JP2000214007A - Pressure sensor - Google Patents
Pressure sensorInfo
- Publication number
- JP2000214007A JP2000214007A JP11013065A JP1306599A JP2000214007A JP 2000214007 A JP2000214007 A JP 2000214007A JP 11013065 A JP11013065 A JP 11013065A JP 1306599 A JP1306599 A JP 1306599A JP 2000214007 A JP2000214007 A JP 2000214007A
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- Japan
- Prior art keywords
- pressure
- substrate
- contact
- elastic body
- conductive
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、荷重を段階的に測
定する感圧センサであって、例えば自動車の座席の下に
配置し、そこに座っている人の体重を測定する場合に使
用されるような測定装置に組み込まれる感圧センサに関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive sensor for measuring a load in a stepwise manner, and is used, for example, for measuring the weight of a person sitting under an automobile seat and sitting there. The present invention relates to a pressure sensor incorporated in such a measuring device.
【０００２】[0002]
【従来の技術】従来、感圧センサとしては、櫛目状また
は平行に設けられた電極を有する接点回路が形成された
基板の接点部の上に感圧ゴムを配置したものが多く使用
されている。2. Description of the Related Art Conventionally, as a pressure-sensitive sensor, a sensor in which a pressure-sensitive rubber is arranged on a contact portion of a substrate on which a contact circuit having electrodes provided in a comb-like or parallel manner is formed has been widely used. .
【０００３】[0003]
【発明が解決しようとする課題】従来の感圧センサは、
感圧センサに加えられる荷重が、電極間の感圧ゴムのア
ナログ的な抵抗値の変化に変換されて現れるため、感圧
センサに加される荷重をパーソナルコンピュータまたは
制御用ＣＰＵで処理する場合には、ＡＤ変換をおこなう
必要があるため回路が複雑になる。The conventional pressure sensor is
Since the load applied to the pressure-sensitive sensor is converted into an analog change in the resistance value of the pressure-sensitive rubber between the electrodes and appears, when the load applied to the pressure-sensitive sensor is processed by a personal computer or a control CPU. However, the circuit becomes complicated because it is necessary to perform AD conversion.
【０００４】[0004]
【課題を解決するための手段】本発明は上記の問題点を
解決するために、接点に接触する弾性体の底面の形状を
傾斜面、曲面あるいは段差面とし、圧力が加えられた時
に、その底面の形状にしたがって、順次複数の接点回路
が導通していくようにすることにより、圧力の変化をデ
ィジタルで出力できるようにした。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has a configuration in which the shape of the bottom surface of an elastic body that contacts a contact point is an inclined surface, a curved surface, or a stepped surface. A plurality of contact circuits are sequentially turned on according to the shape of the bottom surface, so that a change in pressure can be output digitally.
【０００５】そのため本発明は、底面の少なくとも１部
の形状が、傾斜面、曲面あるいは段差を有する形状など
の平坦でない形状である円柱または多角柱の弾性体と、
この弾性体の底面と向き合うように配置された２点以上
の接点回路を有する基板とからなる感圧センサとした。[0005] Therefore, the present invention provides a cylindrical or polygonal elastic body in which at least a part of the bottom surface has an uneven shape such as an inclined surface, a curved surface, or a shape having a step.
A pressure-sensitive sensor comprising a substrate having two or more contact circuits disposed so as to face the bottom surface of the elastic body.
【０００６】本発明の円柱または多角柱は、円錐を含む
円柱形状または、多面体，多角錘を含む多角柱形状また
は、円筒形を含む筒状形状または、これらの形状の一部
が欠けている等の形状のものが挙げられる。The cylindrical or polygonal column of the present invention has a cylindrical shape including a cone, a polygonal column including a polyhedron or a polygonal cone, a cylindrical shape including a cylindrical shape, or a part of these shapes is missing. Shape.
