JP2000195659A - Organic el element and its manufacture - Google Patents
Organic el element and its manufactureInfo
- Publication number
- JP2000195659A JP2000195659A JP10370157A JP37015798A JP2000195659A JP 2000195659 A JP2000195659 A JP 2000195659A JP 10370157 A JP10370157 A JP 10370157A JP 37015798 A JP37015798 A JP 37015798A JP 2000195659 A JP2000195659 A JP 2000195659A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- film
- substrate
- sealing member
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910001868 water Inorganic materials 0.000 claims abstract description 65
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 62
- 239000010410 layer Substances 0.000 claims abstract description 55
- 239000004840 adhesive resin Substances 0.000 claims abstract description 28
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 28
- 239000012044 organic layer Substances 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 19
- 239000012298 atmosphere Substances 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 89
- 239000000758 substrate Substances 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 43
- 239000010409 thin film Substances 0.000 claims description 18
- 239000006096 absorbing agent Substances 0.000 claims description 16
- 238000011049 filling Methods 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000005240 physical vapour deposition Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 7
- 239000000292 calcium oxide Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- -1 or the like Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 101150000971 SUS3 gene Proteins 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical class [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子と正孔の注入
・再結合により発光する有機化合物材料のエレクトロル
ミネッセンス（以下ＥＬという）を利用して、前記有機
ＥＬ化合物の薄膜から構成された有機ＥＬ素子とその製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic EL device composed of a thin film of the organic EL compound utilizing electroluminescence (hereinafter referred to as EL) of an organic compound material which emits light by injection and recombination of electrons and holes. The present invention relates to an EL device and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】有機ＥＬ素子は、蛍光性有機化合物を含
む薄膜を陰極と陽極との間に挟んだ積層構造を有し、前
記薄膜に正孔および電子を注入して再結合させることに
より励起子（エキシトン）を生成させ、この励起子が失
活する際の光の放出（蛍光・燐光）を利用して表示を行
う表示素子である。2. Description of the Related Art An organic EL device has a laminated structure in which a thin film containing a fluorescent organic compound is sandwiched between a cathode and an anode, and is excited by injecting holes and electrons into the thin film and recombining them. This is a display element that generates a photon (exciton) and performs display using light emission (fluorescence / phosphorescence) when the exciton is deactivated.
【０００３】ところで、上記有機ＥＬ素子を表示素子と
して利用する場合、最大の課題は耐久性の改善であり、
その中でもダークスポットと呼ばれる非発光部の生成と
成長が最も大きな問題となっている。ダークスポットが
生成される原因としては、水分および酸素の影響が最も
大きいとされ、特に水分は極めて微量でも大きな影響を
及ぼすものとされている。When the above-mentioned organic EL device is used as a display device, the biggest problem is to improve durability.
Among them, generation and growth of a non-light emitting portion called a dark spot is the most important problem. The cause of the formation of dark spots is considered to be the greatest effect of moisture and oxygen. Particularly, even a very small amount of moisture is considered to have a great effect.
【０００４】そこで、使用する有機材料の精製、成膜時
の真空の質、素子の封止など、水分を極力取り除くよう
に工夫し、ドライプロセスで有機ＥＬ素子の製造が行わ
れる。しかしながら、それでも十分な特性が得られてい
ないのが現状である。Therefore, the organic EL device is manufactured by a dry process by devising as much as possible water, such as purification of an organic material to be used, quality of a vacuum at the time of film formation, sealing of the device, and the like. However, at present, sufficient characteristics have not yet been obtained.
【０００５】このように、有機ＥＬ素子の最大の課題は
ダークスポットを根絶して長寿命化を図ることが最大の
課題であり、素子を封止することで大幅に改善できる。
加えて、別途捕水剤を使用することでより改善が進んで
いる。[0005] As described above, the biggest problem of the organic EL device is to eradicate dark spots and extend the life thereof, and it can be greatly improved by sealing the device.
In addition, the use of a water catching agent has further improved.
【０００６】図７は捕水剤を使用した従来の有機ＥＬ素
子の構成を示す側断面図である。図７に示す有機ＥＬ素
子２１は、絶縁性および透光性を有するガラス基板２２
を基部としている。ガラス基板２２の上には、ＩＴＯ
（Indium Tin Oxide）からなる透明導電膜が所定パター
ン形状に成膜されて陽極２３が形成されている。FIG. 7 is a side sectional view showing the structure of a conventional organic EL device using a water catching agent. The organic EL element 21 shown in FIG. 7 is a glass substrate 22 having an insulating property and a light transmitting property.
Is based. On the glass substrate 22, ITO
A transparent conductive film made of (Indium Tin Oxide) is formed into a predetermined pattern to form the anode 23.
【０００７】陽極２３の上には有機化合物材料の薄膜に
よる有機層２４が積層されている。有機層２４の上に
は、例えばＡｌ−Ｌｉ等の金属薄膜からなる陰極２５が
所定パターン形状に形成されている。そして、上記陽極
２３、有機層２４および陰極２５により所定パターン形
状の発光部を形成している。On the anode 23, an organic layer 24 of a thin film of an organic compound material is laminated. On the organic layer 24, a cathode 25 made of a metal thin film such as Al-Li is formed in a predetermined pattern shape. A light emitting portion having a predetermined pattern shape is formed by the anode 23, the organic layer 24, and the cathode 25.
【０００８】ガラス基板２２の外周部分には、水分を極
力取り除いた不活性ガス（例えばドライ窒素）やドライ
エアによるドライ雰囲気において、金属キャップや樹脂
キャップ等からなる封止部材２６が有機接着剤によるシ
ール膜２７で固着されている。この有機接着剤によるシ
ール膜２７は、その膜厚が接着強度に影響を与えない範
囲で薄く形成され、四方のシール幅がマージンの許す範
囲内で大きく取られている。これにより、素子を構成す
るガラス基板２２上の陽極２３、有機層２４および陰極
２５が保護される。A sealing member 26 made of a metal cap, a resin cap, or the like is sealed on the outer peripheral portion of the glass substrate 22 with an organic adhesive in a dry atmosphere using an inert gas (eg, dry nitrogen) or dry air from which water is removed as much as possible. It is fixed by the film 27. The seal film 27 made of the organic adhesive is formed to be thin as long as the film thickness does not affect the adhesive strength, and the seal width in four directions is set to be large within the range allowed by the margin. Thereby, the anode 23, the organic layer 24, and the cathode 25 on the glass substrate 22 constituting the element are protected.
【０００９】封止部材２６に形成された凹部２６ａに
は、粉末状の酸化バリウムや酸化カルシウム等からなる
捕水剤２８が収容されている。粉末状の捕水剤２８を収
容した凹部２６ａは、水分を通すシート状の蓋部材２９
によって覆われている。凹部２６ａ内の捕水剤２８は、
水と化学反応して水酸化物を生成し、この生成された水
酸化物を保持することにより、内部の残留水分や外部か
らの水分を吸着している。A recess 26a formed in the sealing member 26 accommodates a water trapping agent 28 made of powdered barium oxide, calcium oxide, or the like. The concave portion 26a containing the powdery water trapping agent 28 is provided with a sheet-like lid member 29 through which moisture passes.
Covered by The water catching agent 28 in the concave portion 26a is
By chemically reacting with water to generate a hydroxide, and by retaining the generated hydroxide, residual moisture inside and moisture from the outside are adsorbed.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、上述し
た従来の有機ＥＬ素子２１では、有機接着剤によるシー
ル膜２７を形成して素子を封止しているので、金属・セ
ラミックス等の接着剤と比較すると、その原子（分子）
間距離が大きな構造となっている。However, in the conventional organic EL element 21 described above, since the element is sealed by forming the seal film 27 using an organic adhesive, it is compared with an adhesive such as metal and ceramics. Then, the atom (molecule)
The structure has a large distance.
【００１１】このため、特に高温・多湿の環境において
は、有機接着剤によるシール膜２７自体が膨潤し、空気
中の水分、酸素等のガスを簡単に透過させてしまう。For this reason, especially in a high-temperature and high-humidity environment, the seal film 27 itself made of the organic adhesive swells, and gas such as moisture and oxygen in the air easily permeates.
