JP2000124611A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JP2000124611A JP2000124611A JP31544898A JP31544898A JP2000124611A JP 2000124611 A JP2000124611 A JP 2000124611A JP 31544898 A JP31544898 A JP 31544898A JP 31544898 A JP31544898 A JP 31544898A JP 2000124611 A JP2000124611 A JP 2000124611A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- resin
- masking
- printed wiring
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気機器、電子機
器、コンピューター、通信機器等に用いられるビルドア
ップ型多層プリント配線板の製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a build-up type multilayer printed wiring board used for electric equipment, electronic equipment, computers, communication equipment and the like.
【０００２】[0002]
【従来の技術】最近のセット機器の薄型・小型化の進展
により、高密度実装、配線を実現し得るビルドアップ型
多層プリント配線板が注目されている。その製造の１工
程として、銅箔キャリー付樹脂シートを用いた熱圧成形
を繰り返すことによって、順次、絶縁層と配線層とを多
層に積上げをしていくビルドアップ工程がある。このビ
ルドアップ工程において、絶縁層の材料がガラス基材を
含めない樹脂単体であることに起因して、下記の3 点の
高密度配線化の歩留りを損なう問題点がクローズアップ
されてきた。2. Description of the Related Art With the recent progress in thinning and miniaturization of set equipment, a build-up type multilayer printed wiring board capable of realizing high-density mounting and wiring has attracted attention. As one step of the production, there is a build-up step in which insulating layers and wiring layers are sequentially stacked in multiple layers by repeating hot-press molding using a resin sheet with a copper foil carry. In the build-up process, the following three problems that impair the yield of high-density wiring due to the fact that the material of the insulating layer is a resin alone that does not include a glass substrate have been highlighted.
【０００３】第一点は、銅箔キャリーの片面に樹脂を塗
布、乾燥した後、所定のワークサイズへの切断、それの
積載といった過程で、銅箔面への樹脂切断粉の付着によ
る回路形成歩留の低下である。[0003] The first point is that a resin is applied to one side of a copper foil carry, dried, then cut into a predetermined work size, and in the process of loading it, a circuit is formed by adhesion of resin cutting powder to the copper foil side. This is a decrease in yield.
【０００４】第二点は、ビルドアップ型多層板の配線仕
様が従来型のものに対して厳しく、成形時の銅箔面打痕
等の発生による外観歩留が低下する。[0004] Second, the wiring specifications of the build-up type multilayer board are stricter than those of the conventional type, and the appearance yield is reduced due to the occurrence of dents on the copper foil surface during molding.
【０００５】第三点は、銅箔キャリー付樹脂シートが、
従来型のガラス基材プリプレグに比べてのその絶縁層厚
が薄く、また、ガラス基材を有しないため、弾性率又は
クッション性が少ないため、内層回路基板の凹凸の影響
を受けやすく、成形時に銅箔のシワ、パターンの浮き出
しおよび打痕を発生させ、歩留を低下させることであ
る。The third point is that the resin sheet with a copper foil carry is
The insulating layer thickness is thinner than the conventional glass substrate prepreg, and because it does not have a glass substrate, it has less elastic modulus or cushioning property, so it is susceptible to the unevenness of the inner layer circuit board, This is to reduce the yield by generating wrinkles of the copper foil, embossing of the pattern and dents.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、上記の問題
点を鑑みてなされたもので、その目的とするところは、
前述した銅箔キャリー付樹脂シートを用いるビルドアッ
プ型多層プリント配線板を、銅箔のシワ、パターンの浮
き出しおよび打痕の発生がなく、歩留りよく生産できる
製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems.
It is an object of the present invention to provide a manufacturing method capable of producing a build-up type multilayer printed wiring board using the above-described resin sheet with a copper foil carry, without wrinkling of copper foil, embossing of a pattern and occurrence of dents, with good yield.
【０００７】[0007]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意検討を重ねた結果、ビルドアップ型
多層プリント配線板の外層用銅箔キャリー付樹脂シート
における銅露出面に、予めＰＥＴフィルムなどの保護マ
スキングを施したものを用い、かつ、樹脂露出面に離型
性保護フィルムを用いれば、多層板製造において、成形
時のシワ、パターンの浮き出しおよび打痕などの発生に
よる外観歩留りの低下を少なくでき、かつ、銅箔カット
時の樹脂粉の影響を受けないため、回路形成時の歩留り
低下の阻止に役立つことを見いだして、本発明を完成す
るに至った。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found that a copper exposed surface of a resin sheet with a copper foil carry for an outer layer of a build-up type multilayer printed wiring board has If a protective mask such as a PET film is used in advance and a releasable protective film is used on the exposed surface of the resin, the appearance due to wrinkles during molding, embossing of the pattern and dents in the production of multilayer boards The present invention has been found to be useful for preventing a decrease in yield when forming a circuit because the decrease in yield can be reduced and is not affected by the resin powder at the time of cutting the copper foil.
