JP2000115086A - Electromagnetic shielded electronic circuit board - Google Patents
Electromagnetic shielded electronic circuit boardInfo
- Publication number
- JP2000115086A JP2000115086A JP10277368A JP27736898A JP2000115086A JP 2000115086 A JP2000115086 A JP 2000115086A JP 10277368 A JP10277368 A JP 10277368A JP 27736898 A JP27736898 A JP 27736898A JP 2000115086 A JP2000115086 A JP 2000115086A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic shielding
- electronic circuit
- circuit board
- electromagnetic
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばパーソナル
コンピュータや携帯電話装置などの電子機器に備えられ
る高速デジタル回路や高周波回路などの電子回路から放
射され、また、電子回路に放射される電磁波を遮蔽する
電磁遮蔽電子回路基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to shielding electromagnetic waves radiated from electronic circuits such as high-speed digital circuits and high-frequency circuits provided in electronic equipment such as personal computers and portable telephone devices, and radiated to the electronic circuits. To an electromagnetic shielding electronic circuit board.
【０００２】[0002]
【従来の技術】近年、例えばパーソナルコンピュータや
携帯電話装置などの電子機器に用いられる高速デジタル
回路基板や高周波回路基板などの電子回路における処理
速度が高速になってきている。このような高速処理用の
電子回路から放射される電磁波は他の電子回路の誤動作
の原因になるため、その放射される電磁波を抑圧した適
正な環境を提供する必要がある。2. Description of the Related Art In recent years, the processing speed of electronic circuits such as high-speed digital circuit boards and high-frequency circuit boards used in electronic devices such as personal computers and mobile telephone devices has been increasing. Electromagnetic waves radiated from such a high-speed processing electronic circuit cause malfunctions of other electronic circuits. Therefore, it is necessary to provide an appropriate environment in which the radiated electromagnetic waves are suppressed.
【０００３】このような高速処理用の電子回路からの不
要な電磁波の放射を防いだり、この電子回路が備えられ
た基板間の電磁波干渉を防いだりするために、従来の携
帯電話装置などでは、その高速処理用の電子回路が搭載
された基板を、金属製の箱内に密閉収容して電磁的な閉
空間を作り出し基板を金属製の箱に接地していた。In order to prevent unnecessary radiation of electromagnetic waves from such a high-speed processing electronic circuit and to prevent electromagnetic wave interference between substrates provided with this electronic circuit, a conventional portable telephone device or the like is used. The substrate on which the electronic circuit for high-speed processing is mounted is hermetically housed in a metal box to create an electromagnetically closed space, and the substrate is grounded to the metal box.
【０００４】[0004]
【発明が解決しようとする課題】このような従来の金属
製箱による密閉構造では、電子回路基板を収容している
金属製箱のために、嵩が大きくなって電子機器の小型化
が容易ではなくコスト高にもなり、さらに、電子回路基
板の検査や修理の場合に金属製箱内の電子回路基板を取
り出さねばならず大変手間がかかるという問題を有して
いた。In such a hermetically sealed structure using a conventional metal box, it is difficult to reduce the size of the electronic equipment because the metal box containing the electronic circuit board is bulky. In addition, there is a problem that the cost is high and the electronic circuit board in the metal box has to be taken out when inspecting or repairing the electronic circuit board, which is very troublesome.
【０００５】本発明は、上記従来の問題を解決するもの
で、電子回路からの不要電磁放射を抑圧すると共に、電
子回路の検査や修理も容易で小型化にも有利な電磁遮蔽
電子回路基板を提供することを目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides an electromagnetic shielding electronic circuit board which suppresses unnecessary electromagnetic radiation from an electronic circuit and which is easy to inspect and repair the electronic circuit and which is advantageous in miniaturization. The purpose is to provide.
【０００６】[0006]
【課題を解決するための手段】本発明の電磁遮蔽電子回
路基板は、電子部品が実装されコモンラインを含む配線
基板の実装面に、コモンラインとの間で電子部品を覆っ
て電磁遮蔽空間を形成する電磁遮蔽シート体が被せられ
たことを特徴とするものである。An electromagnetically shielded electronic circuit board according to the present invention has an electromagnetically shielded space on a mounting surface of a wiring board on which electronic components are mounted and including a common line, by covering the electronic component with the common line. The electromagnetic shielding sheet to be formed is covered.
【０００７】この構成により、電磁遮蔽シート体が被せ
られた電磁遮蔽空間内に電子部品が収容されているの
で、電子回路から電磁遮蔽シート体外部への不要電磁放
射だけではなく、外部から内部の電子回路に入る不要電
磁放射が抑圧されると共に、従来の金属製箱による密閉
構造の場合と比べて嵩ばらず小型化が可能で、電磁遮蔽
シート体を剥がすだけで回路基板の検査や修理が容易に
行われる。With this configuration, since the electronic components are accommodated in the electromagnetic shielding space covered by the electromagnetic shielding sheet, not only unnecessary electromagnetic radiation from the electronic circuit to the outside of the electromagnetic shielding sheet, but also the external electromagnetic radiation from the inside to the outside. Unnecessary electromagnetic radiation entering the electronic circuit is suppressed, and it is not bulky and can be miniaturized as compared with the case of the conventional sealed structure made of metal box, and inspection and repair of the circuit board can be performed simply by peeling off the electromagnetic shielding sheet. Easy to do.
