JP2000233374A - Metal bond diamond grinding wheel and manufacture therefor - Google Patents
Metal bond diamond grinding wheel and manufacture thereforInfo
- Publication number
- JP2000233374A JP2000233374A JP3647699A JP3647699A JP2000233374A JP 2000233374 A JP2000233374 A JP 2000233374A JP 3647699 A JP3647699 A JP 3647699A JP 3647699 A JP3647699 A JP 3647699A JP 2000233374 A JP2000233374 A JP 2000233374A
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- JP
- Japan
- Prior art keywords
- powder
- metal
- copper
- bond
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ガラス、セラミッ
クス、シリコン基板等の研削加工、切断加工として使用
する研削ホイール又は切断ホイール等のメタルボンドダ
イヤモンド砥石に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal-bonded diamond wheel such as a grinding wheel or a cutting wheel used for grinding and cutting glass, ceramics, silicon substrates and the like.
【０００２】[0002]
【発明が解決しようとする課題】従来、ガラス、セラミ
ックス、シリコン基板等の研削工具、切断用工具には、
通常寿命が長く、切味が優れている等の点から、ダイヤ
モンド砥粒がメタルボンドされたメタルボンドダイヤモ
ンド砥石が用いられている。Conventionally, grinding tools and cutting tools for glass, ceramics, silicon substrates, etc.
Generally, a metal-bonded diamond grindstone in which diamond abrasive grains are metal-bonded is used because of its long life and excellent sharpness.
【０００３】研削加工に用いられるダイヤモンド砥石
は、一般に、台金上にダイヤモンド粉末とボンド構成メ
タル粉末との混合物の加圧焼結体層が設けられた構造を
有しており、このようなダイヤモンド砥石の一例として
の、ガラス板周縁を研削するペンシルエッヂダイヤモン
ド砥石は、図１に示すように、通常、台金１と、台金１
上に形成された砥石層としての焼結体層２とを具備して
いる。[0003] A diamond grindstone used for grinding has a structure in which a pressurized sintered body layer of a mixture of diamond powder and a bond constituent metal powder is provided on a base metal. As an example of a grindstone, a pencil-edge diamond grindstone for grinding the periphery of a glass plate usually has a base metal 1 and a base metal 1 as shown in FIG.
And a sintered body layer 2 as a grindstone layer formed thereon.
【０００４】メタルボンドダイヤモンド砥石のボンド構
成メタルの主成分は、従来、銅−スズ合金又は鉄を主成
分とした鉄−銅系からなるが、この銅−スズ合金系又は
鉄−銅系等のメタル構成ボンドでは、ダイヤモンド砥
粒に対する保持力が弱く、研削時にダイヤモンド砥粒の
脱落が早く砥石の寿命が短い、脱落が多いため、研削
部では、切り刃としてのダイヤモンド砥粒不足によって
ダイヤモンド砥粒間に高さの不揃いが生じ、たたき状態
の研削となり研削面にぶつぶつと凹み（クレータ）が生
じる、ダイヤモンド砥粒の保持力が弱いため、個々の
ダイヤモンド砥粒が劈開形状に至らないうちに、すなわ
ち個々のダイヤモンド砥粒が鈍角化に至らないうちにダ
イヤモンド砥粒の脱落が生じ、鋭角状のダイヤモンド砥
粒により常に研削され、研削面が粗くなる、脱落が多
いため、有効ダイヤモンド砥粒数、すなわち切れ刃数が
減少して、研削能力の低下を来し、而して、振動を起こ
して、研削面が波打ったようになる、等々の不都合が生
じる。Conventionally, the main component of the metal constituting the bond of the metal bond diamond grinding wheel is a copper-tin alloy or an iron-copper system containing iron as a main component. In the metal bond, the holding force against diamond grains is weak, the diamond grains fall off quickly during grinding, the life of the grindstone is short, and there are many drops. Unevenness in height occurs during the grinding, grinding occurs in a beaten state, and the grinding surface crushes and dents (craters) occur.Because the holding power of diamond abrasive grains is weak, before the individual diamond abrasive grains reach the cleavage shape, That is, the diamond abrasive grains fall off before the individual diamond abrasive grains reach the obtuse angle, and are always ground by the sharp diamond abrasive grains, As the ground surface becomes rough and there are many drops, the number of effective diamond abrasive grains, that is, the number of cutting edges, decreases, and the grinding ability decreases, thus causing vibration and causing the grinding surface to undulate. And other inconveniences.
