JP2000114728A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JP2000114728A JP2000114728A JP27723598A JP27723598A JP2000114728A JP 2000114728 A JP2000114728 A JP 2000114728A JP 27723598 A JP27723598 A JP 27723598A JP 27723598 A JP27723598 A JP 27723598A JP 2000114728 A JP2000114728 A JP 2000114728A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- layer
- fpc
- gnd
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、多層フレキシブル
プリント基板に関する。[0001] The present invention relates to a multilayer flexible printed circuit board.
【0002】[0002]
【従来の技術】従来、パソコン本体内の回路と、液晶ユ
ニットを含み開閉できる表示部内の回路との接続に、片
面、または、両面のフレキシブルプリント基板(以下、
FPCと称する)を使用していた。この場合、表示部の
開閉に伴い、FPCが伸縮や屈曲するので、柔軟で耐久
性の高いFPCが要求される。2. Description of the Related Art Conventionally, a single-sided or double-sided flexible printed circuit board (hereinafter, referred to as a single-sided or double-sided printed circuit board) is used to connect a circuit in a personal computer main body and a circuit in a display unit including a liquid crystal unit and capable of being opened and closed.
FPC). In this case, the FPC expands and contracts or bends when the display unit is opened and closed, so that a flexible and highly durable FPC is required.
【0003】図2に、パソコン本体内の回路と表示部内
の回路と接続するFPCの形状例を説明する斜視図を示
す。FIG. 2 is a perspective view illustrating an example of the shape of an FPC connected to a circuit in a personal computer and a circuit in a display unit.
【0004】図2において、一枚のFPCは、表示部の
回路に接続する端子部分1と、巻いた部分2と、屈曲部
3と、パソコン本体の回路に接続する端子部分4を備え
ている。端子部分1と端子部分4は、表示部の回動に応
じて移動する。この移動を吸収してFPCの耐久性を強
化しまた表示部の開閉動作を円滑にするのが巻いた部分
2である。例えば、端子部分1と端子部分4が引っ張り
合う場合、巻いた部分2がより小さい直径の巻きにな
り、端子部分1と端子部分4が押し合う場合、巻いた部
分2はより大きい直径の巻きになる。In FIG. 2, one FPC has a terminal portion 1 connected to a circuit of a display unit, a wound portion 2, a bent portion 3, and a terminal portion 4 connected to a circuit of a personal computer main body. . The terminal portion 1 and the terminal portion 4 move according to the rotation of the display unit. The rolled portion 2 absorbs this movement to enhance the durability of the FPC and to smoothly open and close the display unit. For example, when the terminal portion 1 and the terminal portion 4 are pulled, the wound portion 2 has a smaller diameter winding, and when the terminal portion 1 and the terminal portion 4 are pressed, the wound portion 2 has a larger diameter winding. Become.
【0005】従って、表示部の回路と本体の回路を接続
するFPC、特に巻いた部分2や屈曲部3には、柔軟な
屈曲性能及び屈曲の高い耐久性が要求される。[0005] Therefore, the FPC for connecting the circuit of the display section and the circuit of the main body, in particular, the rolled portion 2 and the bent portion 3 are required to have flexible bending performance and high durability of bending.
【0006】さらに、表示部の回路と本体の回路を接続
するFPCは、クロック信号などの高周波電流が流れる
ために不要輻射や配線間クロストークを低減するシール
ド性能が要求される。特に巻いた部分2や屈曲部3から
強い不要輻射やクロストークが発生しやすい。Further, an FPC that connects a circuit of the display unit and a circuit of the main body is required to have a shielding performance for reducing unnecessary radiation and crosstalk between wirings because a high-frequency current such as a clock signal flows. In particular, strong unnecessary radiation and crosstalk are likely to occur from the wound portion 2 and the bent portion 3.
【0007】図3は、従来のFPCの構成を説明するた
めの断面斜視図を示す。図3に示したように、前述の屈
曲性能と不要輻射やクロストークを改善するために、F
PCの回路面5の裏面6に、少なくとも屈曲される部分
に、シールドパターンを格子状に設けた両面FPCが、
例えば、実開平5−41171号公報に提案されてい
る。裏面6の全面を銅箔にすると、不要輻射やクロスト
ークの低減に効果的であるが、柔軟で耐久性の高い屈曲
性能が得られないので、格子の目7の銅箔を除去してい
る。FIG. 3 is a sectional perspective view for explaining the structure of a conventional FPC. As shown in FIG. 3, in order to improve the aforementioned bending performance and unnecessary radiation and crosstalk, F
On the back surface 6 of the circuit surface 5 of the PC, a double-sided FPC in which a shield pattern is provided in a lattice shape at least in a bent portion,
For example, it is proposed in Japanese Utility Model Laid-Open No. 5-41171. When the entire surface of the back surface 6 is made of copper foil, it is effective in reducing unnecessary radiation and crosstalk, but since a flexible and highly durable bending performance cannot be obtained, the copper foil of the grid 7 is removed. .
