JP2000127034A - Wafer sticking method to mount plate and its device - Google Patents
Wafer sticking method to mount plate and its deviceInfo
- Publication number
- JP2000127034A JP2000127034A JP31834098A JP31834098A JP2000127034A JP 2000127034 A JP2000127034 A JP 2000127034A JP 31834098 A JP31834098 A JP 31834098A JP 31834098 A JP31834098 A JP 31834098A JP 2000127034 A JP2000127034 A JP 2000127034A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pad
- guide plate
- pressurized fluid
- pressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体ウエ−ハ等
のウエ−ハを平滑に研磨する際、該ウエ−ハを支持する
マウント板に均質にウエ−ハを接着するようにしたマウ
ント板へのウエ−ハ接着方法及び装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting plate for uniformly polishing a wafer such as a semiconductor wafer when the wafer is polished smoothly. The present invention relates to a method and an apparatus for bonding a wafer to a wafer.
【０００２】[0002]
【従来の技術】半導体製造において、ウエ−ハを研磨す
る際、マウント板にウエ−ハを接着剤で貼り付けて研磨
処理を行う方法では、ウエ−ハの全面をきわめて均一に
貼り付けることが要求されている。そのため、ウエ−ハ
に薄く接着剤を塗布し、この接着剤塗布面側を下にして
マウント板に載置し、上面からウエ−ハを押圧する方法
が採られているが、この際に、ウエ−ハとマウント板間
に空気等を取り込むと高い平坦度が得られなくなるの
で、空気を除去する方法としてウエ−ハの中央部から周
辺部にわたって徐々にスタンプで押圧する方法が用いら
れている。2. Description of the Related Art In a semiconductor manufacturing method, when a wafer is polished, a wafer is stuck to a mounting plate with an adhesive and a polishing process is performed. Has been requested. For this reason, a method of applying a thin adhesive to the wafer, placing the adhesive applied side down on a mount plate, and pressing the wafer from the upper surface has been adopted. If air or the like is taken in between the wafer and the mounting plate, a high flatness cannot be obtained. Therefore, as a method for removing the air, a method of gradually pressing the wafer from the center to the periphery of the wafer is used. .
【０００３】上述のようにスタンプで押圧する場合、押
圧面の中央が下方に突出し周辺が弧状にわん曲する略球
状面のパッドを用い、該パッド自体をシリコンゴム等の
弾性材料で中空若しくは中実に構成している。中空のパ
ッドは、押圧の開始から終了までほぼ定圧となるようパ
ッド内に導入する空気量を調整し、ウエ−ハの中心から
周辺に向けて徐々に空気が抜けるようにしているので、
空気の取り込みを生じにくいが、押圧を終了したときパ
ッドの押圧面の中央部が反転して中空体の内方に凹んで
しまい、スタンプが上昇するとき押圧面の中央部が真空
状態になり、ウエ−ハを上方へ引き上げる方向に力が作
用して該ウエ−ハの貼付状態に悪影響を与えることがあ
った。In the case of pressing with a stamp as described above, a pad having a substantially spherical surface with the center of the pressing surface protruding downward and the periphery curved in an arc shape is used, and the pad itself is hollow or medium made of an elastic material such as silicon rubber. It is really composed. The hollow pad adjusts the amount of air introduced into the pad so that the pressure becomes almost constant from the start to the end of pressing, so that the air gradually escapes from the center of the wafer toward the periphery.
It is difficult to take in air, but when pressing is completed, the center of the pressing surface of the pad is inverted and recessed inside the hollow body, and when the stamp rises, the center of the pressing surface is in a vacuum state, In some cases, a force acts in a direction in which the wafer is lifted upward, which has an adverse effect on the attached state of the wafer.