【０００８】また、好ましくは、本発明の電磁遮蔽電子
回路基板において、少なくとも放熱部材が取り付けられ
た電子部品を有し、この電子部品は導電体を介して放熱
部材に取り付けられ、かつ電磁遮蔽シート体は導電体の
周囲と接している。Preferably, in the electromagnetic shielding electronic circuit board of the present invention, at least an electronic component to which a heat radiating member is attached, the electronic component is attached to the heat radiating member via a conductor, and the electromagnetic shielding sheet is provided. The body is in contact with the periphery of the conductor.
【０００９】この構成により、電子部品の放熱部材がア
ンテナ類似の動作により不要電磁波放射が問題視される
が、放熱部材の下端面と電子部品の上端面との間に設け
られた導電体の周囲とコモンラインとの間に電磁遮蔽シ
ート体が設けられて電磁的に閉回路を構成しているの
で、この放熱部材のアンテナ類似動作による不要輻射現
象が防止される。With this configuration, the radiation member of the electronic component may emit unnecessary electromagnetic waves due to an operation similar to that of the antenna. However, the periphery of the conductor provided between the lower end surface of the radiation member and the upper end surface of the electronic component may be problematic. Since an electromagnetic shielding sheet is provided between the antenna and the common line to form an electromagnetically closed circuit, an unnecessary radiation phenomenon due to the operation of the heat radiating member similar to the antenna is prevented.
【００１０】さらに、好ましくは、本発明の電磁遮蔽電
子回路基板において、電磁遮蔽シート体とコモンライン
間に導電部材が介設されている。[0010] More preferably, in the electromagnetic shielding electronic circuit board of the present invention, a conductive member is interposed between the electromagnetic shielding sheet and the common line.
【００１１】この構成により、電磁遮蔽シート体は配線
基板上のコモンラインに貼り付けるよりも、導体部材を
介して貼り付ける方が作業性がよく容易であり良好な仕
上がりとなる。According to this configuration, the workability is good, the work is easy, and a good finish is obtained when the electromagnetic shielding sheet is attached via a conductor member, rather than on the common line on the wiring board.
【００１２】さらに、好ましくは、本発明の電磁遮蔽電
子回路基板において、電磁遮蔽シート体とコモンライン
間に電磁遮蔽フィルタが介設されている。Still preferably, in the electromagnetic shielding electronic circuit board according to the present invention, an electromagnetic shielding filter is provided between the electromagnetic shielding sheet and the common line.
【００１３】この構成により、電磁遮蔽フィルタを介し
て配線基板から引き出し導線が引き出されるので、引き
出し導線を経由した電磁波の漏れや侵入を防ぐことが可
能となる。With this configuration, the lead wire is drawn out of the wiring board through the electromagnetic shielding filter, so that leakage or intrusion of the electromagnetic wave via the lead wire can be prevented.
【００１４】さらに、好ましくは、本発明の電磁遮蔽電
子回路基板における電磁遮蔽空間を複数形成する。ま
た、好ましくは、本発明の電磁遮蔽電子回路基板におけ
る配線基板は電磁遮蔽されている。具体的には例えば、
導電部材が配線基板上を複数の領域に隔離し、電磁遮蔽
シート体、導電部材および配線基板で複数の電磁遮蔽空
間を形成する。Further, preferably, a plurality of electromagnetic shielding spaces in the electromagnetic shielding electronic circuit board of the present invention are formed. Preferably, the wiring board in the electromagnetically shielded electronic circuit board of the present invention is electromagnetically shielded. Specifically, for example,
The conductive member separates the wiring board into a plurality of regions, and the electromagnetic shielding sheet, the conductive member, and the wiring board form a plurality of electromagnetic shielding spaces.
【００１５】この構成により、配線基板上を複数の電磁
遮蔽空間に隔離すれば、同じ配線基板上に搭載される電
子部品から放射される電磁波が相互に干渉するのが防止
されて電子部品の誤動作が防止される。また、複数の電
磁遮蔽空間に隔離することで相互に電磁波干渉をきらう
電子部品であっても同じ配線基板上に接近させて搭載可
能となって装置の小型化にも寄与することになる。With this configuration, if the wiring board is isolated into a plurality of electromagnetic shielding spaces, electromagnetic waves radiated from electronic components mounted on the same wiring board are prevented from interfering with each other, and malfunction of the electronic components is prevented. Is prevented. In addition, by separating the electronic components into a plurality of electromagnetic shielding spaces, even electronic components that are not likely to interfere with each other can be mounted close to the same wiring board, thereby contributing to downsizing of the device.
【００１６】さらに、好ましくは、本発明の電磁遮蔽電
子回路基板における電磁遮蔽シート体は透光性を有して
いる。Further, preferably, the electromagnetic shielding sheet in the electromagnetic shielding electronic circuit board of the present invention has a light transmitting property.
【００１７】この構成により、電磁遮蔽シート体を通し
て電磁遮蔽電子回路基板の様子が容易に目視可能である
ので、電磁遮蔽電子回路基板の様子が容易に判り、その
検査や修理のときに有利である。According to this configuration, the appearance of the electromagnetically shielded electronic circuit board can be easily viewed through the electromagnetically shielded sheet member, so that the state of the electromagnetically shielded electronic circuit board can be easily understood, which is advantageous for inspection and repair. .
【００１８】[0018]
【発明の実施の形態】以下、本発明に係る電磁遮蔽電子
回路基板の実施形態について図面を参照して説明する
が、本発明は以下に示す実施形態に限定されるものでは
ない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the electromagnetically shielded electronic circuit board according to the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.