【００１２】したがって、通常はシール膜２７と空気中
のガス分子の接触面積をできるだけ小さくするため、シ
ール膜２７の膜厚を薄くするのが好ましい。Therefore, in order to minimize the contact area between the seal film 27 and gas molecules in the air, it is preferable to reduce the thickness of the seal film 27.
【００１３】また、ガス分子がシール膜２７に接触して
シール膜２７中に進入したときに、その拡散時間をかせ
ぐため、シール膜２７の幅を広くしてパターン形成する
ことが好ましい。Further, when gas molecules come into contact with the seal film 27 and enter the seal film 27, it is preferable to pattern the seal film 27 with a wide width in order to save diffusion time.
【００１４】しかしながら、シール膜２７の幅を広くす
るということは、素子の表示面積に対するマージン面積
が大きくなるため、シール膜２７の幅を広くするにも限
界がある。However, increasing the width of the seal film 27 increases the margin area with respect to the display area of the device, and therefore, there is a limit in increasing the width of the seal film 27.
【００１５】また、シール膜２７の幅を薄くする場合に
おいても、その封止処理の安定性・繰り返しの再現性等
を維持することはかなり難しく、また工程変動時のシー
ル膜２７の膜厚のばらつきにより特性が大きく変動する
といった問題を招く。Further, even when the width of the sealing film 27 is reduced, it is quite difficult to maintain the stability of the sealing process and the reproducibility of repetition. This causes a problem that the characteristics fluctuate greatly due to the variation.
【００１６】そこで、図７に示す従来の有機ＥＬ素子２
１では、封止部材２６の凹部２６ａに収容された捕水剤
２８により内部の残留水分や外部からの水分を捕らえる
構成を採用している。Therefore, the conventional organic EL device 2 shown in FIG.
1, a configuration is employed in which the water trapping agent 28 contained in the concave portion 26a of the sealing member 26 captures residual moisture inside and moisture from outside.
【００１７】ところが、上記従来の有機ＥＬ素子２１で
は、捕水剤２８として粉体のものを使用しているため、
封止部材２６の凹部２６ａに捕水剤２８を充填した後、
凹部２６ａをシート状の蓋部材２９で覆っている。具体
的には、図７に示すように、封止部材２６に内側凹部２
６ａａと外側凹部２６ａｂからなる段付きの凹部２６ａ
を形成し、内側凹部２６ａａに捕水剤２８を収容し、外
側凹部２６ａｂの平坦面に蓋部材の外周部分を接着剤を
介して固着している。However, in the above-mentioned conventional organic EL element 21, since a powdery material is used as the water trapping agent 28,
After filling the concave portion 26a of the sealing member 26 with the water catching agent 28,
The concave portion 26a is covered with a sheet-like lid member 29. Specifically, as shown in FIG.
Stepped recess 26a composed of 6aa and outer recess 26ab
Are formed, the water catching agent 28 is accommodated in the inner concave portion 26aa, and the outer peripheral portion of the lid member is fixed to the flat surface of the outer concave portion 26ab via an adhesive.
【００１８】したがって、上記従来の有機ＥＬ素子２１
では、蓋部材２９を封止部材２６に接着のためのスペー
スが必要不可欠であった。しかも、有機ＥＬ素子として
の薄型化の利点を活かすには、封止部材２６の凹部２６
ａの容積が必要以上に大きくならないことが望まれる。
その結果、凹部２６ａの容積が小さくなり、凹部２６ａ
に対して十分な捕水剤２８を充填することができなかっ
た。Therefore, the conventional organic EL device 21
In this case, a space for bonding the lid member 29 to the sealing member 26 was indispensable. Moreover, in order to take advantage of the thinness of the organic EL element, the concave portion 26 of the sealing member 26 is required.
It is desired that the volume of a does not become unnecessarily large.
As a result, the volume of the concave portion 26a decreases, and the concave portion 26a
Could not be filled with sufficient water-absorbing agent 28.
【００１９】また、上記従来の有機ＥＬ素子２１は、素
子と捕水剤２８との間に蓋部材２９が介在しており、凹
部２６ａ内の捕水剤２８が素子に対して直接露出した構
成となっていない。しかも、封止部材２６の凹部２６ａ
内に収容された捕水剤２８は、蓋部材２９を通過して捕
水剤２８まで到達した水分のみを化学的に吸着する。こ
のため、蓋部材２９で反射する水分やガス等を吸着する
ことができず、蓋部材２９自身が水分やガス等を吸着す
る際の妨げとなり、捕水効果を低下させるという問題が
あった。The conventional organic EL element 21 has a structure in which a lid member 29 is interposed between the element and the water trapping agent 28, and the water trapping agent 28 in the concave portion 26a is directly exposed to the element. Not. Moreover, the recess 26a of the sealing member 26
The water trapping agent 28 accommodated therein chemically adsorbs only the water that has reached the water trapping agent 28 through the lid member 29. For this reason, it is not possible to adsorb moisture, gas, and the like reflected by the lid member 29, which hinders the lid member 29 itself from adsorbing moisture, gas, and the like, and thus has a problem in that the water capturing effect is reduced.
【００２０】その結果、ダークスポットの生成および成
長を促進させ、素子劣化の原因にもなっていた。しか
も、上記従来の有機ＥＬ素子２１では、捕水剤２８を収
容するための構成および形成方法が煩雑であり、手間が
かかるという問題があった。As a result, the generation and growth of dark spots were promoted, which was a cause of device deterioration. In addition, the conventional organic EL element 21 has a problem that the configuration and the forming method for accommodating the water catching agent 28 are complicated and time-consuming.
【００２１】そこで、本発明は、上記問題点に鑑みてな
されたものであり、捕水剤による捕水効果を向上させて
ダークスポットの生成および成長を抑制することがで
き、素子の保存安定性を向上させて点灯寿命の改善が図
れ、更には封止プロセス中に工程変動に対してもロバス
トネスを上げ、安定して再現性のある素子を製造するこ
とができる有機ＥＬ素子とその製造方法を提供すること
を目的としている。In view of the above, the present invention has been made in view of the above-mentioned problems, and it is possible to suppress the generation and growth of dark spots by improving the water capturing effect of a water capturing agent, and to improve the storage stability of the device. And an organic EL device capable of producing a device with stable and reproducible by improving the lighting life and improving the robustness against the process variation during the sealing process. It is intended to provide.
【００２２】[0022]
【課題を解決するための手段】上記目的を達成するた
め、請求項１の発明は、一対の電極間に発光層を含む有
機層が挟まれた素子が絶縁性を有する基板の上に形成さ
れ、前記素子と所定間隔をおいて前記基板に対向して配
置された封止部材と前記基板との外周部分がドライ雰囲
気中で接着剤からなるシール膜により固着されて封止さ
れた有機ＥＬ素子において、前記封止部材内の前記素子
と対面する位置に有機膜からなる粘着性樹脂膜が形成さ
れており、該粘着性樹脂膜には所定量の捕水剤が固着さ
れていることを特徴とする。In order to achieve the above object, according to the first aspect of the present invention, an element in which an organic layer including a light emitting layer is sandwiched between a pair of electrodes is formed on an insulating substrate. An organic EL element in which a sealing member arranged opposite to the substrate at a predetermined distance from the element and an outer peripheral portion of the substrate are fixed and sealed by a sealing film made of an adhesive in a dry atmosphere; , An adhesive resin film made of an organic film is formed at a position facing the element in the sealing member, and a predetermined amount of a water catching agent is fixed to the adhesive resin film. And
【００２３】請求項２の発明は、一対の電極間に発光層
を含む有機層が挟まれた素子が絶縁性を有する基板の上
に形成され、前記素子と所定間隔をおいて前記基板に対
向して配置された封止部材と前記基板との外周部分がド
ライ雰囲気中で接着剤からなるシール膜により固着され
て封止された有機ＥＬ素子において、前記封止部材内の
前記素子と対面する位置に所定量の捕水剤が充填されて
おり、有機膜からなるオーバーコート層が前記捕水剤の
上から薄膜形成されていることを特徴とする。According to a second aspect of the present invention, an element in which an organic layer including a light emitting layer is sandwiched between a pair of electrodes is formed on an insulating substrate, and is opposed to the substrate at a predetermined distance from the element. In the organic EL element in which the outer peripheral portion of the sealing member and the substrate arranged and fixed by a seal film made of an adhesive in a dry atmosphere and sealed, the organic EL element faces the element in the sealing member. A position is filled with a predetermined amount of a water catching agent, and an overcoat layer made of an organic film is formed as a thin film on the water catching agent.
