JP2000192260A - Production of metallic foil laminated body for etching and etched metallic foil - Google Patents
Production of metallic foil laminated body for etching and etched metallic foilInfo
- Publication number
- JP2000192260A JP2000192260A JP10368942A JP36894298A JP2000192260A JP 2000192260 A JP2000192260 A JP 2000192260A JP 10368942 A JP10368942 A JP 10368942A JP 36894298 A JP36894298 A JP 36894298A JP 2000192260 A JP2000192260 A JP 2000192260A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- metallic foil
- resist
- metal foil
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Cell Electrode Carriers And Collectors (AREA)
- Secondary Cells (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【０００１】[0001]
【発明の技術分野】この発明は、エッチング用金属箔積
層体及びその積層体をエッチングして得られる金属箔の
製造方法に関する。The present invention relates to a metal foil laminate for etching and a method for producing a metal foil obtained by etching the laminate.
【０００２】[0002]
【従来の技術】例えば非接触ＩＣカードのアンテナやポ
リマー２次電池の集電体などに、一定のパターンになる
よう所定部分を除去した金属箔が用いられている。この
所定部分を除去するために、パンチング、ラス加工、エ
ッチングなどの方法が採られている。パンチングは規則
正しい正確な孔あけが可能であり、厚い材料にも適用す
ることができるが、金型が必要であって、消耗が激しく
コスト高になり、量産には向いていない。ラス加工は、
開孔率を大きくとれるが、加工後の強度が低下し切断し
易く、コスト的にも高くつく。2. Description of the Related Art For example, a metal foil from which a predetermined portion is removed so as to have a predetermined pattern is used for an antenna of a non-contact IC card, a current collector of a polymer secondary battery, and the like. In order to remove the predetermined portion, a method such as punching, lathing, and etching is employed. Punching is capable of regular and accurate drilling, and can be applied to thick materials, but requires a mold, requires a lot of wear and is expensive, and is not suitable for mass production. Lath processing is
Although the porosity can be increased, the strength after processing is reduced, so that cutting is easy and the cost is high.
【０００３】[0003]
【発明の課題】上記２方法に比較して、エッチングは、
孔あけパターンの自由度が大きく、コストも安価な利点
を有するが、レジスト塗膜を形成するために実用化され
ているものとして、スクリーン印刷用インキかフィルム
レジストを熱圧着する方式はあるが生産性に劣る。グラ
ビア印刷可能な熱乾燥型レジストインキもあるが、印刷
とエッチングがオフラインのときはコイル巻き取りの際
にブロッキングが生じたり、アルカリ可溶性のないレジ
スト塗膜の剥離は容易でなく、有機溶剤で長時間洗浄し
なければ除去することができないなど、生産性の点で採
用できる方法ではなかった。In comparison with the above two methods, the etching is
It has the advantage of a high degree of freedom in drilling patterns and low cost.However, as a practical method for forming a resist coating film, there is a method of thermocompression bonding of screen printing ink or film resist. Poor sex. There is also a hot-drying resist ink that can be used for gravure printing.However, when printing and etching are offline, blocking occurs when winding the coil, and peeling of the resist coating film that is not soluble in alkali is not easy. It was not a method that could be adopted in terms of productivity, for example, it could not be removed without washing for a long time.
【０００４】そこで、この発明の課題は、量産に対応し
たレジスト塗膜を形成し、生産性良くエッチド金属箔を
作製することにある。Accordingly, an object of the present invention is to form a resist coating film corresponding to mass production and to manufacture an etched metal foil with high productivity.
【０００５】[0005]
【課題の解決手段】上記の課題を解決するために、この
発明においては、金属箔の一面に、分子中に少くとも１
個のカルボキシル基を持つアクリルモノマーおよびアル
カリ可溶性樹脂を主成分とする紫外線硬化型レジストイ
ンキから成るレジスト層を所定のパターンで設けて、エ
ッチング用金属箔積層体を形成させた。According to the present invention, at least one metal foil is provided on one surface of a metal foil.
A resist layer composed of an acrylic monomer having a carboxyl group and an ultraviolet-curable resist ink mainly composed of an alkali-soluble resin was provided in a predetermined pattern to form a metal foil laminate for etching.