【０００５】ダイヤモンド砥粒の保持力を高めるため砥
石中のボンド部の硬度を上げると、ボンド部の摩耗が少
なくなるので、研削面に焼けを生じ、また摩擦抵抗によ
るびびり（振動）が大きくなり、またドレッサビリティ
（目詰りボンドの切り屑除去による適正なダイヤモンド
砥粒突出とチップポケットの形成）が悪化する等の問題
が生じ、ボンド部の硬度を上げることには限界がある。[0005] When the hardness of the bond portion in the grindstone is increased in order to increase the holding force of the diamond abrasive grains, wear of the bond portion is reduced, so that the grinding surface is burned and chatter (vibration) due to frictional resistance increases. In addition, problems such as deterioration in dressability (appropriate projection of diamond abrasive grains and formation of chip pockets by removing chips from clogged bonds) occur, and there is a limit to increasing the hardness of the bond portion.
【０００６】現存するメタルボンドの中でダイヤモンド
砥粒保持能力が優れているタングステン系メタルボンド
は、耐焼きつき性、熱伝導性が鉄系、銅系よりも劣るた
め、ガラスのような低融点材の研削では、研削面に焼け
を起こし、不向きである。[0006] Among the existing metal bonds, tungsten-based metal bonds, which have an excellent ability to hold diamond abrasive grains, are inferior in seizure resistance and heat conductivity to iron-based and copper-based materials, and therefore have a low melting point such as glass. Grinding of materials causes burns on the ground surface and is not suitable.
【０００７】ダイヤモンド砥粒の保持力を高める手段と
して、ダイヤモンド砥粒及びボンド構成粉末材をＮｉ等
でコーティングした上で焼結したダイヤモンド砥石が開
発されているが、この技術では均一な砥石を製造するこ
とが困難であって、各砥石の性能がばらつく虞がある。As a means for increasing the holding power of diamond abrasive grains, a diamond abrasive stone obtained by coating diamond abrasive grains and a powder material for a bond with Ni or the like and then sintering has been developed. It is difficult to perform the grinding, and there is a possibility that the performance of each grinding wheel varies.
【０００８】本発明は、前記諸点に鑑みてなされたもの
であって、ガラス、セラミックス、シリコン基板等の研
削工具、切断用工具として、切味がよく、砥石寿命が長
く、研削抵抗が低く、びびり（振動）研削が少なく、木
目細かな研削面が得られ、更にドレッサビリティの良い
メタルボンドダイヤモンド砥石及びこれの製造方法を提
供することにある。The present invention has been made in view of the above-mentioned points, and has good sharpness, a long grinding wheel life, low grinding resistance, as a grinding tool and a cutting tool for glass, ceramics, silicon substrates, and the like. An object of the present invention is to provide a metal-bonded diamond grindstone with less chattering (vibration) grinding, a fine grained surface, and more excellent dressability, and a method for producing the same.
【０００９】[0009]
【課題を解決するための手段】本発明は、ボンド構成メ
タル粉末として、主成分がねずみ鋳鉄粉末からなるもの
を用いるメタルボンドダイヤモンド砥石の製造方法であ
る。SUMMARY OF THE INVENTION The present invention is a method for producing a metal-bonded diamond wheel using, as a bond-forming metal powder, one whose main component is gray cast iron powder.
【００１０】また、本発明は、ボンド構成メタル粉末と
して、主成分のねずみ鋳鉄粉末に加えて、純銅粉末、銅
被覆二硫化モリブデン粉末等の銅系粉末を更に含んだも
のを用いるメタルボンドダイヤモンド砥石の製造方法で
ある。Further, the present invention provides a metal bond diamond grinding wheel which uses, as a bond constituent metal powder, a powder further containing a copper-based powder such as pure copper powder, copper-coated molybdenum disulfide powder in addition to gray cast iron powder as a main component. It is a manufacturing method of.