【０００７】本発明の弾性体は、高分子弾性部とバネ部
を併用して使用することもできる。本発明の弾性体は、
導電性を有するもの、もしくは底面の接点との接触面の
みを導電性とすることもできる。本発明の弾性体の底面
に導電層を設けることもできる。本発明は、基板の接点
部分に皿バネまたはポリドームあるいはメンブレンの導
電部が整合するように配置することもできる。The elastic body of the present invention can be used in combination with a polymer elastic part and a spring part. The elastic body of the present invention,
It is also possible to make only those having conductivity or only the contact surface with the contact on the bottom face conductive. A conductive layer may be provided on the bottom surface of the elastic body of the present invention. The present invention can also be arranged such that the conductive portion of the disc spring or the polydome or the membrane is aligned with the contact portion of the substrate.
【０００８】[0008]
【発明の実施の形態】本発明の代表的な形態は、図１に
示すように底面Ａを傾斜面を有する形状とした弾性体１
からなり、この図１の弾性体は円柱または多角柱となっ
ている。この弾性体の底面Ａと向き合うように２点以上
の接点回路２を有する基板３を配置してある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment of the present invention is an elastic body 1 having a bottom surface A having an inclined surface as shown in FIG.
The elastic body in FIG. 1 is a column or a polygonal column. A substrate 3 having two or more contact circuits 2 is disposed so as to face the bottom surface A of the elastic body.
【０００９】円柱または多角柱からなる弾性体１または
基板３のどちらか一方に圧力が加えられると、図２のよ
うに弾性体１がたわみ、順次接点回路２が導通すること
により、圧力の変化をディジタルで出力する。When pressure is applied to either the elastic body 1 made of a cylinder or a polygonal pillar or the substrate 3, the elastic body 1 bends as shown in FIG. Is output digitally.
【００１０】本発明の弾性体は、高弾性を有する物質な
らどれでもよいが、合成ゴム，天然ゴム，熱可塑性エラ
ストマー，合成樹脂，気体や液体を利用したバネ等が用
いられる。The elastic body of the present invention may be any substance having high elasticity, and synthetic rubber, natural rubber, thermoplastic elastomer, synthetic resin, spring using gas or liquid, or the like is used.
【００１１】また、基板３としては櫛目状，平行，２重
の渦巻き状，点状，線状等にパターンが形成された接点
回路２を表面に有していればよく、紙基材フェノール樹
脂積層基板，紙基材エポキシ樹脂積層基板，ガラス布基
材エポキシ樹脂積層基板または、ＦＰＣまたは、金，
銀，銅，ニッケル，パラジウム等の金属や金属酸化物，
カーボンブラック等の導電性物質を配合した導電性イン
クでフィルム等に回路を印刷した物等が用いられる。The substrate 3 only needs to have a contact circuit 2 on the surface of which a pattern is formed in a comb-like, parallel, double spiral, dot-like, line-like or the like. Laminated substrate, paper-based epoxy resin laminated substrate, glass cloth-based epoxy resin laminated substrate or FPC or gold,
Metals and metal oxides such as silver, copper, nickel and palladium,
A printed circuit on a film or the like with a conductive ink containing a conductive substance such as carbon black is used.
【００１２】図３に、弾性体として、バネ部５と、合成
ゴム，天然ゴム，合成樹脂等の高分子弾性部４を併用し
た複合構造の感圧センサを示す。図３ではバネ部を円筒
形状の高分子弾性部の内側に配置しているが、外側に配
置してもよい。また、バネ部は、金属，セラミック，樹
脂等を材料とする、コイルバネ，板バネ，皿バネ等が用
いられる。FIG. 3 shows a pressure sensor having a composite structure in which a spring portion 5 and a polymer elastic portion 4 made of synthetic rubber, natural rubber, synthetic resin or the like are used together as an elastic body. In FIG. 3, the spring portion is arranged inside the cylindrical polymer elastic portion, but may be arranged outside. As the spring portion, a coil spring, a plate spring, a disc spring, or the like made of metal, ceramic, resin, or the like is used.
【００１３】本発明は、接点回路を導通させるために、
導電性を有する弾性体を用いることができるが、導電性
を有する弾性体としては、導電性高分子または、絶縁性
ゴムマトリックスに導電性物質を分散させた導電性ゴム
等が用いられる。なお、この導電性は底面の接点との接
触面のみに与えるようにしても良い。According to the present invention, in order to make a contact circuit conductive,
An elastic body having conductivity can be used. As the elastic body having conductivity, a conductive polymer, a conductive rubber in which a conductive substance is dispersed in an insulating rubber matrix, or the like is used. The conductivity may be given only to the contact surface of the bottom surface with the contact.