【0008】ところが、上記従来例の両面FPCでも、
クロック信号などの周波数がさらにより高い周波数にな
ってくると、巻いた部分や屈曲部分から不要輻射やクロ
ストークが増加する。However, even in the conventional double-sided FPC,
When the frequency of a clock signal or the like becomes higher, unnecessary radiation or crosstalk increases from a wound portion or a bent portion.
【0009】また、パソコンの小型化に伴い、図2で示
したFPCの巻いた部分の巻径が小さくなり、また、図
2に示したAの部分とBの部分が近接し密着するので、
不要輻射やクロストークの低減が困難になり、さらに、
屈曲部3の屈曲角度が小さくなって、柔軟で耐久性のあ
る屈曲性能を得ることが困難になった。Further, as the size of the personal computer is reduced, the winding diameter of the portion where the FPC is wound as shown in FIG. 2 is reduced, and the portion A and the portion B shown in FIG.
It becomes difficult to reduce unnecessary radiation and crosstalk.
The bending angle of the bending portion 3 became small, and it became difficult to obtain a flexible and durable bending performance.
【0010】[0010]
【発明が解決しようとする課題】本発明は、かかる点に
鑑みてなされたもので、特に、屈曲部分および巻いた部
分でのクロストークおよび不要輻射を低減し、かつ、柔
軟で耐久性の高い屈曲性能が得られるFPCを提供する
ことを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and in particular, reduces crosstalk and unnecessary radiation at a bent portion and a wound portion, and is flexible and durable. An object of the present invention is to provide an FPC capable of obtaining bending performance.
【0011】[0011]
【課題を解決するための手段】本発明のFPCは、格子
状のシールドパターンが配線層の表面及び裏面の両面に
設けられ、且つ、シールドパターンでの銅箔を除去され
た格子の目(銅箔除去部分)が表面と裏面で重複しない
ようにずらして配置されていることを特徴とする。According to the FPC of the present invention, a grid-like shield pattern is provided on both the front surface and the back surface of the wiring layer, and the grid pattern (copper) from which the copper foil in the shield pattern has been removed is provided. (Foil-removed portion) are arranged so as to be shifted from each other so as not to overlap on the front surface and the back surface.
【0012】[0012]
【発明の実施の形態】本発明の請求項1に記載の発明
は、格子状のシールドパターンが配線層の表面及び裏面
に設けられ、且つ、シールドパターンでの銅箔除去部分
が表面と裏面で重複しないようにずらして配置されたこ
とを特徴とするフレキシブルプリント基板であり、柔軟
で耐久性の高い屈曲性と不要輻射やクロストークの低減
という作用が得られる。DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a grid-like shield pattern is provided on the front and back surfaces of a wiring layer, and the copper foil-removed portions of the shield pattern are formed on the front and back surfaces. A flexible printed circuit board characterized by being staggered so as not to overlap with each other. The flexible printed circuit board has a flexible and durable bendability and an effect of reducing unnecessary radiation and crosstalk.
【0013】本発明の請求項2に記載の発明は、前記配
線層の信号箔の両側にGND箔を沿わせた請求項1記載
のフレキシブルプリント基板であり、不要輻射やクロス
トークの低減という作用が得られる。According to a second aspect of the present invention, there is provided the flexible printed circuit board according to the first aspect, wherein a GND foil extends along both sides of the signal foil of the wiring layer, and has an effect of reducing unnecessary radiation and crosstalk. Is obtained.
【0014】本発明の請求項3に記載の発明は、前記表
面と前記裏面のシールドパターンの銅箔部分が、相互に
複数のスルーホールで接続された請求項1記載のフレキ
シブルプリント基板であり、表面と裏面の接地電位がよ
り等しくなり、シールド効果が向上するという作用が得
られる。According to a third aspect of the present invention, there is provided the flexible printed circuit board according to the first aspect, wherein the copper foil portions of the front and rear shield patterns are connected to each other by a plurality of through holes. The effect that the ground potential on the front surface and the ground potential on the back surface are more equal, and the shielding effect is improved can be obtained.
