JP2000218724A - Composite board - Google Patents
Composite boardInfo
- Publication number
- JP2000218724A JP2000218724A JP11019669A JP1966999A JP2000218724A JP 2000218724 A JP2000218724 A JP 2000218724A JP 11019669 A JP11019669 A JP 11019669A JP 1966999 A JP1966999 A JP 1966999A JP 2000218724 A JP2000218724 A JP 2000218724A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- sheet
- gypsum board
- surface sheet
- vinyl acetate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は複合パネル、詳しく
は鋼板、アルミ板等の金属板、メラミン樹脂化粧板等の
プラスチック板等の表面板と石膏ボードとが積層されて
いるパーテイション等に使用される複合ボードに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for a composite panel, in particular, a partition in which a surface plate such as a metal plate such as a steel plate or an aluminum plate, a plastic plate such as a melamine resin decorative plate and a gypsum board are laminated. Composite board.
【0002】[0002]
【従来技術】従来、パーテイション等に使用するボード
類は鋼板等の表面板と石膏ボード等の芯材を接着して仕
上げられたものであつた。これらは表面板と芯材とが全
面で接着されているため使用後に廃棄する場合、表面板
と芯材の分離が不可能なため、そのまま廃棄されていた
が資源的にも不経済であるばかりか、廃棄場所にも困る
状態であつた。2. Description of the Related Art Heretofore, boards used for partitioning and the like have been finished by bonding a surface plate such as a steel plate and a core material such as a gypsum board. When discarded after use because the surface plate and the core material are adhered on the entire surface, it is impossible to separate the surface plate and the core material. Or, they were in trouble at the disposal site.
【0003】[0003]
【発明が解決しようとする課題】本発明は前記のような
従来の課題を解決すべく、検討した結果得られたもので
あつて、不要となつた複合パネルを簡便に表面板と芯材
に分離してリサイクル利用できる複合ボードを提供する
ものである。DISCLOSURE OF THE INVENTION The present invention, which was obtained as a result of an examination to solve the above-mentioned conventional problems, is an easy-to-use composite panel which is no longer required as a surface plate and a core material. It is intended to provide a composite board which can be separated and recycled.
【0004】[0004]
【課題を解決するための手段】本発明における複合ボー
ドを製作するため、表面板と芯材の接着に従来にない接
着方法を採用した。即ち、接着剤の塗布方法において従
来は全面塗布が採用されていたが、本発明では接着剤を
線状、点状、メッシュ状等に塗布する各種塗布パターン
を採用する。In order to manufacture the composite board according to the present invention, an unconventional bonding method has been adopted for bonding the surface plate and the core material. That is, the whole surface of the adhesive is conventionally applied in the method of applying the adhesive. However, the present invention employs various application patterns for applying the adhesive in a linear, dot, or mesh shape.
【0005】接着剤には表面板と芯材とを接着できる各
種タイプが使用できる。例えば、酢酸ビニルエマルジョ
ン、酢酸ビニルとエチレン、アクリル酸エステル等のモ
ノマーとの共重合エマルジョン、クロロプレンゴムラテ
ックス系、SBR系等の水系接着剤、クロロプレンゴム
系接着剤、ウレタン系、エポキシ系等の各種樹脂系接着
剤、ホツトメルト系等の無溶剤型接着剤等が使用でき
る。Various types of adhesives can be used that can bond the surface plate and the core material. For example, vinyl acetate emulsions, copolymer emulsions of vinyl acetate with monomers such as ethylene and acrylic acid esters, aqueous adhesives such as chloroprene rubber latex type, SBR type, etc., chloroprene rubber type adhesives, urethane type, epoxy type etc. A non-solvent type adhesive such as a resin adhesive or a hot melt adhesive can be used.
【0006】接着剤を間欠的に塗布する塗布方法として
ロールコーター、ノズルコータ、スプレー等の間欠的に
塗布できるものであればどんな方法であつても構わない
が、塗布面積率は30%以下が好ましい。30%以上で
は剥離作業する際に剥離しにくく作業の効率が低下して
好ましくない。。[0006] As an application method for applying the adhesive intermittently, any method can be used as long as it can be applied intermittently, such as a roll coater, a nozzle coater, a spray, etc., but the coating area ratio is preferably 30% or less. . If it is 30% or more, it is difficult to peel off during the peeling operation, and the work efficiency is undesirably reduced. .