【００２４】請求項３の発明は、請求項２の有機ＥＬ素
子において、前記オーバーコート層は、０．１〜数百μ
ｍの膜厚からなることを特徴とする。According to a third aspect of the present invention, in the organic EL device of the second aspect, the overcoat layer has a thickness of 0.1 to several hundred μm.
m.
【００２５】請求項４の発明は、一対の電極間に発光層
を含む有機層が挟まれた素子が絶縁性を有する基板の上
に形成され、前記素子と所定間隔をおいて前記基板に対
向して配置された封止部材と前記基板との外周部分がド
ライ雰囲気中で接着剤からなるシール膜により固着され
て封止された有機ＥＬ素子の製造方法において、前記封
止部材の前記素子と対面する位置に有機膜からなる粘着
性樹脂膜を形成する工程と、前記粘着性樹脂膜上に捕水
剤を充填する工程と、前記充填された前記捕水剤のう
ち、前記粘着性樹脂膜に対する未固着の捕水剤を除去す
る工程とを含むことを特徴とする。According to a fourth aspect of the present invention, an element in which an organic layer including a light emitting layer is sandwiched between a pair of electrodes is formed on an insulating substrate, and is opposed to the substrate at a predetermined distance from the element. In a method for manufacturing an organic EL element in which an outer peripheral portion of the sealing member and the substrate arranged and fixed by a sealing film made of an adhesive in a dry atmosphere and sealed, A step of forming an adhesive resin film made of an organic film at a position facing each other, a step of filling a water catching agent on the adhesive resin film, and, among the filled water catching agents, the adhesive resin film And removing a water trapping agent that has not adhered to the water.
【００２６】請求項５の発明は、一対の電極間に発光層
を含む有機層が挟まれた素子が絶縁性を有する基板の上
に形成され、前記素子と所定間隔をおいて前記基板に対
向して配置された封止部材と前記基板との外周部分がド
ライ雰囲気中で接着剤からなるシール膜により固着され
て封止された有機ＥＬ素子の製造方法において、前記封
止部材の前記素子と対面する位置に捕水剤を所定量充填
する工程と、前記充填された前記捕水剤の上から有機膜
からなるオーバーコート層を薄膜形成する工程とを含む
ことを特徴とする。According to a fifth aspect of the present invention, an element in which an organic layer including a light emitting layer is sandwiched between a pair of electrodes is formed on an insulating substrate, and is opposed to the substrate at a predetermined distance from the element. In a method for manufacturing an organic EL element in which an outer peripheral portion of the sealing member and the substrate arranged and fixed by a sealing film made of an adhesive in a dry atmosphere and sealed, The method includes a step of filling a predetermined amount of a water catching agent at a position facing the same, and a step of forming a thin film of an overcoat layer made of an organic film on the filled water catching agent.
【００２７】[0027]
【発明の実施の形態】図１は本発明による有機ＥＬ素子
の第１実施の形態を示す側断面図である。FIG. 1 is a side sectional view showing a first embodiment of an organic EL device according to the present invention.
【００２８】図１に示すように、第１実施の形態の有機
ＥＬ素子１Ａは、絶縁性および透光性を有するガラス等
の基板２を基部としている。基板２の上には第一電極と
しての陽極３が形成されている。陽極３は、例えばＩＴ
Ｏ（Indium Tin Oxide）等の透明導電膜が真空蒸着法、
スパッタ法等のＰＶＤ（Physical Vapor Deposition）
法により１００ｎｍ前後（例えば１５０ｎｍ）の膜厚で
成膜され、更にフォトレジストパターンによるエッチン
グで所定パターン形状（例えばストライプ状）にパター
ンニングされた透明電極である。陽極３の一部は、基板
２の端部に引き出されて不図示の駆動回路に接続され
る。As shown in FIG. 1, the organic EL device 1A of the first embodiment is based on a substrate 2 made of glass or the like having an insulating property and a light transmitting property. On the substrate 2, an anode 3 as a first electrode is formed. The anode 3 is made of, for example, IT
A transparent conductive film such as O (Indium Tin Oxide) is formed by vacuum evaporation,
PVD (Physical Vapor Deposition) such as sputtering
The transparent electrode is formed to a thickness of about 100 nm (for example, 150 nm) by a method, and is patterned into a predetermined pattern shape (for example, a stripe shape) by etching with a photoresist pattern. A part of the anode 3 is drawn out to the end of the substrate 2 and connected to a drive circuit (not shown).
【００２９】陽極３の上には、例えば分子線蒸着法、抵
抗加熱法等のＰＶＤ法により、有機化合物材料の薄膜か
らなる発光層を含む有機層４が積層形成されている。有
機層４は、例えば陽極３の上に成膜される正孔注入層と
しての銅フタロシアニン（ＣｕＰｃ）有機膜と、ＣｕＰ
ｃ有機膜の上に成膜される正孔輸送層としてのα−ＮＰ
Ｄ（Ｂｉｓ（Ｎ−（１−naphtyl −Ｎ−phneyl）benzid
ine ）有機膜と、α−ＮＰＤ有機膜の上に成膜される発
光層兼電子輸送層としてのトリス（８−キノリノラト）
アルミニウム（Ａｌｑ3 ）有機膜の３層構造からなる。On the anode 3, an organic layer 4 including a light emitting layer composed of a thin film of an organic compound material is formed by lamination by a PVD method such as a molecular beam evaporation method or a resistance heating method. The organic layer 4 includes, for example, a copper phthalocyanine (CuPc) organic film as a hole injection layer formed on the anode 3, and a CuP
α-NP as hole transport layer formed on organic film c
D (Bis (N- (1-naphtyl-N-phneyl) benzid
ine) Tris (8-quinolinolato) as an emission layer and an electron transport layer formed on an organic film and an α-NPD organic film
It has a three-layer structure of an aluminum (Alq 3 ) organic film.
【００３０】なお、有機層４は、上記の他、発光層と電
荷輸送層（正孔輸送層、正孔注入・輸送層、電子注入
層、電子注入・輸送層等）との組合せで構成することが
できる。具体的には、発光層１層のみの構造、発光層と
正孔輸送層の２層構造、発光層と電子注入層の２層構
造、正孔輸送層と発光層と電子注入層の３層構造等が考
えられる。The organic layer 4 is composed of a combination of a light emitting layer and a charge transport layer (a hole transport layer, a hole injection / transport layer, an electron injection layer, an electron injection / transport layer, etc.) in addition to the above. be able to. Specifically, the structure includes only one light-emitting layer, a two-layer structure including a light-emitting layer and a hole transport layer, a two-layer structure including a light-emitting layer and an electron injection layer, and a three-layer structure including a hole transport layer, a light-emitting layer, and an electron injection layer. Structure and the like are conceivable.
【００３１】上記発光層の発光材料としては、発光層そ
のものを発光させる場合には、例えばＡｌｑ3 やジスチ
ルアリーレン系化合物等が使用される。また、発光層に
別の発光材料（ドーパント）を微量ドーピングして発光
させる場合には、ドーパントとしてキナクリドン（Ｑ
ｄ）やレーザ用の色素等が使用される。As the light emitting material of the light emitting layer, when the light emitting layer itself emits light, for example, Alq 3 or a distyrylene-based compound is used. When light is emitted by doping the light emitting layer with a small amount of another light emitting material (dopant), quinacridone (Q
d) and dyes for laser and the like are used.
【００３２】また、上記電子注入層としては、電子の注
入をし易くするため、例えばＬｉ、Ｎａ、Ｍｇ、Ｃａ等
の仕事関数の小さい金属材料単体、Ａｌ：Ｌｉ、Ｍｇ：
Ｉｎ、Ｍｇ：Ａｇ、ＬｉＦ等の仕事関数の小さい合金が
使用される。The electron injecting layer is preferably made of a metal material having a small work function, such as Li, Na, Mg, Ca, etc., Al: Li, Mg:
An alloy having a small work function such as In, Mg: Ag, and LiF is used.
