JP2000164548A - Device and method for cleaning - Google Patents

Device and method for cleaning

Info

Publication number
JP2000164548A
JP2000164548A JP10335741A JP33574198A JP2000164548A JP 2000164548 A JP2000164548 A JP 2000164548A JP 10335741 A JP10335741 A JP 10335741A JP 33574198 A JP33574198 A JP 33574198A JP 2000164548 A JP2000164548 A JP 2000164548A
Authority
JP
Japan
Prior art keywords
cleaning
cleaning liquid
side wall
tank
cleaning tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10335741A
Other languages
Japanese (ja)
Inventor
Hiroaki Ishikawa
博章 石川
Satoru Koto
悟 古藤
Naohiko Fujino
直彦 藤野
Hiroshi Tanaka
博司 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10335741A priority Critical patent/JP2000164548A/en
Publication of JP2000164548A publication Critical patent/JP2000164548A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a cleaning device and cleaning method for preventing foreign matters from adhering on a surface in a step of fetching out a matter to be cleaned from a cleaning bath in cleaning of a semiconductor wafer, etc. SOLUTION: As a method for discharging detergent in a region, where a foreign matter of the detergent is accumulated, in particular near the center of a surface of the detergent upward of a matter to be cleaned, this embodiment comprises a part 35 of a sidewall part 21 of a cleaning bath, and a part 35 of the sidewall part is moved, thereby lowering the upper end part more than those of the other sidewall 21, and an outer layer part of the detergent is discharged exceeding the lowered sidewall part. By the use of such a cleaning device, it becomes possible to fetch out the matter to be cleaned continuing to a step of discharging an upper layer part of the detergent, and to simplify a step of cleaning.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体デバイス、
液晶ディスプレイ、電子部品等の製造工程において、半
導体ウエハ、ガラス基板、電子部品等を洗浄液中で洗浄
するための洗浄装置及びその洗浄方法に関する。TECHNICAL FIELD The present invention relates to a semiconductor device,
The present invention relates to a cleaning apparatus and a cleaning method for cleaning a semiconductor wafer, a glass substrate, an electronic component, and the like in a cleaning liquid in a manufacturing process of a liquid crystal display, an electronic component, and the like.

【０００２】[0002]

【従来の技術】半導体ウエハ、ガラス基板、電子部品な
どの各種基板の洗浄装置については、特開平３−２１８
４６号公報や特開平８−１７７８２号公報などに記載さ
れた装置が一般に使用されている。図１６は、従来用い
られていた洗浄装置の一般的な構造を示す概略図であ
る。図１６の洗浄装置は、薬液と純水からなる洗浄液、
又は純水のみからなる洗浄液で、被洗浄物であるウエハ
２００を洗浄するものである。洗浄装置は、ウエハ２０
０を収納するための洗浄槽１１を備え、洗浄槽１１は洗
浄槽側壁２１で側面の全周囲が構成されている。洗浄槽
側壁２１の上端には洗浄液を越流させるための越流部１
７が存在する。また、洗浄槽１１下部には洗浄液供給用
配管７０を通じて洗浄槽１１内に洗浄液を供給するため
の洗浄液供給口１４が備えられている。同様に洗浄槽１
１下部には、洗浄槽１１内の洗浄液を排液用配管７１か
ら排液するための洗浄槽内排液口１８および排液を制御
するためのバルブ３３が設けられている。なお、図中の
洗浄液液表面１３は洗浄槽１１内の洗浄液と環境雰囲気
との間の液表面を表すものである。かかる洗浄装置で
は、洗浄槽１１の下部に配置された洗浄液供給口１４よ
り、洗浄液を連続的に洗浄槽１１の中に供給すること
で、これらの液が越流部１７を越えて洗浄槽１１内から
排出される。この状態で、ウエハ２００を洗浄槽１１中
に配置することにより、ウエハ２００の洗浄が行われ
る。2. Description of the Related Art An apparatus for cleaning various substrates such as semiconductor wafers, glass substrates, and electronic components is disclosed in Japanese Patent Application Laid-Open No. 3-218.
The devices described in JP-A-46-46 and JP-A-8-17782 are generally used. FIG. 16 is a schematic diagram showing a general structure of a conventionally used cleaning apparatus. The cleaning device of FIG. 16 includes a cleaning solution including a chemical solution and pure water,
Alternatively, the wafer 200, which is the object to be cleaned, is cleaned with a cleaning liquid consisting of pure water only. The cleaning device is a wafer 20
A cleaning tank 11 for accommodating the cleaning tank 11 is provided. An overflow portion 1 for overflowing the cleaning liquid is provided at the upper end of the cleaning tank side wall 21.
7 are present. Further, a cleaning liquid supply port 14 for supplying a cleaning liquid into the cleaning tank 11 through a cleaning liquid supply pipe 70 is provided below the cleaning tank 11. Cleaning tank 1
The lower part 1 is provided with a drain port 18 in the cleaning tank for draining the cleaning liquid in the cleaning tank 11 from the drain pipe 71 and a valve 33 for controlling the drain liquid. The cleaning liquid surface 13 in the figure represents the liquid surface between the cleaning liquid in the cleaning tank 11 and the ambient atmosphere. In such a cleaning apparatus, the cleaning liquid is continuously supplied into the cleaning tank 11 from the cleaning liquid supply port 14 disposed below the cleaning tank 11 so that these liquids pass through the overflow section 17 and are supplied to the cleaning tank 11. Exhausted from inside. In this state, the wafer 200 is cleaned by disposing the wafer 200 in the cleaning tank 11.

【０００３】処理されたウエハ２００は、洗浄後、洗浄
液中から取り出されるが、ウエハ２００を取り出す方法
には、図１７に示すように、ウエハ２００を洗浄槽１１
内に残したまま洗浄層１１下部の排液口１８から洗浄液
を排出する方法と、図１８に示すように、洗浄液は排出
せずにウエハ２００を洗浄液中から引き上げて取り出す
方法との２種類の方法がある。[0003] The processed wafer 200 is taken out of the cleaning solution after cleaning. The method of taking out the wafer 200 is as follows, as shown in FIG.
There are two kinds of methods: a method of discharging the cleaning liquid from a liquid discharge port 18 below the cleaning layer 11 while leaving the cleaning liquid inside, and a method of pulling out the wafer 200 from the cleaning liquid without discharging the cleaning liquid as shown in FIG. There is a way.

【０００４】[0004]

【発明が解決しようとする課題】図１９に示すように、
上述の取り出し方法では、洗浄液表面１３に洗浄過程で
生じた多数の異物８０が浮いているため、ウエハ２００
が液表面１３を通過する時に、ウエハ２００表面に異物
８０が付着することとなる。かかる異物８０の付着は、
製造歩留まりの低下を招き、特に、高集積化された超Ｌ
ＳＩや液晶パネルの洗浄工程においては大きな問題とな
っていた。そこで、本発明は、被洗浄物を洗浄槽から取
り出す工程における被洗浄物表面への異物の付着を防止
することを目的とする。As shown in FIG.
In the above-described removal method, since a large number of foreign substances 80 generated in the cleaning process float on the cleaning liquid surface 13, the wafer 200
When the liquid passes through the liquid surface 13, foreign matter 80 adheres to the surface of the wafer 200. Such adhesion of the foreign matter 80
In particular, a highly integrated ultra-L
This has been a major problem in the process of cleaning SI and liquid crystal panels. Accordingly, an object of the present invention is to prevent foreign matter from adhering to the surface of the object to be cleaned in the step of removing the object to be cleaned from the cleaning tank.

【０００５】[0005]

【課題を解決するための手段】そこで、発明者らは鋭意
研究の結果、従来の洗浄装置で被洗浄物を洗浄した場
合、洗浄槽下方部から供給された洗浄液が、洗浄槽上端
の越流部を越えて溢れるにもかかわらず、被洗浄物上方
の洗浄液表面の中央近傍では、異物が洗浄液とともに排
出されることなく滞留していることを見出し、かかる異
物が滞留した領域の洗浄液を排出することにより、被洗
浄物を洗浄液から取り出す場合の被洗浄物表面への異物
の付着を防止できることを見出し、本発明を完成した。Accordingly, as a result of intensive studies, the present inventors have found that when an object to be cleaned is cleaned with a conventional cleaning apparatus, the cleaning liquid supplied from the lower portion of the cleaning tank overflows at the upper end of the cleaning tank. Despite overflowing beyond the portion, it is found that foreign matter stays without being discharged together with the cleaning liquid near the center of the surface of the cleaning liquid above the object to be cleaned, and the cleaning liquid in the area where such foreign matter has stayed is discharged. As a result, it has been found that foreign substances can be prevented from adhering to the surface of the object to be cleaned when the object to be cleaned is removed from the cleaning liquid, and the present invention has been completed.

【０００６】即ち、本発明は、第１に、洗浄槽内に被洗
浄物が配置され、該洗浄槽の底部から供給された洗浄液
を該洗浄槽の上部から溢れさせながら該被洗浄物が洗浄
される洗浄装置であって、該洗浄槽が、該洗浄槽に満た
された該洗浄液に該被洗浄物が浸漬されるように設けら
れた底面と側壁部とを備え、更に、該洗浄液から該被洗
浄物を取り出す前に、該被洗浄物が浸漬されている該洗
浄液の表層部を排出する排出手段を備えたことを特徴と
する洗浄装置である。かかる洗浄装置を用いることによ
り、洗浄槽内の洗浄液液表面に浮遊する異物を洗浄液と
共に洗浄槽外に効率良く排出することができ、洗浄液の
液表面を清浄な状態に保つことができる。従って、洗浄
液から被洗浄物を取り出す場合に、被洗浄物表面への異
物の付着を低減することができる。特に、超ＬＳＩや、
液晶パネル等の洗浄工程における異物の付着を低減する
ことにより、超ＬＳＩ等の製造歩留まりを向上させるこ
とが可能となる。That is, according to the present invention, first, an object to be cleaned is arranged in a cleaning tank, and the object to be cleaned is washed while overflowing a cleaning liquid supplied from the bottom of the cleaning tank from above the cleaning tank. The cleaning tank comprises a bottom surface and a side wall provided so that the object to be cleaned is immersed in the cleaning liquid filled in the cleaning tank, and further comprising: A cleaning apparatus, comprising: a discharge unit that discharges a surface portion of the cleaning liquid in which the object to be cleaned is immersed before removing the object to be cleaned. By using such a cleaning device, foreign substances floating on the surface of the cleaning liquid in the cleaning tank can be efficiently discharged out of the cleaning tank together with the cleaning liquid, and the liquid surface of the cleaning liquid can be kept in a clean state. Therefore, when removing the object to be cleaned from the cleaning liquid, it is possible to reduce the adhesion of foreign substances to the surface of the object to be cleaned. In particular, VLSI,
By reducing the adhesion of foreign substances in the step of cleaning a liquid crystal panel or the like, it becomes possible to improve the production yield of VLSI and the like.

【０００７】本発明は、上記排出手段が、上記洗浄槽の
上記側壁部の一部からなり、該側壁部の一部を動かし
て、その上端部を他の側壁部より低くなるようにし、該
低くした側壁部を越えて上記洗浄液の表層部を排出する
ものでもある。側壁部が、垂直方向に下がったり、外方
に傾いたりする洗浄装置を用いることにより、洗浄槽内
の洗浄液液表面に浮遊する異物を容易に洗浄槽外に出す
ることができるからである。According to the present invention, the discharging means comprises a part of the side wall of the cleaning tank, and a part of the side wall is moved so that an upper end thereof is lower than other side walls. The surface layer of the cleaning liquid is discharged beyond the lowered side wall. By using a cleaning device in which the side wall portion is lowered in the vertical direction or tilted outward, foreign matters floating on the surface of the cleaning liquid in the cleaning tank can be easily taken out of the cleaning tank.