【００１４】また、接点回路を導通させるために、弾性
体の底面Ａの接点との接触面に導電層を設けても良い。
この導電層を設ける方法としては、導電性インクを接触
面に印刷または塗布する方法、または、導電性物質を高
濃度に高分子材料中に分散させフィルム状に成形したも
のを底面に固定する方法、または、電気絶縁性フィルム
に導電性物質を塗布または印刷，蒸着，スパッター等で
薄層に付着させた導電性フィルムを底面に固定する方法
等が挙げられる。Further, in order to make the contact circuit conductive, a conductive layer may be provided on the contact surface of the bottom surface A of the elastic body with the contact.
As a method of providing this conductive layer, a method of printing or applying a conductive ink on a contact surface, or a method of dispersing a conductive substance in a high-concentration polymer material at a high concentration and forming a film-like material on the bottom surface is fixed. Or a method in which a conductive material is applied to a thin layer by coating or printing, vapor deposition, sputtering, or the like on an electrically insulating film, and the conductive film is fixed to the bottom surface.
【００１５】さらに本発明は、弾性体側に導通部を構成
せずに、接点回路側に導通構造を構成した。図４に、基
板３の接点回路２の部分に金属製の皿バネ６を配置した
ものを示す。図５に、フィルムをドーム状に成形し、そ
の内側に導電性インクで導電部８を印刷または塗布した
ポリドーム９を配置したものを示す。皿バネ６，ポリド
ーム７を用いた場合、少なくとも弾性体または基板３の
どちらか一方に圧力が加わることにより弾性体がたわ
み、皿バネ６またはポリドーム７を押すことにより、皿
バネ６またはポリドーム７が坐屈する。そして、皿バネ
６の金属面またはポリドーム７の導電部８が基板３の接
点回路２に接触し、接点回路２が導通する。Further, in the present invention, a conductive structure is formed on the contact circuit side without forming a conductive portion on the elastic body side. FIG. 4 shows an arrangement in which a metal disc spring 6 is arranged on the portion of the contact circuit 2 of the substrate 3. FIG. 5 shows a film formed into a dome shape, and a polydome 9 on which a conductive portion 8 is printed or applied with conductive ink disposed inside. When the disc spring 6 and the polydome 7 are used, the elastic body bends by applying pressure to at least one of the elastic body and the substrate 3, and the disc spring 6 or the polydome 7 is pressed by pressing the disc spring 6 or the polydome 7. Buckle. Then, the metal surface of the disc spring 6 or the conductive portion 8 of the polydome 7 comes into contact with the contact circuit 2 of the substrate 3, and the contact circuit 2 conducts.
【００１６】図６に、基板３の接点回路２の部分にメン
ブレン１１の導電部８が整合するように配置したものを
示す。弾性体または基板３のどちらか一方に圧力が加わ
ることにより弾性体がたわみ、メンブレン１１のフィル
ム９を押し、メンブレン１１のスペーサー１０により隔
てられていた導電部８が降下して基板３の接点回路２と
接触し、接点回路２が導通する。図６のように、メンブ
レン１１の導電部８は基板３の接点回路２に整合する部
分のみに形成されているのではなく、フィルム９全面に
形成されていてもよい。FIG. 6 shows an arrangement in which the conductive portion 8 of the membrane 11 is aligned with the contact circuit 2 of the substrate 3. When pressure is applied to either the elastic body or the substrate 3, the elastic body bends and pushes the film 9 of the membrane 11, and the conductive portion 8 separated by the spacer 10 of the membrane 11 descends to contact the circuit of the substrate 3. 2 and the contact circuit 2 conducts. As shown in FIG. 6, the conductive portion 8 of the membrane 11 is not formed only on a portion of the substrate 3 that matches the contact circuit 2, but may be formed on the entire surface of the film 9.