【００１９】図１は本発明の一実施形態における電磁遮
蔽電子回路基板の概略縦断面構造を示す模式図である。FIG. 1 is a schematic diagram showing a schematic longitudinal sectional structure of an electromagnetic shielding electronic circuit board according to an embodiment of the present invention.
【００２０】図１において、電磁遮蔽電子回路基板１
は、回路配線がプリントされたプリント配線基板である
基板本体２と、この基板本体２上に実装され配線パター
ンと共に電子回路を構成する各種の電子部品３と、基板
本体２の接地面（コモンライン）に当接する導電部材４
と、この導電部材４の上面に貼り付けられて基板本体２
の上方（配線基板の一部であってもよい）および電子部
品３の上方を覆って、これらの基板本体２および導電部
材４とで電磁遮蔽空間を形成する電磁遮蔽シート体とし
ての電磁遮蔽フィルム５とを有している。In FIG. 1, an electromagnetic shielding electronic circuit board 1 is shown.
Are a printed circuit board on which circuit wiring is printed, various electronic components 3 mounted on the printed circuit board 2 and constituting an electronic circuit together with a wiring pattern, and a ground plane (common line) of the printed circuit board 2. ) Contacting the conductive member 4
And the substrate body 2 attached to the upper surface of the conductive member 4.
Electromagnetic shielding film as an electromagnetic shielding sheet that forms an electromagnetic shielding space with the substrate main body 2 and the conductive member 4 covering the upper part (which may be a part of a wiring board) and the upper part of the electronic component 3 5 is provided.
【００２１】この基板本体２は、ＩＣチップなどの各種
電子部品３が実装されて回路配線パターンと共に構成さ
れた２つの電子回路部分I,IIが形成されており、これら
の電子回路部分I,IIの外周部に沿って接地配線パターン
（コモンライン）が形成されている。この接地配線パタ
ーンとホール（図示せず）を経由するなどして基板本体
２の層間または下面に基板本体２を電磁波が透過しにく
いように電磁遮蔽用の金属薄膜が設けられて電磁遮蔽さ
れている。The substrate main body 2 is formed with two electronic circuit parts I and II on which various electronic components 3 such as an IC chip are mounted and configured with a circuit wiring pattern, and these electronic circuit parts I and II are formed. A ground wiring pattern (common line) is formed along the outer peripheral portion of. A metal thin film for electromagnetic shielding is provided on the interlayer or the lower surface of the substrate main body 2 so as to make it difficult for electromagnetic waves to pass through the substrate main body 2 through the ground wiring pattern and a hole (not shown). I have.
【００２２】また、導電部材４は、アルミニウムなどの
金属材料で構成されており、その下面の少なくとも一部
が基板本体２の接地面（コモンライン）に当接すると共
に、基板本体２上における電磁遮蔽エリアの外周部に亘
って閉ループを構成するように基板本体２上に装着され
ている。本実施形態では、導電部材４は、２つの電磁遮
蔽エリアである電子回路部分I,IIとなるように基板本体
２上を２つに隔離するように配設されている。The conductive member 4 is made of a metal material such as aluminum. At least a part of the lower surface of the conductive member 4 is in contact with the ground plane (common line) of the substrate body 2 and the electromagnetic shielding on the substrate body 2 It is mounted on the substrate body 2 so as to form a closed loop over the outer periphery of the area. In the present embodiment, the conductive member 4 is disposed so as to separate the two on the substrate body 2 so as to be the electronic circuit portions I and II, which are two electromagnetic shielding areas.
【００２３】さらに、電磁遮蔽シート体としての電磁遮
蔽フィルム５は、図２に示すように、熱伝導性の良好な
材質の薄い金属膜６と、この金属膜６を上下から挾み込
んで保護する絶縁膜７とを有している。ここでは、金属
膜６は抵抗体でありそのシート抵抗値が４０オームで透
明または半透明の透光性を有した材料の薄膜であり、こ
の金属膜６を覆う絶縁膜７は厚さ２５ミクロンのポリエ
ステルの透明または半透明の透光性を有する薄膜であ
る。この場合、電磁遮蔽フィルム５を透過する電磁波の
入射電磁波に対する減衰量は３０ｄＢである。この電磁
遮蔽フィルム５として熱線遮断フィルムを用いても良
い。Further, as shown in FIG. 2, the electromagnetic shielding film 5 as the electromagnetic shielding sheet is protected by sandwiching the metal film 6 from above and below with a thin metal film 6 having a good thermal conductivity. And an insulating film 7 to be formed. Here, the metal film 6 is a resistor, a thin film of a transparent or translucent material having a sheet resistance value of 40 ohms and having a translucency, and an insulating film 7 covering the metal film 6 has a thickness of 25 μm. Is a transparent or translucent translucent thin film of polyester. In this case, the attenuation of the electromagnetic wave transmitted through the electromagnetic shielding film 5 with respect to the incident electromagnetic wave is 30 dB. A heat ray shielding film may be used as the electromagnetic shielding film 5.