【０００８】上記洗浄槽が平らな側壁部を四方に備えた
有底の容器で、上記排出手段が少なくとも一の該側壁部
からなり、該一の側壁部を略垂直方向に下げて上記洗浄
液の表層部を排出することが好ましい。少なくとも一の
側壁部が垂直方向に動く洗浄装置を用いることによっ
て、洗浄槽内の洗浄液液表面に浮遊する異物を容易に洗
浄槽外に排出することができるからである。The washing tank is a bottomed container provided with flat side walls on all sides, and the discharge means comprises at least one of the side walls, and the one side wall is lowered in a substantially vertical direction to remove the cleaning liquid. It is preferable to discharge the surface layer. By using the cleaning device in which at least one side wall portion moves in the vertical direction, foreign matters floating on the surface of the cleaning liquid in the cleaning tank can be easily discharged out of the cleaning tank.

【０００９】上記排出手段は、上記一の側壁部の一部か
らなり、該一の側壁部の一部を略垂直方向に下げて上記
洗浄液の表層部を排出するものであっても良い。側壁部
の一部のみを動かすことにより、小さな動きだけで効率
良く洗浄液の表層部の排出ができるからである。[0009] The discharge means may be a part of the one side wall part, and lower the part of the one side wall part in a substantially vertical direction to discharge the surface layer of the cleaning liquid. This is because, by moving only a part of the side wall, the surface layer of the cleaning liquid can be efficiently discharged with only a small movement.

【００１０】上記洗浄槽が平らな側壁部を四方に備えた
有底の容器で、上記排出手段が少なくとも一の該側壁部
からなり、該一の側壁部を外方に倒して上記洗浄液の表
層部を排出することが好ましい。側壁部を外方に倒すこ
とによっても、比較的簡単な構造で、洗浄液の表層部を
排出することができるからである。The washing tank is a bottomed container provided with flat side walls on all sides, and the discharge means comprises at least one of the side walls, and the one side wall is turned outward to form a surface layer of the cleaning liquid. It is preferred to discharge the part. This is because the surface layer of the cleaning liquid can be discharged with a relatively simple structure even when the side wall is turned outward.

【００１１】上記排出手段は、上記一の側壁部の一部か
らなり、該一の側壁部の一部を外方に倒して上記洗浄液
の表層部を排出するものであっても良い。側壁部の一部
のみを倒すことにより、小さな動きだけで効率良く洗浄
液の表層部の排出ができるからである。The discharge means may be a part of the one side wall part, and the part of the one side wall part may be tilted outward to discharge the surface layer of the cleaning liquid. This is because the surface layer of the cleaning liquid can be efficiently discharged with only a small movement by tilting only a part of the side wall.

【００１２】上記側壁部の一部は、その上端部が上記洗
浄槽内に配置された上記被洗浄物の下端より低い位置ま
で下がるようにしても良い。かかる洗浄装置を用いるこ
とにより、洗浄液の上層部の排出工程と連続して被洗浄
物の取り出しも可能となり、洗浄工程の簡略化が可能と
なる。A part of the side wall may have an upper end lowered to a position lower than a lower end of the object to be cleaned disposed in the cleaning tank. By using such a cleaning apparatus, the object to be cleaned can be taken out continuously from the step of discharging the upper layer of the cleaning liquid, and the cleaning step can be simplified.

【００１３】上記排出手段は、上記洗浄液の表層部を排
出するように設けられた導管からなるものでもある。か
かる手段を用いることにより、比較的簡単な構造で、洗
浄液の上層部の排出が可能となるからである。[0013] The discharge means may comprise a conduit provided to discharge a surface portion of the cleaning liquid. By using such a means, the upper layer of the cleaning liquid can be discharged with a relatively simple structure.

【００１４】上記導管は、上記洗浄槽内に、上記洗浄液
の表面近傍から下方に延び、該洗浄槽の底部に設けられ
た開口部に接続され、該導管を通して該洗浄液の表層部
を該洗浄槽外に排出してなることが好ましい。The conduit extends downward from the vicinity of the surface of the cleaning liquid into the cleaning tank, is connected to an opening provided at the bottom of the cleaning tank, and connects the surface layer of the cleaning liquid to the cleaning tank through the conduit. Preferably, it is discharged outside.

【００１５】上記導管は、上記洗浄槽の外に設けられ
て、かつ吸引手段を備え、該導管を通して上記洗浄液の
表層部を吸引し、該洗浄槽外に排出してなることが好ま
しい。[0015] It is preferable that the conduit is provided outside the cleaning tank and is provided with a suction means, and the surface layer of the cleaning liquid is suctioned through the conduit and discharged out of the cleaning tank.

【００１６】上記導管は、上記洗浄槽に対して垂直方向
及び／又は水平方向に移動できることが好ましい。被洗
浄物の取り出しを容易にするためである。Preferably, the conduit is movable in a vertical and / or horizontal direction with respect to the cleaning tank. This is for facilitating removal of the object to be cleaned.

【００１７】本発明は、第２に、洗浄槽内に被洗浄物を
配置し、該洗浄槽の底部から洗浄液を供給し、該洗浄槽
内の該被洗浄物を浸漬した該洗浄液を該洗浄槽の上部か
ら溢れさせながら該被洗浄物を洗浄する洗浄方法であっ
て、該被洗浄物の洗浄後に、該洗浄槽に残った該洗浄液
の表層部を排出する排出工程と、該洗浄液から該被洗浄
物を取り出す工程とを備えることを特徴とする洗浄方法
である。かかる洗浄方法を用いることにより、洗浄槽内
の洗浄液液表面に浮遊する異物を洗浄液と共に洗浄槽外
に効率良く排出することができ、洗浄液の液表面を清浄
な状態に保つことができ、洗浄液から被洗浄物を取り出
す工程における、被洗浄物表面への異物の付着を低減す
ることができる。In the present invention, second, an object to be cleaned is disposed in a cleaning tank, a cleaning liquid is supplied from the bottom of the cleaning tank, and the cleaning liquid in which the object to be cleaned is immersed in the cleaning tank is subjected to the cleaning. A washing method for washing the object to be washed while overflowing from an upper part of a tank, wherein after the object to be washed is washed, a discharging step of discharging a surface layer portion of the washing liquid remaining in the washing tank; Removing the object to be cleaned. By using such a cleaning method, foreign substances floating on the surface of the cleaning liquid in the cleaning tank can be efficiently discharged out of the cleaning tank together with the cleaning liquid, and the liquid surface of the cleaning liquid can be maintained in a clean state. In the step of taking out the object to be cleaned, adhesion of foreign matter to the surface of the object to be cleaned can be reduced.

【００１８】上記排出工程は、上記洗浄槽の側壁部の一
部の上端部を、他の側壁部より低くして、当該低くした
側壁部を越えて上記洗浄液の表層部を排出する工程であ
ることが好ましい。かかる工程により、容易に、洗浄液
の表層部のみを排出することができるからである。The draining step is a step of lowering the upper end of a part of the side wall of the cleaning tank from the other side wall and discharging the surface layer of the cleaning liquid over the lowered side wall. Is preferred. This is because by such a step, only the surface layer portion of the cleaning liquid can be easily discharged.

【００１９】上記排出工程は、平らな側壁部を四方に備
えた有底の容器からなる上記洗浄槽の少なくとも一の該
側壁部を略垂直方向に下げて、該洗浄液の表層部を排出
する工程であっても良い。The discharging step is a step of lowering at least one of the side walls of the cleaning tank, which is a bottomed container having flat side walls on all sides, in a substantially vertical direction, and discharging the surface layer of the cleaning liquid. It may be.

【００２０】上記排出工程は、上記一の側壁部の一部の
みを略垂直方向に下げる工程でも良い。The discharging step may be a step of lowering only a part of the one side wall in a substantially vertical direction.

【００２１】上記排出工程は、平らな側壁部を四方に備
えた有底の容器からなる上記洗浄槽の少なくとも一の該
側壁部を外方に倒して、上記洗浄液の表層部を排出する
工程であっても良い。In the discharging step, at least one of the side walls of the cleaning tank having a bottomed container having flat side walls on all sides is tilted outward to discharge the surface layer of the cleaning liquid. There may be.

【００２２】上記排出工程は、上記一の側壁部の一部の
みを外方に倒す工程でも良い。The discharging step may be a step in which only one part of the one side wall is outwardly tilted.

【００２３】上記排出工程は、上記洗浄槽の側壁部の一
部の上端部を、該洗浄槽内に配置された上記被洗浄物よ
り低い位置まで下げて、上記洗浄液を排出する工程であ
っても良い。かかる工程を用いることにより、洗浄液の
上層部の排出工程と、被洗浄物の取り出し工程とを一の
工程で行うことができ、洗浄工程の短縮、簡略化が可能
となる。The discharging step is a step of discharging the cleaning liquid by lowering the upper end of a part of the side wall of the cleaning tank to a position lower than the object to be cleaned disposed in the cleaning tank. Is also good. By using such a step, the step of discharging the upper layer of the cleaning liquid and the step of removing the object to be cleaned can be performed in one step, and the cleaning step can be shortened and simplified.

【００２４】上記排出工程は、導管を通して上記洗浄液
の表層部を排出する工程であることが好ましい。かかる
工程を用いることにより、比較的簡単な工程で、洗浄液
の表層部を排出することが可能となるからである。Preferably, the discharging step is a step of discharging a surface layer of the cleaning liquid through a conduit. By using such a process, it is possible to discharge the surface layer of the cleaning liquid by a relatively simple process.

【００２５】上記排出工程は、上記洗浄液の表面近傍か
ら下方に延びて、該洗浄槽の底部に設けられた開口部に
接続された上記導管を通して、該洗浄液の表層部を排出
する工程であっても良い。The discharging step is a step of discharging the surface layer of the cleaning liquid through the conduit extending downward from near the surface of the cleaning liquid and connected to an opening provided at the bottom of the cleaning tank. Is also good.

【００２６】上記排出工程は、上記洗浄槽の外に設けら
れ、かつ吸引手段を備えた上記導管を通して、上記洗浄
液の表層部を吸引して排出する工程であっても良い。The discharging step may be a step of sucking and discharging the surface layer portion of the cleaning liquid through the conduit provided outside the cleaning tank and provided with a suction means.

【００２７】更に、上記導管を、上記洗浄槽に対して垂
直方向及び／又は水平方向に移動させる工程を備えるも
のであっても良い。被洗浄物の取り出しを容易にするた
めである。Further, the method may include a step of moving the conduit in a vertical direction and / or a horizontal direction with respect to the cleaning tank. This is for facilitating removal of the object to be cleaned.