【００１７】[0017]
【実施例１】図７、図８に、高分子弾性部とバネ部の複
合構造弾性体を示す。円筒形状の高分子弾性部４の内側
にバネ部５を内臓させた。円筒状の高分子弾性部４の底
面の一部には、図８（１）の側面図に示されるように、
傾斜面を設けてある。そして、この傾斜を持つ面に導電
インクを塗布した導電部８を形成する。図８（２）は上
面図を示している。そして、基板３の接点回路２が高分
子弾性部４の導電部８と同じ面を向くように配置してあ
る。Embodiment 1 FIGS. 7 and 8 show a composite structural elastic body of a polymer elastic part and a spring part. The spring portion 5 was incorporated inside the cylindrical polymer elastic portion 4. As shown in the side view of FIG. 8A, a part of the bottom surface of the cylindrical polymer elastic portion 4
An inclined surface is provided. Then, a conductive portion 8 coated with conductive ink is formed on the surface having the inclination. FIG. 8B shows a top view. The contact circuit 2 of the substrate 3 is disposed so as to face the same surface as the conductive portion 8 of the polymer elastic portion 4.
【００１８】図９に使用した基板３の接点回路２を示
す。接点回路２は点状の接点部１３（“Com”,“１”,
“２”,“３”）とそれを外部に接続するための回路パ
ターン１４とから構成されている。接点“Com”は高分
子弾性部４の導電部８が基板３に対し、水平になってい
る部分ａに整合するように配置されているため、常時高
分子弾性部４の導電部８と“Com”接点部１３は接触し
ている。また、接点“１”，“２”,“３”は等間隔に
導電部８と整合される位置に配置されている。FIG. 9 shows the contact circuit 2 of the substrate 3 used. The contact circuit 2 has a point-like contact portion 13 (“Com”, “1”,
"2", "3") and a circuit pattern 14 for connecting them to the outside. Since the contact “Com” is arranged such that the conductive portion 8 of the polymer elastic portion 4 is aligned with the horizontal portion a with respect to the substrate 3, the contact “Com” is always in contact with the conductive portion 8 of the polymer elastic portion 4. Com "contact 13 is in contact. The contacts “1”, “2”, and “3” are arranged at equal intervals in a position matched with the conductive portion 8.
【００１９】また、回路パターン１４は高分子弾性部４
の導電部８と接触しないようにレジストインクを印刷し
たり、接点部１３に整合する部分だけ穴を開けた絶縁フ
ィルムを貼り付ける等により絶縁されている。さらに高
分子弾性部４の中にバネ部５を配置し、感圧センサが高
い荷重を受けられるように、上下を板金１２で挟み込ん
でいる。The circuit pattern 14 is formed of the polymer elastic portion 4.
It is insulated by printing a resist ink so as not to contact with the conductive portion 8 or by attaching an insulating film having a hole only at a portion matching the contact portion 13. Further, a spring portion 5 is disposed in the polymer elastic portion 4, and the upper and lower portions are sandwiched between sheet metals 12 so that the pressure-sensitive sensor can receive a high load.
【００２０】実施例１では高分子弾性部４に硬度２０度
（JIS-A）の軟らかいシリコーンゴムを用いており、ま
たバネ部５に金属製のコイルバネを用いている。そのた
め感圧センサに受ける荷重の殆どをバネ部５で受けてい
る。以上のように構成された感圧センサに圧力が加えら
れると、高分子弾性部がたわみ順次接点部と高分子弾性
部の導電部とが接触していく。In the first embodiment, the polymer elastic part 4 is made of soft silicone rubber having a hardness of 20 degrees (JIS-A), and the spring part 5 is made of a metal coil spring. Therefore, most of the load received by the pressure-sensitive sensor is received by the spring portion 5. When pressure is applied to the pressure-sensitive sensor configured as described above, the polymer elastic portion bends and the contact portion sequentially contacts the conductive portion of the polymer elastic portion.
【００２１】実施例１では、常時高分子弾性部の導電部
ａと“Com”接点部は接触しており、感圧センサに圧力
が加えられることにより接点“Com”と接点“１”、そ
して接点“Com”と接点“１”と“２”、最後に接点“C
om”と“接点１”と“２”と“３”が同時に高分子弾性
部の導電部と接触する。これにより、接点“１”，
“２”，“３”は接点“Com”と導通することになる。In the first embodiment, the conductive portion a of the polymer elastic portion is always in contact with the “Com” contact portion, and when pressure is applied to the pressure-sensitive sensor, the contact “Com” and the contact “1”, and Contact "Com" and contacts "1" and "2", and finally contact "C"
om "," contact 1 "," 2 ", and" 3 "are simultaneously in contact with the conductive portion of the polymer elastic portion.
