JP2000195747A - Manufacture of plastic film capacitor - Google Patents
Manufacture of plastic film capacitorInfo
- Publication number
- JP2000195747A JP2000195747A JP36917098A JP36917098A JP2000195747A JP 2000195747 A JP2000195747 A JP 2000195747A JP 36917098 A JP36917098 A JP 36917098A JP 36917098 A JP36917098 A JP 36917098A JP 2000195747 A JP2000195747 A JP 2000195747A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- molding
- pressure
- plastic film
- ultrasonic vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器等に用い
られるプラスチックフィルムコンデンサの製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plastic film capacitor used for electronic equipment and the like.
【０００２】[0002]
【従来の技術】従来のプラスチックフィルムコンデンサ
の製造方法について説明する。その一般的なコンデンサ
の製造方法は、図１に示すように、プラスチックフィル
ムと、蒸着金属電極を設けた金属化プラスチックフィル
ム１、２、または金属箔を交互に重ね合わせ、所定の静
電容量を得るように、必要数円筒状に巻きまたは必要数
積層したものに、補強層３を設けたコンデンサ４を、加
熱と加圧により、偏平状態に成型を行い、単位コンデン
サ５を得る。2. Description of the Related Art A conventional method for manufacturing a plastic film capacitor will be described. As shown in FIG. 1, a general method of manufacturing a capacitor is to alternately superimpose a plastic film and metallized plastic films 1, 2 or metal foils provided with vapor-deposited metal electrodes to obtain a predetermined capacitance. In order to obtain the required number of capacitors, a capacitor 4 provided with a reinforcing layer 3 on a required number of cylindrically wound or laminated layers is molded into a flat state by heating and pressing to obtain a unit capacitor 5.
【０００３】[0003]
【発明が解決しようとする課題】この従来のプラスチッ
クフィルムコンデンサの製造方法においては、コンデン
サを８０〜１５０℃の加熱と、５〜５０ｋｇ／ｃｍ2の
加圧にて、５〜６０分間要して成型していた為、成型に
要する時間が長いなどの問題があった。In the conventional method for manufacturing a plastic film capacitor, the capacitor requires heating at 80 to 150 ° C. and pressurizing at 5 to 50 kg / cm 2 for 5 to 60 minutes. Since molding was performed, there was a problem that the time required for molding was long.
【０００４】本発明はこのような課題を解決するもので
あり、コンデンサの成型に、最初に超音波振動と加圧に
よる成型を行う事で、次に行う加熱と加圧による成型の
時間を、従来技術による成型時間に比べ、大幅に短縮さ
せる事を目的とする。[0004] The present invention is to solve such a problem, by first performing the molding by ultrasonic vibration and pressurization in the molding of the capacitor, to reduce the time of the subsequent molding by heating and pressurization. The purpose is to greatly reduce the molding time according to the prior art.
【０００５】[0005]
【課題を解決するための手段】この課題を解決するため
に、本発明の製造方法は、偏平に成型する際、最初に超
音波振動と加圧による成型を行い、次に加熱と加圧によ
る成型に分けて、成型を行う事を特徴としている。これ
によりプラスチックコンデンサは、成型する際、最初に
超音波振動と加圧による成型を１〜３０秒間行い、次に
加熱と加圧による成型を１０秒〜６０分行うことにより
所定の成型性が得られ、従来に比べ成型に要する時間を
大幅に短縮させることが出来る。Means for Solving the Problems In order to solve this problem, the manufacturing method of the present invention, when forming into a flat shape, first performs molding by ultrasonic vibration and pressurization, and then performs heating and pressurization. It is characterized by performing molding separately into molding. Thereby, when molding a plastic capacitor, first, molding by ultrasonic vibration and pressure is performed for 1 to 30 seconds, and then molding by heating and pressure is performed for 10 seconds to 60 minutes, thereby obtaining a predetermined moldability. Thus, the time required for molding can be greatly reduced as compared with the conventional case.
【０００６】[0006]
【発明の実施の形態】本発明の請求項１に記載の発明
は、プラスチックフィルムと、蒸着金属電極を設けた金
属化プラスチックフィルム、または金属箔とで構成され
るプラスチックフィルムコンデンサにおいて、前記フィ
ルムまたは金属箔を交互に重ね合わせ、円筒状に巻回ま
たは積層されたコンデンサ素子を、偏平に成型する際、
超音波振動と熱と圧力を用いた事を特徴とする、プラス
チックフィルムコンデンサの製造方法を示したものであ
り、超音波振動と加圧による成型を最初に追加する事
で、加熱と加圧による成型に要する時間を大幅に短縮し
て、所定の成型性が得られる作用を有する。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention relates to a plastic film capacitor comprising a plastic film and a metallized plastic film provided with a vapor-deposited metal electrode, or a metal foil. When laminating metal foils alternately, and forming a cylindrically wound or laminated capacitor element flat,
This is a method of manufacturing a plastic film capacitor, characterized by using ultrasonic vibration, heat, and pressure. Molding by heating and pressing is performed by first adding molding by ultrasonic vibration and pressing. Has the effect of significantly shortening the time required for the molding and obtaining predetermined moldability.