【００２４】この金属膜６は絶縁膜７を介して、接地さ
れた導電部材４の上面に接着剤などで貼り付けされてい
るために、金属膜６は電気的に接地された状態ではな
く、従来の概念では電磁遮蔽効果が得られないはずであ
る。ところが、図１のＡ部付近拡大図である図３におい
て、基板本体２上に設けられた接地配線パターン８上の
導電部材４の上面と金属膜６との間の絶縁膜７の厚さｔ
の隙間を、電磁遮蔽フィルム５の貼付代の長さＳに亘っ
て、基板本体２上の電子部品３から放射された不要電磁
波の漏洩や侵入が大幅に抑圧されるようになっている。Since the metal film 6 is adhered to the upper surface of the grounded conductive member 4 with an adhesive or the like via the insulating film 7, the metal film 6 is not electrically grounded. The conventional concept should not provide an electromagnetic shielding effect. However, in FIG. 3 which is an enlarged view near the portion A in FIG. 1, the thickness t of the insulating film 7 between the upper surface of the conductive member 4 on the ground wiring pattern 8 provided on the substrate body 2 and the metal film 6
The leakage or intrusion of unnecessary electromagnetic waves radiated from the electronic component 3 on the substrate main body 2 is largely suppressed in the gap of the electromagnetic shielding film 5 over the length S of the sticking allowance of the electromagnetic shielding film 5.
【００２５】このように、この電磁遮蔽フィルム５はそ
の貼付代の長さＳに亘って導電部材４の上面に貼り付け
られているが、これは、厚さｔの絶縁膜７である誘電体
を介して電磁波が漏洩したり侵入したりするために、そ
の高い周波数帯では図４に示すような電気容量Ｃが発生
する。一方、電磁遮蔽フィルム５の金属膜６には電気抵
抗Ｒが存在する結果、導電部材４の上面に貼付られた電
磁遮蔽フィルム５の貼付代の区間長さＳにおける等価回
路網９は、図４に示すような電気抵抗Ｒと電気容量Ｃか
ら構成される分布定数回路となっている。As described above, the electromagnetic shielding film 5 is stuck on the upper surface of the conductive member 4 over the length S of the sticking allowance, and is made of the dielectric film 7 having the thickness t. In this high frequency band, an electric capacity C is generated as shown in FIG. On the other hand, as a result of the presence of the electrical resistance R in the metal film 6 of the electromagnetic shielding film 5, the equivalent circuit network 9 in the section length S of the allowance of the electromagnetic shielding film 5 attached to the upper surface of the conductive member 4 is shown in FIG. Is a distributed constant circuit composed of an electric resistance R and an electric capacitance C as shown in FIG.
【００２６】この等価回路網９の分布定数回路には、特
性インピーダンスＺ0および伝播定数γが与えられる。
今、図５に示すように、空間に対する導電部材４と金属
膜６との隙間（絶縁膜７の厚さｔ）の等価インピーダン
ス（スロットアンテナと等価）をＺSとおけば、絶縁膜
７の厚さｔ部分から漏洩する電磁波実効動作減衰量は、
フィルム貼付代の区間長さＳを次の（数１）式で示すこ
とができる。The distributed impedance circuit of the equivalent circuit network 9 is given a characteristic impedance Z 0 and a propagation constant γ.
Now, as shown in FIG. 5, if the equivalent impedance (equivalent to a slot antenna) of the gap (the thickness t of the insulating film 7) between the conductive member 4 and the metal film 6 with respect to the space is Z S , The effective operation attenuation of the electromagnetic wave leaking from the thickness t portion is:
The section length S of the film sticking allowance can be expressed by the following (Equation 1).
【００２７】[0027]
【数１】 (Equation 1)
【００２８】すなわち、この電磁遮蔽フィルム５の金属
膜６の電気抵抗Ｒが高く、フィルム貼付代の区間長さＳ
が長く、絶縁膜７による電気容量Ｃが大きいほど、放射
された電磁波の同一周波数では減衰量が多くなる。この
ように、減衰量が多いということは、基板本体２上の電
子部品３から発生した不要電磁波の外部への漏れをより
抑圧し、また、外部から内部への侵入をより抑圧したこ
とになる。このとき、金属膜６の電気抵抗Ｒをあまり高
くすると、金属膜６の薄膜面に直角な方向に直接的に透
過する電磁波の減衰量が小さくなるので、その抵抗値を
高くすることには限界がある。That is, the electric resistance R of the metal film 6 of the electromagnetic shielding film 5 is high, and the section length S of the film sticking allowance is set.
And the larger the capacitance C due to the insulating film 7, the greater the attenuation at the same frequency of the radiated electromagnetic wave. As described above, the large amount of attenuation means that the unnecessary electromagnetic wave generated from the electronic component 3 on the substrate main body 2 is further suppressed from leaking to the outside, and the intrusion from outside to inside is further suppressed. . At this time, if the electric resistance R of the metal film 6 is too high, the attenuation of the electromagnetic wave transmitted directly in the direction perpendicular to the thin film surface of the metal film 6 becomes small, so that it is impossible to increase the resistance value. There is.
【００２９】この電磁遮蔽フィルム５の金属膜６の電気
抵抗Ｒの適正値は主に、フィルム貼付代の区間長さＳお
よび電気容量Ｃ（絶縁膜７の誘電率とその厚さｔで決ま
る値）から求める必要がある。本実施形態では、厚さ２
５ミクロンのポリエステルフィルム（誘電率は約３）を
絶縁膜７として使用して、図６に示すように、フィルム
貼付代の区間長さＳ（＝３ｍｍ，５ｍｍ，１０ｍｍ）毎
の電磁波の周波数ＭＨｚに対する減衰量を測定して得
た。この図６に示した減衰量（ｄＢ）では、図５の観測
点１０までの距離Ｄをゼロに補正した値となっている。
したがって、実際の減衰量は、この観測点１０までの距
離Ｄにより、次の（数２）式の伝播損失が図６の減衰量
に加算されればよい。The proper value of the electric resistance R of the metal film 6 of the electromagnetic shielding film 5 is mainly determined by the section length S and the electric capacity C (the value determined by the dielectric constant of the insulating film 7 and its thickness t). ). In the present embodiment, the thickness 2
Using a 5-micron polyester film (having a dielectric constant of about 3) as the insulating film 7, as shown in FIG. 6, the frequency MHz of the electromagnetic wave for each section length S (= 3 mm, 5 mm, 10 mm) of the film sticking allowance Was obtained by measuring the amount of attenuation with respect to. The attenuation (dB) shown in FIG. 6 is a value obtained by correcting the distance D to the observation point 10 in FIG. 5 to zero.