【００２８】[0028]

【発明の実施の形態】発明者らは、洗浄装置からウエハ
２００等の被洗浄物を取り出す場合に、被洗浄物表面に
異物が付着する原因を探るため、被洗浄物の洗浄時に発
生する異物について検討し、以下の知見を得た。即ち、
図１６に示す従来の洗浄装置を用いてウエハ２００を洗
浄した場合、洗浄槽１１内やウエハ２００の裏面などに
付着していた異物が洗浄中に剥がれ、洗浄液中に浮遊す
る。かかる異物について詳細に検討した結果、異物は、
洗浄液より密度が小さく洗浄液表面に浮く異物８０、洗
浄液と密度がほぼ同じであるため洗浄液中に漂う異物８
１、洗浄液より密度が大きく洗浄槽の底部に沈む異物８
２からなり、異物８０と異物８２が比較的多く、異物８
１は少量であることがわかった。このため、洗浄液中の
異物の数は、洗浄液表面および洗浄槽の底面で最も多く
なることがわかった。特に、洗浄槽１１の底部から供給
された洗浄液が、洗浄槽上端の越流部を越えて溢れるに
もかかわらず、ウエハ２００上方の洗浄液表面１３の中
央近傍では、異物８０が洗浄液とともに排出されること
なく滞留していることがわかった。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The inventors of the present invention have found that when an object to be cleaned such as a wafer 200 is taken out of a cleaning apparatus, foreign matter generated during cleaning of the object to be cleaned is investigated in order to investigate the cause of foreign matter adhering to the surface of the object to be cleaned. And the following findings were obtained. That is,
When the wafer 200 is cleaned using the conventional cleaning apparatus shown in FIG. 16, foreign matter adhering to the inside of the cleaning tank 11 or the back surface of the wafer 200 is peeled off during the cleaning and floats in the cleaning liquid. As a result of a detailed study of such foreign matter,
Foreign matter 80 having a smaller density than the cleaning liquid and floating on the surface of the cleaning liquid, and foreign matter 8 floating in the cleaning liquid because the density is substantially the same as that of the cleaning liquid
1. Foreign matter having a density higher than that of the cleaning liquid and sinking at the bottom of the cleaning tank 8
2, the foreign matter 80 and the foreign matter 82 are relatively large, and the foreign matter 8
1 was found to be small. For this reason, it was found that the number of foreign substances in the cleaning liquid was largest on the surface of the cleaning liquid and on the bottom of the cleaning tank. In particular, the foreign matter 80 is discharged together with the cleaning liquid near the center of the cleaning liquid surface 13 above the wafer 200 even though the cleaning liquid supplied from the bottom of the cleaning tank 11 overflows over the overflow portion at the upper end of the cleaning tank. It was found that they were staying without.

【００２９】また、発明者らは、被洗浄物表面への異物
の付着メカニズムについても検討した結果、以下のよう
な知見を得た。図２０は、洗浄液中からウエハ２００を
取り出し時のウエハ２００近傍の洗浄液および異物の挙
動を示した概略図である。図２０は、ウエハ２００の取
り出し時に洗浄液を洗浄槽から排液する場合について示
すが、ウエハ２００自身を洗浄液中から引き上げて取り
出す場合も同様のメカニズムである。即ち、ウエハ２０
０を洗浄液中から取り出す場合、ウエハ２００は洗浄液
液表面１３を必ず通過するが、上記検討結果が示すよう
に、洗浄液表面１３には多数の異物８０が存在する。従
って、ウエハ２００が洗浄液の液表面１３を通過する時
にウエハ２００表面には洗浄液が付着し、この付着した
洗浄液中には、洗浄液液表面１３に浮遊していた異物が
多数存在することとなる。このため、洗浄液中からウエ
ハ２００を取り出し後、洗浄液の液滴を乾燥、除去した
場合、ウエハ２００表面には異物８０が多数残留するこ
ととなる。The inventors have also studied the mechanism of adhesion of foreign matter to the surface of the object to be cleaned, and have obtained the following findings. FIG. 20 is a schematic diagram showing the behavior of the cleaning liquid and foreign matter near the wafer 200 when the wafer 200 is taken out of the cleaning liquid. FIG. 20 shows a case where the cleaning liquid is drained from the cleaning tank when the wafer 200 is taken out. However, the same mechanism is applied to the case where the wafer 200 itself is pulled up from the cleaning liquid and taken out. That is, the wafer 20
When 0 is taken out of the cleaning liquid, the wafer 200 always passes through the cleaning liquid surface 13, but as shown in the above examination results, a large number of foreign substances 80 exist on the cleaning liquid surface 13. Therefore, when the wafer 200 passes over the surface 13 of the cleaning liquid, the cleaning liquid adheres to the surface of the wafer 200, and a large number of foreign substances floating on the surface 13 of the cleaning liquid are present in the adhered cleaning liquid. Therefore, if the droplets of the cleaning liquid are dried and removed after the wafer 200 is taken out of the cleaning liquid, many foreign substances 80 remain on the surface of the wafer 200.

【００３０】本発明は、かかる知見に基づいてなされた
もので、異物８０を含む洗浄槽上部の洗浄液を予め排出
することにより、被洗浄物を洗浄液中から取り出す時に
発生する被洗浄物への異物８０の付着を防止するための
洗浄装置及び洗浄方法を提供するものである。以下、そ
の具体的な実施の形態について、図を参照しながら説明
する。The present invention has been made on the basis of the above findings. By discharging the cleaning liquid in the upper part of the cleaning tank containing the foreign matter 80 in advance, the foreign matter to the object to be cleaned generated when the object to be cleaned is taken out of the cleaning liquid is removed. It is intended to provide a cleaning device and a cleaning method for preventing adhesion of 80. Hereinafter, specific embodiments thereof will be described with reference to the drawings.

【００３１】実施の形態１．本発明の一の実施の形態に
ついて、図１〜６を参照しながら説明する。図１は、本
実施の形態にかかる洗浄装置の概略図であり、図中、図
１６と同一符号は、同一又は相当箇所を示す。本洗浄装
置は、例えばウエハ２００等の被洗浄物を、薬液及び純
水からなる洗浄液、又は純水のみからなる洗浄液に浸漬
して洗浄するものである。薬液としては、例えば、フッ
化水素酸、アンモニア、塩酸等が必要に応じて用いられ
る。Embodiment 1 One embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic diagram of a cleaning apparatus according to the present embodiment, in which the same reference numerals as in FIG. 16 indicate the same or corresponding parts. In the present cleaning apparatus, for example, an object to be cleaned such as a wafer 200 is immersed in a cleaning liquid composed of a chemical solution and pure water or a cleaning liquid composed only of pure water for cleaning. As the chemical, for example, hydrofluoric acid, ammonia, hydrochloric acid, or the like is used as needed.

【００３２】洗浄装置は、ウエハ２００を収納するため
の洗浄槽１１を備える、洗浄槽１１は、一般には、上面
が開放され、平らな側壁部を四方に備えた有底の容器で
あり、直方体形状からなるが、ウエハ２００を収容し洗
浄を行えるものであれば、他の形状であっても構わな
い。The cleaning apparatus includes a cleaning tank 11 for accommodating the wafer 200. The cleaning tank 11 is generally a bottomed container having an open upper surface and flat side walls on all sides. Although it has a shape, any other shape may be used as long as it can accommodate and clean the wafer 200.

【００３３】洗浄槽１１は、側面の全周囲が洗浄槽側壁
２１で構成されるが、少なくとも１の洗浄槽側壁２１
は、可動側壁３５で置き換えられている。本実施の形態
では、図１の左側面のみ可動側壁３５で置き換えられて
いる。なお、洗浄槽側壁２１のうち、可動側壁３５の占
める割合はどのような割合であってもよい。例えば、洗
浄槽１１の形状が上面が開放された直方体形状であれ
ば、図２、３に示すように、任意の洗浄槽側壁２１の一
部、あるいは図１に示すように、直方体の一面ないし複
数面、更には全面を可動側壁３５に代えてもよい。図２
は洗浄槽側壁２１の一面において、さらに一部を可動側
壁３５とした場合の例である。このように、洗浄槽側壁
２１を可動側壁３５に置き換える割合は任意でよい。ま
た、図３のように、洗浄槽側壁２１の上部のみを可動側
壁３５に置き換えてもよい。即ち、洗浄槽１１の形状や
洗浄の条件などに合わせて最適な箇所を可動側壁３５と
すればよい。The cleaning tank 11 has a cleaning tank side wall 21 around the entire side surface, but at least one cleaning tank side wall 21.
Is replaced by a movable side wall 35. In the present embodiment, only the left side surface of FIG. The ratio of the movable side wall 35 in the cleaning tank side wall 21 may be any ratio. For example, if the shape of the cleaning tank 11 is a rectangular parallelepiped shape having an open upper surface, as shown in FIGS. 2 and 3, a part of an arbitrary cleaning tank side wall 21, or as shown in FIG. A plurality of surfaces, and moreover, the entire surface may be replaced with the movable side wall 35. FIG.
Is an example of a case in which one part of the cleaning tank side wall 21 is formed as a movable side wall 35. As described above, the ratio of replacing the cleaning tank side wall 21 with the movable side wall 35 may be arbitrary. Further, as shown in FIG. 3, only the upper portion of the cleaning tank side wall 21 may be replaced with the movable side wall 35. That is, the movable sidewall 35 may be formed at an optimum location in accordance with the shape of the cleaning tank 11 and the cleaning conditions.

【００３４】洗浄槽側壁２１及び可動側壁３５の上端
は、洗浄液を越流させるための越流部１７及び可動側壁
越流部２５となっている。又、洗浄槽１１の下部には、
洗浄液供給用配管７０を通じて洗浄液を洗浄槽１１内に
供給するための洗浄液供給口１４、洗浄液を排液用配管
７１から排出するための洗浄槽内排液口１８が夫々設け
られている。The upper ends of the cleaning tank side wall 21 and the movable side wall 35 form an overflow section 17 and a movable side wall overflow section 25 for overflowing the cleaning liquid. Also, in the lower part of the cleaning tank 11,
A cleaning liquid supply port 14 for supplying the cleaning liquid into the cleaning tank 11 through the cleaning liquid supply pipe 70 and a drain port 18 in the cleaning tank for discharging the cleaning liquid from the drain pipe 71 are provided.

【００３５】次に、図４を参照しながら洗浄方法につい
て説明する。図４中、図１６と同一符号は、同一又は相
当箇所を示す。まず、ウエハ２００を洗浄する工程で
は、図１に示すように可動側壁越流部２５の高さを洗浄
槽側壁２１の上部に配置された越流部１７と同等の高さ
に移動させておく。ここで、越流部１７および可動側壁
越流部２５の高さは、ウエハ２００を洗浄槽１１内に配
置し、洗浄液で満たした場合に、ウエハ２００の全面が
洗浄液に浸るように、ウエハ２００の上端のより高い位
置とする。Next, the cleaning method will be described with reference to FIG. 4, the same reference numerals as those in FIG. 16 indicate the same or corresponding parts. First, in the step of cleaning the wafer 200, as shown in FIG. 1, the height of the movable side wall overflow portion 25 is moved to the same height as the overflow portion 17 arranged above the cleaning tank side wall 21. . Here, the heights of the overflow section 17 and the movable side wall overflow section 25 are set such that the entire surface of the wafer 200 is immersed in the cleaning liquid when the wafer 200 is placed in the cleaning tank 11 and filled with the cleaning liquid. Higher than the top of.