【００３３】有機層４の上には、金属薄膜からなる第二
電極としての陰極５が形成されている。陰極５は、例え
ばＡｌ、Ｌｉ、Ｍｇ、Ａｇ、Ｉｎ等の仕事関数の小さい
金属材料単体やＡｌ−Ｌｉ、Ｍｇ−Ａｇ等の仕事関数の
小さい合金からなる。陰極５は、例えば分子線蒸着法、
抵抗加熱法等のＰＶＤ法により例えば数１０ｎｍ〜数１
００ｎｍ（例えば１００ｎｍ）の膜厚で所定パターン形
状（例えば陽極３と直交するストライプ状）に形成され
る。陰極５の一部は、基板２の端部に引き出されて不図
示の駆動回路に接続される。そして、上記陽極、有機層
および陰極により所定パターン形状（例えばドット状）
の発光部を有する素子６が形成される。On the organic layer 4, a cathode 5 as a second electrode made of a metal thin film is formed. The cathode 5 is made of a metal material having a small work function, such as Al, Li, Mg, Ag, In, or the like, or an alloy having a small work function, such as Al-Li or Mg-Ag. The cathode 5 is, for example, a molecular beam evaporation method,
For example, several tens nm to several tens by a PVD method such as a resistance heating method.
It is formed in a predetermined pattern shape (for example, a stripe shape orthogonal to the anode 3) with a thickness of 00 nm (for example, 100 nm). Part of the cathode 5 is drawn out to the end of the substrate 2 and connected to a drive circuit (not shown). Then, a predetermined pattern shape (for example, dot shape) is formed by the anode, the organic layer, and the cathode.
The element 6 having the light-emitting portion is formed.
【００３４】基板２の外周部分には、水分を極力除去し
た不活性ガス（例えばドライ窒素）やドライエア等のド
ライ雰囲気において蓋状の封止部材７が有機接着剤から
なるシール膜８によって固着されている。これにより、
内部が気密保持された外囲器９が構成され、基板２の内
面に積層形成された素子６が保護される。A lid-shaped sealing member 7 is fixed to the outer peripheral portion of the substrate 2 by a sealing film 8 made of an organic adhesive in a dry atmosphere such as an inert gas (eg, dry nitrogen) or dry air from which water is removed as much as possible. ing. This allows
An envelope 9 whose inside is kept airtight is formed, and the element 6 laminated on the inner surface of the substrate 2 is protected.
【００３５】封止部材７は、例えば金属、ガラス、セラ
ミックス、樹脂、ほうろう等で構成される。具体的に
は、厚さ０．３ｍｍのステンレス基板（ＳＵＳ３０４）
を封止部材７として用いることができる。The sealing member 7 is made of, for example, metal, glass, ceramics, resin, enamel and the like. Specifically, a 0.3 mm thick stainless steel substrate (SUS304)
Can be used as the sealing member 7.
【００３６】封止部材７は、基板２の外周部分と固着さ
れる外周部分が垂直に折曲されており、この外周部分の
内側には基板２の上の素子６の表示面積と対面して捕水
剤収容部７ａが一体形成されている。捕水剤収容部７ａ
の底面には有機膜からなる粘着性樹脂膜１０が成膜され
ている。粘着性樹脂膜１０は、０．１〜数百μｍ（好ま
しくは０．１〜１０μｍ）の硬化膜厚で形成される。The sealing member 7 has an outer peripheral portion fixed to the outer peripheral portion of the substrate 2 bent vertically. Inside the outer peripheral portion, the sealing member 7 faces the display area of the element 6 on the substrate 2. The water-trapping agent accommodating portion 7a is integrally formed. Water trapping agent container 7a
An adhesive resin film 10 made of an organic film is formed on the bottom surface of the substrate. The adhesive resin film 10 is formed with a cured film thickness of 0.1 to several hundreds μm (preferably 0.1 to 10 μm).
【００３７】粘着性樹脂膜１０の成膜には、例えばディ
スペンス法、刷毛塗り法、スクリーン印刷法、転写法、
スピンコート法等の方法が採用される。粘着性樹脂膜１
０は、熱可塑性あるいは熱硬化性樹脂を溶剤（例えばト
ルエン、石油系溶剤等の非水系溶剤）に溶解したもの、
無溶剤タイプの紫外線硬化性接着剤等からなる。For forming the adhesive resin film 10, for example, a dispensing method, a brush coating method, a screen printing method, a transfer method,
A method such as a spin coating method is employed. Adhesive resin film 1
0 is a solution obtained by dissolving a thermoplastic or thermosetting resin in a solvent (for example, a non-aqueous solvent such as toluene or a petroleum-based solvent);
It is made of a solventless type ultraviolet curable adhesive or the like.
【００３８】粘着性樹脂膜１０には、素子６に対して直
接露出した状態で所定量の捕水剤１１が固着されてい
る。捕水剤１１は、水分と化学結合するものが好まし
く、例えばＣａＯ（５０Ｍｅｓｈ≒数１００μｍ）、Ｍ
ｇＯ（３００Ｍｅｓｈ≒数１０μｍ）、ＢａＯ（３００
Ｍｅｓｈ≒数１０μｍ）等がある。A predetermined amount of a water catching agent 11 is fixed to the adhesive resin film 10 in a state of being directly exposed to the element 6. The water-absorbing agent 11 is preferably one that chemically bonds to water, for example, CaO (50 Mesh ≒ several 100 μm), M
gO (300 Mesh ≒ several 10 μm), BaO (300
Mesh (several tens of μm).
【００３９】本実施の形態における捕水剤１１として
は、上記平均粒径を有するＣａＯ（５０Ｍｅｓｈ≒数１
００μｍ）、ＭｇＯ（３００Ｍｅｓｈ≒数１０μｍ）、
ＢａＯ（３００Ｍｅｓｈ≒数１０μｍ）を強制的に粉砕
処理し、その平均粒径を数μｍと小さくして使用してい
る。捕水剤１１を粉砕処理する方法としては、例えば窒
素ガス雰囲気中における乳鉢での粉砕、ホモジナイザー
による回転粉砕等がある。As the water catching agent 11 in the present embodiment, CaO (50 Mesh 粒径 number 1) having the above average particle diameter is used.
00 μm), MgO (300 Mesh ≒ several 10 μm),
BaO (300 Mesh ≒ several tens of μm) is compulsorily pulverized to reduce its average particle size to several μm. Examples of the method of pulverizing the water-absorbing agent 11 include pulverization in a mortar in a nitrogen gas atmosphere, and rotary pulverization using a homogenizer.
【００４０】捕水剤収容部７ａ内に収容されて粘着性樹
脂膜１０に固着された捕水剤１１は、外囲器９内の残留
水分や外部からの水分等を化学的に吸着して保持してい
る。The water-absorbing agent 11 accommodated in the water-absorbing agent accommodating portion 7a and fixed to the adhesive resin film 10 chemically adsorbs residual moisture in the envelope 9 and moisture from the outside. keeping.
【００４１】更に説明すると、捕水剤１１が酸化カルシ
ウムで構成される場合には、ＣａＯと水（Ｈ2 Ｏ）が化
学反応して水酸化物であるＣａ（ＯＨ）2 を生成し、こ
の生成されたＣａ（ＯＨ）2 を保持して水分を化学結合
により吸着している。More specifically, when the water-absorbing agent 11 is composed of calcium oxide, CaO and water (H 2 O) undergo a chemical reaction to produce Ca (OH) 2 , which is a hydroxide. Moisture is adsorbed by chemical bonding while holding the generated Ca (OH) 2 .
【００４２】上記のように構成される有機ＥＬ素子１Ａ
では、陽極３と陰極５との間に不図示の駆動回路から駆
動電圧を印加して定電流を流すと、有機層４に対して陽
極３から正孔が注入され、陰極５から電子が注入され
る。そして、注入された正孔と電子が有機層４で再結合
して励起子を生成し、この励起子が失活する際の光の放
出により所望の表示がなされる。その際の発光は、透明
電極である陽極３を介して基板２の外側から観察され
る。The organic EL device 1A configured as described above
Then, when a drive voltage is applied from a drive circuit (not shown) between the anode 3 and the cathode 5 to flow a constant current, holes are injected from the anode 3 into the organic layer 4 and electrons are injected from the cathode 5. Is done. Then, the injected holes and electrons are recombined in the organic layer 4 to generate excitons, and a desired display is performed by emission of light when the excitons are deactivated. Light emission at that time is observed from outside the substrate 2 via the anode 3 which is a transparent electrode.