【０００８】すなわち、本発明は、予め片面あるいは両
面に導体回路パターンが形成された内層回路基板の片面
あるいは両面に、銅箔キャリー付樹脂シートを重ねたも
のを、金型プレートに挟んで熱圧成形を行う工程を繰り
返して配線層を積み重ねる多層プリント配線板の製造方
法において、上記銅箔キャリー付樹脂シートとして、銅
箔キャリー付樹脂シートにおける銅露出面と樹脂露出面
の両方にそれぞれの保護マスキングを施したマスキング
銅箔付樹脂シートを使用することを特徴とする多層プリ
ント配線板の製造方法である。That is, according to the present invention, a resin sheet with a copper foil carry is laminated on one or both sides of an inner circuit board in which a conductor circuit pattern is formed on one or both sides in advance, and is sandwiched between mold plates. In the method for manufacturing a multilayer printed wiring board in which a wiring layer is stacked by repeating a molding step, as the above-mentioned resin sheet with a copper foil carry, the protective masking is applied to both the copper exposed surface and the resin exposed surface in the copper foil carry resin sheet. A method for producing a multilayer printed wiring board, characterized by using a resin sheet with a masking copper foil subjected to the above.
【０００９】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【００１０】本発明に用いる内層回路基板としては、ガ
ラス、アスベスト等の無機繊維やポリエステル、ポリア
ミド、ポリビニルアルコール、アクリル等の有機合成繊
維や木綿等の天然繊維からなる織布、不織布、マットあ
るいは紙等の基材に、フェノール樹脂、クレゾール樹
脂、エポキシ樹脂、不飽和ポリエステル樹脂、メラミン
樹脂、ポリイミド、ポリブタジエン、ポリアミド、ポリ
アミドイミド、ポリスルフォン、ポリフェニレンサルフ
ァイド、ポリフェニレンオキサイド、ポリブチレンテレ
フタレート、ポリエーテルエーテルケトン、フッ素樹脂
等の単独、変性物、混合物等の樹脂を含浸乾燥したプリ
プレグの所要枚数を重ね、その上面および又は下面に銅
箔を配設一体化してなる電気用積層板であって、その銅
箔に電気回路を形成したものである。The inner layer circuit board used in the present invention includes woven fabric, nonwoven fabric, mat or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol and acrylic, and natural fibers such as cotton. Such as a phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamide imide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, A laminated sheet for electric use which is obtained by laminating a required number of prepregs impregnated and dried with a resin such as a fluororesin alone, a modified product, a mixture, etc., and arranging and integrating a copper foil on its upper surface and / or lower surface. Form an electric circuit Those were.
【００１１】本発明における銅箔キャリー付樹脂シート
に用いる銅箔としては、電解銅箔、圧延銅箔いずれでも
よく、特に制限されるものではなく、銅箔厚さは、一般
的に0.006 〜0.07ｍｍ程度のものである。銅箔への塗布
に用いる樹脂に関しては、前述した内層回路基板の例示
含浸樹脂と同様の分野範疇のものが使用され、特に制限
されるものではない。銅箔キャリー付樹脂シートの製造
については、銅箔の片面に所定厚さの樹脂を常法により
塗布乾燥して製造することができる。The copper foil used for the resin sheet with a copper foil carry in the present invention may be any of an electrolytic copper foil and a rolled copper foil, and is not particularly limited. The copper foil generally has a thickness of 0.006 to 0.07. mm. Regarding the resin used for application to the copper foil, those having the same category as those of the above-described impregnated resin for the inner circuit board are used, and are not particularly limited. Regarding the production of a resin sheet with a copper foil carry, a resin having a predetermined thickness can be applied to one side of a copper foil by a conventional method and dried.
【００１２】本発明に用いる銅露出面の保護マスキング
は、通常のポリエチレンテレフタレートフィルム（ＰＥ
Ｔフィルム）などの合成樹脂製耐熱性フィルムである
が、特に限定されるものではない。使用するＰＥＴフィ
ルムの厚さは、10μｍ〜150 μｍの範囲が好適である。
その厚さが10μｍ未満では、成形時のクッション性の影
響（効果）が少なく、成形時の銅箔シワ、パターンの浮
き出し、打痕の発生への抑制効果が十分ではなく、ま
た、厚さが150 μｍを超えると成形時の材料のズレ出し
が懸念されるので好ましくない。The protective masking of the copper-exposed surface used in the present invention is carried out by using a general polyethylene terephthalate film (PE).