【０００７】請求項２に記載の発明は、前記単位コンデ
ンサを成型する工程において、最初に超音波振動と加圧
による成型を１秒〜３０秒行い、次に熱と圧力による成
型を１０秒〜６０分の範囲で行う事を特徴とする請求項
１記載のプラスチックフィルムコンデンサの製造方法を
示したものである。最初に超音波振動をコンデンサ上部
に与え、下部より加圧し、１秒以上超音波振動を与える
事により、外部よりの熱伝導方式に比べて、はるかに急
速にコンデンサ素子全体を発熱させ、コンデンサ内部温
度が８０〜１５０℃に上昇し、加圧とあいまって、重ね
合ったプラスチックフィルムと金属化フィルムが接着し
成型を成す。しかしながら、超音波振動による成型は、
短時間に急速に昇温させるため成型性にバラツキが発生
し易く、安定性を保つ為、次に８０〜１５０℃の加熱、
５〜５０ｋｇ／ｃｍ2の加圧で、外部よりの熱伝導によ
り、プラスチックフィルムと金属化フィルムを接着させ
て、所定の成型性が得られる作用を有する。According to a second aspect of the present invention, in the step of molding the unit capacitor, molding by ultrasonic vibration and pressure is first performed for 1 to 30 seconds, and then molding by heat and pressure is performed for 10 to 30 seconds. A method for manufacturing a plastic film capacitor according to claim 1, wherein the method is performed in a range of 60 minutes. First, ultrasonic vibration is applied to the upper part of the capacitor, pressurized from the lower part, and ultrasonic vibration is applied for 1 second or more, so that the entire capacitor element generates heat much more quickly than the external heat conduction method, and the inside of the capacitor The temperature rises to 80-150 ° C and, in combination with the pressure, the superposed plastic film and metallized film adhere and form. However, molding by ultrasonic vibration,
Since the temperature is rapidly raised in a short time, the moldability tends to vary, and in order to maintain stability, heating at 80 to 150 ° C.
With a pressure of 5 to 50 kg / cm 2 , the plastic film and the metallized film are adhered by heat conduction from the outside, and have an effect of obtaining a predetermined moldability.
【０００８】以下、本発明の実施の形態について図１を
用いて説明する。 （実施の形態）本発明の実施の形態におけるプラスチッ
クフィルムコンデンサの製造方法は、図１に示すよう
に、プラスチックフィルムと、蒸着金属電極を設けた金
属化プラスチックフィルム、または金属箔を交互に重ね
合わせ、所定の静電容量を得るように、必要数円筒状に
巻きまたは必要数積層したコンデンサ素子を、偏平に成
型する際、超音波振動と熱と圧力を用いて成型を行う。Hereinafter, an embodiment of the present invention will be described with reference to FIG. (Embodiment) As shown in FIG. 1, a method of manufacturing a plastic film capacitor according to an embodiment of the present invention is such that a plastic film and a metallized plastic film provided with vapor-deposited metal electrodes or a metal foil are alternately laminated. When the required number of cylindrically wound or laminated capacitor elements are flatly molded so as to obtain a predetermined capacitance, the molding is performed using ultrasonic vibration, heat and pressure.
【０００９】[0009]
【実施例】次に本発明の具体例を説明する。Next, specific examples of the present invention will be described.
【００１０】（実施例１）実施例１は本発明による成型
方法で、２枚の蒸着金属電極を設けた厚み５μｍの金属
化ポリプロピレンフィルムを重ね合わせ、円筒状に巻回
しコンデンサ素子を得た。最初にコンデンサ上部より、
超音波振動（振動周波数２５ｋＨｚ、先端振幅５０μ
ｍ）を与え、下部より２５ｋｇ／ｃｍ2にて加圧し、１
０秒間成型した。次にコンデンサ上下より１００℃の加
熱、下部より１５ｋｇ／ｃｍ2の加圧を与え、外部より
の熱伝導により１分間成型して、０．４７μＦの単位コ
ンデンサを得た。Example 1 In Example 1, a metallized polypropylene film having a thickness of 5 μm provided with two vapor-deposited metal electrodes was superimposed by a molding method according to the present invention, and wound into a cylindrical shape to obtain a capacitor element. First, from the top of the capacitor,
Ultrasonic vibration (vibration frequency 25kHz, tip amplitude 50μ
m) and pressurized at 25 kg / cm 2 from below to
Molded for 0 seconds. Next, heating at 100 ° C. was applied from above and below the capacitor, and 15 kg / cm 2 was applied under pressure from the lower part, and the mixture was molded for 1 minute by heat conduction from the outside to obtain a 0.47 μF unit capacitor.
