は炎にさらされたときに熱エネルギーを奪い硬化物
の難燃性を向上させ、更に弾性率を向上させることによ
り良好な成形性（離型性）を発現するのに有効である。
無機充填材の量が７０重量％未満だと、硬化物の吸水率
が多くなり、難燃試験において燃焼し易く、又、成形時
の離型性に劣る樹脂組成物となる。９４重量％を越える
と流動性が低下して成形品を得ることができなくなる。The type of the inorganic filler used in the present invention is not particularly limited, and those generally used for a sealing material can be used. For example, fused crushed silica powder, fused spherical silica powder, crystalline silica powder, secondary aggregated silica powder, alumina, titanium white, aluminum hydroxide, talc, clay, glass fibers, and the like,
Particularly, a fused spherical silica powder is preferable. The shape is preferably infinitely spherical, and the filling amount can be increased by mixing particles having different particle sizes. The content of the inorganic filler is preferably 70 to 94% by weight, more preferably 85 to 9% by weight in the whole epoxy resin composition.
2% by weight. When the amount of the inorganic filler is large, the water absorption of the cured product of the resin composition decreases, and the non-combustible inorganic filler deprives the heat energy when exposed to a flame to improve the flame retardancy of the cured product, Further, by improving the elastic modulus, it is effective to exhibit good moldability (release properties).
When the amount of the inorganic filler is less than 70% by weight, the water absorption of the cured product is increased, so that the resin composition is easily burned in a flame retardancy test and has poor releasability during molding. If it exceeds 94% by weight, the fluidity is reduced, and a molded article cannot be obtained.
【００１３】本発明の樹脂組成物は、（Ａ）〜（Ｄ）成
分の他、必要に応じてγ−グリシドキシプロピルトリメ
トキシシラン、γ−アミノプロピルトリエトキシシラン
等のシランカップリング剤、カーボンブラック等着色
剤、臭素化エポキシ樹脂、酸化アンチモン、リン化合物
等の難燃剤、シリコーンオイル、シリコーンゴム等の低
応力成分、天然ワックス、合成ワックス等の離型剤、酸
化防止剤等の各種添加剤を配合することができる。特に
添加剤のシリコーンオイルはボイドの低減に非常に効果
的である。本発明の樹脂組成物は、（Ａ）〜（Ｄ）成
分、及びその他の添加剤等をミキサーを用いて常温混合
し、ロール、押出機等の混練機で混練し、冷却後粉砕し
て得られる。本発明の樹脂組成物を用いて、半導体等の
各種パッケージを封止し、半導体装置を製造するには、
トランスファーモールド、コンプレッションモールド、
インジェクションモールド等の従来からの成形方法で硬
化成形すればよい。The resin composition of the present invention comprises, in addition to the components (A) to (D), a silane coupling agent such as γ-glycidoxypropyltrimethoxysilane and γ-aminopropyltriethoxysilane, if necessary. Colorants such as carbon black, flame retardants such as brominated epoxy resins, antimony oxide and phosphorus compounds, low stress components such as silicone oil and silicone rubber, release agents such as natural wax and synthetic wax, and various additives such as antioxidants An agent can be compounded. In particular, silicone oil as an additive is very effective in reducing voids. The resin composition of the present invention is obtained by mixing the components (A) to (D) and other additives at room temperature using a mixer, kneading the mixture with a kneader such as a roll or an extruder, cooling, and pulverizing. Can be Using the resin composition of the present invention, to seal various packages such as semiconductors, to manufacture a semiconductor device,
Transfer mold, compression mold,
What is necessary is just to carry out hardening molding by the conventional molding methods, such as an injection mold.