T film) and other heat-resistant films made of synthetic resin, but are not particularly limited. The thickness of the PET film used is preferably in the range of 10 μm to 150 μm.
If the thickness is less than 10 μm, the effect (effect) of the cushioning property during molding is small, and the effect of suppressing copper foil wrinkles, pattern embossing and dents during molding is not sufficient, and the thickness is insufficient. If it exceeds 150 μm, there is a concern that the material may be displaced during molding, which is not preferable.
【００１３】樹脂露出面の保護マスキングは、通常のポ
リエチレンテレフタレートフィルム（ＰＥＴフィル
ム）、ＯＰＰフィルム、離型紙等の離型性を有するフィ
ルムが挙げられ、特に限定されるものではないが、シー
トカット時に発塵等の有害性がなく、また、樹脂面と熱
融着による貼合せ時に特にカール及び離型剥離強度に実
用上の問題のないものであればよい。The protective masking of the exposed surface of the resin may be a normal polyethylene terephthalate film (PET film), an OPP film, a film having release properties such as release paper, and is not particularly limited. Any material may be used as long as there is no harmful effect such as dust generation and there is no practical problem in curling and release peeling strength particularly at the time of laminating with the resin surface by heat fusion.
【００１４】保護マスキングの銅箔への貼合せはフィル
ム片面に粘着剤を付着させて行うものである。貼合せ工
程は、一般的に、反対面の樹脂シート用樹脂を塗布する
前に行う方が好ましいが、樹脂シート用樹脂の塗布乾燥
後でも可能である。粘着剤の種類は、特に限定されるも
のではないが、樹脂シート用樹脂の塗布、乾燥工程及び
多層積層工程で問題がなく、かつ成形後、銅箔面からの
剥離が可能で特に粘着樹脂転写等のトラブルがないこと
が要求される。The bonding of the protective mask to the copper foil is performed by attaching an adhesive to one surface of the film. In general, the laminating step is preferably performed before applying the resin for the resin sheet on the opposite surface, but is also possible after the application and drying of the resin for the resin sheet. The kind of the adhesive is not particularly limited, but there is no problem in the application of the resin for the resin sheet, the drying step and the multilayer laminating step, and after the molding, the adhesive can be peeled off from the copper foil surface. It is required that there be no troubles such as.
【００１５】保護マスキングの樹脂面への貼合せは、樹
脂シート用樹脂の塗布、乾燥後に通常、熱ロールを通し
て樹脂を融着させて離型性フィルムを貼り合わせるもの
であるが、特に条件等限定されるものではなく、適度の
剥離強度を有して、貼合せ後のシートカット化に耐える
ものであり、その後の成形時の貼合せ前に問題なく離型
性フィルムが剥がせればよい。The bonding of the protective masking to the resin surface is usually performed by applying a resin for a resin sheet and drying it, and then bonding the release film by fusing the resin through a hot roll. It is not necessary to have a proper peel strength and to withstand sheet cutting after lamination, and it is sufficient that the release film can be peeled off without any problem before lamination at the time of subsequent molding.
【００１６】マスキング銅箔付樹脂シートは、内層板の
寸法に合わせて所定のワークサイズにカットして準備す
る。プレス成形に関しては、通常の多層用多段プレスを
用いてクッション等の副資材は、特に成形に問題がなけ
れば、常法にて行うことができ、限定されるものではな
い。The resin sheet with a masking copper foil is prepared by cutting it into a predetermined work size according to the dimensions of the inner layer plate. With regard to press molding, auxiliary materials such as cushions can be formed by an ordinary method using a general multi-stage press for multilayering, if there is no problem in molding, and are not limited.
【００１７】[0017]
【作用】本発明の多層プリント配線板の製造方法は、所
定の保護マスキングを使用しているため、、かつカット
時の樹脂粉及び銅箔粉の発生抑制、成形時の銅箔シワ、
パターンの浮き出しの発生抑制および打痕等の銅箔外観
の歩留り向上に寄与できる有効な方法となり得る。The method for manufacturing a multilayer printed wiring board according to the present invention uses a predetermined protective masking, and suppresses the generation of resin powder and copper foil powder at the time of cutting;
This can be an effective method that can contribute to suppressing the occurrence of pattern embossing and improving the yield of copper foil appearance such as dents.
【００１８】[0018]
【実施例】次に、本発明を実施例によって具体的に説明
するが、本発明は、これらの実施例によって限定される
ものではない。EXAMPLES Next, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.