【００４３】次に、上記構成による有機ＥＬ素子１Ａの
製造方法を図２（ａ）〜（ｅ）に基づいて説明する。Next, a method of manufacturing the organic EL device 1A having the above configuration will be described with reference to FIGS.
【００４４】まず、図２（ａ）に示すように、捕水剤１
１を収容するための捕水剤収容部７ａを有する封止部材
７を作製する。具体的には、厚さ０．３ｍｍのＳＵＳ３
０４からなるステンレス板をプレス成型して蓋形状を形
成する。次に、図２（ｂ）に示すように、封止部材７の
捕水剤収容部７ａの底面に粘着性樹脂膜１０を形成す
る。この粘着性樹脂膜１０の成膜には、ディスペンス
法、刷毛塗り法、スクリーン印刷法、転写法、スピンコ
ート法等が採用される。具体的には、無溶剤タイプのエ
ポキシ系紫外線硬化性接着剤を用い、ディスペンサー塗
布により硬化膜厚が１μｍになるように粘着性樹脂膜１
０を形成する。First, as shown in FIG.
The sealing member 7 having the water-trapping agent accommodating portion 7a for accommodating 1 is manufactured. Specifically, SUS3 with a thickness of 0.3 mm
A stainless steel plate made of 04 is press-molded to form a lid shape. Next, as shown in FIG. 2B, an adhesive resin film 10 is formed on the bottom surface of the water trapping agent accommodating portion 7a of the sealing member 7. The adhesive resin film 10 is formed by a dispense method, a brush coating method, a screen printing method, a transfer method, a spin coating method, or the like. Specifically, a non-solvent type epoxy ultraviolet curable adhesive is used, and the adhesive resin film 1 is coated with a dispenser so that the cured film thickness becomes 1 μm.
0 is formed.
【００４５】続いて、図２（ｃ）に示すように、粘着性
樹脂膜１０が形成された捕水剤収容部７ａに捕水剤１１
を一定量充填する。具体的には、ＣａＯパウダーをパー
ツフィーダーにより、一定重量を捕水剤収容部７ａに充
填する。Subsequently, as shown in FIG. 2C, the water-absorbing agent 11 is stored in the water-absorbing agent accommodating portion 7a on which the adhesive resin film 10 is formed.
Is filled in a fixed amount. Specifically, a certain weight of CaO powder is filled into the water trapping agent accommodating portion 7a by a parts feeder.
【００４６】捕水剤収容部７ａに捕水剤１１が充填され
ると、粘着性樹脂膜１０に接触・固着されない捕水剤１
１をエアーブロー等の方法により捕水剤収容部７ａ内か
ら取り除く。これにより、図２（ｄ）に示すように、捕
水剤収容部７ａ内には、粘着性樹脂膜１０に固着された
捕水剤１１のみが残る。When the water-absorbing agent 11 is filled in the water-absorbing agent accommodating portion 7a, the water-absorbing agent 1 that does not contact and adhere
1 is removed from the inside of the water trapping agent accommodating portion 7a by a method such as air blow. Thereby, as shown in FIG. 2D, only the water trapping agent 11 fixed to the adhesive resin film 10 remains in the water trapping agent accommodating portion 7a.
【００４７】そして、上記作業とは別に、不図示のチャ
ンバー内に基板２をセットし、基板２の表面に透明導電
膜を例えば１５０ｎｍの膜厚で成膜する。続いて、透明
導電膜にフォトレジストパターンによるエッチングを施
して陽極３を例えばストライプ状に形成する。Then, separately from the above operation, the substrate 2 is set in a chamber (not shown), and a transparent conductive film is formed on the surface of the substrate 2 to a thickness of, for example, 150 nm. Subsequently, the transparent conductive film is etched by a photoresist pattern to form the anode 3 in, for example, a stripe shape.
【００４８】透明導電膜による陽極３が形成された後、
分子線蒸着法や抵抗加熱法等のＰＶＤ法により有機層４
を陽極３の上に成膜する。具体的には、ＰＶＤ法により
陽極３の上に４０ｎｍの膜厚でＣｕＰｃ有機膜を成膜
し、ＣｕＰｃ有機膜の上に２０ｎｍの膜厚でα−ＮＰＤ
有機膜を成膜し、更にα−ＮＰＤ有機膜の上に５０ｎｍ
の膜厚でＡｌｑ3 有機膜を成膜する。続いて、ＰＶＤ法
によりＡｌ−Ｌｉの金属薄膜による陰極を例えば１００
ｎｍの膜厚で有機層４の上に陽極３と直交する例えばス
トライプ状に成膜する。これにより、基板２の上には、
マトリクス状の一対の電極３，５間に有機層４が挟まれ
て積層された素子６が形成される。After the anode 3 of the transparent conductive film is formed,
The organic layer 4 is formed by a PVD method such as a molecular beam evaporation method or a resistance heating method.
Is formed on the anode 3. Specifically, a CuPc organic film having a thickness of 40 nm is formed on the anode 3 by the PVD method, and α-NPD having a thickness of 20 nm is formed on the CuPc organic film.
An organic film is formed, and 50 nm is further formed on the α-NPD organic film.
An Alq 3 organic film is formed with a thickness of Subsequently, a cathode made of a metal thin film of Al-Li is
A film having a thickness of nm is formed on the organic layer 4, for example, in a stripe shape orthogonal to the anode 3. Thereby, on the substrate 2,
An element 6 is formed in which the organic layer 4 is sandwiched between a pair of electrodes 3 and 5 in a matrix.
【００４９】基板２の上に素子６が形成されると、封止
部材７の捕水剤１１が収容された側の外周部分に有機接
着剤を塗布してシール膜８を形成し、シール膜８が形成
された封止部材７の面に素子６の面を向けて基板２を封
止部材７の上に載せる。その後、予め準備したバネクリ
ップ等の荷重手段を用い、基板２と封止部材７に所定の
荷重を掛ける。この状態で、紫外線照射処理を行うと、
粘着性樹脂膜１０とともにシール膜８が硬化される。こ
れにより、捕水剤１１が粘着性樹脂１０に固着されると
ともに、基板２と封止部材７とが外周部分で固着されて
封止され、有機ＥＬ素子１Ａが完成する（図２
（ｅ））。When the element 6 is formed on the substrate 2, an organic adhesive is applied to the outer peripheral portion of the sealing member 7 on the side where the water catching agent 11 is stored to form a seal film 8. The substrate 2 is placed on the sealing member 7 with the surface of the element 6 facing the surface of the sealing member 7 on which 8 is formed. Thereafter, a predetermined load is applied to the substrate 2 and the sealing member 7 using a load means such as a spring clip prepared in advance. In this state, when UV irradiation treatment is performed,
The seal film 8 is cured together with the adhesive resin film 10. As a result, the water catching agent 11 is fixed to the adhesive resin 10, and the substrate 2 and the sealing member 7 are fixed and sealed at the outer peripheral portion, thereby completing the organic EL element 1A.
(E)).
【００５０】次に、図３は本発明による有機ＥＬ素子の
第２実施の形態を示す側断面図である。なお、第１実施
の形態と同一の構成要素には同一番号を付し、その説明
を省略する。Next, FIG. 3 is a side sectional view showing a second embodiment of the organic EL device according to the present invention. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
【００５１】第２実施の形態の有機ＥＬ素子１Ｂは、第
１実施の形態の有機ＥＬ素子１Ａと比較して、封止部材
７の捕水剤収容部７ａに捕水剤１１を固着する構成およ
び方法が異なる他は同一である。The organic EL element 1B of the second embodiment has a structure in which the water catching agent 11 is fixed to the water catching agent accommodating portion 7a of the sealing member 7 as compared with the organic EL element 1A of the first embodiment. And the method is different.