【０００６】上記レジスト層を形成するためのレジスト
インキは、グラビア印刷が可能で、酸に耐え、かつアル
カリによって容易に剥離除去が可能であるため連続大量
生産が可能となる。このレジストインキを用いて金属箔
に所定のパターンでグラビア印刷を施し、紫外線を照射
して硬化させた後、常法に従って酸エッチング、アルカ
リによるレジスト層の剥離除去を行なうと、エッチド金
属箔が得られる。[0006] The resist ink for forming the resist layer can be gravure-printed, resists acids, and can be easily peeled off by alkali, thereby enabling continuous mass production. After performing gravure printing on the metal foil in a predetermined pattern using the resist ink and irradiating with ultraviolet light to cure the resist, the resist layer is peeled off and removed with an acid according to a conventional method to obtain an etched metal foil. Can be
【０００７】[0007]
【実施の形態】以下、この発明の実施形態を添付図面に
基づいて説明する。図１に示すように、エッチング用金
属箔積層体１は、基材となる金属箔２の一面に所定のパ
ターンでレジスト層３ａ、反対面に全面レジスト層３ｂ
を設けたものである。金属箔２には、アルミニウム、銅
などが使用できる。レジスト層３ａおよび３ｂは、塩化
第２鉄水溶液などの酸エッチングに耐え、かつ水酸化ナ
トリウム水溶液などのアルカリで剥離除去可能なインキ
を用いてグラビア印刷により形成したものである。この
ようなグラビア印刷可能なインキとしては、分子中に少
くとも１個のカルボキシル基を持つアクリルモノマーお
よびアルカリ可溶性樹脂を主成分としている。少くとも
１個のカルボキシル基を持つアクリルモノマーとして
は、例えば２−アクリロイルオキシエチルフタル酸、２
−アクリロイルオキシエチルコハク酸、２−アクリロイ
ルオキシエチルヘキサヒドロフタル酸、２−アクリロイ
ルオキシプロピルフタル酸、２−アクリロイルオキシプ
ロピルテトラヒドロフタル酸、２−アクリロイルオキシ
プロピルヘキサヒドロフタル酸などが挙げられ、これら
を単独又は混合して使用する。アルカリ可溶性樹脂とし
ては例えばスチレン−マレイン酸樹脂、スチレン−アク
リル酸樹脂、ロジン−マレイン酸樹脂などが挙げられ
る。Embodiments of the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1, a metal foil laminate 1 for etching includes a resist layer 3a in a predetermined pattern on one surface of a metal foil 2 serving as a base material, and a resist layer 3b on the opposite surface.
Is provided. Aluminum or copper can be used for the metal foil 2. The resist layers 3a and 3b are formed by gravure printing using an ink such as an aqueous solution of sodium hydroxide which can withstand acid etching such as an aqueous solution of ferric chloride and which can be peeled off with an alkali such as an aqueous solution of sodium hydroxide. Such a gravure-printable ink contains an acrylic monomer having at least one carboxyl group in a molecule and an alkali-soluble resin as main components. Acrylic monomers having at least one carboxyl group include, for example, 2-acryloyloxyethyl phthalic acid,
-Acryloyloxyethyl succinic acid, 2-acryloyloxyethyl hexahydrophthalic acid, 2-acryloyloxypropyl phthalic acid, 2-acryloyloxypropyl tetrahydrophthalic acid, 2-acryloyloxypropyl hexahydrophthalic acid, and the like. Use alone or as a mixture. Examples of the alkali-soluble resin include a styrene-maleic acid resin, a styrene-acrylic acid resin, and a rosin-maleic acid resin.
