JP2000206809A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000206809A5 JP2000206809A5 JP1999006223A JP622399A JP2000206809A5 JP 2000206809 A5 JP2000206809 A5 JP 2000206809A5 JP 1999006223 A JP1999006223 A JP 1999006223A JP 622399 A JP622399 A JP 622399A JP 2000206809 A5 JP2000206809 A5 JP 2000206809A5
- Authority
- JP
- Japan
- Prior art keywords
- glass
- coating layer
- substrate
- glass coating
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
Description
特に、Ａ１Ｎ基板がガラスコート層よりも約２桁高い熱伝導性を有することで、基板厚みはガラスコート層に対して１０倍以上厚い（基板厚みが０．５から０．８ｍｍ程度、この実施の形態２では０．６５ｍｍとした、一方、ガラス厚みは３０から６０μｍ程度である）にも関わらず、この実施の形態２のように基板の上面に発熱体１２ａ及びガラスコート層１２ｃと温度検知素子１４を配置し、基板裏面が定着ニップ面に当接する裏面加熱型Ａ１Ｎヒータ１２を用いることが可能となり、アルミナ基板のヒータより素早く立ち上るうえ、熱伝導性が高いために、基板全体で均一に幅広く加熱することが可能となり、高速化しても高い定着性を維持できるようになる。 In particular, since the A1N substrate has about two orders of magnitude higher thermal conductivity than the glass coating layer, the substrate thickness is thicker 10-fold or more relative to the glass coating layer (substrate thickness 0 .8Mm order of 0.5, the present was 0.65mm in the second, on the other hand, despite the glass thickness is 60μm order of 30), the heating element 12a and the glass coating layer 12c and the temperature on the upper surface of the base plate as in the second embodiment It is possible to use a back surface heating type A1N heater 12 in which the detection element 14 is arranged and the back surface of the substrate abuts on the fixing nip surface. It is possible to heat a wide range of glass, and it is possible to maintain high fixability even at high speeds.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11006223A JP2000206809A (en) | 1999-01-13 | 1999-01-13 | Heat fixing device and image forming device |
| US09/379,355 US6423941B1 (en) | 1998-08-31 | 1999-08-23 | Image heating apparatus and heater |
| KR1019990036197A KR100311702B1 (en) | 1998-08-31 | 1999-08-30 | Image heating apparatus and heater |
| DE69936618T DE69936618T2 (en) | 1998-08-31 | 1999-08-30 | Image warmer and heating element |
| EP99117023A EP0984339B1 (en) | 1998-08-31 | 1999-08-30 | Image heating apparatus and heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11006223A JP2000206809A (en) | 1999-01-13 | 1999-01-13 | Heat fixing device and image forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000206809A JP2000206809A (en) | 2000-07-28 |
| JP2000206809A5 true JP2000206809A5 (en) | 2006-02-16 |
Family
ID=11632530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11006223A Pending JP2000206809A (en) | 1998-08-31 | 1999-01-13 | Heat fixing device and image forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000206809A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6351367B2 (en) | 2014-05-16 | 2018-07-04 | キヤノン株式会社 | HEATER CONTROL DEVICE, IMAGE HEATING DEVICE, AND IMAGE FORMING DEVICE |
| JP6604731B2 (en) | 2014-05-20 | 2019-11-13 | キヤノン株式会社 | Image heating device |
| JP6253508B2 (en) | 2014-05-21 | 2017-12-27 | キヤノン株式会社 | Image heating apparatus and image forming apparatus equipped with the image heating apparatus |
| JP6321507B2 (en) | 2014-09-24 | 2018-05-09 | 東芝テック株式会社 | Fixing apparatus and image forming apparatus |
| JP2016138969A (en) * | 2015-01-27 | 2016-08-04 | 株式会社リコー | Fixing device and image forming apparatus |
| JP6657900B2 (en) * | 2015-01-30 | 2020-03-04 | 株式会社リコー | Fixing device and image forming device |
| JP2016200665A (en) * | 2015-04-08 | 2016-12-01 | 株式会社リコー | Fixing device and image forming apparatus |
| JP6753274B2 (en) * | 2015-12-25 | 2020-09-09 | 株式会社リコー | Fixing device and image forming device |
| JP6753275B2 (en) * | 2015-12-25 | 2020-09-09 | 株式会社リコー | Fixing device and image forming device |
| JP7038787B2 (en) * | 2020-12-09 | 2022-03-18 | 株式会社東芝 | Fixing device and fixing temperature control program for fixing device |
| JP2021056529A (en) * | 2020-12-23 | 2021-04-08 | 東芝テック株式会社 | Fixing device and image forming apparatus |
| JP7312303B2 (en) * | 2020-12-23 | 2023-07-20 | 東芝テック株式会社 | Fixing device and image forming device |
-
1999
- 1999-01-13 JP JP11006223A patent/JP2000206809A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000206809A5 (en) | ||
| ATE300098T1 (en) | HOT PLATE | |
| TW255986B (en) | ||
| DE69815142D1 (en) | QUARTZ SUBSTRATE HEATING ELEMENT | |
| WO2008039611A3 (en) | Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system | |
| JP2003275653A5 (en) | ||
| ES2163263T3 (en) | SUSCEPTOR DESIGNS FOR SLIM SILICON CARBIDE FILMS. | |
| WO2007040908A3 (en) | Film formation apparatus and methods including temperature and emissivity/pattern compensation | |
| CA2189934A1 (en) | Heater and heating/fixing unit comprising the same | |
| DE60006291D1 (en) | THERMAL MASS TRANSFER ELEMENT WITH LIGHT-HEAT CONVERSION LAYER | |
| DE69825360D1 (en) | Surface coated substrate with low heat transfer | |
| DE60125484D1 (en) | RETRORE-LOOKING FILM WITH PRINTED LAYER | |
| ATE366038T1 (en) | ELECTRICAL HEATING ARRANGEMENT | |
| DE60024082D1 (en) | HEAT RADIATION REFLECTIVE LAYER POROUS METAL OXIDE FILM COMPOSITE INSULATION | |
| FR2808162B1 (en) | HEATING ELEMENT ON ALUMINUM SUBSTRATE FOR HOUSEHOLD APPLIANCES | |
| JP2003017228A (en) | Heater, its manufacturing method and fixing equipment equipped with the same | |
| JPH0654298B2 (en) | Humidity sensor | |
| JPH0750679Y2 (en) | Thermopile type infrared sensor | |
| JP3633894B2 (en) | Lid heater structure in electric rice cooker | |
| JPH03124849U (en) | ||
| JP2002110321A5 (en) | ||
| JP2517199Y2 (en) | Thermopile | |
| JP2000241641A (en) | Optical device | |
| JP2005159212A5 (en) | ||
| JPH0539891Y2 (en) |