【００１１】更に、本発明は、ボンド構成メタル粉末と
して、主成分のねずみ鋳鉄粉末に加えて、純銅粉末、銅
被覆二硫化モリブデン粉末等の銅系粉末及びカーボニル
純鉄粉末を更に含んだものを用いるメタルボンドダイヤ
モンド砥石の製造方法である。Further, the present invention provides a bond-forming metal powder further comprising a copper-based powder such as pure copper powder, copper-coated molybdenum disulfide powder, and carbonyl pure iron powder in addition to gray cast iron powder as a main component. This is a method for producing a metal bond diamond grindstone to be used.
【００１２】更に、本発明は、ボンド構成メタル粉末と
して、主成分のねずみ鋳鉄粉末に加えて、純銅粉末、銅
被覆二硫化モリブデン粉末等の銅系粉末、カーボニル純
鉄粉末及びすず粉末を更に含んだものを用いるメタルボ
ンドダイヤモンド砥石の製造方法である。Furthermore, the present invention further includes, as bond-forming metal powders, in addition to gray cast iron powder as a main component, copper-based powders such as pure copper powder, copper-coated molybdenum disulfide powder, carbonyl pure iron powder, and tin powder. This is a method for producing a metal-bonded diamond whetstone.
【００１３】本発明のメタルボンドダイヤモンド砥石
は、ねずみ鋳鉄を主成分として含んだ焼結メタルボンド
部と、この焼結メタルボンド部に分散、保持されたダイ
ヤモンド砥粒とからなる。The metal bond diamond grindstone of the present invention comprises a sintered metal bond portion containing gray cast iron as a main component and diamond abrasive grains dispersed and held in the sintered metal bond portion.
【００１４】また、本発明のメタルボンドダイヤモンド
砥石では、ねずみ鋳鉄を主成分として含んだ焼結メタル
ボンド部は、純銅、銅被覆二硫化モリブデン等の銅系物
質を更に含んでいる。Further, in the metal bond diamond grinding wheel of the present invention, the sintered metal bond portion containing gray cast iron as a main component further contains a copper-based substance such as pure copper and copper-coated molybdenum disulfide.
【００１５】加えて、本発明のメタルボンドダイヤモン
ド砥石では、ねずみ鋳鉄を主成分として含んだ焼結メタ
ルボンド部は、純銅、銅被覆二硫化モリブデン等の銅系
物質及びカーボニル純鉄を更に含んでいる。In addition, in the metal bond diamond wheel of the present invention, the sintered metal bond portion containing gray cast iron as a main component further contains pure copper, a copper-based material such as copper-coated molybdenum disulfide, and carbonyl pure iron. I have.
【００１６】更に、本発明のメタルボンドダイヤモンド
砥石では、ねずみ鋳鉄を主成分として含んだ焼結メタル
ボンド部は、純銅、銅被覆二硫化モリブデン等の銅系物
質、カーボニル純鉄及びすずを更に含んでいる。Further, in the metal bond diamond grinding wheel of the present invention, the sintered metal bond portion containing gray cast iron as a main component further contains pure copper, a copper-based material such as copper-coated molybdenum disulfide, carbonyl pure iron and tin. In.
【００１７】[0017]
【発明の実施の形態】以下、本発明をその実施の形態に
基づいて更に詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail based on its embodiments.
【００１８】本発明メタルボンドダイヤモンド砥石は、
ダイヤモンド砥粒となるダイヤモンド粉末とボンド構成
メタル粉末とを好ましい容量比で混合し、この混合粉末
を水素還元雰囲気中で、約９００℃程度の温度下におい
て、好ましくは０．５〜１．５ｔ／ｃｍ２の範囲の加圧
下で焼結することによって製造する。The metal bond diamond grinding wheel of the present invention comprises:
A diamond powder to be a diamond abrasive and a metal powder constituting a bond are mixed at a preferable volume ratio, and the mixed powder is mixed in a hydrogen reducing atmosphere at a temperature of about 900 ° C., preferably 0.5 to 1.5 t / t. Produced by sintering under pressure in the range of cm 2 .