Therefore, the actual attenuation may be obtained by adding the propagation loss of the following equation (2) to the attenuation shown in FIG. 6 based on the distance D to the observation point 10.
【００３０】[0030]
【数２】 (Equation 2)
【００３１】ここでは、隙間（絶縁膜７の厚さｔ）のイ
ンピーダンスを輻射量最大の１３０オームの共振点に置
いた。この値は隙間から漏れる電磁波の減衰量であり、
電磁遮蔽フィルム５を透過して直接漏れる減衰量が３０
ｄＢであるから、基板本体２全体の電磁波の漏れ減衰量
は３０ｄＢを越えるようなことはない。Here, the impedance of the gap (the thickness t of the insulating film 7) is set at the resonance point of 130 ohms, which is the maximum radiation amount. This value is the amount of attenuation of electromagnetic waves leaking from the gap,
The attenuation that directly leaks through the electromagnetic shielding film 5 is 30.
Since it is dB, the leakage attenuation of the electromagnetic wave of the entire substrate main body 2 does not exceed 30 dB.
【００３２】以上により、電子回路、特にデジタル半導
体回路などで発生する有害な高調波が基板本体２、導電
部材４および電磁遮蔽フィルム５で構成される電磁遮蔽
空間内に閉じ込められ、電磁遮蔽フィルム５の外部への
放射量は３０ｄＢ以下に抑圧される。また、このように
不要電磁波を抑圧する以外に、隣接する基板本体２同士
や、２つの電磁遮蔽空間の電子回路部分I,IIの電磁波干
渉を軽減するため、電子部品３を含む電子回路の動作の
安定化や、基板本体２を近接配置して装置全体を小型化
するのにも寄与することができる。さらに、電磁遮蔽フ
ィルム５は導電部材４の上面に接着剤などで貼付るた
め、作業が簡単であり、検査、点検および修理の場合に
電磁遮蔽フィルム５を剥がすことも容易である。さらに
は、この場合、電子回路へのアクセス性も良好となる。As described above, harmful harmonics generated in electronic circuits, especially digital semiconductor circuits, etc., are confined in the electromagnetic shielding space formed by the substrate body 2, the conductive member 4, and the electromagnetic shielding film 5, and the electromagnetic shielding film 5 Is suppressed to 30 dB or less. In addition to suppressing the unnecessary electromagnetic waves as described above, the operation of the electronic circuit including the electronic component 3 is performed to reduce the electromagnetic wave interference between the adjacent substrate main bodies 2 and the electronic circuit portions I and II in the two electromagnetic shielding spaces. , And the size of the entire device can be reduced by arranging the substrate main body 2 in close proximity. Furthermore, since the electromagnetic shielding film 5 is stuck on the upper surface of the conductive member 4 with an adhesive or the like, the operation is simple, and the electromagnetic shielding film 5 can be easily peeled off for inspection, inspection and repair. Further, in this case, the accessibility to the electronic circuit is improved.
【００３３】したがって、基板本体２と電磁遮蔽フィル
ム５間の電磁遮蔽空間内に電子部品３を収容するように
したため、電子部品３から電磁遮蔽フィルム５の外部へ
の不要電磁放射を抑圧でき、かつ外部から内部に侵入す
る電磁波を抑圧できると共に、従来の金属製箱による密
閉構造の場合と比べて嵩ばらず小型化でき、また、電磁
遮蔽フィルム５を剥がすだけで電磁遮蔽電子回路基板１
の検査や修理を容易に行うことができる。Therefore, since the electronic component 3 is accommodated in the electromagnetic shielding space between the substrate body 2 and the electromagnetic shielding film 5, unnecessary electromagnetic radiation from the electronic component 3 to the outside of the electromagnetic shielding film 5 can be suppressed, and It is possible to suppress electromagnetic waves entering from the outside to the inside, to reduce the size without increasing the bulk compared to the case of a conventional sealed structure made of a metal box, and to remove the electromagnetic shielding film 5 to remove the electromagnetic shielding electronic circuit board 1.
Inspection and repair can be easily performed.
【００３４】また、電磁遮蔽フィルム５は可視光線を比
較的容易に透過するため、基板本体２の表面の目視が容
易である。したがって、電磁遮蔽電子回路基板１の様子
が透明または半透明な電磁遮蔽フィルム５を通して容易
に判り、電磁遮蔽電子回路基板１の検査や修理のときに
便利である。さらに、電磁遮蔽フィルム５の表面は絶縁
されているため、基板本体２に搭載する電子回路に直接
及ぼす影響は無視することができる。Further, since the electromagnetic shielding film 5 transmits visible light relatively easily, the surface of the substrate body 2 can be easily viewed. Therefore, the appearance of the electromagnetic shielding electronic circuit board 1 can be easily understood through the transparent or translucent electromagnetic shielding film 5, which is convenient when inspecting or repairing the electromagnetic shielding electronic circuit board 1. Further, since the surface of the electromagnetic shielding film 5 is insulated, the effect directly on the electronic circuit mounted on the substrate body 2 can be ignored.