【００３６】次に、洗浄槽１１の下部に配置された洗浄
液供給口１４より、薬液および純水からなる洗浄液、又
は純水のみからなる洗浄液が連続的に洗浄槽１１の中に
供給される。これらの液は、洗浄槽１１の上部の越流部
１７及び可動側壁越流部２５を越えて、洗浄槽１１内か
ら排液される。かかる工程において、洗浄槽１１中に配
置されたウエハ２００が、洗浄液により洗浄されること
となる。Next, a cleaning liquid consisting of a chemical solution and pure water or a cleaning liquid consisting only of pure water is continuously supplied into the cleaning tank 11 from a cleaning liquid supply port 14 arranged below the cleaning tank 11. These liquids are discharged from the inside of the cleaning tank 11 over the overflow section 17 and the movable side wall overflow section 25 on the upper part of the cleaning tank 11. In this step, the wafer 200 placed in the cleaning tank 11 is cleaned by the cleaning liquid.

【００３７】ウエハ２００の洗浄時には、洗浄槽１１内
やウエハ２００の裏面などに付着していた異物が剥が
れ、洗浄液中に浮遊し、洗浄液表面に浮かぶ異物８０、
洗浄液中に留まる異物８１、洗浄液底部に沈降する異物
８２となる。特に、洗浄液液表面１３には、多数の異物
８０が存在することになる。なお、異物８０は主にウエ
ハ２００の微細なかけらや前工程までの生成物等からな
る。At the time of cleaning the wafer 200, the foreign substances adhering to the inside of the cleaning tank 11 and the back surface of the wafer 200 are peeled off, float in the cleaning liquid, and float on the cleaning liquid surface.
The foreign matter 81 remains in the cleaning liquid and the foreign matter 82 settles at the bottom of the cleaning liquid. In particular, many foreign substances 80 are present on the cleaning liquid surface 13. The foreign matter 80 is mainly composed of fine fragments of the wafer 200 and products up to the previous step.

【００３８】次に、ウエハ２００の洗浄が終了した後、
洗浄液を洗浄槽１１内に供給しつつ、可動側壁３５を下
げることにより、可動側壁越流部２５を洗浄液液表面１
３に対して相対的に下降させる。この結果、洗浄液液表
面１３近傍の洗浄液は、下降させた可動側壁越流部２５
方向へ流れることとなる。特に、可動側壁越流部２５と
洗浄液液表面１３との高さの差を大きくするほど、洗浄
液は多量に可動側壁越流部２５から越流することにな
る。かかる工程により、洗浄液液表面１３に浮遊した異
物８０は可動側壁越流部２５を越えて洗浄槽１１外に排
出され、洗浄液液表面１３は異物８０の殆どない清浄な
状態となる。なお、洗浄液供給口１４からの洗浄液の供
給は、洗浄後も連続して行ってもよいが、洗浄液の使用
量を節約するため、可動側壁３５下降時に洗浄液の供給
を止めても構わない。Next, after the cleaning of the wafer 200 is completed,
By lowering the movable side wall 35 while supplying the cleaning liquid into the cleaning tank 11, the movable side wall overflow portion 25 is moved to the cleaning liquid surface 1.
Lower relative to 3. As a result, the cleaning liquid in the vicinity of the cleaning liquid surface 13 is moved downward by the movable side wall overflowing portion 25.
It will flow in the direction. In particular, as the height difference between the movable side wall overflow section 25 and the cleaning liquid surface 13 increases, a larger amount of cleaning liquid overflows from the movable side wall overflow section 25. By this process, the foreign matter 80 floating on the cleaning liquid surface 13 is discharged to the outside of the cleaning tank 11 over the movable side wall overflow portion 25, and the cleaning liquid surface 13 is in a clean state with almost no foreign matter 80. The supply of the cleaning liquid from the cleaning liquid supply port 14 may be performed continuously after the cleaning, but the supply of the cleaning liquid may be stopped when the movable side wall 35 descends in order to save the usage amount of the cleaning liquid.

【００３９】その後、移送ロボットを使用して、又は洗
浄液の排液用配管７１から洗浄液を排出した後に、洗浄
液中からウエハ２００を取り出す。図５は、本実施の形
態において、洗浄液中からウエハ２００を取り出す場合
の、ウエハ２００近傍の洗浄液及び異物の挙動を説明す
るための概略図である。上述のように、ウエハ２００を
洗浄液中からの取り出す場合には、ウエハ２００は洗浄
液液表面１３を必ず通過し、ウエハ２００表面に洗浄液
が付着する。しかしながら、本実施の形態にかかる洗浄
方法では、洗浄液液表面１３は、異物８０の殆どない清
浄な状態に保たれているため、ウエハ２００上への異物
８０の付着はほとんどない。Thereafter, the wafer 200 is taken out of the cleaning liquid using a transfer robot or after discharging the cleaning liquid from the cleaning liquid drain pipe 71. FIG. 5 is a schematic diagram for explaining the behavior of the cleaning liquid and foreign matter near the wafer 200 when the wafer 200 is taken out from the cleaning liquid in the present embodiment. As described above, when taking out the wafer 200 from the cleaning liquid, the wafer 200 always passes through the cleaning liquid surface 13 and the cleaning liquid adheres to the surface of the wafer 200. However, in the cleaning method according to the present embodiment, since the cleaning liquid surface 13 is kept in a clean state with almost no foreign matter 80, the foreign matter 80 hardly adheres to the wafer 200.

【００４０】なお、上記洗浄方法では、可動側壁３５の
下降を一度行う場合について述べたが、より洗浄液液表
面１３を清浄な状態にするためには、可動側壁３５の下
降を複数回行ってもよい。即ち、可動側壁３５の下降を
行った後、再び可動側壁３５を上昇させ、可動側壁越流
部２５が越流部１７と同等の高さになるようにする。洗
浄液を洗浄槽１１内に供給することで、再び洗浄液は洗
浄槽１１内に満たされる。洗浄液が洗浄槽１１内に満た
された後、再度可動側壁３５を下降させる。これによ
り、洗浄液液表面１３の洗浄液は、下降させた可動側壁
越流部２５方向へ流れ、洗浄液液表面１３に浮遊した異
物８０は、洗浄液とともに可動側壁越流部２５より洗浄
槽１１外に排出され、洗浄液液表面１３はさらに清浄な
状態になる。可動側壁３５を上下する回数は、異物８０
の量を考慮して、任意に設定してよい。In the above-described cleaning method, the case where the movable side wall 35 is lowered once has been described. However, in order to make the cleaning liquid surface 13 more clean, the movable side wall 35 may be lowered a plurality of times. Good. That is, after the movable side wall 35 is lowered, the movable side wall 35 is raised again so that the movable side wall overflowing portion 25 becomes the same height as the overflowing portion 17. By supplying the cleaning liquid into the cleaning tank 11, the cleaning liquid is filled in the cleaning tank 11 again. After the cleaning liquid is filled in the cleaning tank 11, the movable side wall 35 is lowered again. As a result, the cleaning liquid on the cleaning liquid surface 13 flows toward the lowered movable side wall overflowing portion 25, and the foreign matter 80 floating on the cleaning liquid surface 13 is discharged from the movable side wall overflowing portion 25 to the outside of the cleaning tank 11 together with the cleaning liquid. As a result, the cleaning liquid surface 13 is further cleaned. The number of times the movable side wall 35 moves up and down
May be arbitrarily set in consideration of the amount of

【００４１】更に、洗浄液液表面１３の洗浄液の排出
は、可動側壁３５を洗浄槽１１の他の側壁に対して相対
的に下降させればよいため、上記実施の形態で、可動側
壁３５に相当する側壁を固定し、その他の３つの側壁を
上昇させても、同等の効果が得られる。Further, since the cleaning liquid on the cleaning liquid surface 13 can be discharged by lowering the movable side wall 35 relatively to the other side wall of the cleaning tank 11, this corresponds to the movable side wall 35 in the above embodiment. Even if the side wall to be fixed is fixed and the other three side walls are raised, the same effect can be obtained.

【００４２】また、可動側壁３５は、同一速度で下降さ
せる必要はなく、洗浄槽１１内の流れが最適になるよう
下降速度を時間に対して変化させてもよい。可動側壁３
５の下降速度の最適値は、ウエハ２００や洗浄槽１１の
寸法などに依存するため、その都度設定する必要があ
る。ただし、異物８０が洗浄槽１１内から排出される前
に、洗浄液液表面１３がウエハ２００上端まで到達しな
いように設定する必要がある。下降速度を時間に対して
変化させることで、同一の下降速度の場合より、効率よ
く異物８０を排出できることとなる。It is not necessary to lower the movable side wall 35 at the same speed, and the lowering speed may be changed with time so that the flow in the cleaning tank 11 is optimized. Movable side wall 3
Since the optimum value of the descending speed of 5 depends on the dimensions of the wafer 200 and the cleaning tank 11, it is necessary to set each time. However, it is necessary to set the cleaning liquid surface 13 so as not to reach the upper end of the wafer 200 before the foreign matter 80 is discharged from the cleaning tank 11. By changing the descending speed with respect to time, the foreign substances 80 can be discharged more efficiently than in the case of the same descending speed.

【００４３】更に、複数の可動側壁３５が存在する場合
には、可動側壁３５の可動機構も複数あってもよい。図
６は、複数の可動側壁３５を設けた場合の洗浄装置の概
略図であり、図中、図１６と同一符号は、同一又は相当
箇所を示す。図６では、左右両方の側壁部が可動側壁３
５となっている。このように、複数の可動側壁３５を設
ける場合には、各々の可動側壁３５に対して個別の可動
機構を設け、各々の可動側壁３５の下降速度を任意に設
定できるようにしてもよい。このようにすることで、単
独の可動機構の場合より、さらに効率の良い異物８０の
除去条件を設定することができる。Further, when there are a plurality of movable side walls 35, there may be a plurality of movable mechanisms of the movable side walls 35. FIG. 6 is a schematic diagram of a cleaning apparatus provided with a plurality of movable side walls 35. In the drawing, the same reference numerals as those in FIG. 16 indicate the same or corresponding parts. In FIG. 6, both the left and right side walls are movable side walls 3.
It is 5. As described above, when a plurality of movable side walls 35 are provided, an individual movable mechanism may be provided for each movable side wall 35 so that the descending speed of each movable side wall 35 can be arbitrarily set. By doing so, it is possible to set conditions for removing the foreign matter 80 more efficiently than in the case of a single movable mechanism.

【００４４】なお、異物８０を除去するために必要とな
る洗浄液液表面１３の洗浄液の排出量は、洗浄槽１１の
容積等によっても異なるが、例えば、一辺が３０ｃｍ程
度の立方体からなる洗浄槽１１を用いる場合には、洗浄
液表面１３から、深さ１ｃｍ程度の洗浄液を除去できれ
ば足りると考えられる。The discharge amount of the cleaning liquid on the cleaning liquid surface 13 required for removing the foreign matter 80 varies depending on the volume of the cleaning tank 11 and the like. For example, the cleaning tank 11 is formed of a cube having a side of about 30 cm. In the case of using, it is considered sufficient if the cleaning liquid having a depth of about 1 cm can be removed from the cleaning liquid surface 13.

【００４５】実施の形態２．本発明の他の実施の形態に
ついて、図７を参照しながら説明する。可動側壁３５
は、洗浄槽１１の他の側壁部に対して相対的に下降させ
れば、洗浄液を排出することができるが、可動側壁３５
の移動は上下方向の移動のみでなく、可動側壁越流部２
５を洗浄槽１１の他の側壁部に対して相対的に下げるこ
とができれば、どのような方法であっても構わない。Embodiment 2 Another embodiment of the present invention will be described with reference to FIG. Movable side wall 35
If the cleaning liquid can be discharged by lowering the cleaning liquid relative to the other side wall of the cleaning tank 11, the movable side wall 35
Movement is not only vertical movement, but also movable side wall overflow 2
Any method may be used as long as it can be lowered relatively to the other side wall of the cleaning tank 11.