【００５２】すなわち、第２実施の形態の有機ＥＬ素子
１Ｂでは、封止部材７の捕水剤収容部７ａに所定量の捕
水剤１１が充填されており、この捕水剤１１の上から有
機膜からなる薄膜のオーバーコート層１５が形成されて
いる。オーバーコート層１５は、０．１〜数百μｍ（好
ましくは０．１〜１０μｍ）の膜厚で形成される。オー
バーコート層１５は、完全硬化させるよりも若干硬化不
足にし、水分・ガス等が容易に透過できる薄膜で形成さ
れるのが好ましい。That is, in the organic EL element 1B of the second embodiment, a predetermined amount of the water-absorbing agent 11 is filled in the water-absorbing agent accommodating portion 7a of the sealing member 7. An overcoat layer 15 of a thin film made of an organic film is formed. The overcoat layer 15 is formed with a thickness of 0.1 to several hundreds μm (preferably 0.1 to 10 μm). It is preferable that the overcoat layer 15 is formed as a thin film which is slightly hardened more than hardened completely and which can easily transmit moisture and gas.
【００５３】図４は紫外線照射光源としてメタルハライ
ドランプを使用し、エポキシ系紫外線硬化樹脂を用いて
オーバーコート層１５を膜厚０．１μｍ、１．０μｍ、
１０μｍで形成したときの紫外線照射量に対する硬化密
度の関係を示す図である。FIG. 4 shows a case where a metal halide lamp is used as an ultraviolet irradiation light source, and an overcoat layer 15 is formed to a thickness of 0.1 μm, 1.0 μm using an epoxy ultraviolet curing resin.
It is a figure which shows the relationship of the hardening density with respect to the irradiation amount of ultraviolet rays when it forms at 10 micrometers.
【００５４】本実施の形態の構成によれば、図４に示す
０．１μｍ、１．０μｍ、１０μｍのいずれの膜厚で完
全硬化させても水分・ガス等を透過させることができる
が、その紫外線照射量を低くすることによってオーバー
コート層１５の硬化密度を調整し、より水分・ガス等を
透過させ易くすることができる。According to the structure of the present embodiment, moisture and gas can be transmitted even when the film is completely cured to a thickness of 0.1 μm, 1.0 μm, or 10 μm as shown in FIG. The curing density of the overcoat layer 15 can be adjusted by lowering the irradiation amount of ultraviolet rays, so that moisture, gas, and the like can be more easily transmitted.
【００５５】上記オーバーコート層１５の形成には、例
えばディスペンス法、刷毛塗り法、スクリーン印刷法、
転写法等が採用される。また、上記樹脂溶液としては、
例えば熱可塑性あるいは熱硬化性樹脂を溶剤（例えばト
ルエン、石油系溶剤等の非水系溶剤）に溶解したもの、
無溶剤タイプの紫外線硬化性接着剤等が使用される。For forming the overcoat layer 15, for example, a dispensing method, a brush coating method, a screen printing method,
A transfer method or the like is employed. Further, as the resin solution,
For example, a thermoplastic or thermosetting resin dissolved in a solvent (eg, a non-aqueous solvent such as toluene or a petroleum solvent),
A non-solvent type ultraviolet curable adhesive or the like is used.
【００５６】次に、上記構成による有機ＥＬ素子の製造
方法を図５（ａ）〜（ｄ）に基づいて説明する。Next, a method of manufacturing the organic EL device having the above-described configuration will be described with reference to FIGS.
【００５７】まず、図５（ａ）に示すように、捕水剤１
１を収容するための捕水剤収容部７ａを有する封止部材
７を作製する。次に、図５（ｂ）に示すように、封止部
材７の捕水剤収容部７ａに捕水剤１１を一定量充填す
る。具体的には、ＣａＯパウダーをパーツフィーダーに
より、一定重量を捕水剤収容部７ａに充填する。First, as shown in FIG.
The sealing member 7 having the water-trapping agent accommodating portion 7a for accommodating 1 is manufactured. Next, as shown in FIG. 5B, a certain amount of the water catching agent 11 is filled in the water catching agent storage portion 7 a of the sealing member 7. Specifically, a certain weight of CaO powder is filled into the water trapping agent accommodating portion 7a by a parts feeder.
【００５８】続いて、図５（ｃ）に示すように、捕水剤
収容部７ａに充填された捕水剤１１の上から薄膜のオー
バーコート層１５を形成する。このオーバーコート層１
５の成膜には、ディスペンス法、刷毛塗り法、スクリー
ン印刷法、転写法、スピンコート法等が採用される。具
体的には、樹脂溶液として無溶剤タイプのエポキシ系紫
外線硬化性接着剤を用い、ディスペンサー塗布により硬
化膜厚が１μｍになるようにオーバーコート層１５を形
成する。このオーバーコート層１５を硬化させるための
紫外線照射条件としては、完全硬化させるよりも若干硬
化不足とし、水分・ガス等が容易に透過する薄膜にする
のが好ましい。Subsequently, as shown in FIG. 5C, a thin overcoat layer 15 is formed on the water-trapping agent 11 filled in the water-trapping agent accommodating portion 7a. This overcoat layer 1
The film formation of No. 5 employs a dispensing method, a brush coating method, a screen printing method, a transfer method, a spin coating method, or the like. Specifically, a non-solvent type epoxy-based ultraviolet curable adhesive is used as the resin solution, and the overcoat layer 15 is formed by dispenser application so that the cured film thickness becomes 1 μm. It is preferable that the UV irradiation conditions for curing the overcoat layer 15 be slightly thinner than the complete curing, and a thin film through which moisture, gas, and the like are easily transmitted.
【００５９】そして、上記作業とは別に、不図示のチャ
ンバー内に基板２をセットし、基板２の表面に透明導電
膜を例えば１５０ｎｍの膜厚で成膜する。続いて、透明
導電膜にフォトレジストパターンによるエッチングを施
して陽極３を例えばストライプ状に形成する。Then, separately from the above operation, the substrate 2 is set in a chamber (not shown), and a transparent conductive film is formed on the surface of the substrate 2 to a thickness of, for example, 150 nm. Subsequently, the transparent conductive film is etched by a photoresist pattern to form the anode 3 in, for example, a stripe shape.
【００６０】透明導電膜による陽極３が形成された後、
分子線蒸着法や抵抗加熱法等のＰＶＤ法により有機層４
を陽極３の上に成膜する。続いて、ＰＶＤ法によりＡｌ
−Ｌｉの金属薄膜による陰極を例えば１００ｎｍの膜厚
で有機層４の上に陽極３と直交する例えばストライプ状
に成膜する。これにより、基板２の上には、マトリクス
状の一対の電極３，５間に有機層４が挟まれて積層され
た素子６が形成される。After the anode 3 of the transparent conductive film is formed,
The organic layer 4 is formed by a PVD method such as a molecular beam evaporation method or a resistance heating method.
Is formed on the anode 3. Subsequently, Al is applied by PVD method.
A cathode made of a metal thin film of Li is formed in a thickness of, for example, 100 nm on the organic layer 4 in, for example, a stripe shape orthogonal to the anode 3. Thus, an element 6 is formed on the substrate 2 with the organic layer 4 interposed between the pair of electrodes 3 and 5 in a matrix.
【００６１】基板２の上に素子６が形成されると、封止
部材７の捕水剤１１が収容された側の外周部分に有機接
着剤を塗布してシール膜８を形成し、シール膜８が形成
された封止部材７の面に素子６の面を向けて基板２を封
止部材７の上に載せる。その後、予め準備したバネクリ
ップ等の荷重手段を用い、基板２と封止部材７に所定の
荷重を掛ける。この状態で、基板２の外側から紫外線照
射処理を行うと、シール膜８が硬化され、基板２と封止
部材７とが外周部分で固着されて封止され、有機ＥＬ素
子１Ｂが完成する（図５（ｄ））。When the element 6 is formed on the substrate 2, an organic adhesive is applied to the outer peripheral portion of the sealing member 7 on the side where the water catching agent 11 is accommodated to form a seal film 8, and the seal film 8 is formed. The substrate 2 is placed on the sealing member 7 with the surface of the element 6 facing the surface of the sealing member 7 on which 8 is formed. Thereafter, a predetermined load is applied to the substrate 2 and the sealing member 7 using a load means such as a spring clip prepared in advance. In this state, when an ultraviolet irradiation process is performed from the outside of the substrate 2, the sealing film 8 is cured, and the substrate 2 and the sealing member 7 are fixed and sealed at the outer peripheral portion, thereby completing the organic EL element 1B ( FIG. 5D).