【００３５】なお、本実施形態では、図１に示すよう
に、接地された導電部材４を基板本体２上に搭載するこ
とで、２つの電磁遮蔽領域の電子回路部分I,IIを電磁波
的に隔離して区分したが、この導電部材４の代りに図７
に示すようなスルーホール１１で接続された基板本体１
２の金属接地面（コモンライン）１３，１３ａのうち実
装面側の金属接地面１３ａに、柔軟な電磁遮蔽フィルム
５を接着剤１４で直接貼り付けて電子部品１５を覆って
電子部品１５から放射される電磁波を遮蔽することもで
きる。この場合のように、電磁遮蔽フィルム５は基板本
体１２上の金属接地面１３に直接貼り付けるよりも、上
記実施形態のように導電部材４を介して貼り付ける方が
作業性がよく容易であり良好な仕上がりとすることがで
きるが、上記場合の方が導電部材４の部品を削減するこ
とができる。In this embodiment, as shown in FIG. 1, by mounting the grounded conductive member 4 on the substrate body 2, the electronic circuit portions I and II of the two electromagnetic shielding regions are electromagnetically affected. Although it is separated and divided, the conductive member 4 is replaced with the one shown in FIG.
Substrate body 1 connected by through holes 11 as shown in FIG.
The flexible electromagnetic shielding film 5 is directly adhered to the metal ground plane 13a on the mounting surface side of the metal ground planes (common lines) 13 and 13a on the mounting surface side with an adhesive 14 to cover the electronic component 15 and radiate from the electronic component 15. Electromagnetic waves to be emitted can be shielded. As in this case, it is easier and easier to attach the electromagnetic shielding film 5 via the conductive member 4 as in the above-described embodiment than to directly attach the electromagnetic shielding film 5 to the metal ground plane 13 on the substrate body 12. Although a good finish can be obtained, the number of components of the conductive member 4 can be reduced in the above case.
【００３６】また、この導電部材４の代りに、導線を経
由した電磁波を遮蔽する機能を持つ図８に示すような電
磁遮蔽（ＥＭＩ）フィルタまたはこの電磁遮蔽（ＥＭ
Ｉ）フィルタを含む接栓の外部金属体２１を使用して、
基板本体２からの引き出し導線２２を経由しての電磁波
の漏れや侵入を防ぐことができる。このように、電磁遮
蔽（ＥＭＩ）フィルタなどを介して基板本体２から引き
出し導線２２が引き出されるため、この引き出し導線２
２を経由した基板本体２からの電磁波の漏れや侵入を防
ぐことができる。In place of the conductive member 4, an electromagnetic shielding (EMI) filter as shown in FIG.
I) Using the external metal body 21 of the plug including the filter,
Electromagnetic waves can be prevented from leaking or entering through the lead wires 22 from the substrate body 2. As described above, since the lead wire 22 is drawn out of the substrate body 2 via an electromagnetic shielding (EMI) filter or the like, the lead wire 2 is pulled out.
2 can prevent leakage or intrusion of electromagnetic waves from the substrate main body 2 via the main body 2.
【００３７】また、図９に示すように、基板本体２上に
装着される高周波クロックで高速動作する半導体３１
は、その発熱を放熱するために放熱部材としての放熱片
３２を使用するが、この大型の放熱片３２がアンテナ類
似の動作をしてしまうことで放熱片３２からの不要電磁
波の放射が問題視されているが、この放熱片３２の下端
面と高速動作の半導体３１の上端面との間に、金属板ま
たは金属シートなどの導電体としての金属部材３３を設
け、同様な電磁遮蔽フィルム５の貼付代の区間長さＳを
設けて、金属部材３３の周囲と導電部材４との間で電磁
遮蔽フィルム５を貼り付けて、電磁波的な閉回路を構成
すれば、この放熱片３２のアンテナ類似動作による不要
輻射現象を防止することができる。As shown in FIG. 9, a semiconductor 31 which operates at high speed by a high frequency clock mounted on the substrate main body 2 is used.
Uses a heat radiating piece 32 as a heat radiating member in order to radiate the heat generated. However, since the large heat radiating piece 32 operates in a manner similar to an antenna, radiation of unnecessary electromagnetic waves from the heat radiating piece 32 is regarded as a problem. However, a metal member 33 as a conductor such as a metal plate or a metal sheet is provided between the lower end surface of the heat radiating piece 32 and the upper end surface of the semiconductor 31 which operates at a high speed. If an electromagnetic shielding film 5 is attached between the periphery of the metal member 33 and the conductive member 4 by providing a section length S for the attachment allowance to form an electromagnetic wave closed circuit, the heat radiation piece 32 is similar to the antenna. The unnecessary radiation phenomenon due to the operation can be prevented.
【００３８】[0038]
【発明の効果】以上のように本発明の請求項１によれ
ば、電磁遮蔽シート体が被せられた電磁遮蔽空間内に電
子部品が収容されるため、電子回路から電磁遮蔽シート
体外部への不要電磁放射を抑圧できるだけではなく、外
部から内部に侵入して電子回路に放射される電磁波を抑
圧できると共に、従来の金属製箱による密閉構造の場合
と比べて嵩ばらず小型化でき、また、電磁遮蔽シート体
を剥がすだけで回路基板の検査や修理を容易に行うこと
ができる。As described above, according to the first aspect of the present invention, since the electronic components are accommodated in the electromagnetic shielding space covered by the electromagnetic shielding sheet, the electronic components are transferred from the electronic circuit to the outside of the electromagnetic shielding sheet. Not only can unnecessary electromagnetic radiation be suppressed, but also electromagnetic waves that enter the inside from the outside and are radiated to electronic circuits can be suppressed, and can be made smaller and less bulky than in the case of a conventional metal box-based closed structure. Inspection and repair of the circuit board can be easily performed only by peeling off the electromagnetic shielding sheet.