"2" and "3" are electrically connected to the contact "Com".
【００２２】実施例１の感圧センサの荷重と接点部が導
通する関係を図１０に示す。感圧センサに受ける荷重の
殆どをバネ部５で受けているため、感圧センサの受ける
荷重とたわみ量の関係は、バネ部５の弾性限界内に限っ
てはほぼ比例する。実施例１では接点部を等間隔に基板
に配置しているため、図１０のように感圧センサに加え
る荷重と各導電部が導通する関係において、非常に優れ
たリニアリティーを得られた。FIG. 10 shows the relationship between the load of the pressure-sensitive sensor of the first embodiment and the continuity of the contacts. Since most of the load received by the pressure-sensitive sensor is received by the spring portion 5, the relationship between the load received by the pressure-sensitive sensor and the amount of deflection is almost proportional only within the elastic limit of the spring portion 5. In the first embodiment, since the contact portions are arranged on the substrate at regular intervals, as shown in FIG. 10, a very excellent linearity was obtained in relation to the load applied to the pressure-sensitive sensor and the conduction between the conductive portions.
【００２３】また、高分子弾性体の底面に形成される傾
斜面の角度及び、基板に設けられる接点部の間隔を調整
することにより任意の荷重で接点部が導通する荷重セン
サを容易に製作することができる。実施例１では、高分
子弾性部４としてシリコーンゴムを用いているが、合成
ゴム，天然ゴム，合成樹脂等の高弾性を示す物なら何で
もよい。実施例１では、バネ部５として金属製のコイル
バネを用いているが、高強度高弾性を示す物なら何でも
よく、板バネや皿バネ等でもよい。実施例１では、高分
子弾性部４に導電インクを塗布し導電層８を形成した
が、導電性フィルムを貼り付けて導電層８としてもよ
い。実施例１の接点部１３の形状は図９のように点では
なく、線状や円状等の形状をしていてもよい。Also, by adjusting the angle of the inclined surface formed on the bottom surface of the polymer elastic body and the interval between the contact portions provided on the substrate, a load sensor in which the contact portions are conducted with an arbitrary load can be easily manufactured. be able to. In the first embodiment, silicone rubber is used as the polymer elastic portion 4, but any material having high elasticity such as synthetic rubber, natural rubber, and synthetic resin may be used. In the first embodiment, a metal coil spring is used as the spring portion 5, but any material having high strength and high elasticity may be used, such as a plate spring or a disc spring. In the first embodiment, the conductive ink is applied to the polymer elastic portion 4 to form the conductive layer 8. However, the conductive layer 8 may be formed by attaching a conductive film. The shape of the contact portion 13 in the first embodiment is not a dot as shown in FIG. 9 but may be a linear shape or a circular shape.
【００２４】実施例１では、基板の電極部は図９のよう
に片側に配置されているだけだが、図１１のように接点
部を両側に配置することにより、接点部の数を多く取る
ことができるため、感圧センサの分解能を向上できる。
実施例１では、感圧センサの上下を板金１２で挟み込ん
でいるが、感圧センサに加える荷重及び取り付け方法に
よっては、上下を挟み込んでいる板金１２は無くてもよ
い。In the first embodiment, the electrode portions of the substrate are arranged only on one side as shown in FIG. 9, but by arranging the contact portions on both sides as shown in FIG. 11, the number of contact portions can be increased. Therefore, the resolution of the pressure-sensitive sensor can be improved.
In the first embodiment, the upper and lower sides of the pressure-sensitive sensor are sandwiched by the sheet metal 12, but the sheet metal 12 sandwiching the upper and lower sides may be omitted depending on the load applied to the pressure-sensitive sensor and the mounting method.