【0015】以下に、本発明のフレキシブルプリント
(FPC)基板の実施の形態を説明する。An embodiment of the flexible printed circuit (FPC) board of the present invention will be described below.
【0016】(実施の形態1)図1(a)は本発明のF
PCの実施の形態1の断面斜視図、図1(b)は本発明
のFPCの実施の形態1の表面と裏面のシールドパター
ンの透視図である。(Embodiment 1) FIG. 1 (a) shows the F of the present invention.
FIG. 1B is a perspective view of a shield pattern on the front surface and the back surface of the FPC according to the first embodiment of the present invention.
【0017】図1(a)において、FPCは、配線され
た内層11をシールドパターンを備えた表面12と、表
面12と同様のシールドパターンを備えた裏面13とで
配線層を挟む3層構成である。Referring to FIG. 1A, the FPC has a three-layer structure in which a wired inner layer 11 is sandwiched between a front surface 12 having a shield pattern and a back surface 13 having a shield pattern similar to the front surface 12. is there.
【0018】表面12は、銅箔を除去した格子の目の部
分(銅箔除去部分)14と格子状のGND銅箔15とG
ND銅箔15内にスルーホール16を有する格子状のシ
ールドパターンを備えている。GND銅箔15は接地電
位に保持されている。The surface 12 has a grid mesh portion (copper foil removed portion) 14 from which the copper foil has been removed, a grid-shaped GND copper foil 15 and a G
The ND copper foil 15 has a grid-like shield pattern having a through hole 16. The GND copper foil 15 is kept at the ground potential.
【0019】内層11は、スルホール16と接続された
GND銅箔17に近接して挟まれた高周波の信号銅箔1
8を備えている。The inner layer 11 is composed of a high-frequency signal copper foil 1 sandwiched close to a GND copper foil 17 connected to a through hole 16.
8 is provided.
【0020】裏面13は、銅箔を除去した格子の目の部
分(銅箔除去部分)20と格子状のGND銅箔19とG
ND銅箔19内にスルーホール21を有する格子状のシ
ールドパターンを備えている。GND銅箔19はGND
パターンである。The back surface 13 has a grid portion (copper foil removed portion) 20 from which the copper foil has been removed, a grid-shaped GND copper foil 19 and a G
The ND copper foil 19 has a grid-like shield pattern having a through hole 21. GND copper foil 19 is GND
It is a pattern.
【0021】スルーホール21は、内層11のGND銅
箔17に接続され、さらに、スルーホール16で表面1
2のGND銅箔15にも接続されている。The through hole 21 is connected to the GND copper foil 17 of the inner layer 11,
The second GND copper foil 15 is also connected.
【0022】スルーホール16、21は、複数個設けら
れて、表面と内層と裏面の3層の各GND銅箔15、1
7、19を接続する。従って、信号銅箔18は隣接する
GND銅箔17と表面12のGND銅箔15と裏面13
のGND銅箔及び導電性のスルーホール16、21に囲
まれているので不要輻射やクロストークが低減する。A plurality of through holes 16 and 21 are provided, and three layers of GND copper foils 15, 1
7 and 19 are connected. Therefore, the signal copper foil 18 is adjacent to the GND copper foil 17, the GND copper foil 15 on the front surface 12, and the back surface 13.
, And unnecessary radiation and crosstalk are reduced.
【0023】図1(b)は表面12の銅箔除去部分14
と裏面13の銅箔除去部分20の関係を示す説明図であ
る。FIG. 1B shows a copper foil removal portion 14 on the surface 12.
FIG. 4 is an explanatory diagram showing a relationship between a copper foil removed portion 20 of the back surface 13.
【0024】図1(b)において、実線の大きい円は表
面12の銅箔除去部分14、点線の大きい円は裏面13
の銅箔除去部分20、小さい白点は、表面12のスルー
ホール16と裏面13のスルーホール21を示す。In FIG. 1B, a large circle with a solid line indicates a copper foil removed portion 14 of the front surface 12 and a large circle with a dotted line indicates a back surface 13.
A small white dot indicates the through hole 16 on the front surface 12 and the through hole 21 on the back surface 13.