【００１４】[0014]
【実施例】以下に本発明の実施例を示すが、本発明はこ
れらに限定されるものではない。配合単位は重量部とす
る。 実施例１ 式（Ｅ−１）のエポキシ樹脂 ８．１重量部EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited to these examples. The mixing unit is parts by weight. Example 1 8.1 parts by weight of epoxy resin of formula (E-1)
【化９】 Embedded image
【００１５】 式（Ｈ−１）のフェノール樹脂 ３．９重量部3.9 parts by weight of a phenolic resin of the formula (H-1)
【化１０】 Embedded image
【００１６】 臭素化ビスフェノールＡ型エポキシ樹脂 ０．５重量部 三酸化アンチモン １重量部 １，８−ジアザビシクロ（５，４，０）ウンデセン−７（以下、ＤＢＵという ） ０．２重量部 溶融球状シリカ（平均粒径１５μｍ） ８５重量部 エポキシシランカップリング剤 ０．５重量部 カーボンブラック ０．５重量部 カルナバワックス ０．３重量部 を常温でミキサーを用いて混合した後、１００℃で二軸
ロールを用いて混練し、冷却後粉砕し、樹脂組成物を得
た。得られた樹脂組成物を以下の方法で評価した。結果
を表１に示す。Brominated bisphenol A type epoxy resin 0.5 part by weight Antimony trioxide 1 part by weight 1,8-diazabicyclo (5,4,0) undecene-7 (hereinafter referred to as DBU) 0.2 part by weight Fused spherical silica (Average particle size: 15 μm) 85 parts by weight Epoxysilane coupling agent 0.5 parts by weight Carbon black 0.5 parts by weight Carnauba wax 0.3 parts by weight at room temperature after mixing using a mixer, biaxial roll at 100 ° C. The mixture was kneaded, cooled and pulverized to obtain a resin composition. The obtained resin composition was evaluated by the following method. Table 1 shows the results.
【００１７】評価方法 スパイラルフロー：ＥＭＭＩ−Ｉ−６６に準じたスパイ
ラルフロー測定用の金型を用い、金型温度１７５℃、注
入圧力７０ｋｇ／ｃｍ2、硬化時間２分で測定した。単
位ｃｍ。 難燃性：低圧トランスファー成形機を用い、成形温度１
７５℃、圧力７０ｋｇ／ｃｍ2、硬化時間２分で、テス
トピースを成形した。成形品の厚みは１．６ｍｍ。ＵＬ
−９４に従って難燃性試験を行った。 高温保管性：模擬素子を実装した１６ｐＤＩＰにて、１
８５℃で１０００時間処理する。処理後の配線間の抵抗
値を計測し、初期値に対し２０％以上抵抗値が上がった
パッケージを不良とする。１０パッケージ中の不良パッ
ケージの個数で示した。 耐半田性：低圧トランスファー成形機を用い、成形温度
１７５℃、圧力７０ｋｇ／ｃｍ2、硬化時間２分で、８
０ｐＱＦＰ（１．５ｍｍ厚）を成形し、１７５℃、８時
間のポストキュアを行ったのち、８５℃、相対湿度６０
％で９６時間の処理を行い、ＩＲリフロー処理（２２０
℃、１０秒）を行った。処理済みのパッケージをＳＡＴ
（超音波探傷機）を用いて観察し、パッケージ内部の剥
離、クラック等の不良を測定する。６個のパッケージ中
の不良パッケージ数を示す。Evaluation method Spiral flow: Spiral flow was measured using a mold for measuring spiral flow according to EMMI-I-66, at a mold temperature of 175 ° C., an injection pressure of 70 kg / cm 2 , and a curing time of 2 minutes. Unit cm. Flame retardancy: Using a low-pressure transfer molding machine, molding temperature 1
Test pieces were molded at 75 ° C., a pressure of 70 kg / cm 2 , and a curing time of 2 minutes. The thickness of the molded product is 1.6 mm. UL
A flame retardancy test was performed according to -94. High-temperature storage property: 16 pDIP with a simulated element mounted, 1
Treat at 85 ° C. for 1000 hours. The resistance value between the interconnects after the processing is measured, and a package whose resistance value has increased by 20% or more with respect to the initial value is regarded as defective. It is indicated by the number of defective packages in 10 packages. Solder resistance: Using a low-pressure transfer molding machine, a molding temperature of 175 ° C., a pressure of 70 kg / cm 2 , and a curing time of 2 minutes.
After molding 0pQFP (1.5 mm thick) and performing post-curing at 175 ° C. for 8 hours, 85 ° C. and a relative humidity of 60
% For 96 hours, and IR reflow processing (220
C., 10 seconds). SAT for processed packages
(Ultrasonic flaw detector) to observe and measure defects such as peeling and cracks inside the package. The number of defective packages in the six packages is shown.