【００６２】このように、第１実施の形態の有機ＥＬ素
子１Ａでは、捕水剤１１が素子６に対して直接露出して
封止部材７の捕水剤収容部７ａ内に粘着性樹脂膜１０を
介して固着されている。また、第２実施の形態の有機Ｅ
Ｌ素子１Ｂでは、封止部材７の捕水剤収容部７ａ内に収
容された捕水剤１１が水分・ガス等を透過させる硬化密
度の薄膜からなるオーバーコート層１５で覆われて固着
されている。As described above, in the organic EL device 1A of the first embodiment, the water trapping agent 11 is directly exposed to the element 6 and the adhesive resin film is formed in the water trapping agent accommodating portion 7a of the sealing member 7. 10 is fixed. In addition, the organic E of the second embodiment
In the L element 1B, the water catching agent 11 accommodated in the water catching agent accommodating portion 7a of the sealing member 7 is fixed by being covered with an overcoat layer 15 made of a thin film having a cured density that allows moisture and gas to pass therethrough. I have.
【００６３】したがって、各実施の形態の有機ＥＬ素子
１Ａ，１Ｂによれば、図７に示す従来の有機ＥＬ素子２
１と比較して、封止後の素子内に存在する水分・ガス分
子等を捕水剤１１で効率的に捕らえ、ダークスポットの
生成および成長を抑制することができる。Therefore, according to the organic EL elements 1A and 1B of each embodiment, the conventional organic EL element 2 shown in FIG.
As compared with 1, the moisture / gas molecules and the like existing in the element after sealing can be efficiently caught by the water catching agent 11, and the generation and growth of dark spots can be suppressed.
【００６４】加えて、有機ＥＬ素子の保存安定性を従来
品よりも数倍上げることができ、通常の点灯寿命等も改
善することができる。また、封止プロセス中に工程変動
に対してもロバストネスをあげることができ、安定して
再現性のある有機ＥＬ素子を製造することができる。In addition, the storage stability of the organic EL device can be several times higher than that of the conventional product, and the normal lighting life and the like can be improved. In addition, robustness can be increased with respect to process variations during the sealing process, and a stable and reproducible organic EL device can be manufactured.
【００６５】ここで、各実施の形態の有機ＥＬ素子１
Ａ，１Ｂと従来の有機ＥＬ素子２１における保存安定性
を比較するため、室温保存時間と全発光面積との関係を
図６に示す。Here, the organic EL element 1 of each embodiment
FIG. 6 shows the relationship between the storage time at room temperature and the total light emission area in order to compare the storage stability of A, 1B with the conventional organic EL element 21.
【００６６】この図６からも明らかなように、各実施の
形態の有機ＥＬ素子１Ａ，１Ｂによれば、図７に示す従
来の有機ＥＬ素子２１と比較して、室温保存時間の経過
とともに変化する全発光面積に対するダークスポット面
積の割合を低く抑えることができる。例えば室温保存時
間が５０００時間を経過したとき、従来の有機ＥＬ素子
２１では全発光面積に対するダークスポット面積が５０
％にまで及ぶのに対し、第２実施の形態の有機ＥＬ素子
１Ｂではその割合が約３０％に抑えられる。更に第１実
施の形態の有機ＥＬ素子１Ａでは約２０％程度まで抑え
ることができる。As is apparent from FIG. 6, according to the organic EL elements 1A and 1B of the respective embodiments, as compared with the conventional organic EL element 21 shown in FIG. The ratio of the dark spot area to the total light emitting area can be kept low. For example, when the storage time at room temperature exceeds 5000 hours, in the conventional organic EL element 21, the dark spot area with respect to the total light emission area is 50%.
%, Whereas the ratio is suppressed to about 30% in the organic EL device 1B of the second embodiment. Further, in the organic EL element 1A of the first embodiment, it can be suppressed to about 20%.
【００６７】また、各実施の形態の有機ＥＬ素子１Ａ，
１Ｂにおける封止部材７には、基板２との封着部分を除
いてすべてが捕水剤１１を収容するための捕水剤収容部
７ａが形成されている。このため、図７に示す従来の有
機ＥＬ素子２１のような蓋部材２９が不要となる。その
結果、同一寸法の有機ＥＬ素子を構成した場合、従来の
有機ＥＬ素子２１よりも捕水剤１１の収容容積が大きく
なり、より多くの捕水剤１１を収容でき、捕水剤１１に
よる捕水効果を向上させることができる。Further, the organic EL element 1A of each embodiment,
The sealing member 7 in 1B is provided with a water-trapping agent accommodating portion 7a for storing the water-trapping agent 11 except for the sealing portion with the substrate 2. For this reason, the cover member 29 like the conventional organic EL element 21 shown in FIG. 7 becomes unnecessary. As a result, when the organic EL elements having the same dimensions are configured, the capacity of the water-absorbing agent 11 is larger than that of the conventional organic EL element 21, so that a larger amount of the water-absorbing agent 11 can be accommodated. Water effect can be improved.
【００６８】ところで、上記各実施の形態において、透
明導電膜からなる陽極３と金属薄膜からなる陰極５を逆
転させた構成としてもよい。その際、使用される基板２
は必ずしも透光性を有する必要はなく、絶縁性を有する
有色の基板を用いることができる。In each of the above embodiments, the anode 3 made of a transparent conductive film and the cathode 5 made of a metal thin film may be reversed. At this time, the substrate 2 used
Does not necessarily need to have a light-transmitting property, and a colored substrate having an insulating property can be used.
【００６９】また、一対の電極（陽極３、陰極５）は、
少なくとも一方が透光性を有する導電材料で形成されて
いればよい。その際、両方の電極が透光性を有する導電
材料の場合には、一方の電極（陽極）に仕事関数の大き
い透光性を有する導電材料（例えばＩＴＯ）を用い、他
方の電極（陰極）に仕事関数の小さい透光性を有する導
電材料を用いる。The pair of electrodes (anode 3 and cathode 5)
At least one of them may be formed of a light-transmitting conductive material. In this case, when both electrodes are made of a light-transmitting conductive material, one of the electrodes (anode) is made of a light-transmitting conductive material (eg, ITO) having a large work function, and the other electrode (cathode) is used. A light-transmitting conductive material having a small work function is used.
【００７０】[0070]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、従来の有機ＥＬ素子と比較して、封止後の素子
内に存在する水分・ガス分子等を捕水剤で効率的に捕ら
え、ダークスポットの生成および成長を抑制することが
できる。As is apparent from the above description, according to the present invention, as compared with the conventional organic EL device, the efficiency of water / gas molecules and the like existing in the sealed device is improved by the water trapping agent. And the generation and growth of dark spots can be suppressed.
【００７１】加えて、有機ＥＬ素子の保存安定性を従来
品よりも数倍上げることができ、通常の点灯寿命等も改
善することができる。また、封止プロセス中に工程変動
に対してもロバストネスをあげることができ、安定して
再現性のある有機ＥＬ素子を製造することができる。In addition, the storage stability of the organic EL element can be several times higher than that of the conventional product, and the normal lighting life and the like can be improved. In addition, robustness can be increased with respect to process variations during the sealing process, and a stable and reproducible organic EL device can be manufactured.
【００７２】特に、封止部材の底面に有機膜からなる粘
着性樹脂膜を形成し、この粘着性樹脂膜に所定量の捕水
剤を固着した構成によれば、捕水剤が素子に対して直接
露出するので、より効率的に水分・ガス分子等を捕らえ
ることができる。In particular, according to the structure in which an adhesive resin film made of an organic film is formed on the bottom surface of the sealing member and a predetermined amount of a water catching agent is fixed to the adhesive resin film, the water catching agent is applied to the element. And direct exposure, it is possible to capture moisture, gas molecules and the like more efficiently.
【図１】本発明による有機ＥＬ素子の第１実施の形態を
示す側断面図FIG. 1 is a side sectional view showing a first embodiment of an organic EL device according to the present invention.
【図２】（ａ）〜（ｅ）図１の有機ＥＬ素子の製造工程
を示す側断面図2 (a) to 2 (e) are side sectional views showing manufacturing steps of the organic EL device of FIG. 1;
【図３】本発明による有機ＥＬ素子の第２実施の形態を
示す側断面図FIG. 3 is a side sectional view showing a second embodiment of the organic EL device according to the present invention.