【０００８】インキは上記主成分の他にアルカリ剥離性
を阻害しない程度に通常の単官能アクリルモノマー、多
官能アクリルモノマー、プレポリマーが添加でき、光重
合開始剤、顔料、添加剤、溶剤等を添加して作製する。
光重合開始剤としてはベンゾフエノン及びその誘導体、
ベンジル、ベンゾイン及びそのアルキルエーテル、チオ
キサントン及びその誘導体、ルシリンＴＰＯ、チバスペ
シャルティケミカルズ製イルガキュア、フラッテリ・ラ
ンベルティ製エサキュア等がある。顔料としてはパター
ンが見やすいように着色顔料を添加する他、シリカ、タ
ルク、クレー、硫酸バリウム、炭酸カルシウム等の体質
顔料が挙げられ、特にシリカはインキの紫外線硬化後レ
ジストを付けたまま金属箔を巻きとる場合にはブロッキ
ング防止効果がある。添加剤としては、２−ターシャリ
ブチルハイドロキノンなどの重合禁止剤、シリコン、フ
ッ素化合物、アクリル重合物等の消泡剤、レベリング剤
があり必要に応じて適宜添加する。溶剤としては酢酸エ
チル、エタノール、変性アルコール、イソプロピルアル
コール、トルエン、ＭＥＫ等が挙げられ、単独又は混合
して使用し、グラビア印刷を可能にさせる。溶剤はグラ
ビア印刷の後熱乾燥オーブンでレジストから蒸発させ除
くことが必要である。[0008] In addition to the above main components, ordinary monofunctional acrylic monomers, polyfunctional acrylic monomers, and prepolymers can be added to the ink to such an extent that alkali releasability is not impaired. Photoinitiators, pigments, additives, solvents and the like can be added. It is prepared by adding.
Benzophenone and its derivatives as a photopolymerization initiator,
Benzyl, benzoin and its alkyl ethers, thioxanthone and its derivatives, lucilin TPO, Irgacure manufactured by Ciba Specialty Chemicals, and esacure manufactured by Frattelli Lamberti. As the pigment, besides adding a coloring pigment so that the pattern is easy to see, extenders such as silica, talc, clay, barium sulfate, and calcium carbonate are exemplified. When wound, there is an effect of preventing blocking. Examples of the additives include a polymerization inhibitor such as 2-tert-butylhydroquinone, an antifoaming agent such as silicon, a fluorine compound and an acrylic polymer, and a leveling agent, and these are added as needed. Examples of the solvent include ethyl acetate, ethanol, denatured alcohol, isopropyl alcohol, toluene, MEK, and the like, which are used alone or in combination to enable gravure printing. After the gravure printing, the solvent needs to be removed from the resist by evaporation in a heat drying oven.
【０００９】グラビア印刷によって形成するレジスト層
３ａのパターンは、用途に応じて任意に選択することが
できる。図２にその一例を示す。図２（ａ）は丸抜きパ
ターン、（ｂ）（ｃ）（ｄ）は多角形抜きパターンであ
る。例えばポリマー２次電池の集電体に用いる場合は、
（ｄ）のような六角形抜きパターンが好ましく、レジス
ト層３ａの線幅は０．１０〜２．０ｍｍ、１個当りの非
レジスト印刷部面積は０．０３〜７ｍｍ2 、開孔率は１
０〜７０％が好適である。さらに好ましくは、線幅が
０．１５〜０．８０ｍｍ、１個当りの非レジスト印刷部
面積は０．２０〜３ｍｍ2 、開孔率は３０〜６０％であ
る。レジスト線幅が０．１０ｍｍ未満では正確な印刷が
難しく、２．０ｍｍを越えると開孔率確保のため１個当
りの孔面積を大きくせねばならず、シワ対策など取扱い
上の問題が生じる。孔面積については、０．０３ｍｍ2
未満では所定の開孔率を得るための線幅確保が難しく、
７ｍｍ2 を越えるとシワ対策など取扱い上の問題が生じ
る。開孔率が１０％未満では電極箔としての効果が小さ
く、７０％を越えるとシワ対策など取扱い上の問題が生
じる。The pattern of the resist layer 3a formed by gravure printing can be arbitrarily selected according to the application. FIG. 2 shows an example. FIG. 2A shows a round-cut pattern, and FIGS. 2B, 2C, and 2D show a polygon-cut pattern. For example, when used as a current collector for a polymer secondary battery,
A hexagonal punching pattern as shown in (d) is preferable, the line width of the resist layer 3a is 0.10 to 2.0 mm, the area of the non-resist printing portion per one is 0.03 to 7 mm 2 , and the aperture ratio is 1
0-70% is preferred. More preferably, the line width is 0.15 to 0.80 mm, the area of the non-resist printing portion per piece is 0.20 to 3 mm 2 , and the aperture ratio is 30 to 60%. If the resist line width is less than 0.10 mm, accurate printing is difficult. If the resist line width is more than 2.0 mm, the hole area per hole must be increased in order to secure the aperture ratio, and handling problems such as wrinkle countermeasures arise. For the hole area, 0.03 mm 2
If it is less, it is difficult to secure a line width to obtain a predetermined opening ratio,
If it exceeds 7 mm 2 , handling problems such as measures against wrinkles occur. If the porosity is less than 10%, the effect as an electrode foil is small, and if it exceeds 70%, handling problems such as measures against wrinkles occur.