【０００４】また、ウエ−ハのエッジを押圧するとき、
パッドの押圧面の周辺部のわん曲が大きく、この周辺部
がウエ−ハエッジから外れた状態で該エッジを押すよう
になるため、充分にウエ−ハエッジを押圧することがで
きないことがあった。そして、ウエ−ハのエッジの押圧
が不確実になると、該エッジはマウント板から微少量浮
き上ったような状態になるから、研磨によって該エッジ
は過研磨され、ダレたようになってしまう。そのような
欠点は、本件出願人が先に提案した実公平７−９３７５
号公報に記載されているように、スタンプのパッドの基
部にウエ−ハのエッジに直接的に押圧力が作用するよう
起立壁を形成することにより改良されるが、ウエ−ハの
口径が３００mm若しくはそれ以上というように大口径に
なると、エッジに沿って確実に押圧することは一層むず
かしくなるおそれがあった。When pressing the edge of a wafer,
The peripheral portion of the pressing surface of the pad has a large curvature, and the peripheral portion is depressed from the wafer edge so as to press the edge, so that the wafer edge may not be sufficiently pressed. When the pressing of the edge of the wafer becomes uncertain, the edge is in a state where it is slightly lifted from the mounting plate. . Such a drawback lies in the fact that the applicant of the present application has previously proposed the Japanese Utility Model 7-9375.
As described in Japanese Patent Application Laid-Open Publication No. H10-209, the improvement can be achieved by forming an upright wall at the base of the pad of the stamp so that a pressing force acts directly on the edge of the wafer, but the diameter of the wafer is 300 mm. When the diameter becomes larger, or more, there is a possibility that it is more difficult to surely press along the edge.
【０００５】中実のパッドの場合、ウエ−ハの中心部か
らエッジまで確実にウエ−ハを押圧することができる
が、押圧面が中空のパッドのように徐々にウエ−ハに接
触して変形するのではなく、瞬時にウエ−ハを押圧する
ようになっているため、ウエ−ハとマウント板間の空気
の除去が不充分になることが多い。そのため、あたかも
微粒子（パ−ティクル）が混入した場合と同じように、
接着剤層中に気泡が取り込まれ、研磨により高い平坦度
のウエ−ハを得ることはむずかしい。In the case of a solid pad, the wafer can be surely pressed from the center to the edge of the wafer, but the pressing surface gradually contacts the wafer like a hollow pad. Since the wafer is instantaneously pressed instead of being deformed, the removal of air between the wafer and the mounting plate is often insufficient. Therefore, as if the particles (particles) were mixed,
Bubbles are taken in the adhesive layer, and it is difficult to obtain a wafer with high flatness by polishing.
【０００６】[0006]
【発明が解決しようとする課題】本発明の解決課題は、
上記のように接着剤を塗布したウエ−ハをマウント板に
載置し、該ウエ−ハをスタンプで押圧してマウント板に
接着する際、ウエ−ハとマウント板間に空気を取り込む
ことがなく、かつウエ−ハのエッジまで確実に押圧して
マウント板にウエ−ハをきわめて均一な状態に接着でき
るようにした接着方法及び装置を提供することである。The problem to be solved by the present invention is as follows.
When the wafer to which the adhesive has been applied as described above is placed on a mounting plate, and the wafer is pressed with a stamp and bonded to the mounting plate, air may be taken in between the wafer and the mounting plate. It is an object of the present invention to provide a bonding method and apparatus capable of bonding a wafer to a mounting plate in an extremely uniform state by pressing the wafer to the edge of the wafer without fail.