【００１９】ボンド構成メタル粉末は、平均粒径１０〜
５００μｍのねずみ鋳鉄粉末を主成分とし、これに純銅
粉末、銅被覆二硫化モリブデン粉末等の平均粒径１０〜
５００μｍの銅系粉末を加え、更に、鋳鉄の焼結性の悪
さを補うため、例えばカーボニル純鉄粉末を加え、更に
通常は焼結保進材としてすず粉末を加える。The metal powder constituting the bond has an average particle diameter of 10 to 10.
The main component is gray cast iron powder of 500 μm, and the average particle size of pure copper powder, copper-coated molybdenum disulfide powder, etc. is 10 to 10 μm.
A copper-based powder of 500 μm is added, and further, for example, pure iron powder of carbonyl is added in order to compensate for the poor sinterability of cast iron, and usually tin powder is added as a sintering promoter.
【００２０】ダイヤモンド粉末とボンド構成メタル粉末
との混合容量比は、ガラス板エッヂ研削としてのダイヤ
モンド粉末、粒度＃２００／２３０又は＃１７０／２０
０の場合は、１０：９０ないし３５：６５の範囲を通常
とする。The mixing volume ratio between the diamond powder and the bond constituent metal powder is as follows: diamond powder as a glass plate edge grinding, particle size # 200/230 or # 170/20.
In the case of 0, the range of 10:90 to 35:65 is normal.
【００２１】ねずみ鋳鉄は、耐圧縮強度に優れ、従来の
Ｃｕ−Ｓｎ系、鉄−銅系等ボンドよりダイヤモンド砥粒
の保持力が大きく、ダイヤモンド砥粒が容易に無駄に脱
落して減少することを防ぐことができ、図２に示すよう
に、切り刃として機能する各ダイヤモンド砥粒３は劈開
摩耗した形状でもメタルボンド部４に残り、均等摩耗し
てその多くの各ダイヤモンド砥粒３は高さ均一の状態で
研削を行うため、砥石の寿命は長く、切味が良い。しか
も、この劈開摩耗した均等高さのダイヤモンド砥粒３に
よる研削では、凹凸研削、すなわち、不揃い高さによる
たたき研削がなくなり、滑らかで木目細かい研削面が得
られる。Gray cast iron is excellent in compressive strength, has a larger holding force for diamond abrasive grains than conventional Cu-Sn-based, iron-copper-based bonds, etc., and easily reduces and drops diamond abrasive grains. As shown in FIG. 2, each diamond abrasive grain 3 functioning as a cutting blade remains in the metal bond portion 4 even in the shape of cleavage wear, and evenly wears, and many of the diamond abrasive grains 3 become high. Since the grinding is performed in a uniform state, the life of the grinding wheel is long and the sharpness is good. In addition, in the grinding with the diamond abrasive grains 3 having the uniform height that has undergone the cleavage wear, the uneven grinding, that is, the hitting grinding due to the uneven height is eliminated, and a smooth and fine-grained surface can be obtained.
【００２２】鋳鉄は、鉄系に比べ高温で安定した熱伝導
を示し、その成分中の高温で摩擦抵抗が小さいグラファ
イトのマイクロベアリング効果、すなわち鋳物の離脱小
片粒の転がり付着効果によって切り屑の排出が保進さ
れ、この離脱小片によるクッションによって研削面を衝
撃等から保護する。Cast iron exhibits stable heat conduction at high temperatures compared to iron-based materials, and discharges chips due to the micro-bearing effect of graphite having a small frictional resistance at high temperatures in its components, that is, the effect of rolling and adhering small pieces of separated castings. Is maintained, and the cushion by the detached small pieces protects the ground surface from impacts and the like.
【００２３】また、鋳鉄は、鉄、銅より被削性が良いの
で、ドレッサビリティに優れており、研削加工中、切り
屑粉末によって適度なチップポケットが形成され易い。Since cast iron has better machinability than iron and copper, it has excellent dressability, and an appropriate chip pocket is easily formed by chip powder during grinding.