【００２５】図１２に、実施例１の感圧センサを用い、
感圧センサの出力を制御用ＣＰＵ１５で読みとるための
一回路例を示す。感圧センサ１６の“Com”以外の端子
部と制御用ＣＰＵ１５の入力ポートを接続する。また、
感圧センサ１６と制御用ＣＰＵ１５の入力ポートに接続
されている部分にプルアップ抵抗１７を設ける。そし
て、感圧センサ１６の“Com”端子部の出力部は“Ｇｎ
ｄ”に接続される。FIG. 12 shows the pressure-sensitive sensor of the first embodiment,
3 shows an example of a circuit for reading the output of a pressure-sensitive sensor by a control CPU 15. A terminal part other than “Com” of the pressure-sensitive sensor 16 is connected to an input port of the control CPU 15. Also,
A pull-up resistor 17 is provided at a portion connected to the pressure-sensitive sensor 16 and the input port of the control CPU 15. The output of the “Com” terminal of the pressure-sensitive sensor 16 is “Gn”.
d ".
【００２６】実施例１では“Com”端子部と高分子弾性
部の導電部は常時接触しているため、高分子弾性部の導
電部もＧｎｄレベルとなる。そして、感圧センサ１６に
圧力が加えられると、“Com”端子部と、他の端子部は
順次導通していく。プルアップ抵抗の抵抗値を“Com”
端子部と他の端子部との導通抵抗より十分大きな値にす
ることにより、“Com”端子部と導通していない端子部
の出力は電源電圧と同じ電圧となり、“Com”端子部と
導通した端子部の出力は、ほぼＧｎｄ電圧まで下がる。
これにより、制御用ＣＰＵ１５では“Com”端子部と導
通していない端子部は“１”と認識され、“Com”端子
部と導通している端子部は“０”と、ディジタルな値で
認識することができる。In the first embodiment, since the "Com" terminal portion and the conductive portion of the polymer elastic portion are always in contact with each other, the conductive portion of the polymer elastic portion is also at the Gnd level. When the pressure is applied to the pressure-sensitive sensor 16, the "Com" terminal and the other terminals sequentially conduct. Set the resistance value of the pull-up resistor to “Com”
By making the resistance sufficiently higher than the conduction resistance between the terminal and other terminals, the output of the terminal that is not conductive with the “Com” terminal has the same voltage as the power supply voltage, and the output has become conductive with the “Com” terminal. The output of the terminal section falls to approximately the Gnd voltage.
As a result, the control CPU 15 recognizes a terminal portion not conducting to the “Com” terminal portion as “1” and a terminal portion conducting to the “Com” terminal portion as “0” by a digital value. can do.
【００２７】[0027]
【実施例２】図１３に実施例２として、底面の少なくと
も１面に段差を有する形状である導電性ゴム状の弾性体
１を用いた感圧センサの例を示す。実施例１では底面に
形成された傾斜面の角度を調整することにより、基板に
形成される接点部が導通する荷重を変化させることがで
きるが、実施例２の場合には、段の高さを調整すること
により接点部が導通する荷重を変化させることができ
る。Embodiment 2 FIG. 13 shows an embodiment 2 of a pressure-sensitive sensor using a conductive rubber-like elastic body 1 having a shape having a step on at least one bottom surface. In the first embodiment, by adjusting the angle of the inclined surface formed on the bottom surface, the load at which the contact portion formed on the substrate is conducted can be changed. However, in the second embodiment, the height of the step is changed. By adjusting the load, the load at which the contact portion conducts can be changed.
【００２８】[0028]
【実施例３】実施例３として、基板の接点回路２とメン
ブレン１１の導電部８を整合させ貼り合わせた感圧セン
サを図１４に示す。基板とメンブレンは接着されている
ため、メンブレン１１の導電部８と基板３の接点回路２
の間に異物が入らない。このため、埃が多い環境におい
ても、導電部８と接点回路２の間に埃が入らないため、
接点不良が起きない。Third Embodiment As a third embodiment, a pressure-sensitive sensor in which the contact circuit 2 of the substrate and the conductive portion 8 of the membrane 11 are aligned and bonded is shown in FIG. Since the substrate and the membrane are bonded, the conductive portion 8 of the membrane 11 and the contact circuit 2 of the substrate 3
No foreign objects enter between. For this reason, dust does not enter between the conductive part 8 and the contact circuit 2 even in an environment where there is a lot of dust.
Contact failure does not occur.