【００３９】また、本発明の請求項２によれば、電子部
品の放熱部材がアンテナ類似の動作により不要電磁波放
射が問題視されるが、放熱部材の下端面と電子部品の上
端面との間に設けられた導電体の周囲とコモンラインと
の間に電磁遮蔽シート体が設けられて電磁的に閉回路を
構成しているため、この放熱部材のアンテナ類似動作に
よる不要輻射現象を防止することができる。According to the second aspect of the present invention, unnecessary radiation of electromagnetic waves is regarded as a problem due to the operation of the heat radiating member of the electronic component similar to that of an antenna. Since the electromagnetic shielding sheet is provided between the periphery of the conductor provided in the antenna and the common line to form an electromagnetically closed circuit, it is possible to prevent the unnecessary radiation phenomenon due to the antenna-like operation of the heat radiation member. Can be.
【００４０】さらに、本発明の請求項３によれば、電磁
遮蔽シート体は配線基板上のコモンラインに貼り付ける
よりも、導電部材を介して貼り付ける方が作業性がよく
容易であり良好な仕上がりとすることができる。Further, according to the third aspect of the present invention, it is easier and more favorable to attach the electromagnetic shielding sheet via a conductive member than to the common line on the wiring board, rather than attaching it to the common line. It can be finished.
【００４１】さらに、本発明の請求項４によれば、電磁
遮蔽フィルタを介して配線基板から引き出し導線が引き
出されるため、引き出し導線を経由した電磁波の漏れを
防ぐことができる。Further, according to the fourth aspect of the present invention, since the lead wire is drawn from the wiring board through the electromagnetic shielding filter, it is possible to prevent leakage of electromagnetic waves via the lead wire.
【００４２】さらに、本発明の請求項５によれば、配線
基板上を複数の電磁遮蔽空間に隔離すれば、同じ配線基
板上に搭載される電子部品から放射される電磁波が相互
に干渉するのを防止して電子部品の誤動作を防止するこ
とができる。また、複数の電磁遮蔽空間に隔離すること
で相互に電磁波干渉をきらう電子部品であっても同じ配
線基板上に接近させて搭載できて装置の小型化にも寄与
することができる。Further, according to the fifth aspect of the present invention, if the wiring board is separated into a plurality of electromagnetic shielding spaces, electromagnetic waves radiated from electronic components mounted on the same wiring board interfere with each other. And the malfunction of the electronic component can be prevented. In addition, by separating the electronic components into a plurality of electromagnetic shielding spaces, even electronic components that are not likely to interfere with each other can be mounted close to each other on the same wiring board, thereby contributing to downsizing of the device.
【００４３】さらに、本発明の請求項６によれば、配線
基板は電磁遮蔽されているため、配線基板、電磁遮蔽シ
ート体および導電部材で電磁遮蔽空間を形成することが
できる。Further, according to the sixth aspect of the present invention, since the wiring board is electromagnetically shielded, an electromagnetic shielding space can be formed by the wiring board, the electromagnetic shielding sheet member, and the conductive member.
【００４４】さらに、本発明の請求項７によれば、電磁
遮蔽電子回路基板の様子が電磁遮蔽シート体を通して容
易に目視ができるため、電磁遮蔽電子回路基板の様子が
容易に判り、その検査や修理のときに有利である。Further, according to the seventh aspect of the present invention, since the state of the electromagnetically shielded electronic circuit board can be easily visually observed through the electromagnetically shielded sheet member, the state of the electromagnetically shielded electronic circuit board can be easily recognized, and the inspection and inspection thereof can be performed. It is advantageous during repair.
【図１】本発明の一実施形態における電磁遮蔽電子回路
基板の概略縦断面構造を示す模式図である。FIG. 1 is a schematic view showing a schematic longitudinal sectional structure of an electromagnetic shielding electronic circuit board according to an embodiment of the present invention.
【図２】図１の電磁遮蔽フィルムの概略縦断面構造を示
す模式図である。FIG. 2 is a schematic diagram showing a schematic longitudinal sectional structure of the electromagnetic shielding film of FIG.
【図３】図１のＡ部付近拡大図である。FIG. 3 is an enlarged view of the vicinity of a portion A in FIG.
【図４】図３の隙間ｔで貼付代の区間長さＳにおける等
価回路網の回路図である。FIG. 4 is a circuit diagram of an equivalent circuit network in a section length S of a pasting allowance at a gap t in FIG. 3;
【図５】図４の等価回路網の分布定数回路を示す図であ
る。FIG. 5 is a diagram showing a distributed constant circuit of the equivalent network of FIG. 4;
【図６】図３のフィルム貼付代の各区間長さＳ毎の電磁
波周波数に対する減衰量を示す図である。FIG. 6 is a diagram showing an attenuation amount with respect to an electromagnetic wave frequency for each section length S of the film sticking allowance in FIG. 3;
【図７】本発明の他の実施形態における電磁遮蔽電子回
路基板の概略一部縦断面構造を示す模式図である。FIG. 7 is a schematic diagram showing a schematic partial longitudinal sectional structure of an electromagnetic shielding electronic circuit board according to another embodiment of the present invention.