【００２４】鋳鉄粉末に加える銅系粉末は、鋳鉄粉末の
焼結温度を約９００℃に下げ、低温焼結を得ると共に、
その優れた熱伝導性によって加工面の焼けを防ぐ働きを
する。The copper-based powder added to the cast iron powder lowers the sintering temperature of the cast iron powder to about 900 ° C. to obtain low-temperature sintering,
Its excellent thermal conductivity serves to prevent burnt surfaces.
【００２５】レジンボンドダイヤモンド砥石に使用され
る二硫化モリブデンは、優れた潤滑性を示すが、焼結ボ
ンドを脆くするので、好ましくは、その粉末に銅を蒸着
によって被覆して使用するとよい。Although molybdenum disulfide used for a resin-bonded diamond wheel shows excellent lubricity, it makes the sintered bond brittle. Therefore, it is preferable to coat copper on the powder by vapor deposition.
【００２６】カーボニル純鉄粉末は鋳鉄粉末の焼結性を
容易にするために用いる。Carbonyl pure iron powder is used to facilitate sintering of cast iron powder.
【００２７】本発明の鋳鉄系ボンドは、ダイヤモンド砥
粒の被覆技術によらなくとも、砥石における、ダイヤモ
ンド砥粒の保持力を大きくでき、耐焼きつき性、ドレッ
サビリティ、減衰能力、耐摩耗性を他のメタルボンドよ
り優れたものとできる。The cast iron-based bond of the present invention can increase the holding power of diamond abrasive grains in a grindstone without relying on the technique of coating diamond abrasive grains, and can improve seizure resistance, dressability, damping ability, and wear resistance. Can be better than other metal bonds.
【００２８】[0028]
【実施例】実施例１ ボンド構成メタル粉末として、ねずみ鋳鉄粉末４０容量
％、カーボニル純鉄粉末２０容量％、純銅粉末３２容量
％、すず粉末７容量％、銅被覆二硫化モリブデン粉末１
容量％の組成からなるボンド構成メタル粉末と、粒度＃
２００／２３０のダイヤモンド粉末とを、容量比７５：
２５の割合で、ライカイ機で混合し、この混合物を金型
に充填し、水素還元雰囲気中で、温度９００℃、圧力１
ｔ／ｃｍ ２で加圧焼結した。EXAMPLES Example 1 40 volume of gray cast iron powder as bond constituent metal powder
%, Pure carbon powder 20% by volume, pure copper powder 32 volume
%, Tin powder 7% by volume, copper-coated molybdenum disulfide powder 1
Bond composition metal powder consisting of volume% composition and particle size #
200/230 diamond powder at a volume ratio of 75:
Mix with a raikai machine at a ratio of 25 and mold this mixture into a mold.
At a temperature of 900 ° C. and a pressure of 1 in a hydrogen reducing atmosphere.
t / cm 2For pressure sintering.
【００２９】得られた焼結体を機械加工して、図１に示
すような、ペンシルエッヂタイプのガラス研削用砥石を
製作した。The obtained sintered body was machined to produce a pencil-edge type glass grinding wheel as shown in FIG.
【００３０】このようにして得られた砥石を用いて、竪
軸タイプのガラス研削盤（自動車窓ガラス周縁研削用）
でガラス板の研削試験を行った。Using the thus obtained grindstone, a vertical axis type glass grinder (for grinding the periphery of an automobile window glass)
The grinding test of the glass plate was performed.
【００３１】本実施例１によって得られた本発明砥石と
従来品であるＣｕ−Ｓｎ系砥石とによる上記研削試験に
よるそれぞれのガラス板研削加工面の粗さを、表面粗さ
測定機で測定した結果を図３及び図４に示す。なお測定
は、ガラス板に対する研削進行方向に沿って行った。The roughness of each of the ground surfaces of the glass sheets ground by the above-described grinding test using the grindstone of the present invention obtained in Example 1 and the conventional Cu-Sn-based grindstone was measured by a surface roughness measuring device. The results are shown in FIGS. The measurement was performed along the direction in which the glass plate was ground.