【００１０】グラビア印刷に使用する印刷版の製版方式
は、コンベンショナルグラビア、網グラビア、ヘリオク
リッショグラビアなどいずれでも良い。ただ、版つなぎ
部分でレジスト印刷にズレが生じるとエッチング箔が切
断する恐れがあるため、コンピューター制御で製版でき
る電子彫刻法であるヘリオクリッショグラビアが好適で
ある。[0010] The plate making method of the printing plate used for the gravure printing may be any of a conventional gravure, a net gravure, a heliolithography gravure, and the like. However, if there is a deviation in the resist printing at the plate connecting portion, the etching foil may be cut. Therefore, heliocrissional gravure, which is an electronic engraving method capable of making a plate under computer control, is preferable.
【００１１】前記金属箔２の他面のレジスト層３ｂは、
反対面のレジスト層３ａと必ずしも同じインキを塗布す
る必要はなく、酸エッチングに耐え、かつアルカリ剥離
除去可能であれば、合成樹脂を押し出して全面被覆する
ことができる。その場合、印刷法よりも塗膜が厚くなる
のでアルカリによる膜剥離除去がより容易となる。この
ような樹脂としては、エチレン−アクリル酸などの酸変
成オレフィン樹脂が好適である。The resist layer 3b on the other side of the metal foil 2
It is not necessary to apply the same ink as that of the resist layer 3a on the opposite side, and the synthetic resin can be extruded to cover the entire surface if it can withstand acid etching and can be removed by alkali peeling. In this case, since the coating film is thicker than in the printing method, it is easier to remove and remove the film with alkali. As such a resin, an acid-modified olefin resin such as ethylene-acrylic acid is suitable.
【００１２】図３に他の実施形態を示す。基材となる金
属箔２、２は容易に剥離できる強度で接着層４により積
層されている。それぞれの金属箔２にはレジスト層３ａ
が所定パターンで施されている。接着層４は酸エッチン
グに耐え、かつアルカリ剥離除去可能であれば良く、例
えばポリエチレン、ポリエステルなどの基材フィルムの
両面に粘着加工したもの、或は前記の熱溶融押し出し樹
脂などを使用しても良い。レジスト層３ａ、３ａは必ず
しも同一パターンである必要はない。この実施形態のメ
リットは、強度の低い金属箔（薄いもの、開孔率の高い
もの）を製作できること及び生産効率を向上できること
である。FIG. 3 shows another embodiment. The metal foils 2 and 2 serving as base materials are laminated by the adhesive layer 4 with a strength that can be easily peeled. Each metal foil 2 has a resist layer 3a
Are applied in a predetermined pattern. The adhesive layer 4 only needs to withstand acid etching and be removable by alkali peeling. For example, it is possible to use a substrate film made of polyethylene, polyester, or the like that has been subjected to adhesive processing on both surfaces, or the above-described hot melt extruded resin. good. The resist layers 3a, 3a need not necessarily have the same pattern. The merits of this embodiment are that a metal foil having a low strength (thin and a high aperture ratio) can be manufactured, and production efficiency can be improved.
【００１３】図４に他の例を示す。基材となる金属箔
２、２が絶縁層５の両面に積層されている。それぞれの
金属箔２の外面には所定パターンでレジスト層３ａが設
けられ、一方のレジスト層３ａと他方のレジスト層３ａ
とは共振回路を形成するパターンとなっており、絶縁層
５は所定の誘電率を持っている。レジスト層３ａを剥離
除去する目的は、形成された回路上にＩＣチップなどを
ボンディングして非接触ＩＣカードとすることにある。
一般には、両面共に除去する必要はなく、片面側だけで
よい。FIG. 4 shows another example. Metal foils 2, 2 serving as base materials are laminated on both surfaces of the insulating layer 5. A resist layer 3a is provided in a predetermined pattern on the outer surface of each metal foil 2, and one resist layer 3a and the other resist layer 3a
Are patterns forming a resonance circuit, and the insulating layer 5 has a predetermined dielectric constant. The purpose of peeling and removing the resist layer 3a is to bond an IC chip or the like to the formed circuit to obtain a non-contact IC card.