【図４】図３の有機ＥＬ素子におけるオーバーコート層
の膜厚が０．１μｍ、１．０μｍ、１０μｍのそれぞれ
の紫外線照射量に対する硬化密度の関係を示す図FIG. 4 is a diagram showing a relationship between a curing density and an ultraviolet irradiation amount when the thickness of an overcoat layer in the organic EL element of FIG. 3 is 0.1 μm, 1.0 μm, and 10 μm.
【図５】（ａ）〜（ｄ）図３の有機ＥＬ素子の製造工程
を示す側断面図5 (a) to 5 (d) are side sectional views showing manufacturing steps of the organic EL device of FIG. 3;
【図６】本実施の形態の有機ＥＬ素子と従来の有機ＥＬ
素子における室温保存時間と全発光面積との関係を示す
図FIG. 6 shows an organic EL device of the present embodiment and a conventional organic EL device.
Diagram showing the relationship between the storage time at room temperature and the total light emitting area in the device
【図７】従来の有機ＥＬ素子の一構成例を示す側断面図FIG. 7 is a side cross-sectional view showing one configuration example of a conventional organic EL element.
１Ａ，１Ｂ…有機ＥＬ素子、２…基板、３…陽極（第一
電極）、４…有機層、５…陰極（第二電極）、６…素
子、７…封止部材、７ａ…凹部、８…シール膜、１０…
粘着性樹脂膜、１１…捕水剤、１５…オーバーコート
層。1A, 1B: organic EL element, 2: substrate, 3: anode (first electrode), 4: organic layer, 5: cathode (second electrode), 6: element, 7: sealing member, 7a: concave portion, 8 ... seal membrane, 10 ...
Adhesive resin film, 11: water trapping agent, 15: overcoat layer.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 稗田 茂 千葉県茂原市大芝629 双葉電子工業株式 会社内 Ｆターム(参考） 3K007 AB11 AB13 AB18 BB01 BB05 CA01 CB01 DA01 DB03 EB00 FA02 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Shigeru Hieda 629 Oshiba, Mobara-shi, Chiba Futaba Electronics Co., Ltd. F-term (reference) 3K007 AB11 AB13 AB18 BB01 BB05 CA01 CB01 DA01 DB03 EB00 FA02
Claims (5)
まれた素子が絶縁性を有する基板の上に形成され、前記
素子と所定間隔をおいて前記基板に対向して配置された
封止部材と前記基板との外周部分がドライ雰囲気中で接
着剤からなるシール膜により固着されて封止された有機
ＥＬ素子において、 前記封止部材内の前記素子と対面する位置に有機膜から
なる粘着性樹脂膜が形成されており、該粘着性樹脂膜に
は所定量の捕水剤が固着されていることを特徴とする有
機ＥＬ素子。An element in which an organic layer including a light-emitting layer is interposed between a pair of electrodes is formed on an insulating substrate, and is arranged to face the substrate at a predetermined distance from the element. In an organic EL element in which an outer peripheral portion of a sealing member and the substrate is fixed and sealed by a sealing film made of an adhesive in a dry atmosphere, an organic film is formed at a position facing the element in the sealing member. An organic EL device, wherein an adhesive resin film is formed, and a predetermined amount of a water catching agent is fixed to the adhesive resin film.
まれた素子が絶縁性を有する基板の上に形成され、前記
素子と所定間隔をおいて前記基板に対向して配置された
封止部材と前記基板との外周部分がドライ雰囲気中で接
着剤からなるシール膜により固着されて封止された有機
ＥＬ素子において、 前記封止部材内の前記素子と対面する位置に所定量の捕
水剤が充填されており、有機膜からなるオーバーコート
層が前記捕水剤の上から薄膜形成されていることを特徴
とする有機ＥＬ素子。2. An element in which an organic layer including a light-emitting layer is interposed between a pair of electrodes is formed on an insulating substrate, and is arranged to face the substrate at a predetermined distance from the element. In an organic EL element in which an outer peripheral portion of a sealing member and the substrate is fixed and sealed by a seal film made of an adhesive in a dry atmosphere, a predetermined amount of the organic EL element is positioned at a position facing the element in the sealing member. An organic EL device filled with a water catching agent, wherein an overcoat layer made of an organic film is formed as a thin film on the water catching agent.
μｍの膜厚からなる請求項２記載の有機ＥＬ素子。3. The organic EL device according to claim 2, wherein the overcoat layer has a thickness of 0.1 to several hundred μm.
まれた素子が絶縁性を有する基板の上に形成され、前記
素子と所定間隔をおいて前記基板に対向して配置された
封止部材と前記基板との外周部分がドライ雰囲気中で接
着剤からなるシール膜により固着されて封止された有機
ＥＬ素子の製造方法において、 前記封止部材の前記素子と対面する位置に有機膜からな
る粘着性樹脂膜を形成する工程と、 前記粘着性樹脂膜上に捕水剤を充填する工程と、 前記充填された前記捕水剤のうち、前記粘着性樹脂膜に
対する未固着の捕水剤を除去する工程とを含むことを特
徴とする有機ＥＬ素子の製造方法。4. An element in which an organic layer including a light emitting layer is interposed between a pair of electrodes is formed on an insulating substrate, and is arranged to face the substrate at a predetermined distance from the element. In a method of manufacturing an organic EL element in which an outer peripheral portion of a sealing member and the substrate is fixed and sealed by a sealing film made of an adhesive in a dry atmosphere, an organic material is provided at a position of the sealing member facing the element. A step of forming an adhesive resin film composed of a film; a step of filling a water catching agent on the adhesive resin film; Removing the liquid agent.
まれた素子が絶縁性を有する基板の上に形成され、前記
素子と所定間隔をおいて前記基板に対向して配置された
封止部材と前記基板との外周部分がドライ雰囲気中で接
着剤からなるシール膜により固着されて封止された有機
ＥＬ素子の製造方法において、 前記封止部材の前記素子と対面する位置に捕水剤を所定
量充填する工程と、 前記充填された前記捕水剤の上から有機膜からなるオー
バーコート層を薄膜形成する工程とを含むことを特徴と
する有機ＥＬ素子の製造方法。5. An element in which an organic layer including a light-emitting layer is interposed between a pair of electrodes is formed on an insulating substrate, and is arranged to face the substrate at a predetermined distance from the element. In a method of manufacturing an organic EL element in which an outer peripheral portion of a sealing member and the substrate is fixed and sealed by a sealing film made of an adhesive in a dry atmosphere, the sealing member is captured at a position facing the element. A method for manufacturing an organic EL device, comprising: a step of filling a predetermined amount of a liquid agent; and a step of forming a thin film of an overcoat layer made of an organic film on the filled water-absorbing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37015798A JP3695190B2 (en) | 1998-12-25 | 1998-12-25 | Organic EL device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37015798A JP3695190B2 (en) | 1998-12-25 | 1998-12-25 | Organic EL device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000195659A true JP2000195659A (en) | 2000-07-14 |
| JP3695190B2 JP3695190B2 (en) | 2005-09-14 |
Family
ID=18496208
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP37015798A Expired - Fee Related JP3695190B2 (en) | 1998-12-25 | 1998-12-25 | Organic EL device and manufacturing method thereof |
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| Country | Link |
|---|---|
| JP (1) | JP3695190B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010039830A (en) * | 1999-08-19 | 2001-05-15 | 가네꼬 히사시 | Organic thin-film device |
| US6673436B2 (en) | 2000-05-17 | 2004-01-06 | Dynic Corporation | Moisture absorbing formed article |
| KR100645722B1 (en) * | 2005-10-04 | 2006-11-14 | 삼성에스디아이 주식회사 | Organic light emitting display |
-
1998
- 1998-12-25 JP JP37015798A patent/JP3695190B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010039830A (en) * | 1999-08-19 | 2001-05-15 | 가네꼬 히사시 | Organic thin-film device |
| US6673436B2 (en) | 2000-05-17 | 2004-01-06 | Dynic Corporation | Moisture absorbing formed article |
| KR100645722B1 (en) * | 2005-10-04 | 2006-11-14 | 삼성에스디아이 주식회사 | Organic light emitting display |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3695190B2 (en) | 2005-09-14 |
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