【図８】本発明のさらに他の実施形態における電磁遮蔽
電子回路基板の概略一部縦断面構造を示す模式図であ
る。FIG. 8 is a schematic diagram showing a schematic partial longitudinal sectional structure of an electromagnetic shielding electronic circuit board according to still another embodiment of the present invention.
【図９】本発明のさらに別の実施形態における電磁遮蔽
電子回路基板の概略縦断面構造を示す模式図である。FIG. 9 is a schematic view showing a schematic longitudinal sectional structure of an electromagnetic shielding electronic circuit board according to still another embodiment of the present invention.
１ 電磁遮蔽電子回路基板 ２，１２ 基板本体（配線基板） ３，１５ 電子部品 ４ 導電部材 ５ 電磁遮蔽フィルム（電磁遮蔽シート体） ６ 金属膜 ７ 絶縁膜 ８ 接地配線パターン（コモンライン） ９ 等価回路網 １１ スルーホール １３，１３ａ 金属接地面（コモンライン） １４ 接着剤 ２１ 外部金属体 ２２ 引き出し導線 ３１ 高速半導体 ３２ 放熱片 ３３ 金属部材 DESCRIPTION OF SYMBOLS 1 Electromagnetic shielding electronic circuit board 2, 12 Substrate body (wiring board) 3, 15 Electronic components 4 Conductive member 5 Electromagnetic shielding film (electromagnetic shielding sheet) 6 Metal film 7 Insulating film 8 Grounding wiring pattern (common line) 9 Equivalent circuit Net 11 Through hole 13, 13a Metal ground plane (common line) 14 Adhesive 21 External metal body 22 Lead-out wire 31 High-speed semiconductor 32 Heat radiating piece 33 Metal member
Claims (7)
配線基板の実装面に、前記コモンラインとの間で前記電
子部品を覆って電磁遮蔽空間を形成する電磁遮蔽シート
体が被せられたことを特徴とする電磁遮蔽電子回路基
板。An electromagnetic shielding sheet that covers an electronic component and forms an electromagnetic shielding space between the electronic component and a common line is provided on a mounting surface of a wiring board including an electronic component and including a common line. Characteristic electromagnetic shielding electronic circuit board.
子部品を有し、この電子部品は導電体を介して前記放熱
部材に取り付けられ、かつ前記電磁遮蔽シート体は導電
体の周囲と接していることを特徴とする請求項１に記載
の電磁遮蔽電子回路基板。2. An electronic component having at least a heat dissipating member attached thereto, wherein the electronic component is attached to the heat dissipating member via a conductor, and the electromagnetic shielding sheet is in contact with a periphery of the conductor. The electromagnetically shielded electronic circuit board according to claim 1, wherein:
に導電部材が介設されていることを特徴とする請求項１
または２に記載の電磁遮蔽電子回路基板。3. A conductive member is provided between the electromagnetic shielding sheet and a common line.
Or the electromagnetic shielding electronic circuit board according to 2.
に電磁遮蔽フィルタが介設されていることを特徴とする
請求項１または２に記載の電磁遮蔽電子回路基板。4. The electromagnetic shielding electronic circuit board according to claim 1, wherein an electromagnetic shielding filter is provided between the electromagnetic shielding sheet and the common line.
特徴とする請求項１〜４の何れかに記載の電磁遮蔽電子
回路基板。5. The electromagnetically shielded electronic circuit board according to claim 1, wherein a plurality of said electromagnetically shielded spaces are formed.
を特徴とする請求項１〜５の何れかに記載の電磁遮蔽電
子回路基板。6. The electromagnetically shielded electronic circuit board according to claim 1, wherein said wiring board is electromagnetically shielded.
したことを特徴とする請求項１〜６の何れかに記載の電
磁遮蔽電子回路基板。7. The electromagnetically shielded electronic circuit board according to claim 1, wherein the electromagnetically shielded sheet body has a light-transmitting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10277368A JP2000115086A (en) | 1998-09-30 | 1998-09-30 | Electromagnetic shielded electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10277368A JP2000115086A (en) | 1998-09-30 | 1998-09-30 | Electromagnetic shielded electronic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000115086A true JP2000115086A (en) | 2000-04-21 |
Family
ID=17582559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10277368A Pending JP2000115086A (en) | 1998-09-30 | 1998-09-30 | Electromagnetic shielded electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000115086A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010116993A1 (en) * | 2009-04-07 | 2010-10-14 | シャープ株式会社 | Structure having integrated circuit mounted therein |
| EP2607653B1 (en) * | 2011-12-22 | 2019-12-04 | Rolls-Royce plc | Electrical assembly with ground plane for gas turbine engines |
| CN112601467A (en) * | 2019-06-11 | 2021-04-02 | 韩国烟草人参公社 | Aerosol-generating device comprising an induction coil |
-
1998
- 1998-09-30 JP JP10277368A patent/JP2000115086A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010116993A1 (en) * | 2009-04-07 | 2010-10-14 | シャープ株式会社 | Structure having integrated circuit mounted therein |
| JP2010245342A (en) * | 2009-04-07 | 2010-10-28 | Sharp Corp | Mounting structure for integrated circuit |
| EP2607653B1 (en) * | 2011-12-22 | 2019-12-04 | Rolls-Royce plc | Electrical assembly with ground plane for gas turbine engines |
| CN112601467A (en) * | 2019-06-11 | 2021-04-02 | 韩国烟草人参公社 | Aerosol-generating device comprising an induction coil |
| CN112601467B (en) * | 2019-06-11 | 2024-03-15 | 韩国烟草人参公社 | Aerosol generating device comprising an induction coil |
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