【００４６】図７は、可動側壁３５を可動させるための
他の具体例を説明するための概略図であり、図中、図１
９と同一符号は、同一又は相当箇所を示す。可動側壁３
５の下部には、可動側壁３５を外方に蝶番状に回転させ
るための回転軸４０が設けられている。FIG. 7 is a schematic diagram for explaining another specific example for moving the movable side wall 35. In FIG.
The same reference numerals as 9 indicate the same or corresponding parts. Movable side wall 3
At the lower part of 5, a rotating shaft 40 for rotating the movable side wall 35 outward in a hinge shape is provided.

【００４７】ウエハ２００を洗浄する場合には、可動側
壁３５は垂直方向に立てられ、洗浄液供給口１４から供
給された洗浄液は洗浄槽１１内に満たされる。ウエハ２
００の洗浄後、回転軸４０を中心にし、例えば、駆動用
のモーター等の手段により可動側壁３５を外方に倒すこ
とにより、可動側壁越流部２５の高さを下げ、洗浄槽１
１内の洗浄液を排出することができ、洗浄液表面１３の
異物８０も排出することができる。本実施の形態にかか
る洗浄装置では、実施の形態１に示した可動側壁２５を
上下方向に移動させる装置と比べて、より簡単に可動側
壁３５を動かすことができる。When cleaning the wafer 200, the movable side wall 35 is set up vertically, and the cleaning liquid supplied from the cleaning liquid supply port 14 fills the cleaning tank 11. Wafer 2
After the cleaning in step 00, the height of the movable side wall overflowing part 25 is lowered by tilting the movable side wall 35 outward by means of, for example, a driving motor or the like around the rotating shaft 40, and the cleaning tank 1 is cleaned.
1 can be discharged, and the foreign matter 80 on the cleaning liquid surface 13 can also be discharged. In the cleaning device according to the present embodiment, the movable side wall 35 can be moved more easily than the device that moves the movable side wall 25 in the up-down direction shown in the first embodiment.

【００４８】実施の形態３．本発明の他の実施の形態に
ついて、図８を参照しながら説明する。本実施の形態
は、実施の形態１の方法に、更に、ウエハ２００を洗浄
液中から取り出す機能を付加した方法に関するものであ
る。図８は、本実施の形態にかかる方法により、被洗浄
物を洗浄液中から取り出す場合の動作を説明する概略図
であり、図中、図１６と同一符号は、同一又は相当箇所
を示す。Embodiment 3 Another embodiment of the present invention will be described with reference to FIG. This embodiment relates to a method in which the function of taking out the wafer 200 from the cleaning liquid is added to the method of the first embodiment. FIG. 8 is a schematic diagram for explaining an operation when the object to be cleaned is taken out of the cleaning liquid by the method according to the present embodiment. In the figure, the same reference numerals as those in FIG. 16 indicate the same or corresponding parts.

【００４９】ウエハ２００の洗浄が実施された後、洗浄
槽１１に対して可動側壁３５をウエハの上端部が洗浄液
表面１３から出ない程度まで下降させることにより、洗
浄液は可動側壁越流部２５から越流し、洗浄槽１１内か
ら異物８０が排出される。ここで、洗浄液供給口１４か
らの洗浄液の供給は、洗浄後も連続して行ってもよい
が、洗浄液の使用量を節約するため、可動側壁３５下降
時に洗浄液の供給を止めても構わない。After the cleaning of the wafer 200, the movable side wall 35 is lowered with respect to the cleaning tank 11 so that the upper end of the wafer does not come out of the cleaning liquid surface 13, so that the cleaning liquid flows from the movable side wall overflowing section 25. Overflow, and foreign matter 80 is discharged from the cleaning tank 11. Here, the supply of the cleaning liquid from the cleaning liquid supply port 14 may be performed continuously after the cleaning, but the supply of the cleaning liquid may be stopped when the movable side wall 35 descends in order to save the usage amount of the cleaning liquid.

【００５０】本実施の形態にかかる方法では、まず、実
施の形態１と同様に、洗浄液液表面１３近傍の洗浄液を
排出することにより、異物８０を除去する。更に、本実
施の形態では、図８に示すように、可動側壁越流部２５
を更に下降させることにより、洗浄液を排出し、ウエハ
２００を洗浄液中から取り出す。In the method according to the present embodiment, first, as in the first embodiment, the foreign substance 80 is removed by discharging the cleaning liquid near the cleaning liquid surface 13. Further, in the present embodiment, as shown in FIG.
Is further lowered, the cleaning liquid is discharged, and the wafer 200 is taken out of the cleaning liquid.

【００５１】可動側壁３５の下降が終了した後、洗浄槽
１１の形状等によっては、洗浄槽１１底部に洗浄液が残
留している場合があるが、かかる場合はバルブ３３を開
いて洗浄槽内排液口１８から残留した洗浄液を排液して
もよい。この操作により、洗浄槽底面に沈降した異物８
２も排出することができる。After the lowering of the movable side wall 35 is completed, the cleaning liquid may remain at the bottom of the cleaning tank 11 depending on the shape and the like of the cleaning tank 11. In such a case, the valve 33 is opened to discharge the cleaning liquid into the cleaning tank 11. The cleaning liquid remaining from the liquid port 18 may be drained. By this operation, foreign matter 8 settled on the bottom of the washing tank 8
2 can also be discharged.

【００５２】このように、本実施の形態では、可動側壁
３５を移動させて異物８０を含む洗浄液を排出する工程
が、洗浄液を排出してウエハ２００を洗浄液中から取り
出す工程をも兼ねるため、ウエハ２００の取り出しに必
要な時間の短縮を図ることが可能となる。また、洗浄槽
底面の異物８２もすべて洗浄槽１１内から排出できるた
め、洗浄槽１１内を清浄に保つことができる。As described above, in the present embodiment, the step of moving the movable side wall 35 to discharge the cleaning liquid containing the foreign matter 80 also serves as the step of discharging the cleaning liquid and removing the wafer 200 from the cleaning liquid. It is possible to reduce the time required for taking out the 200. Further, since all the foreign substances 82 on the bottom of the cleaning tank can be discharged from the cleaning tank 11, the inside of the cleaning tank 11 can be kept clean.

【００５３】実施の形態４．本発明の他の実施の形態に
ついて、図９〜１１を参照しながら説明する。実施例１
においては、可動側壁を下降させることで、洗浄液の液
表面１３近傍の異物８０を選択的に洗浄槽１１外へ排出
させたが、本実施の形態では、洗浄液の液表面１３近傍
の洗浄液を、導管を用いて洗浄槽１１から排出する場合
について述べる。Embodiment 4 Another embodiment of the present invention will be described with reference to FIGS. Example 1
In the above, the foreign matter 80 near the liquid surface 13 of the cleaning liquid was selectively discharged to the outside of the cleaning tank 11 by lowering the movable side wall. In the present embodiment, the cleaning liquid near the liquid surface 13 of the cleaning liquid is The case of discharging from the cleaning tank 11 using a conduit will be described.

【００５４】図９は、本発明の実施の形態４にかかる洗
浄装置の概略図であり、図中、図１６と同一符号は、同
一又は相当箇所を示す。また、６１は、洗浄液液表面１
３の洗浄液を吸引するために設けられた導管の吸液口、
６０は、洗浄液を洗浄槽１１の外に吸引、排出するため
のポンプである。FIG. 9 is a schematic view of a cleaning apparatus according to Embodiment 4 of the present invention. In the figure, the same reference numerals as those in FIG. 16 indicate the same or corresponding parts. Reference numeral 61 denotes the cleaning liquid surface 1
A liquid suction port of a conduit provided for sucking the cleaning liquid of 3;
Reference numeral 60 denotes a pump for sucking and discharging the cleaning liquid out of the cleaning tank 11.

【００５５】上述のように、ウエハ２００を洗浄した場
合、ウエハ２００の上方の洗浄液液表面１３には異物８
０が浮遊し滞留している。本実施の形態では、洗浄液供
給口１４から洗浄液の供給を行いつつポンプ６０を運転
して、導管を通して洗浄液を吸引、排出する。As described above, when the wafer 200 is cleaned, the foreign matter 8 is present on the cleaning liquid surface 13 above the wafer 200.
0 floats and stays. In the present embodiment, the pump 60 is operated while supplying the cleaning liquid from the cleaning liquid supply port 14 to suck and discharge the cleaning liquid through the conduit.

【００５６】即ち、本実施の形態では、導管の吸液口６
１を洗浄液液表面１３の洗浄液を吸引するよう配置して
おく。この吸液口６１の配置位置は、洗浄液液表面１３
近傍であればどこでもよいが、異物８０の数が多い場所
へ移動することで、より効果的に異物８０を排出するこ
とができる。That is, in the present embodiment, the liquid suction port 6 of the conduit is used.
1 is arranged so that the cleaning liquid on the cleaning liquid surface 13 is sucked. The position of the liquid suction port 61 depends on the cleaning liquid surface 13.
Any location may be used as long as it is in the vicinity, but by moving to a place where the number of foreign substances 80 is large, the foreign substances 80 can be discharged more effectively.

【００５７】かかる状態で、ウエハ２００の洗浄後、洗
浄液液表面１３近傍の洗浄液を吸液口６１より吸引し、
導管を経て洗浄槽１１外に排出する。この時、同様に洗
浄液液表面１３に浮遊する異物８０も洗浄液とともに吸
引され、洗浄槽１１外に排出され、洗浄液液表面１３は
異物８０が無く清浄な状態に保たれる。In this state, after cleaning the wafer 200, the cleaning liquid in the vicinity of the cleaning liquid surface 13 is sucked from the liquid suction port 61,
It is discharged out of the washing tank 11 through a conduit. At this time, the foreign substances 80 floating on the cleaning liquid surface 13 are also sucked together with the cleaning liquid and discharged out of the cleaning tank 11, and the cleaning liquid surface 13 is kept clean without the foreign substances 80.

【００５８】この後に、バルブ３３を開き、洗浄槽内排
液口１８より洗浄槽１１内の洗浄液を排液し、又はウエ
ハ２００を移送ロボット等の移送手段により洗浄槽１１
内より引き上げることにより、ウエハ２００を洗浄液中
から取り出す。かかる取り出し工程では、洗浄液液表面
１３に異物８０が存在しないため、異物８０がウエハ２
００上に付着することはない。なお、洗浄液中からウエ
ハ２００を取り出す場合に、吸液口６１が邪魔になる場
合には、ウエハ２００の取り出し前に、邪魔にならない
位置まで吸液口６１を移動させておけばよい。Thereafter, the valve 33 is opened and the cleaning liquid in the cleaning tank 11 is drained from the drain port 18 in the cleaning tank, or the wafer 200 is transferred to the cleaning tank 11 by a transfer means such as a transfer robot.
The wafer 200 is taken out of the cleaning liquid by pulling it up from the inside. In the removal step, since the foreign matter 80 does not exist on the cleaning liquid surface 13, the foreign matter 80
It does not adhere to the top of the 00. If the liquid suction port 61 is in the way when removing the wafer 200 from the cleaning liquid, the liquid suction port 61 may be moved to a position where it does not interfere before taking out the wafer 200.