【００１９】実施例 ガラス布基材エポキシ樹脂両面銅張積層板（総厚0.5 ｍ
ｍ、銅箔厚さ35μｍ）の両面銅箔に電気回路を形成して
内層板を得た。EXAMPLE A glass cloth-based epoxy resin double-sided copper-clad laminate (total thickness 0.5 m)
m, copper foil thickness 35 μm) to form an electric circuit on the double-sided copper foil to obtain an inner layer plate.
【００２０】一方、銅箔（12μｍ厚）の一面にＰＥＴフ
ィルム（38μｍ厚）を粘着剤で貼り合わせたＰＥＴ保護
フィルム付銅箔のＴＦＢ−４−４３４ＡＳ（藤森工業株
式会社製、商品名）に、エポキシ樹脂を厚さ80μｍとな
るように塗布乾燥して銅箔面マスキング銅箔付樹脂シー
トを得た。On the other hand, TFB-4-434AS (trade name, manufactured by Fujimori Kogyo Co., Ltd.), a copper foil with a PET protective film in which a PET film (38 μm thickness) is adhered to one surface of a copper foil (12 μm thickness) with an adhesive. Then, an epoxy resin was applied to a thickness of 80 μm and dried to obtain a resin sheet with a copper foil masking copper foil.
【００２１】次に、上記銅箔面マスキング銅箔付樹脂シ
ートにおける樹脂露出面に、ＰＥＴフィルム（30μｍ
厚）を重ね、熱ロールを用いて熱融着させることによ
り、所望の両面マスキング銅箔付き樹脂シートを得た。
この両面マスキング銅箔付樹脂シートは、前記内層板の
サイズに合わせてシートカット化しておく。Next, a PET film (30 μm) was formed on the exposed resin surface of the resin sheet with the copper foil masking copper foil.
Thickness) was stacked and thermally fused using a hot roll to obtain a desired resin sheet with double-sided masking copper foil.
This double-sided masking copper foil-attached resin sheet is cut into sheets according to the size of the inner layer plate.
【００２２】シートカットした両面マスキング銅箔付樹
脂シートは、その樹脂面のＰＥＴフィルムだけを剥が
し、前記内層板の上下面にそれぞれ、そのマスキング銅
箔面を外側にして積載しＳＵＳ板に挟んで1 組とする。
そのようにした積載組10組を成形圧30ｋｇｆ／ｃｍ2 ，
温度170 ℃×120 分間の条件で多段成形し、次いで銅箔
面マスキングを剥離して、多層プリント配線板を100 枚
製造した。The sheet-cut resin sheet with double-sided masking copper foil is peeled off only the PET film on the resin surface, and is stacked on the upper and lower surfaces of the inner layer plate with the masking copper foil surface outside and sandwiched between SUS plates. One set.
10 sets of such loading groups were formed at a molding pressure of 30 kgf / cm 2 ,
Multi-stage molding was performed at a temperature of 170 ° C. for 120 minutes, and then the masking of the copper foil surface was peeled off to produce 100 multilayer printed wiring boards.
【００２３】比較例１ 実施例において、両面マスキング銅箔付樹脂シートに換
えて両面のＰＥＴフィルムを用いない銅箔付樹脂シート
（銅箔12μｍ厚、エポキシ樹脂厚さ80μｍ）を用いた以
外は、実施例と同様にして多層プリント配線板を100 枚
製造した。COMPARATIVE EXAMPLE 1 In the example, a resin sheet with a copper foil (12 μm thick copper foil, 80 μm thick epoxy resin) without using a PET film on both sides was used instead of the resin sheet with double-sided masking copper foil. In the same manner as in the example, 100 multilayer printed wiring boards were manufactured.
【００２４】比較例２ 実施例において、銅箔面マスキング（片面のみ）銅箔付
樹脂シートの段階でシートカットした材料を用いた以外
は、実施例と同様にして多層プリント配線板を100 枚製
造した。Comparative Example 2 100 multi-layer printed wiring boards were manufactured in the same manner as in the example except that the material cut in the stage of the resin sheet with the copper foil was used in the step of masking the copper foil (only one side). did.
【００２５】こうして得られた実施例及び比較例１，２
の多層プリント配線板について、外観の打痕等の歩留り
及び銅箔のシワ、内層パターンの浮き出しのレベルを確
認した。その結果を表１に示したが、本発明は、銅箔外
観の歩留り及び内層回路の浮き出しが良好、また、外層
パターン形成の歩留りが良好であることが確認できた。Examples and Comparative Examples 1 and 2 thus obtained
With respect to the multilayer printed wiring board, the yield such as dents in the appearance, the wrinkles of the copper foil, and the level of embossment of the inner layer pattern were confirmed. The results are shown in Table 1, and it was confirmed that the present invention had a good yield of the copper foil appearance and good embossing of the inner layer circuit, and a good yield of the outer layer pattern formation.