Generally, it is not necessary to remove both sides, but only one side.
【００１４】上記のようにして形成したエッチング用金
属箔積層体１のレジスト層３ａに紫外線を照射して硬化
させた後、塩化第２鉄水溶液のような酸エッチング液に
浸漬して金属箔２をエッチングし、さらに、水酸化ナト
リウム水溶液などのアルカリ水溶液に浸漬して、レジス
ト層３ａを剥離除去すると、エッチド金属箔が得られ
る。The resist layer 3a of the metal foil laminate for etching 1 formed as described above is cured by irradiating the resist layer 3a with ultraviolet rays and then immersed in an acid etching solution such as an aqueous ferric chloride solution. Is etched and further immersed in an aqueous alkali solution such as an aqueous sodium hydroxide solution to peel off and remove the resist layer 3a, thereby obtaining an etched metal foil.
【００１５】以下に実施例と比較例を挙げる。Examples and comparative examples will be described below.
【００１６】[0016]
【実施例１】厚み４０μｍのアルミニウム箔を用い、レ
ジスト層として次の組成で表わされるインキを使用し
た。 〔インキ組成〕 ベッカサイトＪ−８９６（大日本インキ化学工業社製ロジン−マレイン酸 樹脂） ２１重量部 ２−アクリロイロキシエチルヘキサヒドロフタル酸 ２５重量部 ユニディックＶ−５５１０（大日本インキ化学工業社製プレポリマー、モ ノマーの混合物） ８重量部 イルガキュア１８４ ３重量部 酢酸エチル ２８重量部 変性アルコール １２重量部 フタロシアニンブルー １重量部 シリカ ２重量部。Example 1 An aluminum foil having a thickness of 40 μm was used, and an ink represented by the following composition was used as a resist layer. [Ink composition] Beccasite J-896 (Rosin-maleic acid resin manufactured by Dainippon Ink and Chemicals, Inc.) 21 parts by weight 2-acryloyloxyethylhexahydrophthalic acid 25 parts by weight Unidick V-5510 (Dainippon Ink and Chemicals, Inc.) 8 parts by weight Irgacure 184 3 parts by weight Ethyl acetate 28 parts by weight Modified alcohol 12 parts by weight Phthalocyanine blue 1 part by weight Silica 2 parts by weight
【００１７】ヘリオクリッショグラビア版を用い、印刷
パターンは図２（ｄ）の抜き６角形で、線幅は０．２ｍ
ｍ、対角線長さは０．７ｍｍとし、５０ｍ／分で膜厚３
μｍに印刷後、１２０Ｗ／ｃｍＵＶランプ×４本で照射
した。その後、反対面にも同じインクでベタ印刷を行い
同様にＵＶランプで照射してレジスト印刷済試料を作成
した。Using a heliocrissional gravure plate, the printing pattern is a hexagonal blank as shown in FIG.
m, the diagonal length is 0.7 mm, and the film thickness is 3 at 50 m / min.
After printing to μm, irradiation was performed with four 120 W / cm UV lamps. Thereafter, solid printing was performed on the opposite surface with the same ink, and irradiation was similarly performed with a UV lamp to prepare a resist-printed sample.
【００１８】この試料を３５％塩化第二鉄水溶液４０℃
に５分浸漬後、１％水酸化ナトリウム水溶液２０℃に１
０秒浸漬したところ、レジスト層は膜状に剥離除去でき
た。また、完成した孔あき箔は線幅が０．２２ｍｍ、対
角線長さが０．６８ｍｍであった。なお、エッチング工
程以降の中和、水洗、乾燥などの工程は通常の工程を採
用した。This sample was treated with a 35% ferric chloride aqueous solution at 40 ° C.
After immersion for 5 minutes in 1% aqueous sodium hydroxide solution at 20 ° C
After immersion for 0 seconds, the resist layer could be peeled and removed in a film form. The finished perforated foil had a line width of 0.22 mm and a diagonal length of 0.68 mm. Note that ordinary steps were employed for steps such as neutralization, washing with water, and drying after the etching step.