【0007】接着剤を塗布後の圧締はピンチロール又は
プレスにより数kg/cm2の圧力で行われる。圧締時
間は接着剤の種類により適宜選定されればよい。Pressing after applying the adhesive is performed by a pinch roll or a press at a pressure of several kg / cm 2. The pressing time may be appropriately selected depending on the type of the adhesive.
【0008】本発明に係わる石膏ボードは、芯部に石膏
層、表面に0.3〜1.2mm程度の板紙が積層された
建材として汎用されている通称「石膏ボード」と呼ばれ
るものである。[0008] The gypsum board according to the present invention is a so-called "gypsum board" which is widely used as a building material in which a gypsum layer is laminated on a core portion and a paperboard of about 0.3 to 1.2 mm is laminated on the surface.
【0009】表面板にはアルミ、鋼板等の各種の金属系
表面板、メラミン樹脂化粧板等の各種樹脂系化粧板なら
びに合板等の木質系表面板等を使用できる。勿論これら
は印刷或いは塗装等の化粧仕上の有無は問わない。As the surface plate, various metal-based surface plates such as aluminum and steel plates, various resin-based decorative plates such as melamine resin decorative plates, and wood-based surface plates such as plywood can be used. Of course, these do not matter whether cosmetic finishing such as printing or painting is performed.
【0010】[0010]
【実施例1】アクリルエマルジョン系粘着剤(樹脂分6
0%、アイカ工業製、アイカアイボンRA−227)石
膏ボード(1mm厚、吉野石膏製)に2mm、間隔5m
mの線状にロールコーターにより塗布した後、エリオ鋼
板(1mm厚、新日鉄製)を貼り合わせピンチロールで
圧締して実施例1の複合ボードを調製した。Example 1 Acrylic emulsion adhesive (resin content 6)
0%, manufactured by Aika Kogyo, Aika Aibon RA-227) 2 mm on gypsum board (1 mm thick, manufactured by Yoshino Gypsum), spacing 5 m
Then, the composite board of Example 1 was prepared by applying an erio steel plate (1 mm thick, manufactured by Nippon Steel) and pressing with a pinch roll.
【0011】[0011]
【実施例2】エチレン・酢酸ビニル系エマルジヨン接着
剤(樹脂分55%、アイカ工業製、アイカアイボンAE
−21)を石膏ボード(8mm厚、チヨダウーテ製)に
1mm幅、間隔5mmのメッシュ状にロールコーターに
て塗布しメラミン樹脂化粧板(1mm厚、アイカ工業
(株)製)を貼り合わせプレスで30分間圧締して実施例
2の複合ボードを調製した。Example 2 Ethylene / vinyl acetate emulsion adhesive (resin content 55%, manufactured by Aika Kogyo, Aika Aibon AE)
-21) is applied to a gypsum board (8 mm thick, manufactured by Chiyoda Ute) in the form of a mesh having a width of 1 mm and an interval of 5 mm using a roll coater, and a melamine resin decorative board (1 mm thick, Aika Kogyo)
(Manufactured by Co., Ltd.) was pressed with a bonding press for 30 minutes to prepare a composite board of Example 2.
【0012】[0012]
【実施例3】アクリルエマルジョン系粘接着剤(樹脂分
50%、アイカ工業製、アイカアイボンRA−200A
〈主剤〉RA−200B〈硬化剤〉)を石膏ボード(1
2mm厚、チヨダウーテ製)にタテ、ヨコ各間隔10m
mに直径5mmの点状に吐出機にて塗布し、乾燥後、化
粧合板(2.4mm厚、アイカ工業(株)製)を貼り合わ
せピンチロールで圧締して実施例3の複合ボードを調製
した。Example 3 Acrylic emulsion adhesive (resin content: 50%, manufactured by Aika Kogyo, Aika Aibon RA-200A)
<Main agent> RA-200B <Curing agent>) on gypsum board (1
2 mm thick, made by Chiyoda Ute) Vertical and horizontal each 10 m apart
m, a 5 mm diameter dot was applied by a discharger, and after drying, a decorative plywood (2.4 mm thick, manufactured by Aika Kogyo Co., Ltd.) was bonded and pressed with a pinch roll to obtain a composite board of Example 3. Prepared.