【００２６】[0026]
【表１】 [Table 1]
【００２７】[0027]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の多層プリント配線板の製造方法によれば、
成形時の銅箔のシワ、パターンの浮き出し発生を抑制
し、銅箔外観の歩留を向上した多層プリント配線板が製
造できる。As apparent from the above description and Table 1, according to the method for manufacturing a multilayer printed wiring board of the present invention,
It is possible to manufacture a multilayer printed wiring board in which wrinkling of copper foil and occurrence of pattern embossing during molding are suppressed, and the yield of copper foil appearance is improved.
Claims (3)
ンが形成された内層回路基板の片面あるいは両面に、銅
箔キャリー付樹脂シートを重ねたものを、金型プレート
に挟んで熱圧成形を行う工程を繰り返して配線層を積み
重ねる多層プリント配線板の製造方法において、上記銅
箔キャリー付樹脂シートとして、銅箔キャリー付樹脂シ
ートにおける銅露出面と樹脂露出面の両方にそれぞれの
保護マスキングを施したマスキング銅箔付樹脂シートを
使用することを特徴とする多層プリント配線板の製造方
法。1. A step of hot-press molding a resin sheet with a copper foil carry on one or both sides of an inner circuit board on which a conductor circuit pattern has been formed on one or both sides in advance by sandwiching the resin sheet with a mold plate. In the method for manufacturing a multilayer printed wiring board in which the wiring layers are stacked by repeating the above, in the above-mentioned resin sheet with a copper foil carry, masking is performed on both the copper exposed surface and the resin exposed surface of the copper foil carry with resin mask. A method for producing a multilayer printed wiring board, comprising using a resin sheet with copper foil.
露出面の保護マスキングは、銅露出面に粘着させた厚さ
10μｍ〜150 μｍのポリエチレンテレフタレートフィル
ムであり、樹脂露出面の保護マスキングは、樹脂露出面
における樹脂を融着させた離型性フィルムである請求項
１記載の多層プリント配線板の製造方法。2. The protective masking of an exposed copper surface in a resin sheet with a masking copper foil is performed by using a thickness adhered to the exposed copper surface.
2. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the protective masking on the exposed resin surface is a release film obtained by fusing the resin on the exposed resin surface with a polyethylene terephthalate film of 10 μm to 150 μm.
脂露出面の保護マスキングは、それを成形前に剥がし、
銅露出面の保護マスキングは、それを成形後に剥がし
て、銅箔キャリー付樹脂シートとして使用する請求項２
記載の多層プリント配線板の製造方法。3. The protective masking of the resin exposed surface of the resin sheet with the masking copper foil is performed by peeling the resin before molding.
The protective masking of an exposed copper surface is peeled off after molding, and used as a resin sheet with a copper foil carry.
A method for producing the multilayer printed wiring board according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31544898A JP3943735B2 (en) | 1998-10-19 | 1998-10-19 | Manufacturing method of build-up type multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31544898A JP3943735B2 (en) | 1998-10-19 | 1998-10-19 | Manufacturing method of build-up type multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000124611A true JP2000124611A (en) | 2000-04-28 |
| JP3943735B2 JP3943735B2 (en) | 2007-07-11 |
Family
ID=18065498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31544898A Expired - Fee Related JP3943735B2 (en) | 1998-10-19 | 1998-10-19 | Manufacturing method of build-up type multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3943735B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013115316A (en) * | 2011-11-30 | 2013-06-10 | Shin Etsu Polymer Co Ltd | Manufacturing method of wiring board |
| CN114571532A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Die cutting device for manufacturing bending-proof folded copper foil die cutting piece and manufacturing method |
-
1998
- 1998-10-19 JP JP31544898A patent/JP3943735B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013115316A (en) * | 2011-11-30 | 2013-06-10 | Shin Etsu Polymer Co Ltd | Manufacturing method of wiring board |
| CN114571532A (en) * | 2020-11-30 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Die cutting device for manufacturing bending-proof folded copper foil die cutting piece and manufacturing method |
| CN114571532B (en) * | 2020-11-30 | 2024-04-02 | 上海昊佰智造精密电子股份有限公司 | Die cutting device and method for manufacturing bending-prevention fold copper foil die cutting piece |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3943735B2 (en) | 2007-07-11 |
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