【００５９】なお、吸液手段は、洗浄液液表面１３近傍
の洗浄液を吸引することができるものであれば、どのよ
うな構成のものであってもよい。また、ここでは、ウエ
ハ２００の取り出し前に、洗浄液の吸引、排出を行う場
合について述べたが、この洗浄液の吸引は、洗浄液から
ウエハ２００を取り出す時にも連続して行っても良い。
更に、ロボット等の移送手段により、ウエハ２００を洗
浄液中から取り出す場合には、吸液口６１には可動手段
を設ける必要はないが、バルブ３３を開き、洗浄液を洗
浄槽１１中から排液することでウエハ２００を洗浄液中
から取り出す場合には、吸液口６１に可動手段を設けて
もよい。The liquid absorbing means may have any configuration as long as it can suck the cleaning liquid near the cleaning liquid surface 13. Further, here, the case where the cleaning liquid is suctioned and discharged before taking out the wafer 200 has been described. However, the suctioning of the cleaning liquid may be continuously performed when the wafer 200 is taken out from the cleaning liquid.
Further, when the wafer 200 is taken out of the cleaning liquid by a transfer means such as a robot, it is not necessary to provide a movable means in the liquid suction port 61, but the valve 33 is opened and the cleaning liquid is drained from the cleaning tank 11. When taking out the wafer 200 from the cleaning liquid, a movable means may be provided in the liquid suction port 61.

【００６０】図１０〜１３に、吸液口６１の可動手段の
具体例を示す。図１０は、洗浄槽１１の外に吸液口６１
をロボットなどにより可動させるための手段を設けた具
体例である。洗浄槽１１の外にロボット３９を備え、ロ
ボット３９に取り付けられた支持部３８により吸液口６
１が保持されている。吸液口６１とポンプ６０との間
は、フレキシブルチューブ等の変形が容易な配管で接続
されている。ロボット３９により支持部３８を上下する
ことで、吸液口６１も同時に上下させることができる。
洗浄処理中には、吸液口６１を洗浄槽１１外に移動する
ことができ、洗浄槽１１内を清浄に保つことができる。FIGS. 10 to 13 show specific examples of the moving means of the liquid suction port 61. FIG. FIG. 10 shows that the liquid suction port 61 is provided outside the cleaning tank 11.
This is a specific example in which means for moving the robot by a robot or the like is provided. A robot 39 is provided outside the cleaning tank 11, and the liquid suction port 6 is provided by a support 38 attached to the robot 39.
1 is held. The liquid suction port 61 and the pump 60 are connected by a pipe such as a flexible tube that is easily deformed. By moving the support portion 38 up and down by the robot 39, the liquid suction port 61 can be moved up and down simultaneously.
During the cleaning process, the liquid suction port 61 can be moved out of the cleaning tank 11, and the inside of the cleaning tank 11 can be kept clean.

【００６１】図１１は、他の吸液口６１の可動手段を説
明するための図である。洗浄液液表面１３に吸液口６１
が浮くよう、浮き６５が取り付けられている。なお、こ
の浮きは、洗浄液液表面１３に吸液口６１が浮くもので
あれば、どのような物を使用しても良い。吸液口６１と
ポンプ６０との間は、フレキシブルチューブ等の、変形
が容易な配管で接続されている。かかる構造を用いた場
合、洗浄液液表面１３の下降によっても吸液口６１は常
に洗浄液液表面１３近傍に存在するため、洗浄液液表面
１３近傍の洗浄液を効率よく洗浄槽１１外へ排出するこ
とができる。FIG. 11 is a view for explaining another means for moving the liquid suction port 61. In FIG. The suction port 61 is provided on the cleaning liquid surface 13.
A float 65 is attached so as to float. The float may be of any type as long as the liquid suction port 61 floats on the cleaning liquid surface 13. The liquid suction port 61 and the pump 60 are connected by easily deformable piping such as a flexible tube. When such a structure is used, the liquid suction port 61 is always near the cleaning liquid surface 13 even when the cleaning liquid surface 13 is lowered, so that the cleaning liquid near the cleaning liquid surface 13 can be efficiently discharged to the outside of the cleaning tank 11. it can.

【００６２】実施の形態５．本発明の他の実施の形態に
ついて、図１２〜１５を参照しながら説明する。図１２
は、本発明の実施の形態５にかかる洗浄装置の概略図で
あり、図中、図１６と同一符号は、同一又は相当箇所を
示す。また、図１３は、図１２の越流口６４近傍の拡大
図である。Embodiment 5 Another embodiment of the present invention will be described with reference to FIGS. FIG.
Is a schematic view of a cleaning apparatus according to Embodiment 5 of the present invention, in which the same reference numerals as in FIG. 16 indicate the same or corresponding parts. FIG. 13 is an enlarged view of the vicinity of the overflow port 64 in FIG.

【００６３】図１２に示した洗浄装置では、洗浄液液表
面１３近傍には、洗浄液液表面１３の洗浄液を越流さ
せ、洗浄槽１１内から排液するための越流口６４が設け
られている。また、越流口６４には越流管７３が連結さ
れており、越流管７３は洗浄槽１１の中に設けられ、底
面を通って外部に延びている。更に、越流管７３は、越
流バルブ３４を介して、洗浄槽１１外に洗浄液を排液さ
れる構造となっている。越流口６４は、越流口６４の位
置を、洗浄液液表面１３の高さより低い位置に配置した
場合に、洗浄液が越流口６４を越流して越流管７３内に
流入する形状であればどのような形状であっても良い。In the cleaning apparatus shown in FIG. 12, an overflow port 64 is provided in the vicinity of the cleaning liquid surface 13 to allow the cleaning liquid on the cleaning liquid surface 13 to overflow and drain the cleaning liquid from the cleaning tank 11. . An overflow pipe 73 is connected to the overflow port 64. The overflow pipe 73 is provided in the cleaning tank 11 and extends to the outside through the bottom surface. Further, the overflow pipe 73 is configured to drain the cleaning liquid out of the cleaning tank 11 via the overflow valve 34. The overflow port 64 may have a shape in which the cleaning liquid overflows the overflow port 64 and flows into the overflow pipe 73 when the overflow port 64 is located at a position lower than the height of the cleaning liquid surface 13. Any shape may be used.

【００６４】上述のように、洗浄終了時には、ウエハ２
００の上方の洗浄液液表面１３には、洗浄時に発生した
異物８０が浮遊し滞留しているが、本実施の形態では、
かかる状態で越流管バルブ３４を開いた後、洗浄液供給
口１４から洗浄液の供給を行う。この時、洗浄液液表面
１３の洗浄液が越流口６４を越流し、越流管７３内に流
入するよう、越流口６４の高さは洗浄液内において、洗
浄液液表面１３の高さより若干低い位置に配置してお
く。この越流口６４の配置位置は、洗浄液液別１３近傍
であればどこでもよい。また、越流口６４は一カ所に固
定する必要はない。As described above, at the end of the cleaning, the wafer 2
The foreign matter 80 generated during cleaning floats and stays on the cleaning liquid surface 13 above the surface of the cleaning liquid 00, but in the present embodiment,
After opening the overflow pipe valve 34 in this state, the cleaning liquid is supplied from the cleaning liquid supply port 14. At this time, the height of the overflow port 64 is slightly lower than the height of the cleaning liquid surface 13 in the cleaning liquid so that the cleaning liquid on the cleaning liquid surface 13 overflows the overflow port 64 and flows into the overflow pipe 73. To be placed. The position of the overflow port 64 may be anywhere as long as it is near the cleaning liquid 13. Further, the overflow port 64 does not need to be fixed at one place.

【００６５】越流口６４に、上下方向への移動手段を設
けることで、洗浄槽１１内に洗浄液を供給しない場合で
も、洗浄液液表面１３の下降に合わせて、越流口６４の
位置を下降することで、連続的に洗浄液液表面１３の洗
浄液を越流させることができる。また、越流口６４に水
平方向への移動手段を設け、異物８０の数が多い場所へ
移動配置することで、効率よく異物８０を洗浄槽１１内
から排出することができる。By providing a means for moving the cleaning liquid in the cleaning tank 11 in the vertical direction in the overflow port 64, the position of the overflow port 64 is lowered in accordance with the lowering of the cleaning liquid surface 13. By doing so, the cleaning liquid on the cleaning liquid surface 13 can be continuously overflowed. In addition, by providing a moving means in the horizontal direction at the overflow port 64 and moving and arranging it in a place where the number of foreign substances 80 is large, the foreign substances 80 can be efficiently discharged from the cleaning tank 11.

【００６６】洗浄液が越流口６４を越流し、越流管７３
内に流入することで、洗浄液液表面１３近傍の洗浄液と
共に、洗浄液液表面１３に浮遊する異物８０も洗浄槽１
１外に排出される。このため、洗浄液液表面１３は、異
物８０のない、清浄な状態に保たれる。最後に、バルブ
３３を開き、洗浄槽内排液口１８より洗浄槽１１内の洗
浄液を排液するか、又は、ウエハ２００を移送ロボット
等の移送手段により洗浄槽１１内より引き上げることに
より、ウエハ２００を洗浄液中から取り出す。かかる取
り出し工程において、洗浄液液表面１３には異物８０が
存在しないため、異物８０がウエハ２００上に付着する
ことはない。なお、ウエハ２００の取り出し時に、越流
口６４が邪魔になる場合には、ウエハ２００を取り出し
前に、邪魔にならない位置まで越流口６４を移動させて
おけばよい。The washing liquid overflows the overflow port 64 and the overflow pipe 73
The foreign matter 80 floating on the cleaning liquid surface 13 together with the cleaning liquid near the cleaning liquid surface 13 flows into the cleaning tank 1 by flowing into the cleaning tank 1.
It is discharged outside. For this reason, the cleaning liquid surface 13 is kept in a clean state without any foreign matter 80. Finally, the valve 33 is opened, and the cleaning liquid in the cleaning tank 11 is drained from the drain port 18 in the cleaning tank, or the wafer 200 is pulled up from the cleaning tank 11 by a transfer means such as a transfer robot. 200 is taken out of the cleaning solution. In the removal step, the foreign matter 80 does not exist on the wafer 200 because the foreign matter 80 does not exist on the cleaning liquid surface 13. If the overflow port 64 is in the way when the wafer 200 is taken out, the overflow port 64 may be moved to a position where it does not get in the way before taking out the wafer 200.