【００１９】[0019]
【実施例２】反対面のレジスト層としてエチレン−アク
リル酸樹脂を使用し熱溶融押し出しにより膜厚１０μｍ
に形成した。これを実施例１と同条件でエッチング・レ
ジスト剥離処理を行った。その結果、レジスト層は膜状
に剥離除去できた。また、完成した孔あき箔は線幅が
０．２２ｍｍ、対角線長さが０．６８ｍｍであった。Embodiment 2 Ethylene-acrylic acid resin was used as the resist layer on the opposite side, and the film thickness was 10 μm by hot melt extrusion.
Formed. This was subjected to etching and resist stripping under the same conditions as in Example 1. As a result, the resist layer could be peeled and removed in the form of a film. The finished perforated foil had a line width of 0.22 mm and a diagonal length of 0.68 mm.
【００２０】[0020]
【実施例３】金属箔として厚さ１８μｍの圧延銅箔を用
いた以外は、実施例１と同条件でエッチング・レジスト
剥離処理を行った。その結果、レジスト層は膜状に剥離
除去できた。また、完成した孔あき箔は線幅が０．２２
ｍｍ、対角線長さが０．６８ｍｍであった。Example 3 An etching / resist stripping treatment was performed under the same conditions as in Example 1 except that a rolled copper foil having a thickness of 18 μm was used as the metal foil. As a result, the resist layer could be peeled and removed in the form of a film. The finished perforated foil has a line width of 0.22.
mm and the diagonal length was 0.68 mm.
【００２１】[0021]
【比較例１】レジスト層として、エッチング後、アルカ
リ溶解性を考慮していない一般のグラビア印刷インキを
用いた以外は実施例１と同条件でエッチング・レジスト
剥離処理を行った。その結果、レジスト印刷層は全く除
去不能であった。また、完成した孔あき箔は線幅Ｗ＝
０．２２ｍｍ、対角線長さが０．６８ｍｍであった。COMPARATIVE EXAMPLE 1 An etching and resist stripping treatment was performed under the same conditions as in Example 1 except that a general gravure printing ink not considering alkali solubility was used as a resist layer after etching. As a result, the resist print layer could not be removed at all. The finished perforated foil has a line width W =
The diagonal length was 0.28 mm and the diagonal length was 0.68 mm.
【００２２】[0022]
【効果】この発明によれば、以上のように、酸エッチン
グに耐え、かつアルカリによって容易に剥離除去可能な
レジストインキを用い、グラビア印刷によってレジスト
層を形成することが可能となり種々の複雑なレジスト層
のパターンを効率よく大量かつ正確に形成することがで
き、生産性の向上をはかることができる。According to the present invention, as described above, it is possible to form a resist layer by gravure printing using a resist ink that can withstand acid etching and can be easily peeled off with an alkali. Layer patterns can be efficiently formed in large quantities and accurately, and productivity can be improved.
【図１】この発明のエッチング用金属箔積層体の一例を
示す断面図FIG. 1 is a sectional view showing an example of a metal foil laminate for etching according to the present invention.
【図２】同上の平面図FIG. 2 is a plan view of the above.
【図３】エッチング用金属箔積層体の他の例を示す断面
図FIG. 3 is a cross-sectional view showing another example of the metal foil laminate for etching.
【図４】エッチング用金属箔積層体のさらに他の例を示
す断面図FIG. 4 is a sectional view showing still another example of the metal foil laminate for etching.
１ エッチング用金属箔積層体 ２ 金属箔 ３ａ、３ｂ レジスト層 ４ 易剥離接着層 ５ 樹脂層 DESCRIPTION OF SYMBOLS 1 Metal foil laminated body for etching 2 Metal foil 3a, 3b Resist layer 4 Easy peeling adhesive layer 5 Resin layer
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１１年１０月５日（１９９９．１０．
５）[Submission date] October 5, 1999 (1999.10.