【００３２】従来品のメタルボンドダイヤモンド砥石に
よる研削面には、大きな凹凸と深い凹みとが生じている
ことが図４から解る。これは、凹凸研削、すなわち、ダ
イヤモンド砥粒の高さ不揃いによるたたき研削が行われ
ているものと思われる。一方、本発明メタルボンドダイ
ヤモンド砥石による研削面には、深い凹みがなく凹凸面
が小さくなっていることが図３から解る。これは、ダイ
ヤモンド砥粒の無駄な脱落が少なく、多くのダイヤモン
ド砥粒が鈍角に摩耗されて残り、高さが平均された状態
で研削が行われているものと思われる。FIG. 4 shows that large irregularities and deep dents are formed on the grinding surface by the conventional metal bond diamond grindstone. This is presumably due to uneven grinding, that is, tapping grinding due to irregular height of diamond abrasive grains. On the other hand, it can be seen from FIG. 3 that the ground surface formed by the metal bond diamond grindstone of the present invention has no deep dents and has a small uneven surface. This is presumably because the useless grinding of the diamond abrasive grains is small, many diamond abrasive grains are worn at an obtuse angle, and grinding is performed in a state where the heights are averaged.
【００３３】実施例２ ねずみ鋳鉄粉末４０容量％、カーボニル純鉄粉末２０容
量％、純銅粉末３２容量％、すず粉末７容量％、銅被覆
二硫化モリブデン粉末１容量％の組成からなるボンド構
成メタル粉末と、粒度＃１７０／２００のダイヤモンド
粉末とを、容量比６９：３１の割合でライカイ機で混合
し、この混合物を金型に充填し、水素還元雰囲気中で、
温度９００℃、圧力１ｔ／ｃｍ２で加圧焼結した。Example 2 Bond-forming metal powder composed of 40% by volume of gray cast iron powder, 20% by volume of pure carbon iron powder, 32% by volume of pure copper powder, 7% by volume of tin powder, and 1% by volume of copper-coated molybdenum disulfide powder. And diamond powder having a particle size of # 170/200 in a ratio of 69:31 by volume using a raikai machine, and filling the mixture in a mold.
Pressure sintering was performed at a temperature of 900 ° C. and a pressure of 1 t / cm 2 .
【００３４】得られた焼結体を機械加工して、図１に示
すようなペンシルエッヂタイプのガラス研削用砥石を製
作した。The obtained sintered body was machined to produce a pencil-edge type glass grinding wheel as shown in FIG.
【００３５】このようにして得られた砥石を用いて、竪
軸タイプのガラス研削盤（自動車窓ガラス周縁研削用）
でガラス板の研削試験を行った結果、実施例１とほぼ同
じような効果が得られた。Using the grindstone thus obtained, a vertical axis type glass grinder (for grinding the periphery of an automobile window glass)
As a result of performing a grinding test on a glass plate, the same effect as in Example 1 was obtained.
【００３６】尚、本実施例１のメタルボンドダイヤモン
ド砥石によって研削されたガラス板の研削面と従来のメ
タルボンドダイヤモンド砥石によって研削されたガラス
板の研削面とを顕微鏡で観測してみると、図５及び図６
に示すように、従来のメタルボンドダイヤモンド砥石に
よる研削面には、焼けが極めて多く発生しており、本実
施例１のメタルボンドダイヤモンド砥石による研削面に
は、ほとんど焼けが生じていないことが確認できた。When the ground surface of the glass plate ground by the metal bond diamond wheel of the first embodiment and the ground surface of the glass plate ground by the conventional metal bond diamond wheel are observed by a microscope, 5 and FIG.
As shown in the figure, it was confirmed that the burn surface was extremely large on the ground surface of the conventional metal-bonded diamond grindstone, and almost no burn occurred on the ground surface of the metal-bonded diamond grindstone of Example 1. did it.