【０００７】[0007]
【課題を解決するための手段】本発明によれば、接着剤
を塗布したウエ−ハをマウント板に載置し、該ウエ−ハ
を加圧流体が導入され中央が下方に突出する有弾性の中
空のパッドで押圧してマウント板に接着する方法におい
て、上記加圧流体によりパッド内を定圧に保持しつつウ
エ−ハの中央から外周に向けて徐々にパッドを接触させ
該ウエ−ハの全面にパッドが接触した後、パッド内の加
圧流体を流出して該パッドの背面を案内板で支持し、該
案内板と上記パッドにより上記ウエ−ハを押圧すること
を特徴とするマウント板へのウエ−ハ接着方法が提供さ
れ、上記課題が解決される。According to the present invention, a wafer to which an adhesive has been applied is placed on a mounting plate, and the wafer is subjected to a pressurized fluid, and a resilient wafer whose center projects downward. In this method, the pad is gradually contacted from the center to the outer periphery of the wafer while the inside of the pad is kept at a constant pressure by the pressurized fluid. After the pad contacts the entire surface, the pressurized fluid in the pad flows out, the back surface of the pad is supported by a guide plate, and the wafer is pressed by the guide plate and the pad. A method for bonding a wafer to a wafer is provided to solve the above-mentioned problem.
【０００８】また本発明によれば、接着剤を塗布したウ
エ−ハをマウント板に載置し、該ウエ−ハを加圧流体が
導入され中央が下方に突出する有弾性の中空のパッドで
押圧してマウント板に接着する装置において、上記パッ
ドの内方にウエ−ハ全面を覆う大きさの案内板を設け、
上記ウエ−ハの全面に上記パッドが接触した際パッド内
の加圧流体を流出し該パッドの背面に上記案内板を当接
させてウエ−ハを押圧するようにしたことを特徴とする
マウント板へのウエ−ハ接着装置が提供され、上記課題
が解決される。Further, according to the present invention, a wafer coated with an adhesive is placed on a mounting plate, and the wafer is formed by an elastic hollow pad into which a pressurized fluid is introduced and whose center projects downward. In an apparatus for pressing and bonding to a mounting plate, a guide plate large enough to cover the entire surface of the wafer is provided inside the pad,
When the pad comes into contact with the entire surface of the wafer, the pressurized fluid in the pad flows out, and the guide plate is brought into contact with the back surface of the pad to press the wafer. An apparatus for bonding a wafer to a plate is provided to solve the above-mentioned problems.
【０００９】[0009]
【発明の実施の形態】図１には、マウント板（１）と、
該マウント板（１）に接着するための接着剤（２）を塗
布したウエ−ハ（３）と、該ウエ−ハを押圧する本発明
の接着装置をそれぞれ分離して示した一実施例が示され
ている。上記装置は、図示を省略したエアシリンダ−等
の流体圧シリンダ−やモ−タ−シリンダ−等の駆動手段
により昇降する軸（４）と、該軸（４）の先端を受け入
れる孔（５）を有し側面からボルト（６）で押え片
（７）を締着することにより該軸に取付けられるブラケ
ット（８）と、該ブラケット（８）にライナ−（９）を
介してボルト(10)で取付けられる取付枠(11)と、該取付
枠(11)の下面に取付けられるパッド(12)を有している。
なお、上記ブラケット（８）の適宜位置に複数設けた調
整ねじ(13)のねじ込み量を変え、該ねじの先端でライナ
−（９）とブラケット（８）間の間隔を変化させること
により上記取付枠(11)の取付角度を調整することができ
る。FIG. 1 shows a mounting plate (1);
One embodiment in which a wafer (3) coated with an adhesive (2) for bonding to the mounting plate (1) and a bonding apparatus of the present invention for pressing the wafer are separately illustrated is shown. It is shown. The above-mentioned device comprises a shaft (4) which is moved up and down by a driving means such as a fluid pressure cylinder such as an air cylinder or a motor cylinder (not shown) and a hole (5) for receiving the tip of the shaft (4). A bracket (8) attached to the shaft by tightening a holding piece (7) from the side with a bolt (6), and a bolt (10) connected to the bracket (8) via a liner (9). And a pad (12) attached to the lower surface of the attachment frame (11).
The mounting amount is changed by changing the screw-in amount of a plurality of adjusting screws (13) provided at appropriate positions of the bracket (8) and changing the distance between the liner (9) and the bracket (8) at the end of the screw. The mounting angle of the frame (11) can be adjusted.