5)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Correction target item name] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００５】[0005]
【課題の解決手段】上記の課題を解決するために、この
発明においては、金属箔又は、金属箔が外層になる金属
箔積層体の少なくとも一面に、分子中に少くとも１個の
カルボキシル基を持つアクリルモノマーおよびアルカリ
可溶性樹脂を主成分とする紫外線硬化型レジストインキ
から成るレジスト層を所定のパターンで設けて、エッチ
ング用金属箔積層体を形成させた。In order to solve the above-mentioned problems, in the present invention, a metal foil or a metal in which the metal foil is an outer layer is provided.
On at least one surface of the foil laminate, a resist layer made of an ultraviolet-curable resist ink mainly composed of an acrylic monomer having at least one carboxyl group in a molecule and an alkali-soluble resin is provided in a predetermined pattern and used for etching. A metal foil laminate was formed.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鎌田 守 大阪市中央区久太郎町三丁目６番８号 東 洋アルミニウム株式会社内 (72)発明者 高橋 四郎 大宮市大成町１丁目534番地の18 (72)発明者 鈴木 清之 埼玉県南埼玉郡菖蒲町菖蒲5013番地の245 Ｆターム(参考） 2H096 AA27 AA30 BA05 CA20 DA02 DA10 HA13 HA18 LA03 4K057 WA08 WB04 WB05 WB15 WC08 WE08 WE22 WK10 WN10 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Mamoru Kamata 3-6-8 Kutaro-cho, Chuo-ku, Osaka-shi Inside Toyo Aluminum Co., Ltd. (72) Inventor Shiro Takahashi 1-534-18 Taisei-cho, Omiya-shi 72) Inventor Kiyoyuki Suzuki 5013 iris, 5013, Iris, Iris Town, Minamisaitama-gun, Saitama 2H096 AA27 AA30 BA05 CA20 DA02 DA10 HA13 HA18 LA03 4K057 WA08 WB04 WB05 WB15 WC08 WE08 WE22 WK10 WN10
Claims (2)
のカルボキシル基を持つアクリルモノマーおよびアルカ
リ可溶性樹脂を主成分とする紫外線硬化型レジストイン
キからなるレジスト層を所定のパターンで設けたエッチ
ング用金属箔積層体。1. A resist layer composed of an acrylic monomer having at least one carboxyl group in a molecule and an ultraviolet-curable resist ink mainly containing an alkali-soluble resin is provided in a predetermined pattern on one surface of a metal foil. Metal foil laminate for etching.
のカルボキシル基を持つアクリルモノマーおよびアルカ
リ可溶性樹脂を主成分とする紫外線硬化型レジストイン
キでグラビア印刷を施して所定のパターンのレジスト層
を設け、これに紫外線を照射した後、酸エッチングを行
ない、アルカリ水溶液でレジスト層を剥離除去すること
から成るエッチド金属箔の製造方法。2. A gravure printing is performed on one surface of a metal foil with an ultraviolet curable resist ink containing an acrylic monomer having at least one carboxyl group in a molecule and an alkali-soluble resin as a main component. A method for producing an etched metal foil, comprising providing a layer, irradiating the layer with ultraviolet rays, performing acid etching, and removing and removing the resist layer with an aqueous alkali solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36894298A JP3411514B2 (en) | 1998-12-25 | 1998-12-25 | Manufacturing method of metal foil laminate for etching and etched metal foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36894298A JP3411514B2 (en) | 1998-12-25 | 1998-12-25 | Manufacturing method of metal foil laminate for etching and etched metal foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000192260A true JP2000192260A (en) | 2000-07-11 |
| JP3411514B2 JP3411514B2 (en) | 2003-06-03 |
Family
ID=18493156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36894298A Expired - Lifetime JP3411514B2 (en) | 1998-12-25 | 1998-12-25 | Manufacturing method of metal foil laminate for etching and etched metal foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3411514B2 (en) |
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| JP2004238659A (en) * | 2003-02-04 | 2004-08-26 | Toyo Aluminium Kk | Metallic foil stacked body for etching, and method of producing etched metallic foil |
| JP2008153627A (en) * | 2007-11-02 | 2008-07-03 | Toyo Aluminium Kk | Metal foil laminated body for etching, and manufacturing method of etched metal foil |
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|---|---|---|---|---|
| US6400323B2 (en) | 2000-06-23 | 2002-06-04 | Toyo Aluminium Kabushiki Kaisha | Antenna coil for IC card and manufacturing method thereof |
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