【００１１】（比較例１）比較例１は超音波振動と加圧
による成型方法で、前記コンデンサ素子に、上部より超
音波振動（振動周波数２５ｋＨｚ、先端振幅５０μｍ）
を与え、下部より２５ｋｇ／ｃｍ2にて加圧し、１０秒
間成型を行い、０．４７μＦの単位コンデンサを得た。Comparative Example 1 Comparative Example 1 is a molding method using ultrasonic vibration and pressure. Ultrasonic vibration (vibration frequency 25 kHz, tip amplitude 50 μm) is applied to the capacitor element from above.
And pressurized from the bottom at 25 kg / cm 2 , and molded for 10 seconds to obtain a 0.47 μF unit capacitor.
【００１２】（比較例２）比較例２は従来の加熱と加圧
による成型方法で、前記コンデンサ素子に、上下より１
００℃の加熱、下部より１５ｋｇ／ｃｍ2の加圧を与
え、外部よりの熱伝導により５分間成型して、０．４７
μＦの単位コンデンサを得た。Comparative Example 2 Comparative Example 2 is a conventional molding method using heat and pressure.
Heating at 00 ° C., applying a pressure of 15 kg / cm 2 from below, molding for 5 minutes by heat conduction from outside,
A unit capacitor of μF was obtained.
【００１３】本実施例１と比較例１，２のコンデンサ素
子を、成型前後の静電容量変化率、直流絶縁破壊電圧試
験を実施し比較した。The capacitor elements of Example 1 and Comparative Examples 1 and 2 were compared with each other by performing a capacitance change rate before and after molding and a DC breakdown voltage test.
【００１４】図２はこのようにして出来た実施例１と比
較例１，２の成型前後の静電容量変化率の結果であり、
実施例１と比較例２のコンデンサ素子は、同等である
が、比較例１は低い。また、バラツキはいずれも同等で
ある。FIG. 2 shows the results of the capacitance change rates before and after molding of Example 1 and Comparative Examples 1 and 2 thus obtained.
The capacitor elements of Example 1 and Comparative Example 2 are equivalent, but Comparative Example 1 is low. In addition, the variations are all the same.
【００１５】図３はこのようにして出来た実施例１と比
較例１，２の直流絶縁破壊電圧試験の結果であり、実施
例１と比較例２のコンデンサ素子は、同等であるが、比
較例１は低い。また、バラツキは実施例１と比較例２
は、比較例１と比べて小さい。FIG. 3 shows the results of the DC breakdown voltage tests of Example 1 and Comparative Examples 1 and 2 made in this manner. The capacitor elements of Example 1 and Comparative Example 2 are equivalent, Example 1 is low. In addition, the variation was in Example 1 and Comparative Example 2.
Is smaller than that of Comparative Example 1.
【００１６】（実施例２）実施例２は本発明による成型
方法で、２枚の蒸着金属電極を設けた厚み１２μｍの金
属化ポリエステルフィルムを重ね合わせ、円筒状に巻回
しコンデンサ素子を得た。最初にコンデンサ上部より、
超音波振動（振動周波数２５ｋＨｚ、先端振幅５０μ
ｍ）を与え、下部より２５ｋｇ／ｃｍ2にて加圧し、１
０秒間成型した。次にコンデンサ上下より１１５℃の加
熱、下部より１５ｋｇ／ｃｍ2の加圧を与え、外部より
の熱伝導により１分間成型して、０．０１μＦの単位コ
ンデンサを得た。Example 2 In Example 2, a metallized polyester film having a thickness of 12 μm provided with two vapor-deposited metal electrodes was superimposed by a molding method according to the present invention, and wound into a cylindrical shape to obtain a capacitor element. First, from the top of the capacitor,
Ultrasonic vibration (vibration frequency 25kHz, tip amplitude 50μ
m) and pressurized at 25 kg / cm 2 from below to
Molded for 0 seconds. Next, heating at 115 ° C. was applied from above and below the capacitor, and 15 kg / cm 2 was applied from below, and molding was performed for 1 minute by heat conduction from the outside to obtain a 0.01 μF unit capacitor.
【００１７】（比較例３）比較例３は従来の成型方法
で、前記コンデンサ素子に、上下より１１５℃の加熱、
下部より１５ｋｇ／ｃｍ2の加圧を与え、外部よりの熱
伝導により５分間成型して、０．０１μＦの単位コンデ
ンサを得た。(Comparative Example 3) In Comparative Example 3, a conventional molding method was used.