【００１０】上記パッド(12)は、シリコンゴム等の有弾
性材料で中空に作られ、中央が下方に突出し周辺が弧状
にわん曲する略球状面の押圧面(14)を有し、該押圧面(1
4)部分の厚みは比較的厚く、例えば約１０〜２５mm、好
ましくは約１３〜２０mm程度に形成してあり、硬度の異
なる複数のパッドを用意して交換可能に形成すると一層
好ましい。該パッド(12)の周縁の起立壁(15)はその基端
部(16)が内方に屈曲して上記取付枠(11)に形成した受溝
(17)に嵌合し、該基端部(16)に形成した上部凹溝(18)に
取付枠(11)に設けた突条(19)が係合するようにしてあ
る。The pad (12) is made of a resilient material such as silicone rubber and is hollow, and has a substantially spherical pressing surface (14) whose center protrudes downward and whose periphery is curved in an arc shape. Face (1
4) The thickness of the portion is relatively thick, for example, about 10 to 25 mm, preferably about 13 to 20 mm, and it is more preferable that a plurality of pads having different hardnesses are prepared and exchangeable. An upright wall (15) at the periphery of the pad (12) has a base end (16) bent inward to form a receiving groove formed in the mounting frame (11).
(17), and a ridge (19) provided on the mounting frame (11) is engaged with an upper concave groove (18) formed in the base end (16).
【００１１】上記基端部(16)の上面に形成した上記上部
凹溝(18)に対向する該基端部の下面には下部凹溝(20)が
あり、該下部凹溝(20)に係合する係合縁(21)を有しその
内方に上記基端部(16)の内方先部を嵌合させる受溝(22)
を有する案内板(23)がボルト(27)・・・で上記取付枠(1
1)に取付けられている。There is a lower groove (20) on the lower surface of the base end opposite to the upper groove (18) formed on the upper surface of the base end (16). A receiving groove (22) having an engaging edge (21) to be engaged with and fitting the inner tip of the base end (16) inward.
Guide plate (23) having bolts (27)
Installed in 1).
【００１２】上記案内板(23)は、上記のようにしてパッ
ド(12)の内方に設けられ、該パッド(12)に対向する面が
図においては平面であるが、中央が下方にゆるやかに突
出する略球状面に形成することもでき、またその外径は
押圧しようとするウエ−ハの全面を覆うよう該ウエ−ハ
（３）よりも少し大径に、例えば直径で数mm程度大きく
なるように形成するとよい。The guide plate (23) is provided inside the pad (12) as described above, and the surface facing the pad (12) is flat in the figure, but the center is gently downward. The outer diameter of the wafer may be slightly larger than that of the wafer (3) so as to cover the entire surface of the wafer to be pressed, for example, about several mm in diameter. It is good to form so that it may become large.
【００１３】上記案内板(23)は、後記するようにマウン
ト板（１）上のウエ−ハ（３）の全面にパッド(12)が接
触した際、該パッド(12)の背面に当接する位置に設けら
れている。また、該パッド(12)と案内板(23)が当接する
際、パッドと案内板間に加圧流体の一部が封じ込まれな
いようにすると共に該パッドを加圧するときには該パッ
ドと案内板間に加圧流体が迅速に入り込んでパッドが素
早く復元するよう案内板(23)の下面には加圧流体を案内
板に沿って流すための条溝(24)・・・を縦横に形成して
あり、該案内板(23)の側面及び下面の条溝に連通する部
位には加圧流体が流通する流通口(25)・・・が開口して
いる。該流通口(25)の内端は、案内板(23)の背面に接続
した供給パイプ(26)に連通するよう複数本、半径方向に
延びている。The guide plate (23) comes into contact with the rear surface of the pad (12) when the pad (12) comes into contact with the entire surface of the wafer (3) on the mount plate (1) as described later. Position. When the pad (12) abuts on the guide plate (23), a part of the pressurized fluid is prevented from being sealed between the pad and the guide plate, and the pad and the guide plate are pressed when the pad is pressed. Grooves (24) are formed vertically and horizontally on the lower surface of the guide plate (23) to allow the pressurized fluid to flow along the guide plate so that the pressurized fluid can quickly enter between them and the pad can be quickly restored. A flow port (25) through which the pressurized fluid flows is opened at a portion communicating with the groove on the side surface and the lower surface of the guide plate (23). The inner end of the circulation port (25) extends in the radial direction so as to communicate with a supply pipe (26) connected to the back surface of the guide plate (23).