【００２９】実施例３で使用する基板は、櫛目状，平
行，２重の渦巻き状，点状，線状等にパターンが形成さ
れた接点回路２を有していればよく、紙基材フェノール
樹脂積層基板，紙基材エポキシ樹脂積層基板，ガラス布
基材エポキシ樹脂積層基板または、ＦＰＣまたは、金，
銀，銅，ニッケル，パラジウム等の金属や金属酸化物，
カーボンブラック等の導電性物質を配合した導電性イン
クでフィルム等に回路を印刷したもの等が用いられる。The substrate used in the third embodiment only needs to have the contact circuit 2 in which a pattern is formed in a comb shape, a parallel shape, a double spiral shape, a dot shape, a linear shape, or the like. Resin laminated board, paper base epoxy resin laminated board, glass cloth based epoxy resin laminated board or FPC or gold,
Metals and metal oxides such as silver, copper, nickel and palladium,
A circuit printed on a film or the like with a conductive ink containing a conductive substance such as carbon black is used.
【発明の効果】以上の説明のように、本発明のセンサ
は、圧力をディジタル信号としてパーソナルコンピュー
タまたは制御用ＣＰＵは認識することができるため、制
御回路は非常に簡単になる。また、弾性体の導電部に設
けられる傾斜の角度、または球面の曲率、または段差形
状の段の高さ、そして基板に形成される接点部の間隔を
調整することにより、接点部がＯＮする荷重を任意に設
定できる。さらに、弾性体としてバネと高分子弾性部を
併用することで高い荷重を受けることができ、さらに、
基板の接点部を等間隔に配置することにより、非常に優
れたリニアリティーを持つ出力を得ることができる。As described above, since the sensor of the present invention can recognize the pressure as a digital signal by the personal computer or the control CPU, the control circuit becomes very simple. Also, by adjusting the angle of inclination provided on the conductive portion of the elastic body, the curvature of the spherical surface, or the height of the step in the step shape, and the distance between the contact portions formed on the substrate, the load at which the contact portion is turned on is adjusted. Can be set arbitrarily. Furthermore, a high load can be received by using a spring and a polymer elastic part together as an elastic body.
By arranging the contact portions of the substrate at equal intervals, an output having very excellent linearity can be obtained.
【図１】本発明の構造例FIG. 1 is a structural example of the present invention.
【図２】本発明の感圧センサに圧力を加えた場合FIG. 2 shows a case where pressure is applied to the pressure-sensitive sensor of the present invention.
【図３】弾性体として高分子弾性部とバネ部を用いた感
圧センサ（断面図）FIG. 3 is a pressure-sensitive sensor using a polymer elastic part and a spring part as elastic bodies (cross-sectional view).
【図４】皿バネを使用した導電部FIG. 4 is a conductive section using a disc spring.
【図５】ポリドームを使用した導電部FIG. 5 is a conductive section using a polydome.
【図６】メンブレンを使用した導電部FIG. 6 is a conductive section using a membrane.
【図７】実施例１の構造（断面図）FIG. 7 shows a structure (cross-sectional view) of the first embodiment.
【図８】実施例１の高分子弾性部４の構造FIG. 8 shows the structure of the polymer elastic part 4 according to the first embodiment.
【図９】実施例１の基板３の接点回路２FIG. 9 illustrates a contact circuit 2 of the substrate 3 according to the first embodiment.
【図１０】実施例１の荷重特性FIG. 10 shows load characteristics of Example 1.
【図１１】接点部１３の配置例FIG. 11 shows an example of an arrangement of a contact portion 13;
【図１２】制御回路例FIG. 12 shows a control circuit example
【図１３】実施例２FIG. 13 is a second embodiment.
【図１４】実施例３FIG. 14 is a third embodiment.
１ 弾性体 ２ 接点回路 ３ 基板 ４ 高分子弾性部 ５ バネ部 ６ 皿バネ ７ ポリドーム ８ 導電部 ９ フィルム １０ スペーサー １１ メンブレン １２ 板金 １３ 接点部 １４ 回路パターン １５ 制御用ＣＰＵ １６ 感圧センサ １７ プルアップ抵抗 DESCRIPTION OF SYMBOLS 1 Elastic body 2 Contact circuit 3 Substrate 4 Polymer elastic part 5 Spring part 6 Disc spring 7 Polydome 8 Conductive part 9 Film 10 Spacer 11 Membrane 12 Sheet metal 13 Contact part 14 Circuit pattern 15 Control CPU 16 Pressure-sensitive sensor 17 Pull-up resistance
Claims (6)
の底面と向き合うように配置された２点以上の接点回路
を有する基板とからなる感圧センサ。1. A pressure-sensitive sensor comprising an elastic body having a non-planar bottom surface and a substrate having two or more contact circuits disposed so as to face the bottom surface.