【0025】図1(b)に示すように、表面12の銅箔
除去部分14と裏面13の銅箔除去部分20の位置を重
複しないようにずらすことにより、FPCの柔軟で耐久
性のよい屈曲性と下記の不要輻射やクロストークの低減
が得られる。As shown in FIG. 1B, by shifting the positions of the copper foil removal portion 14 on the front surface 12 and the copper foil removal portion 20 on the rear surface 13 so as not to overlap, the flexible and durable bending of the FPC is achieved. And the following unwanted radiation and reduction of crosstalk can be obtained.
【0026】表面12の銅箔除去部分14と裏面13の
銅箔除去部分20の位置が重複すれば、内層11の信号
銅箔18の上下にシールドパターンのGND銅箔がない
場合が生じて不要輻射やクロストークが増加する。If the positions of the copper foil-removed portion 14 on the front surface 12 and the copper foil-removed portion 20 on the rear surface 13 overlap with each other, there may be no GND copper foil of the shield pattern above and below the signal copper foil 18 on the inner layer 11, which is unnecessary. Radiation and crosstalk increase.
【0027】表面12の銅箔除去部分14の円の中心点
を結ぶ正3角形の中点に裏面13の銅箔除去部分20の
円の中心点を配置することで、裏面と表面をずらし、屈
曲性を高める。By disposing the center point of the circle of the copper foil removal portion 20 of the back surface 13 at the midpoint of a regular triangle connecting the center points of the circles of the copper foil removal portion 14 of the front surface 12, the back surface and the front surface are shifted. Increase flexibility.
【0028】銅箔除去部分14、20は、屈曲性と不要
輻射およびクロストークの両性能が得られるように最適
寸法や最適形状を設計する。図1(b)に示すように少
し重複しても効果があるが、銅箔除去部分を小さく重複
部分がないように配置する方が屈曲性能が少し低下する
けれども不要輻射およびクロストークの両性能が向上す
る。The copper foil-removed portions 14 and 20 are designed to have an optimum size and an optimum shape so as to obtain both flexibility and unnecessary radiation and crosstalk performance. As shown in FIG. 1 (b), even if a little overlap is effective, it is effective to arrange the copper foil removed portion so as not to have a small overlap portion, but the bending performance is slightly lowered, but both the unnecessary radiation and the crosstalk performance are reduced. Is improved.
【0029】信号銅箔18に流れる高周波信号から生じ
る輻射電磁波は、隣接するGND銅箔17と、高周波の
信号銅箔18の真上の表面12のGND銅箔15と斜め
下の裏面13のGND銅箔19または高周波の信号銅箔
18の斜め上の表面12のGND銅箔15と真下の裏面
13のGND銅箔19に吸収されて、他の信号銅箔への
クロストークや不要輻射が低減する。さらに近接して設
けられたスルーホール16、21によってもクロストー
クや不要輻射が低減する。The radiated electromagnetic wave generated from the high-frequency signal flowing through the signal copper foil 18 is transmitted to the adjacent GND copper foil 17, the GND copper foil 15 on the front surface 12 directly above the high-frequency signal copper foil 18, and the GND on the rear surface 13 obliquely below. Absorbed by the GND copper foil 15 on the obliquely upper surface 12 of the copper foil 19 or the high-frequency signal copper foil 18 and the GND copper foil 19 on the back surface 13 immediately below, reducing crosstalk and unnecessary radiation to other signal copper foils. I do. Further, crosstalk and unnecessary radiation are reduced by the through holes 16 and 21 provided close to each other.
【0030】なお、本発明のFPCの実施の形態1で、
銅箔除去部分は円形で説明したが他の形状でもよい。表
面と裏面で銅箔除去部分が重複しないようにずらし、内
層の信号パターンの上または下の少なくとも一方にGN
D銅箔があるような配置であれば本発明に含まれる。In the first embodiment of the FPC of the present invention,
Although the copper foil removed portion has been described as being circular, other shapes may be used. The copper foil removal portion is shifted so that it does not overlap on the front and back surfaces, and GN is provided on at least one of the upper and lower signal patterns of the inner layer.
Any arrangement having D copper foil is included in the present invention.
【0031】[0031]
【発明の効果】上述のように本発明のFPCによれば、
小型で巻径が小さくまた角度の小さい屈曲に対しても、
柔軟で耐久性の高い屈曲性とクロストークおよび不要輻
射の低減が実現できる。As described above, according to the FPC of the present invention,
For small size, small winding diameter and small angle bending,
Flexible and highly durable bendability and reduction of crosstalk and unnecessary radiation can be realized.