【0013】[0013]
【比較例1】アクリルエマルジョン系接着剤(樹脂分6
0%、アイカ工業製、アイカアイボンRA−227)を
石膏ボード(12mm厚、吉野石膏)にロールコータで
全面塗布しエリオ鋼板(1mm厚、新日鉄製)を貼り合
わせてピンチロールで 分間圧締して比較例1の複合ボ
ードを調製した。Comparative Example 1 Acrylic emulsion adhesive (resin content 6)
0%, manufactured by Aika Kogyo Co., Ltd., Aika Aibon RA-227) is applied to the entire surface of a gypsum board (12 mm thick, Yoshino gypsum) with a roll coater, adhered to an erio steel plate (1 mm thick, Nippon Steel) and pressed with a pinch roll for minutes. Thus, a composite board of Comparative Example 1 was prepared.
【0014】以上調製した実施例、比較例の複合ボード
について剥離強度(再剥離性)及び耐熱性を測定した結
果、表の通り実施例1、3の複合ボードではごく容易に
剥離でき、実施例2の複合ボードにおいても何ら問題は
なく表面材、石膏として再利用が可能であった。しか
し、比較例1の複合ボードでは剥離が難しく、そのまま
の状態で廃棄処分せざるを得なかった。The peel strength (removability) and the heat resistance of the composite boards of Examples and Comparative Examples prepared above were measured. As a result, the composite boards of Examples 1 and 3 could be easily peeled as shown in the table. The composite board of No. 2 had no problem and could be reused as a surface material and gypsum. However, the composite board of Comparative Example 1 was difficult to peel, and had to be discarded as it was.
【0015】[0015]
【表1】 注 ) T型剥離強度及び耐熱T型剥離強度 単
位[kgf/50mm] bf: 材料破壊 cf:凝集破壊 再剥離性 〇:剥離容易 △:やや剥離容易
×:剥離難[Table 1] Note) T-type peel strength and heat-resistant T-type peel strength Unit [kgf / 50mm] bf: Material destruction cf: Cohesive destruction Re-peelability 〇: Easy to peel △: Slightly easy to peel
×: Difficult to peel
【0016】測定方法 イ. T型剥離強度 実施例1、比較例1については実施例の接着方法に従つ
て50mm×50mmの接着面積を持つ各鋼板製のT型
接着片を接着して各試験片を調製し、養生後20℃の雰
囲気中で剥離強度を測定する。実施例2及び実施例3に
ついては実施例1の該T型接着片の接着面に予め化粧板
及び化粧合板をエポキシ樹脂接着剤にて接着したT型試
験片を使用して 各試験片を調製し、養生後20℃の雰
囲気中で剥離強度を測定する。 ロ. 耐熱T型剥離強度 イで調製した各試験片を80℃雰囲気中で剥離強度を測
定する。 ハ. 軟化点 実施例の接着方法に従って石膏ボードの表面に25mm
×25mmの接着面積を持つ各実施例、比較例で使用し
た板状の各接着片を接着し養生した後500gの荷重を
かけ、恒温槽の温度を38℃で15分間維持した後、5
分間に約2℃の割合で温度を上昇させて荷重が落下した
時の温度を最高150℃まで測定する。Measurement method a. T-type peel strength For each of Example 1 and Comparative Example 1, each test piece was prepared by bonding each steel plate T-type adhesive piece having an adhesive area of 50 mm × 50 mm according to the bonding method of the example, and after curing. The peel strength is measured in an atmosphere at 20 ° C. For Examples 2 and 3, each test piece was prepared using a T-type test piece in which a decorative board and a decorative plywood were previously bonded to the bonding surface of the T-type adhesive piece of Example 1 with an epoxy resin adhesive. After curing, the peel strength is measured in an atmosphere at 20 ° C. B. Heat-Resistant T-Type Peel Strength The peel strength of each test piece prepared in a) is measured in an atmosphere at 80 ° C. C. Softening point 25 mm on the surface of the gypsum board according to the bonding method of the example.
After adhering and curing each of the plate-shaped adhesive pieces used in each of the examples and comparative examples having an adhesive area of × 25 mm, a load of 500 g was applied thereto, and the temperature of the thermostat was maintained at 38 ° C. for 15 minutes.