【００６７】また、越流口６４の形状は、一般的には、
断面が円形形状であるが、洗浄液液表面１３近傍の洗浄
液を越流させることができるものであれば、他の形状で
あっても構わない。例えば、洗浄槽１１の形状が直方体
であれば、断面が矩形形状の越流口６４を用いること
で、特に、洗浄槽１１の側壁近傍の洗浄液液表面１３上
にある異物８０も効率良く排出することができる。更
に、実施の形態４のように、越流口６４に移動手段を設
けてもよく、移動手段を設けることで、効率よく異物８
０を洗浄槽１１外に排出することができる。このよう
に、本実施の形態に示すような構造を用いることによ
り、洗浄槽側壁に可動手段を設けることなく、簡単な構
造で、異物８０を洗浄槽外に排出することができる。更
に、異物８０の多い部分に越流口６４を移動させること
により、更に効率よく異物８０を洗浄槽外に排出するこ
とができる。The shape of the overflow port 64 is generally
Although the cross section is circular, other shapes may be used as long as the cleaning liquid in the vicinity of the cleaning liquid surface 13 can overflow. For example, if the shape of the cleaning tank 11 is a rectangular parallelepiped, by using the overflow port 64 having a rectangular cross section, the foreign matter 80 particularly on the cleaning liquid surface 13 near the side wall of the cleaning tank 11 can be efficiently discharged. be able to. Further, as in the fourth embodiment, a moving means may be provided at the overflow port 64, and by providing the moving means, the foreign matter 8 can be efficiently provided.
0 can be discharged out of the cleaning tank 11. As described above, by using the structure shown in the present embodiment, the foreign matter 80 can be discharged out of the cleaning tank with a simple structure without providing a movable means on the side wall of the cleaning tank. Further, by moving the overflow port 64 to a portion where a large amount of foreign matter 80 is present, the foreign matter 80 can be more efficiently discharged out of the cleaning tank.

【００６８】図１４は、図１２の洗浄装置において、越
流管７３内に越流した洗浄液をポンプ６０にて排液する
場合を示したものであり、図１５は、図１４の越流口６
４近傍の拡大図である。図中、図１６と同一符号は、同
一又は相当箇所を示し、６３は越流口６４の中に流入し
た洗浄液を溜めるためのＵ字管である。このように、越
流口６４後方の越流管７３の向きを、Ｕ字管６３を用い
て上向きにすることで、洗浄液液表面１３近傍の洗浄液
は、Ｕ字管６３の中に流入し、ここに溜められることと
なる。溜められた洗浄液は、ポンプ６０を使用すること
で、洗浄槽１１から排液することができる。このような
構造を用いることにより、図１２の場合より、越流口６
４の洗浄液内での移動を容易にすることができ、同等の
効果が得られる。FIG. 14 shows a case where the cleaning liquid overflowed into the overflow pipe 73 is drained by the pump 60 in the cleaning apparatus shown in FIG. 12, and FIG. 6
It is an enlarged view of the vicinity of 4. In the figure, the same reference numerals as those in FIG. 16 indicate the same or corresponding portions, and 63 is a U-shaped tube for storing the cleaning liquid flowing into the overflow port 64. As described above, by making the direction of the overflow pipe 73 behind the overflow port 64 upward using the U-shaped pipe 63, the cleaning liquid near the cleaning liquid surface 13 flows into the U-shaped pipe 63, It will be stored here. The stored cleaning liquid can be drained from the cleaning tank 11 by using the pump 60. By using such a structure, the overflow 6
4 can be easily moved in the cleaning solution, and the same effect can be obtained.

【００６９】[0069]

【発明の効果】以上の説明から明らかなように、本発明
にかかる洗浄装置及び洗浄方法を用いることにより、洗
浄槽内の洗浄液液表面に浮遊する異物を洗浄液と共に洗
浄槽外に効率良く排出することができ、洗浄液の液表面
を清浄な状態に保つことができる。従って、洗浄液から
被洗浄物を取り出す時に発生する被洗浄物表面への異物
の付着を低減でき、かかる被洗浄物を用いた製品の製造
歩留りを向上させることができる。As is apparent from the above description, by using the cleaning apparatus and the cleaning method according to the present invention, foreign matters floating on the surface of the cleaning liquid in the cleaning tank are efficiently discharged out of the cleaning tank together with the cleaning liquid. The liquid surface of the cleaning liquid can be kept clean. Therefore, it is possible to reduce the adhesion of foreign substances to the surface of the object to be cleaned which occurs when the object to be cleaned is taken out from the cleaning liquid, and to improve the production yield of products using the object to be cleaned.

【００７０】特に、洗浄液の表面近傍の液を吸引、排出
することにより、比較的簡単な構造で、効率的に異物を
排出することができ、異物の付着を低減した被洗浄物を
得ることが可能となる。In particular, by suctioning and discharging the liquid in the vicinity of the surface of the cleaning liquid, foreign substances can be efficiently discharged with a relatively simple structure, and an object to be cleaned with reduced adhesion of foreign substances can be obtained. It becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 本発明の実施の形態１にかかる洗浄装置の概
略図である。FIG. 1 is a schematic diagram of a cleaning device according to a first embodiment of the present invention.

【図２】 本発明の実施の形態１にかかる洗浄装置の洗
浄槽の概略図である。FIG. 2 is a schematic diagram of a cleaning tank of the cleaning device according to the first embodiment of the present invention.

【図３】 本発明の実施の形態１にかかる洗浄装置の洗
浄槽の概略図である。FIG. 3 is a schematic diagram of a cleaning tank of the cleaning device according to the first embodiment of the present invention.

【図４】 本発明の実施の形態１にかかる洗浄装置の概
略図である。FIG. 4 is a schematic diagram of a cleaning device according to the first embodiment of the present invention.

【図５】 本発明の実施の形態１において、被洗浄物を
洗浄液中からの取り出す場合の洗浄液及び異物の挙動を
示す概略図である。FIG. 5 is a schematic diagram showing the behavior of the cleaning liquid and foreign matter when the object to be cleaned is taken out of the cleaning liquid in the first embodiment of the present invention.

【図６】 本発明の実施の形態１にかかる他の洗浄装置
の概略図である。FIG. 6 is a schematic diagram of another cleaning apparatus according to the first embodiment of the present invention.

【図７】 本発明の実施の形態２にかかる洗浄装置の概
略図である。FIG. 7 is a schematic diagram of a cleaning device according to a second embodiment of the present invention.

【図８】 本発明の実施の形態３にかかる洗浄装置の概
略図である。FIG. 8 is a schematic diagram of a cleaning device according to a third embodiment of the present invention.

【図９】 本発明の実施の形態４にかかる洗浄装置の概
略図である。FIG. 9 is a schematic diagram of a cleaning device according to a fourth embodiment of the present invention.

【図１０】 本発明の実施の形態４にかかる他の洗浄装
置の概略図である。FIG. 10 is a schematic diagram of another cleaning apparatus according to the fourth embodiment of the present invention.

【図１１】 本発明の実施の形態４にかかる他の洗浄装
置の概略図である。FIG. 11 is a schematic view of another cleaning apparatus according to the fourth embodiment of the present invention.

【図１２】 本発明の実施の形態５にかかる洗浄装置の
概略図である。FIG. 12 is a schematic diagram of a cleaning apparatus according to a fifth embodiment of the present invention.

【図１３】 本発明の実施の形態５にかかる洗浄装置の
拡大図である。FIG. 13 is an enlarged view of a cleaning device according to a fifth embodiment of the present invention.

【図１４】 本発明の実施の形態５にかかる他の洗浄装
置の概略図である。FIG. 14 is a schematic view of another cleaning apparatus according to the fifth embodiment of the present invention.

【図１５】 本発明の実施の形態５にかかる他の洗浄装
置の拡大図である。FIG. 15 is an enlarged view of another cleaning device according to the fifth embodiment of the present invention.

【図１６】 従来の洗浄装置の概略図である。FIG. 16 is a schematic view of a conventional cleaning device.

【図１７】 洗浄装置からウエハを取り出す工程の概略
図である。FIG. 17 is a schematic view of a step of taking out a wafer from the cleaning apparatus.

【図１８】 洗浄装置からウエハを取り出す工程の概略
図である。FIG. 18 is a schematic view of a step of taking out a wafer from the cleaning apparatus.

【図１９】 ウエハ洗浄中における洗浄槽内の異物の挙
動を示す概略図である。FIG. 19 is a schematic view showing the behavior of foreign matter in a cleaning tank during wafer cleaning.

【図２０】 従来の洗浄装置からウエハを取り出す場合
の洗浄液及び異物の挙動を示す概略図である。FIG. 20 is a schematic diagram showing the behavior of a cleaning liquid and foreign matter when a wafer is taken out from a conventional cleaning apparatus.

【符号の説明】[Explanation of symbols]

１１ 洗浄槽、１３ 洗浄液液表面、１４ 洗浄液供給
口、１７ 越流部、１８ 洗浄槽内排液口、２１ 洗浄
槽側壁、２５ 可動側壁越流部、３３ バルブ、３５
可動側壁、６０ ポンプ、６１ 吸液口、７０ 洗浄液
供給用配管、７１ 排液用配管、８０ 洗浄液液表面の
異物、２００ ウエハ。Reference Signs List 11 cleaning tank, 13 cleaning liquid surface, 14 cleaning liquid supply port, 17 overflow section, 18 drain port in cleaning tank, 21 cleaning tank side wall, 25 movable side wall overflow section, 33 valve, 35
Movable side wall, 60 pump, 61 suction port, 70 cleaning liquid supply pipe, 71 drain pipe, 80 foreign matter on cleaning liquid surface, 200 wafer.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤野 直彦 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 田中 博司 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 Ｆターム(参考） 3B201 AA02 AA03 AB44 BB02 BB03 BB04 BB92  ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Naohiko Fujino 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Hiroshi Tanaka 2-3-2 Marunouchi, Chiyoda-ku, Tokyo 3 Rishi Electric Co., Ltd. F-term (reference) 3B201 AA02 AA03 AB44 BB02 BB03 BB04 BB92

Claims (22)