【0032】また、折り曲げが自由自在なため、同軸ケ
ーブルや、シールド線よりも省スペース化を実現でき
る。Also, since it can be freely bent, it is possible to realize a space saving compared with a coaxial cable or a shielded wire.
【図1】(a)本発明のFPCの実施の形態1の断面斜
視図 (b)本発明のFPCの実施の形態1の表面と裏面のシ
ールドパターンの平面透視図FIG. 1A is a cross-sectional perspective view of an FPC according to a first embodiment of the present invention. FIG. 1B is a perspective plan view of the front and back shield patterns of the FPC according to the first embodiment of the present invention.
【図2】パソコン本体内の回路と表示部内の回路と接続
するFPCの形状例を説明する斜視図FIG. 2 is a perspective view illustrating an example of the shape of an FPC connected to a circuit in a personal computer main body and a circuit in a display unit.
【図3】従来のFPCの構成を説明するための断面斜視
図FIG. 3 is a cross-sectional perspective view illustrating a configuration of a conventional FPC.
11 内層 12 表面 13 裏面 14 銅箔除去部分 15 GND銅箔 16 スルーホール 17 GNDパターン 18 信号銅箔 19 GND銅箔 20 銅箔除去部分 21 スルーホール REFERENCE SIGNS LIST 11 inner layer 12 front surface 13 back surface 14 copper foil removed portion 15 GND copper foil 16 through hole 17 GND pattern 18 signal copper foil 19 GND copper foil 20 copper foil removed portion 21 through hole
Claims (3)
及び裏面に設けられ、且つ、シールドパターンでの銅箔
除去部分が表面と裏面で重複しないようにずらして配置
されたことを特徴とするフレキシブルプリント基板。The present invention is characterized in that a grid-like shield pattern is provided on the front and back surfaces of a wiring layer, and a copper foil removed portion of the shield pattern is staggered so as not to overlap between the front and back surfaces. Flexible printed circuit board.
わせた請求項1記載のフレキシブルプリント基板。2. The flexible printed circuit board according to claim 1, wherein a GND foil extends along both sides of the signal foil of the wiring layer.
銅箔部分が、相互に複数のスルーホールで接続された請
求項1記載のフレキシブルプリント基板。3. The flexible printed circuit board according to claim 1, wherein the copper foil portions of the front and rear shield patterns are connected to each other by a plurality of through holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27723598A JP4265001B2 (en) | 1998-09-30 | 1998-09-30 | Flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27723598A JP4265001B2 (en) | 1998-09-30 | 1998-09-30 | Flexible printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000114728A true JP2000114728A (en) | 2000-04-21 |
JP4265001B2 JP4265001B2 (en) | 2009-05-20 |
Family
ID=17580710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27723598A Expired - Fee Related JP4265001B2 (en) | 1998-09-30 | 1998-09-30 | Flexible printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4265001B2 (en) |
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WO2007099596A1 (en) * | 2006-02-28 | 2007-09-07 | Sony Chemical & Information Device Corporation | Wiring board, method for arranging wiring pattern |
JP2007335455A (en) * | 2006-06-12 | 2007-12-27 | Fujikura Ltd | Flexible printed wiring board |
JP2009124044A (en) * | 2007-11-16 | 2009-06-04 | Hitachi Cable Ltd | Flexible printed wiring board |
US7902983B2 (en) | 2007-11-07 | 2011-03-08 | Fujitsu Limited | RFID tag |
JP2013055352A (en) * | 2009-10-28 | 2013-03-21 | Samsung Electro-Mechanics Co Ltd | Multilayer rigid flexible printed circuit board and method for manufacturing the same |
JP2014109445A (en) * | 2012-11-30 | 2014-06-12 | National Institute Of Advanced Industrial & Technology | Flexible power sensor |
JP2014194948A (en) * | 2012-07-30 | 2014-10-09 | Murata Mfg Co Ltd | Flat cable |
CN104427740A (en) * | 2013-08-22 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
JP2020004791A (en) * | 2018-06-26 | 2020-01-09 | 新光電気工業株式会社 | Wiring substrate |
US11205632B2 (en) | 2018-11-16 | 2021-12-21 | Shinko Electric Industries Co., Ltd. | Wiring substrate and semiconductor device |
US11417813B2 (en) | 2019-11-12 | 2022-08-16 | Shinko Electric Industries Co., Ltd. | Electronic device |
CN114913826A (en) * | 2022-05-16 | 2022-08-16 | 星源电子科技(深圳)有限公司 | Manufacturing method of low-crosstalk liquid crystal module |
-
1998
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