The temperature is raised at a rate of about 2 ° C. per minute and the temperature when the load falls is measured up to 150 ° C.
【0017】[0017]
【効果】本発明になる複合ボードは鋼板、化粧板等の表
面板と石膏ボードとが点状、線状、メッシュ状等の間欠
状に塗布された接着剤により接着されているため、ごく
容易に両者を分離することができる。このためパーテシ
ョン、壁材等の部材として使用された後、取り壊し又は
リフォーム等で不要になった場合でも、容易に表面材と
石膏ボードとを剥離して、表面材及び石膏としてリサイ
クル利用可能である。このため、従来このような場合、
分離することなく複合ボードのまま廃棄処分され資源的
なムダ、廃棄スペース問題等の課題が残されていたが、
これらを解消することが出来た。[Effect] The composite board according to the present invention is very easy because a surface plate such as a steel plate or a decorative plate and a gypsum board are bonded by an intermittently applied adhesive such as a dot, a line, or a mesh. Can be separated from each other. For this reason, after being used as a member of a partition, wall material, etc., even if it becomes unnecessary due to demolishing or reforming, the surface material and the gypsum board can be easily peeled off, and can be recycled as the surface material and gypsum. . For this reason, conventionally in such a case,
Although it was disposed of as a composite board without separation, there were problems such as wasteful resources and waste space issues.
These have been resolved.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2E162 CA16 CB02 CB06 CB08 CE08 4F100 AB03D AB10D AE06A AK25 AK36D AR00C BA03 BA04 BA07 BA10A BA10C BA10D DC11C DG10B GB07 HB00D JK06 JL11C JL14 JL16 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2E162 CA16 CB02 CB06 CB08 CE08 4F100 AB03D AB10D AE06A AK25 AK36D AR00C BA03 BA04 BA07 BA10A BA10C BA10D DC11C DG10B GB07 HB00D JK06 JL11C JL14 JL16
Claims (1)
ドの表面に線状、点状、メッシュ状等の間欠状に塗布さ
れた接着剤により表面板が接着されている複合ボード。1. A composite board comprising a gypsum board having a paperboard laminated on the surface of a gypsum board, and a surface board adhered to the surface of the gypsum board by an adhesive applied in an intermittent shape such as a line, a dot, and a mesh.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11019669A JP2000218724A (en) | 1999-01-28 | 1999-01-28 | Composite board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11019669A JP2000218724A (en) | 1999-01-28 | 1999-01-28 | Composite board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000218724A true JP2000218724A (en) | 2000-08-08 |
JP2000218724A5 JP2000218724A5 (en) | 2006-04-13 |
Family
ID=12005663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11019669A Pending JP2000218724A (en) | 1999-01-28 | 1999-01-28 | Composite board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000218724A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7130659B2 (en) | 2001-08-06 | 2006-10-31 | Sanyo Electric Co., Ltd. | Radio base station, radio terminal apparatus, mobile body communication system, and reception operation control program |
US8748515B2 (en) | 2010-04-15 | 2014-06-10 | Henry Company Llc | Mixtures and emulsions for use in providing strength to gypsum compositions |
JP2015501897A (en) * | 2011-12-12 | 2015-01-19 | セント−ゴベイン プラコ エスエーエス | Architectural panels and their manufacture |
US9045370B2 (en) | 2011-02-24 | 2015-06-02 | Henry Company Llc | Aqueous wax emulsions having reduced solids content for use in gypsum compositions and building products |
-
1999
- 1999-01-28 JP JP11019669A patent/JP2000218724A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7130659B2 (en) | 2001-08-06 | 2006-10-31 | Sanyo Electric Co., Ltd. | Radio base station, radio terminal apparatus, mobile body communication system, and reception operation control program |
US8748515B2 (en) | 2010-04-15 | 2014-06-10 | Henry Company Llc | Mixtures and emulsions for use in providing strength to gypsum compositions |
US9045370B2 (en) | 2011-02-24 | 2015-06-02 | Henry Company Llc | Aqueous wax emulsions having reduced solids content for use in gypsum compositions and building products |
JP2015501897A (en) * | 2011-12-12 | 2015-01-19 | セント−ゴベイン プラコ エスエーエス | Architectural panels and their manufacture |
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