【００１４】なお、図４に示すように上記案内板(23)の
下面に上記条溝(24)・・・を連通するように環状溝(28)
を形成し、該環状溝に流通口(25)を開口させてよいし、
案内板の側面に開口する流通口に連通するように該案内
板の側面に環状溝を形成し、該環状溝に連通するよう案
内板の下面に開口する縦溝を案内板の側面に複数形成し
てもよい（図示略）。また、図において、上記案内板(2
3)は、パッド(12)を取付枠(11)に保持する部材を兼ねて
いるが、パッド保持部材（図示略）とパッドの背面に当
接する案内板を別部材として形成してもよく、またパッ
ドを取付枠に保持する構造は図に示す他、適宜の構造に
することができる。As shown in FIG. 4, an annular groove (28) is formed so as to communicate with the groove (24)... On the lower surface of the guide plate (23).
May be formed, a flow opening (25) may be opened in the annular groove,
An annular groove is formed on the side surface of the guide plate so as to communicate with a distribution port opened on the side surface of the guide plate, and a plurality of vertical grooves are formed on the side surface of the guide plate so as to communicate with the annular groove. (Not shown). In the figure, the guide plate (2
3) also serves as a member for holding the pad (12) on the mounting frame (11), but a pad holding member (not shown) and a guide plate that contacts the back surface of the pad may be formed as separate members, In addition, the structure for holding the pad on the mounting frame can be an appropriate structure other than that shown in the drawing.
【００１５】上記案内板(23)に接続した供給パイプ(26)
には、図示を省いたエアコンプレッサ−等の加圧流体供
給源や圧力センサ−、レリ−フ弁、ストップバルブ等を
含む加圧流体調整装置（図示略）が接続され、ウエ−ハ
を押圧する際上記パッド内がほぼ定圧になるよう空気等
の加圧流体の流入、流出を調整し、ウエ−ハの全面にパ
ッドが接触したら、該パッド内の加圧流体を上記流通口
(25)、供給パイプ(26)を通してパッドの外方に流出する
よう制御している。A supply pipe (26) connected to the guide plate (23)
Is connected to a pressurized fluid supply source such as an air compressor (not shown) and a pressurized fluid adjusting device (not shown) including a pressure sensor, a relief valve, a stop valve, etc., and presses the wafer. When the pad is brought into contact with the entire surface of the wafer, the flow of the pressurized fluid such as air is adjusted so that the inside of the pad becomes substantially constant pressure.
(25), it is controlled to flow out of the pad through the supply pipe (26).
【００１６】接着剤（２）を塗布したウエ−ハ（３）
は、搬送ロボットその他の適宜の手段によりマウント板
（１）上に載置され、上記接着装置は軸（４）の中心軸
が該ウエ−ハ（３）の中心と一致する位置に対向する。
そして、上記軸（４）を駆動手段で降下させると、パッ
ド(12)内は加圧流体により定圧に加圧された状態でウエ
−ハ（３）の中央から外周に向けて徐々に接触し、該ウ
エ−ハをマウント板（１）に押圧して行く。ウエ−ハ
（３）の全面にパッド(12)が接触したら、図２に示すよ
うにパッド(12)内の加圧流体を流出させ、該パッド(12)
の背面に案内板(23)を当接し、その状態で上記ウエ−ハ
（３）を押圧する。その後、駆動手段で上記軸（４）を
上昇し、加圧流体を導入してパッド(12)を復元させ、図
１に示す状態とする。Wafer (3) coated with adhesive (2)
Is mounted on the mounting plate (1) by a transfer robot or other appropriate means, and the bonding device faces the position where the center axis of the shaft (4) coincides with the center of the wafer (3).