【００１８】実施例２〜７ 表１の処方に従って配合し、実施例１と同様にして樹脂
組成物を得、実施例１と同様にして評価した。結果を表
１に示す。 比較例１〜３ 表２の処方に従って配合し、実施例１と同様にして樹脂
組成物を得、実施例１と同様にして評価した。結果を表
２に示す。実施例２〜７、比較例１〜３に用いたエポキ
シ樹脂（Ｅ−２）、フェノール樹脂（Ｈ−２）〜（Ｈ−
４）の構造を以下に示す。更に、石油系重質油とホルム
アルデヒド重縮合物とフェノールとを、酸触媒の存在下
で重縮合したフェノール樹脂）（Ｈ−５）は、特開平７
−２５２３３９号公報、特開平９−２１６９２７号公報
に従った樹脂である。その特性は、軟化点８２℃、水酸
基当量１４５、ＩＣＩ粘度２．２／１５０℃、芳香族由
来の炭素原子の含有率は全炭素原子中の８８重量％。Examples 2 to 7 Compounded according to the formulation shown in Table 1, a resin composition was obtained in the same manner as in Example 1, and evaluated in the same manner as in Example 1. Table 1 shows the results. Comparative Examples 1-3 Compounded according to the formulation in Table 2, a resin composition was obtained in the same manner as in Example 1, and evaluated in the same manner as in Example 1. Table 2 shows the results. The epoxy resins (E-2) and the phenolic resins (H-2) to (H-) used in Examples 2 to 7 and Comparative Examples 1 to 3
The structure of 4) is shown below. Further, a phenol resin (H-5) obtained by polycondensing a petroleum heavy oil, a formaldehyde polycondensate and phenol in the presence of an acid catalyst is disclosed in
It is a resin according to JP-A-252339 and JP-A-9-216927. Its characteristics are a softening point of 82 ° C., a hydroxyl equivalent of 145, an ICI viscosity of 2.2 / 150 ° C., and a content of aromatic-derived carbon atoms of 88% by weight in all carbon atoms.
【化１１】 Embedded image
【００１９】[0019]
【化１２】 Embedded image
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【発明の効果】本発明の半導体封止用エポキシ樹脂組成
物は、成形性、難燃性に優れ、かつ低吸水化されている
ため耐半田性に優れており、これを用いた半導体装置は
信頼性に優れている。The epoxy resin composition for semiconductor encapsulation of the present invention is excellent in moldability and flame retardancy, and is excellent in solder resistance due to low water absorption. Excellent reliability.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 23/31 Ｆターム(参考） 4J002 CC03X CC04X CC05X CC07X CD07W DE137 DE147 DJ017 DJ037 DJ047 DL007 EW016 EW176 EZ006 FA047 FD017 FD156 GQ05 4J036 AA02 AD07 DA05 DA06 DC46 DD07 FA03 FA05 FA06 FB08 GA23 GA29 4M109 AA01 BA01 CA21 EA03 EA06 EB03 EB04 EB06 EB07 EB08 EB09 EB12 EB19 EC01 EC03 EC05 EC20 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) H01L 23/31 F-term (Reference) 4J002 CC03X CC04X CC05X CC07X CD07W DE137 DE147 DJ017 DJ037 DJ047 DL007 EW016 EW176 EZ006 FA047 FD017 FD156 GQ05 4J036 AA02 AD07 DA05 DA06 DC46 DD07 FA03 FA05 FA06 FB08 GA23 GA29 4M109 AA01 BA01 CA21 EA03 EA06 EB03 EB04 EB06 EB07 EB08 EB09 EB12 EB19 EC01 EC03 EC05 EC20
Claims (5)
樹脂、（Ｂ）フェノール樹脂（Ｃ）硬化促進剤、及び
（Ｄ）全エポキシ樹脂組成物中に７０〜９４重量％含有
される無機充填材を必須成分とすることを特徴とする半
導体封止用エポキシ樹脂組成物。 【化１】 （ｎは０〜５の整数）(1) The epoxy resin represented by the general formula (1), (B) a phenol resin, (C) a curing accelerator, and (D) 70 to 94% by weight of the total epoxy resin composition. An epoxy resin composition for semiconductor encapsulation, comprising an inorganic filler as an essential component. Embedded image (N is an integer from 0 to 5)
又は（３）である請求項１記載のエポキシ樹脂組成物。 【化２】 （Ｒ1はフェニレン基、ジフェニレン基、ジフェニレン
エーテル基、ジフェニレンメタン基、又はそれらの基に
置換基とし炭素数１〜５のアルキル基のついたもの、
（Ｒ2）lのｌは０〜３の整数で、Ｒ2は炭素数１〜４の
アルキル基、ｎは０〜５の整数を示す。） 【化３】 （Ｒ3はフェニレン基、ジフェニレン基、ジフェニレン
エーテル基、ジフェニレンメタン基、又はそれらの基に
置換基とし炭素数１〜５のアルキル基のついたもの、
（Ｒ4）mのｍは０〜２の整数で、Ｒ4は炭素数１〜４の
アルキル基、ｎは０〜５の整数を示す。）2. The phenolic resin according to the general formula (2) and / or
Or The epoxy resin composition according to claim 1, which is (3). Embedded image (R 1 is a phenylene group, a diphenylene group, a diphenylene ether group, a diphenylenemethane group, or a group in which an alkyl group having 1 to 5 carbon atoms is used as a substituent;
(R 2 ) l is an integer of 0 to 3, R 2 is an alkyl group having 1 to 4 carbon atoms, and n is an integer of 0 to 5. ) (R 3 is a phenylene group, a diphenylene group, a diphenylene ether group, a diphenylenemethane group, or a group in which an alkyl group having 1 to 5 carbon atoms is used as a substituent;
(R 4 ) m is an integer of 0 to 2, R 4 is an alkyl group having 1 to 4 carbon atoms, and n is an integer of 0 to 5. )
ッチ類とホルムアルデヒド重縮合物とフェノール類を縮
合させた重縮合物である請求項１の半導体封止用エポキ
シ樹脂組成物。3. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the phenol resin is a polycondensate obtained by condensing a heavy petroleum oil or pitches, a formaldehyde polycondensate and a phenol.