【００３７】[0037]
【発明の効果】本発明のメタルボンドダイヤモンド砥石
では、ボンド構成メタルの主成分が耐圧縮強さに優れた
ねずみ鋳鉄の焼結体で構成されているために、ダイヤモ
ンド砥粒の保持力が大きく無駄な脱落が少なく、鈍角に
摩耗されて均一高さに残って良い切味が長く続くなめら
かな研削を行うことができ、少ない鋭角ダイヤモンド砥
粒によるびびり研削が出難く、従ってガラス厚さ等の研
削物の厚さ、砥石の周速に関係なく安定した研削能力が
得られる。According to the metal bond diamond grinding wheel of the present invention, since the main component of the metal constituting the bond is made of a gray cast iron sintered body having excellent compressive strength, the holding power of diamond abrasive grains is large. It is possible to carry out smooth grinding with less wasteful falling off, wear at an obtuse angle, remaining at a uniform height and good sharpness for a long time, and it is difficult to produce chatter grinding with a small acute angle diamond abrasive grain, so that glass thickness etc. A stable grinding ability can be obtained regardless of the thickness of the grinding object and the peripheral speed of the grinding wheel.
【００３８】一方また本発明のメタルボンドダイヤモン
ド砥石では、ねずみ鋳鉄のグラファイト（黒鉛）が焼結
体中に存在するため、優れた潤滑作用と切り粉末の細分
作用、すなわちマイクロベアリング効果が得られ、研
削、切断等の加工物との摩擦抵抗が小さく焼け現象が起
き難くく、更にねずみ鋳鉄の振動減衰能力により、振動
を吸収してびびりを伴った研削を抑えることができ、加
えて、ねずみ鋳鉄のグラファイトの存在よる被切削性に
より、ドレッサビリティに優れている上、切削加工中、
切り粉末によって適度なチップポケットを形成できる。On the other hand, in the metal bond diamond grinding wheel of the present invention, since graphite (graphite) of gray cast iron is present in the sintered body, an excellent lubricating effect and a finely dividing effect of the cutting powder, that is, a micro bearing effect are obtained. Grinding, cutting, etc., the frictional resistance with the workpiece is small, and the burning phenomenon is unlikely to occur.In addition, due to the vibration damping ability of gray cast iron, vibration can be absorbed and grinding with chatter can be suppressed, and in addition, gray cast iron Due to the machinability due to the presence of graphite, it has excellent dressability,
An appropriate chip pocket can be formed by the cutting powder.
【図１】ペンシルエッヂダイヤモンド砥石の一例の断面
図である。FIG. 1 is a cross-sectional view of an example of a pencil edge diamond grindstone.
【図２】本発明砥石の焼結体の構造を示す模式図であ
る。FIG. 2 is a schematic view showing a structure of a sintered body of the grindstone of the present invention.
【図３】本発明砥石により研削されたガラスの研削面の
粗さの測定結果を示す図である。FIG. 3 is a view showing a measurement result of roughness of a ground surface of a glass ground by the grindstone of the present invention.
【図４】従来砥石により研削されたガラスの研削面の粗
さの測定結果を示す図である。FIG. 4 is a view showing a measurement result of roughness of a ground surface of glass ground by a conventional grindstone.
【図５】本発明砥石により研削されたガラスの研削面の
顕微鏡写真図である。FIG. 5 is a photomicrograph of the ground surface of the glass ground by the grindstone of the present invention.
【図６】従来砥石により研削されたガラスの研削面の顕
微鏡写真図である。FIG. 6 is a micrograph of a ground surface of glass ground by a conventional grindstone.
１ 台金 ２ 焼結体層 ３ ダイヤモンド砥粒 ４ 焼結メタルボンド部 1 base metal 2 sintered body layer 3 diamond abrasive grain 4 sintered metal bond
Claims (8)
末との混合粉末を加圧焼結してメタルボンドダイヤモン
ド砥石を製造する方法において、ボンド構成メタル粉末
として、主成分がねずみ鋳鉄粉末からなるものを用いる
メタルボンドダイヤモンド砥石の製造方法。1. A method for producing a metal-bonded diamond grinding wheel by pressure-sintering a mixed powder of diamond powder and a metal powder constituting a bond, wherein the main component of the bond-forming metal powder is a gray cast iron powder. Manufacturing method of metal bond diamond whetstone.
末、銅被覆二硫化モリブデン粉末等の銅系粉末を更に含
んだものを用いる請求項１に記載のメタルボンドダイヤ
モンド砥石の製造方法。2. The method for producing a metal-bonded diamond wheel according to claim 1, wherein the bond-forming metal powder further contains a copper-based powder such as a pure copper powder or a copper-coated molybdenum disulfide powder.