When the shaft (4) is lowered by the driving means, the inside of the pad (12) gradually contacts from the center to the outer periphery of the wafer (3) while being pressurized to a constant pressure by the pressurized fluid. Then, the wafer is pressed against the mounting plate (1). When the pad (12) comes into contact with the entire surface of the wafer (3), the pressurized fluid in the pad (12) flows out as shown in FIG.
The guide plate (23) is brought into contact with the back surface of the wafer, and the wafer (3) is pressed in this state. Thereafter, the shaft (4) is raised by the driving means, and the pad (12) is restored by introducing a pressurized fluid to the state shown in FIG.
【００１７】[0017]
【発明の効果】本発明は上記のように構成され、加圧流
体によりパッド内を定圧に保持しつつウエ−ハの中央か
ら外周に向けて徐々にパッドを接触させ、ウエ−ハの全
面にパッドが接触した後、該パッド内の加圧流体を流出
して該パッドの背面を案内板で支持し、該案内板とパッ
ドによりウエ−ハをマウント板に押圧するようにしたか
ら、ウエ−ハとマウント板間の空気は該ウエ−ハの周辺
部から徐々に排出されてウエ−ハの接着剤層中に取り込
まれることがなく、その上ウエ−ハの全面を均一に押圧
した後、ウエ−ハの全面を覆う大きさの案内板とパッド
によりウエ−ハの全面はさらに強く押圧されウエ−ハの
エッジまで確実に押圧することができ、従来のようにエ
ッジの押圧が不充分になるおそれがない。According to the present invention, the pad is gradually contacted from the center to the outer periphery of the wafer while maintaining the inside of the pad at a constant pressure by the pressurized fluid, so that the entire surface of the wafer is brought into contact with the pad. After the pad comes into contact with the pad, the pressurized fluid in the pad flows out, the back surface of the pad is supported by a guide plate, and the wafer is pressed against the mounting plate by the guide plate and the pad. The air between the wafer and the mounting plate is gradually discharged from the peripheral portion of the wafer and is not taken into the adhesive layer of the wafer, and after uniformly pressing the entire surface of the wafer, The entire surface of the wafer is more strongly pressed by the guide plate and the pad which are large enough to cover the entire surface of the wafer, and can be reliably pressed to the edge of the wafer. There is no danger.
【図１】接着前のウエ−ハ及びマウント板の関係と本発
明の一実施例を示す断面図。FIG. 1 is a sectional view showing a relationship between a wafer and a mounting plate before bonding and an embodiment of the present invention.
【図２】ウエ−ハの全面を押圧している状態の断面図。FIG. 2 is a sectional view showing a state where the entire surface of the wafer is pressed.
【図３】案内板の一実施例を示し、（Ａ）は平面図、
（Ｂ）は底面図、（Ｃ）は一部の拡大断面図。FIG. 3 shows one embodiment of a guide plate, (A) is a plan view,
(B) is a bottom view, and (C) is a partially enlarged cross-sectional view.
【図４】案内板の他の実施例を示し、（Ａ）は一部の拡
大底面図、（Ｂ）は一部の拡大断面図。4A and 4B show another embodiment of the guide plate, FIG. 4A is a partially enlarged bottom view, and FIG. 4B is a partially enlarged sectional view.