デヒド重縮合物とフェノール類を縮合させた重縮合物に
おいて、芳香環由来の炭素原子が全炭素原子中８０重量
％以上で、かつ水酸基当量が１４０以上である請求項３
の半導体封止用エポキシ樹脂組成物。4. A polycondensate obtained by condensing petroleum heavy oil or pitches, formaldehyde polycondensate and phenols, wherein the carbon atoms derived from aromatic rings are at least 80% by weight of all carbon atoms and the hydroxyl equivalents Is 140 or more.
Epoxy resin composition for semiconductor encapsulation.
シ樹脂組成物を用いて半導体素子を封止してなることを
特徴とする半導体装置。5. A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11053671A JP2000248050A (en) | 1999-03-02 | 1999-03-02 | Epoxy resin composition and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11053671A JP2000248050A (en) | 1999-03-02 | 1999-03-02 | Epoxy resin composition and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000248050A true JP2000248050A (en) | 2000-09-12 |
Family
ID=12949307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11053671A Pending JP2000248050A (en) | 1999-03-02 | 1999-03-02 | Epoxy resin composition and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000248050A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006118240A1 (en) * | 2005-04-28 | 2006-11-09 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin and epoxy resin composition |
| WO2008087943A1 (en) * | 2007-01-16 | 2008-07-24 | Nippon Kayaku Kabushiki Kaisha | Carboxylate resin and resin composition containing the same |
| JP2009084325A (en) * | 2007-09-27 | 2009-04-23 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor, and semiconductor device |
| JP2011231079A (en) * | 2010-04-30 | 2011-11-17 | Honshu Chem Ind Co Ltd | Novel diepoxy compound |
| KR101284759B1 (en) * | 2010-11-24 | 2013-07-17 | 금호피앤비화학 주식회사 | Self-extinguishable and impact-retardant epoxy resins and epoxy resin compositions |
-
1999
- 1999-03-02 JP JP11053671A patent/JP2000248050A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006118240A1 (en) * | 2005-04-28 | 2006-11-09 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin and epoxy resin composition |
| JP2006307011A (en) * | 2005-04-28 | 2006-11-09 | Nippon Kayaku Co Ltd | Epoxy resin and epoxy resin composition |
| KR101252731B1 (en) * | 2005-04-28 | 2013-04-09 | 니폰 가야꾸 가부시끼가이샤 | Epoxy Resin and Epoxy Resin Composition |
| WO2008087943A1 (en) * | 2007-01-16 | 2008-07-24 | Nippon Kayaku Kabushiki Kaisha | Carboxylate resin and resin composition containing the same |
| JP5222156B2 (en) * | 2007-01-16 | 2013-06-26 | 日本化薬株式会社 | Carboxylate resin and resin composition containing the same |
| JP2009084325A (en) * | 2007-09-27 | 2009-04-23 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor, and semiconductor device |
| JP2011231079A (en) * | 2010-04-30 | 2011-11-17 | Honshu Chem Ind Co Ltd | Novel diepoxy compound |
| KR101284759B1 (en) * | 2010-11-24 | 2013-07-17 | 금호피앤비화학 주식회사 | Self-extinguishable and impact-retardant epoxy resins and epoxy resin compositions |
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