面，曲面あるいは段差を有する形状であることを特徴と
する請求項１に記載の感圧センサ。2. The pressure-sensitive sensor according to claim 1, wherein the bottom surface of the elastic body has a shape having at least a part of an inclined surface, a curved surface, or a step.
構造体である請求項１あるいは２に記載の感圧センサ。3. The pressure-sensitive sensor according to claim 1, wherein the elastic body is a composite structure of a polymer elastic part and a spring part.
性である請求項１、２あるいは３に記載の感圧センサ。4. The pressure-sensitive sensor according to claim 1, wherein at least a bottom contact portion of the elastic body is conductive.
層が設けられている請求項１、２あるいは３に記載の感
圧センサ。5. The pressure-sensitive sensor according to claim 1, wherein a conductive layer is provided on at least a bottom surface contact portion of the elastic body.
あるいはメンブレンの導電部が整合するように配置され
た請求項１、２あるいは３に記載の感圧センサ。6. The pressure-sensitive sensor according to claim 1, wherein a conductive portion of a disc spring, a polydome, or a membrane is arranged so as to be aligned with a contact portion of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11013065A JP2000214007A (en) | 1999-01-21 | 1999-01-21 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11013065A JP2000214007A (en) | 1999-01-21 | 1999-01-21 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000214007A true JP2000214007A (en) | 2000-08-04 |
Family
ID=11822751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11013065A Pending JP2000214007A (en) | 1999-01-21 | 1999-01-21 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000214007A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009122031A (en) * | 2007-11-16 | 2009-06-04 | Seiko Epson Corp | Minute electromechanical device, semiconductor device, manufacturing method of minute electromechanical device, and manufacturing method of semiconductor device |
| JP2011064688A (en) * | 2010-10-18 | 2011-03-31 | Seiko Epson Corp | Microelectric mechanical device, semiconductor device, manufacturing method of microelectric mechanical device, and manufacturing method of semiconductor device |
| JP5217163B2 (en) * | 2004-05-12 | 2013-06-19 | セイコーエプソン株式会社 | Pressure sensor |
| KR101820225B1 (en) | 2016-02-05 | 2018-01-19 | 한양대학교 산학협력단 | Tactile Sensor and Method of operating the same |
| CN111141426A (en) * | 2019-08-10 | 2020-05-12 | 东北师范大学 | Method for preparing full-paper-based full-organic foldable polypyrrole pressure sensor |
-
1999
- 1999-01-21 JP JP11013065A patent/JP2000214007A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5217163B2 (en) * | 2004-05-12 | 2013-06-19 | セイコーエプソン株式会社 | Pressure sensor |
| JP2009122031A (en) * | 2007-11-16 | 2009-06-04 | Seiko Epson Corp | Minute electromechanical device, semiconductor device, manufacturing method of minute electromechanical device, and manufacturing method of semiconductor device |
| JP4655083B2 (en) * | 2007-11-16 | 2011-03-23 | セイコーエプソン株式会社 | Micro electromechanical device |
| US9359189B2 (en) | 2007-11-16 | 2016-06-07 | Seiko Epson Corporation | Micro electro mechanical device, method for manufacturing the same, semiconductor device, and method for manufacturing the same |
| JP2011064688A (en) * | 2010-10-18 | 2011-03-31 | Seiko Epson Corp | Microelectric mechanical device, semiconductor device, manufacturing method of microelectric mechanical device, and manufacturing method of semiconductor device |
| KR101820225B1 (en) | 2016-02-05 | 2018-01-19 | 한양대학교 산학협력단 | Tactile Sensor and Method of operating the same |
| CN111141426A (en) * | 2019-08-10 | 2020-05-12 | 东北师范大学 | Method for preparing full-paper-based full-organic foldable polypyrrole pressure sensor |
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