A pressure of 15 kg / cm 2 was applied from the lower part, and the mixture was molded by heat conduction from the outside for 5 minutes to obtain a unit capacitor of 0.01 μF.
【００１８】本実施例２と比較例３のコンデンサ素子
を、上記と同様な成型前後の静電容量変化率、直流絶縁
破壊電圧試験を実施し比較した。結果は上記実施例１と
比較例２の関係と同様に、測定値およびバラツキとも、
実施例２と比較例３のコンデンサ素子は同等であった。The capacitor elements of Example 2 and Comparative Example 3 were subjected to the same capacitance change rate and DC insulation breakdown voltage test before and after molding as described above, and compared. The results are similar to the relationship between Example 1 and Comparative Example 2 above, with both the measured value and
The capacitor elements of Example 2 and Comparative Example 3 were equivalent.
【００１９】[0019]
【発明の効果】以上のように本発明のプラスチックフィ
ルムコンデンサは、単位コンデンサを成型する際、最初
に超音波振動と加圧による成型を１〜３０秒行い、次に
加熱と加圧による成型を１０秒〜６０分行うことにより
所定の成型性が得られる。このことにより、コンデンサ
の性能を悪化させることなく、加熱と加圧による成型に
要する時間を、従来に比べ大幅に短縮させることが出来
るものである。As described above, in the plastic film capacitor of the present invention, when molding a unit capacitor, first, molding by ultrasonic vibration and pressure is performed for 1 to 30 seconds, and then molding by heating and pressure is performed. By carrying out for 10 seconds to 60 minutes, a predetermined moldability can be obtained. As a result, the time required for molding by heating and pressurizing can be significantly reduced as compared with the related art without deteriorating the performance of the capacitor.
【図１】成型前と後のコンデンサ素子の斜視図FIG. 1 is a perspective view of a capacitor element before and after molding.
【図２】実施例及び比較例の静電容量変化率の結果を示
す図FIG. 2 is a diagram showing the results of the rate of change in capacitance in Examples and Comparative Examples.
【図３】実施例及び比較例の直流絶縁破壊試験の結果を
示す図FIG. 3 is a diagram showing the results of a DC breakdown test of an example and a comparative example.
１ 金属化プラスチックフィルム ２ 金属化プラスチックフィルム ３ 補強層 ４ 成型前コンデンサ ５ 成型後コンデンサ DESCRIPTION OF SYMBOLS 1 Metallized plastic film 2 Metallized plastic film 3 Reinforcement layer 4 Capacitor before molding 5 Capacitor after molding
───────────────────────────────────────────────────── フロントページの続き (72)発明者 建部 薫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E082 AB03 AB04 EE03 EE07 FG06 FG34 MM02 MM22 MM24 PP05 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kaoru Tatebe 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E082 AB03 AB04 EE03 EE07 FG06 FG34 MM02 MM22 MM24 PP05
Claims (2)
を設けた金属化プラスチックフィルム、または金属箔と
で構成されるプラスチックフィルムコンデンサにおい
て、前記フィルムまたは金属箔を交互に重ね合わせたコ
ンデンサ素子を、偏平に成型する際、超音波振動と熱と
圧力を用いる事を特徴とする、プラスチックフィルムコ
ンデンサの製造方法。1. A plastic film capacitor comprising a plastic film and a metallized plastic film provided with a vapor-deposited metal electrode or a metal foil, wherein a capacitor element obtained by alternately stacking the films or the metal foils is flattened. A method for producing a plastic film capacitor, characterized by using ultrasonic vibration, heat and pressure when molding.
いて、最初に超音波振動と加圧による成型を１秒〜３０
秒行い、次に熱と圧力による成型を１０秒〜６０分の範
囲で行う事を特徴とする請求項１記載のプラスチックフ
ィルムコンデンサの製造方法。2. In the step of molding the unit capacitor, first, molding by ultrasonic vibration and pressure is performed for 1 second to 30 seconds.
2. The method for manufacturing a plastic film capacitor according to claim 1, wherein molding by heat and pressure is performed for 10 seconds to 60 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36917098A JP2000195747A (en) | 1998-12-25 | 1998-12-25 | Manufacture of plastic film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36917098A JP2000195747A (en) | 1998-12-25 | 1998-12-25 | Manufacture of plastic film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000195747A true JP2000195747A (en) | 2000-07-14 |
Family
ID=18493747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36917098A Pending JP2000195747A (en) | 1998-12-25 | 1998-12-25 | Manufacture of plastic film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000195747A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022216509A3 (en) * | 2021-04-07 | 2022-11-17 | Kemet Electronics Corporation | Overmolded film capacitor |
-
1998
- 1998-12-25 JP JP36917098A patent/JP2000195747A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022216509A3 (en) * | 2021-04-07 | 2022-11-17 | Kemet Electronics Corporation | Overmolded film capacitor |
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