【特許請求の範囲】[Claims] 【請求項１】 洗浄槽内に被洗浄物が配置され、該洗浄
槽の底部から供給された洗浄液を該洗浄槽の上部から溢
れさせながら該被洗浄物が洗浄される洗浄装置であっ
て、 該洗浄槽が、該洗浄槽に満たされた該洗浄液に該被洗浄
物が浸漬されるように設けられた底面と側壁部とを備
え、 更に、該洗浄液から該被洗浄物を取り出す前に、該被洗
浄物が浸漬されている該洗浄液の表層部を排出する排出
手段を備えたことを特徴とする洗浄装置。1. A cleaning apparatus in which an object to be cleaned is arranged in a cleaning tank, and the object to be cleaned is washed while overflowing a cleaning liquid supplied from a bottom of the cleaning tank from an upper portion of the cleaning tank. The cleaning tank includes a bottom surface and a side wall provided so that the object to be cleaned is immersed in the cleaning liquid filled in the cleaning tank, and further, before removing the object to be cleaned from the cleaning liquid, A cleaning apparatus comprising: a discharge unit configured to discharge a surface portion of the cleaning liquid in which the object to be cleaned is immersed. 【請求項２】 上記排出手段が、上記洗浄槽の上記側壁
部の一部からなり、該側壁部の一部を動かして、その上
端部を他の側壁部より低くなるようにし、該低くした側
壁部を越えて上記洗浄液の表層部を排出することを特徴
とする請求項１に記載の洗浄装置。2. The cleaning device according to claim 1, wherein the discharge unit includes a part of the side wall of the cleaning tank, and moves the part of the side wall so that an upper end thereof is lower than the other side wall. 2. The cleaning apparatus according to claim 1, wherein a surface layer of the cleaning liquid is discharged beyond a side wall. 【請求項３】 上記洗浄槽が平らな側壁部を四方に備え
た有底の容器で、上記排出手段が少なくとも一の該側壁
部からなり、該一の側壁部を略垂直方向に下げて上記洗
浄液の表層部を排出することを特徴とする請求項２に記
載の洗浄装置。3. The washing tank is a bottomed container having flat side walls on all sides, and the discharging means comprises at least one of the side walls, and the one side wall is lowered in a substantially vertical direction. The cleaning device according to claim 2, wherein a surface portion of the cleaning liquid is discharged. 【請求項４】 上記排出手段が、上記一の側壁部の一部
からなり、該一の側壁部の一部を略垂直方向に下げて上
記洗浄液の表層部を排出することを特徴とする請求項３
に記載の洗浄装置。4. The discharge means comprises a part of the one side wall, and lowers a part of the one side wall in a substantially vertical direction to discharge the surface layer of the cleaning liquid. Item 3
The cleaning device according to item 1. 【請求項５】 上記洗浄槽が平らな側壁部を四方に備え
た有底の容器で、上記排出手段が少なくとも一の該側壁
部からなり、該一の側壁部を外方に倒して上記洗浄液の
表層部を排出することを特徴とする請求項２に記載の洗
浄装置。5. The cleaning tank according to claim 1, wherein the cleaning tank is a bottomed container provided with flat side walls on all sides, and the discharge means comprises at least one of the side walls, and the one side wall is tilted outward to clean the cleaning liquid. The cleaning device according to claim 2, wherein the surface layer is discharged. 【請求項６】 上記排出手段が、上記一の側壁部の一部
からなり、該一の側壁部の一部を外方に倒して上記洗浄
液の表層部を排出することを特徴とする請求項５に記載
の洗浄装置。6. The discharge means comprises a part of the one side wall, and the part of the one side wall is tilted outward to discharge a surface layer of the cleaning liquid. 6. The cleaning device according to 5. 【請求項７】 上記側壁部の一部が、その上端部が上記
洗浄槽内に配置された上記被洗浄物の下端より低い位置
まで下がるようにしてなることを特徴とする請求項２に
記載の洗浄装置。7. The cleaning device according to claim 2, wherein a part of the side wall portion has an upper end portion lowered to a position lower than a lower end of the object to be cleaned disposed in the cleaning tank. Cleaning equipment. 【請求項８】上記排出手段が、上記洗浄液の表層部を排
出するように設けられた導管からなることを特徴とする
請求項１に記載の洗浄装置。8. The cleaning apparatus according to claim 1, wherein said discharge means comprises a conduit provided to discharge a surface portion of said cleaning liquid. 【請求項９】 上記導管が、上記洗浄槽内に、上記洗浄
液の表面近傍から下方に延び、該洗浄槽の底部に設けら
れた開口部に接続され、該導管を通して該洗浄液の表層
部を該洗浄槽外に排出してなることを特徴とする請求項
８に記載の洗浄装置。9. The cleaning vessel extends downward from the vicinity of the surface of the cleaning liquid into the cleaning tank, is connected to an opening provided at the bottom of the cleaning tank, and passes the surface layer of the cleaning liquid through the conduit. 9. The cleaning device according to claim 8, wherein the cleaning device is discharged outside the cleaning tank. 【請求項１０】 上記導管が、上記洗浄槽の外に設けら
れて、かつ吸引手段を備え、該導管を通して上記洗浄液
の表層部を吸引し、該洗浄槽外に排出してなることを特
徴とする請求項８に記載の洗浄装置。10. The cleaning apparatus according to claim 1, wherein the conduit is provided outside the cleaning tank and includes a suction unit, and the surface layer of the cleaning liquid is suctioned through the conduit and discharged out of the cleaning tank. The cleaning device according to claim 8, wherein 【請求項１１】 上記導管が、上記洗浄槽に対して垂直
方向及び／又は水平方向に移動できることを特徴とする
請求項１０に記載の洗浄装置。11. The cleaning apparatus according to claim 10, wherein the conduit is movable in a vertical direction and / or a horizontal direction with respect to the cleaning tank. 【請求項１２】 洗浄槽内に被洗浄物を配置し、該洗浄
槽の底部から洗浄液を供給し、該洗浄槽内の該被洗浄物
を浸漬した該洗浄液を該洗浄槽の上部から溢れさせなが
ら該被洗浄物を洗浄する洗浄方法であって、該被洗浄物
の洗浄後に、 該洗浄槽に残った該洗浄液の表層部を排出する排出工程
と、 該洗浄液から該被洗浄物を取り出す工程とを備えること
を特徴とする洗浄方法。12. A cleaning object is placed in a cleaning tank, a cleaning liquid is supplied from the bottom of the cleaning tank, and the cleaning liquid in which the cleaning object is immersed in the cleaning tank overflows from the top of the cleaning tank. A cleaning step of cleaning the object to be cleaned while discharging the surface layer portion of the cleaning liquid remaining in the cleaning tank after the cleaning of the object to be cleaned, and a step of taking out the object to be cleaned from the cleaning liquid A cleaning method comprising: 【請求項１３】 上記排出工程が、上記洗浄槽の側壁部
の一部の上端部を、他の側壁部より低くして、当該低く
した側壁部を越えて上記洗浄液の表層部を排出する工程
であることを特徴とする請求項１２に記載の洗浄方法。13. A step of discharging the surface portion of the cleaning liquid over the lowered side wall part by lowering the upper end of a part of the side wall part of the cleaning tank from the other side wall part. The cleaning method according to claim 12, wherein: 【請求項１４】 上記排出工程が、平らな側壁部を四方
に備えた有底の容器からなる上記洗浄槽の少なくとも一
の該側壁部を略垂直方向に下げて、該洗浄液の表層部を
排出する工程であることを特徴とする請求項１３に記載
の洗浄方法。14. The discharging step includes lowering at least one of the side walls of the cleaning tank having a bottomed container having flat side walls on all sides in a substantially vertical direction, and discharging the surface layer of the cleaning liquid. The cleaning method according to claim 13, wherein the cleaning step is performed. 【請求項１５】 上記排出工程が、上記一の側壁部の一
部のみを略垂直方向に下げる工程であることを特徴とす
る請求項１４に記載の洗浄方法。15. The cleaning method according to claim 14, wherein the discharging step is a step of lowering only a part of the one side wall in a substantially vertical direction. 【請求項１６】 上記排出工程が、平らな側壁部を四方
に備えた有底の容器からなる上記洗浄槽の少なくとも一
の該側壁部を外方に倒して、上記洗浄液の表層部を排出
する工程であることを特徴とする請求項１３に記載の洗
浄方法。16. In the discharging step, at least one of the side walls of the cleaning tank including a bottomed container having flat side walls on all sides is tilted outward to discharge a surface layer of the cleaning liquid. 14. The cleaning method according to claim 13, wherein the method is a step. 【請求項１７】 上記排出工程が、上記一の側壁部の一
部のみを外方に倒す工程であることを特徴とする請求項
１６に記載の洗浄方法。17. The cleaning method according to claim 16, wherein the discharging step is a step of tilting only a part of the one side wall outward. 【請求項１８】 上記排出工程が、上記洗浄槽の側壁部
の一部の上端部を、該洗浄槽内に配置された上記被洗浄
物より低い位置まで下げて、上記洗浄液を排出する工程
であることを特徴とする請求項１３に記載の洗浄方法。18. The method according to claim 18, wherein the discharging step includes lowering an upper end of a part of a side wall of the cleaning tank to a position lower than the object to be cleaned disposed in the cleaning tank, and discharging the cleaning liquid. The cleaning method according to claim 13, wherein the cleaning method is provided. 【請求項１９】 上記排出工程が、導管を通して上記洗
浄液の表層部を排出する工程であることを特徴とする請
求項１２に記載の洗浄方法。19. The cleaning method according to claim 12, wherein the discharging step is a step of discharging a surface portion of the cleaning liquid through a conduit. 【請求項２０】 上記排出工程が、上記洗浄液の表面近
傍から下方に延びて、該洗浄槽の底部に設けられた開口
部に接続された上記導管を通して、該洗浄液の表層部を
排出する工程であることを特徴とする請求項１９に記載
の洗浄方法。20. The discharging step, wherein the surface layer of the cleaning liquid is discharged through the conduit extending downward from near the surface of the cleaning liquid and connected to an opening provided at the bottom of the cleaning tank. The cleaning method according to claim 19, wherein the cleaning method is provided. 【請求項２１】 上記排出工程が、上記洗浄槽の外に設
けられ、かつ吸引手段を備えた上記導管を通して、上記
洗浄液の表層部を吸引して排出する工程であることを特
徴とする請求項１９に記載の洗浄方法。21. The method according to claim 21, wherein the discharging step is a step of sucking and discharging the surface layer of the cleaning liquid through the conduit provided outside the cleaning tank and provided with a suction unit. 20. The cleaning method according to 19 above. 【請求項２２】 更に、上記導管を、上記洗浄槽に対し
て垂直方向及び／又は水平方向に移動させる工程を備え
ることを特徴とする請求項２１に記載の洗浄方法。22. The cleaning method according to claim 21, further comprising moving the conduit in a vertical direction and / or a horizontal direction with respect to the cleaning tank.
JP10335741A 1998-11-26 1998-11-26 Device and method for cleaning Pending JP2000164548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10335741A JP2000164548A (en) 1998-11-26 1998-11-26 Device and method for cleaning

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10335741A JP2000164548A (en) 1998-11-26 1998-11-26 Device and method for cleaning

Publications (1)

Publication Number Publication Date
JP2000164548A true JP2000164548A (en) 2000-06-16

Family

ID=18291965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10335741A Pending JP2000164548A (en) 1998-11-26 1998-11-26 Device and method for cleaning

Country Status (1)

Country Link
JP (1) JP2000164548A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266253A (en) * 2006-03-28 2007-10-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
CN111223791A (en) * 2018-11-23 2020-06-02 南亚科技股份有限公司 Wafer cleaning device and cleaning method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266253A (en) * 2006-03-28 2007-10-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
CN111223791A (en) * 2018-11-23 2020-06-02 南亚科技股份有限公司 Wafer cleaning device and cleaning method thereof
CN111223791B (en) * 2018-11-23 2022-07-26 南亚科技股份有限公司 Wafer cleaning device and cleaning method thereof

Similar Documents

Publication Publication Date Title
JP2009141280A (en) Substrate processing equipment, method for processing substrate, and storage medium
US5282923A (en) Liquid agitation and purification system
JP2005522020A (en) Capillary drying of substrate
CN111223791B (en) Wafer cleaning device and cleaning method thereof
JP2000164548A (en) Device and method for cleaning
JP2000140505A (en) Apparatus and method for degassing
US20080302395A1 (en) Wet processing apparatus and method for discharging particles along horizontal liquid flow
JP4703704B2 (en) Substrate processing equipment
JP3296428B2 (en) WET processing method and apparatus
KR20070033129A (en) Apparatus for washing chuck for wafer
US6732749B2 (en) Particle barrier drain
JP2000031108A (en) Device and method for cleaning and drying wafer
JP2003045843A (en) Substrate processing apparatus and method
JP2000254603A (en) Treating device and treatment method
JP3865969B2 (en) Substrate processing equipment
JPH11145100A (en) Substrate treatment equipment
JPH05102118A (en) Method and apparatus for washing semiconductor wafer
JPH04124824A (en) Washing method of semiconductor wafer
JP2000218243A (en) Substrate treating device
JP7308182B2 (en) Nozzle cleaning equipment and coating equipment
KR100571628B1 (en) A Device And A Method For Wafer Linsing
JP3309596B2 (en) Substrate cleaning device and cleaning method
JPH11319736A (en) Method and apparatus for processing substrate
JP3563329B2 (en) Substrate processing method
JP3756321B2 (en) Substrate processing apparatus and method

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040709

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040817

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050308