１ マウント板 ３ ウエ−ハ ８ ブラケット １１ 取付枠 １２ パッド ２３ 案内板 DESCRIPTION OF SYMBOLS 1 Mounting plate 3 Wafer 8 Bracket 11 Mounting frame 12 Pad 23 Guide plate
Claims (5)
に載置し、該ウエ−ハを加圧流体が導入され中央が下方
に突出する有弾性の中空のパッドで押圧してマウント板
に接着する方法において、上記加圧流体によりパッド内
を定圧に保持しつつウエ−ハの中央から外周に向けて徐
々にパッドを接触させ該ウエ−ハの全面にパッドが接触
した後、パッド内の加圧流体を流出して該パッドの背面
を案内板で支持し、該案内板と上記パッドにより上記ウ
エ−ハを押圧することを特徴とするマウント板へのウエ
−ハ接着方法。1. A wafer coated with an adhesive is placed on a mounting plate, and the wafer is pressed by a resilient hollow pad into which a pressurized fluid is introduced and whose center projects downward. In the method of adhering to the pad, the pad is gradually contacted from the center of the wafer to the outer periphery while the inside of the pad is kept at a constant pressure by the pressurized fluid, and the pad contacts the entire surface of the wafer. Discharging the pressurized fluid to support the back surface of the pad with a guide plate, and pressing the wafer with the guide plate and the pad.
に載置し、該ウエ−ハを加圧流体が導入され中央が下方
に突出する有弾性の中空のパッドで押圧してマウント板
に接着する装置において、上記パッドの内方にウエ−ハ
全面を覆う大きさの案内板を設け、上記ウエ−ハの全面
に上記パッドが接触した際パッド内の加圧流体を流出し
該パッドの背面に上記案内板を当接させてウエ−ハを押
圧するようにしたことを特徴とするマウント板へのウエ
−ハ接着装置。2. A wafer to which an adhesive has been applied is placed on a mounting plate, and the wafer is pressed by a resilient hollow pad into which a pressurized fluid is introduced and whose center projects downward. A guide plate large enough to cover the entire surface of the wafer inside the pad, and when the pad comes into contact with the entire surface of the wafer, pressurized fluid in the pad flows out and the pad A wafer bonding apparatus for mounting a wafer to a mounting plate, wherein the wafer is pressed by bringing the guide plate into contact with the rear surface of the wafer.
るよう条溝が形成されている請求項２に記載のマウント
板へのウエ−ハ接着装置。3. The apparatus for bonding a wafer to a mount plate according to claim 2, wherein a groove is formed on a surface of the guide plate so that a pressurized fluid flows.
２に記載のマウント板へのウエ−ハ接着装置。4. The apparatus according to claim 2, wherein the surface of the guide plate is a flat surface.
求項２に記載のマウント板へのウエ−ハ接着装置。5. The apparatus for bonding a wafer to a mounting plate according to claim 2, wherein the surface of the guide plate is a substantially spherical surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31834098A JP3947989B2 (en) | 1998-10-21 | 1998-10-21 | Wafer bonding method and apparatus for mounting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31834098A JP3947989B2 (en) | 1998-10-21 | 1998-10-21 | Wafer bonding method and apparatus for mounting plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000127034A true JP2000127034A (en) | 2000-05-09 |
| JP3947989B2 JP3947989B2 (en) | 2007-07-25 |
Family
ID=18098083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31834098A Expired - Lifetime JP3947989B2 (en) | 1998-10-21 | 1998-10-21 | Wafer bonding method and apparatus for mounting plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3947989B2 (en) |
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| DE10140133A1 (en) * | 2001-08-16 | 2003-03-13 | Wacker Siltronic Halbleitermat | Method and device for producing an adhesive connection between a semiconductor wafer and a carrier plate |
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| DE10140133A1 (en) * | 2001-08-16 | 2003-03-13 | Wacker Siltronic Halbleitermat | Method and device for producing an adhesive connection between a semiconductor wafer and a carrier plate |
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| JP2009043837A (en) * | 2007-08-07 | 2009-02-26 | Nikon Corp | Substrate bonding apparatus |
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