末、銅被覆二硫化モリブデン粉末等の銅系粉末及びカー
ボニル純鉄粉末を更に含んだものを用いる請求項１に記
載のメタルボンドダイヤモンド砥石の製造方法。3. The method for producing a metal-bonded diamond grinding wheel according to claim 1, wherein the bond-forming metal powder further includes a copper-based powder such as pure copper powder, copper-coated molybdenum disulfide powder, and carbonyl pure iron powder. .
末、銅被覆二硫化モリブデン粉末等の銅系粉末、カーボ
ニル純鉄粉末及びすず粉末を更に含んだものを用いる請
求項１に記載のメタルボンドダイヤモンド砥石の製造方
法。4. The metal-bonded diamond grinding wheel according to claim 1, wherein the bond-forming metal powder further includes pure copper powder, copper-based powder such as copper-coated molybdenum disulfide powder, carbonyl pure iron powder, and tin powder. Manufacturing method.
タルボンド部と、この焼結メタルボンド部中に分散、保
持されたダイヤモンド砥粒とからなるメタルボンドダイ
ヤモンド砥石。5. A metal-bonded diamond grindstone comprising a sintered metal bond portion containing gray cast iron as a main component and diamond abrasive grains dispersed and held in the sintered metal bond portion.
硫化モリブデン等の銅系物質を更に含んでいる請求項５
に記載のメタルボンドダイヤモンド砥石。6. The sintered metal bond further includes a copper-based material such as pure copper or copper-coated molybdenum disulfide.
The metal-bonded diamond wheel described in 1.
硫化モリブデン等の銅系物質及びカーボニル純鉄を更に
含んでいる請求項５に記載のメタルボンドダイヤモンド
砥石。7. The metal-bonded diamond grinding wheel according to claim 5, wherein the sintered metal-bonded portion further contains pure copper, a copper-based material such as copper-coated molybdenum disulfide, and carbonyl pure iron.
硫化モリブデン等の銅系物質、カーボニル純鉄及びすず
を更に含んでいる請求項５に記載のメタルボンドダイヤ
モンド砥石。8. The metal bond diamond grinding wheel according to claim 5, wherein the sintered metal bond portion further contains pure copper, a copper-based substance such as copper-coated molybdenum disulfide, carbonyl pure iron, and tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3647699A JP2000233374A (en) | 1999-02-15 | 1999-02-15 | Metal bond diamond grinding wheel and manufacture therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3647699A JP2000233374A (en) | 1999-02-15 | 1999-02-15 | Metal bond diamond grinding wheel and manufacture therefor |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002311776A Division JP2003127066A (en) | 2002-10-25 | 2002-10-25 | Metal bond diamond grinding wheel and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000233374A true JP2000233374A (en) | 2000-08-29 |
Family
ID=12470879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3647699A Pending JP2000233374A (en) | 1999-02-15 | 1999-02-15 | Metal bond diamond grinding wheel and manufacture therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000233374A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090084042A1 (en) * | 2007-10-01 | 2009-04-02 | Saint-Gobain Abrasives, Inc. | Abrasive processing of hard and /or brittle materials |
| US8882868B2 (en) | 2008-07-02 | 2014-11-11 | Saint-Gobain Abrasives, Inc. | Abrasive slicing tool for electronics industry |
| US10105821B2 (en) | 2013-12-31 | 2018-10-23 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
-
1999
- 1999-02-15 JP JP3647699A patent/JP2000233374A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090084042A1 (en) * | 2007-10-01 | 2009-04-02 | Saint-Gobain Abrasives, Inc. | Abrasive processing of hard and /or brittle materials |
| US8894731B2 (en) * | 2007-10-01 | 2014-11-25 | Saint-Gobain Abrasives, Inc. | Abrasive processing of hard and /or brittle materials |
| US8882868B2 (en) | 2008-07-02 | 2014-11-11 | Saint-Gobain Abrasives, Inc. | Abrasive slicing tool for electronics industry |
| US10105821B2 (en) | 2013-12-31 | 2018-10-23 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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