JP2000114610A - Laminated piezoelectric actuator - Google Patents
Laminated piezoelectric actuatorInfo
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- JP2000114610A JP2000114610A JP10276191A JP27619198A JP2000114610A JP 2000114610 A JP2000114610 A JP 2000114610A JP 10276191 A JP10276191 A JP 10276191A JP 27619198 A JP27619198 A JP 27619198A JP 2000114610 A JP2000114610 A JP 2000114610A
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- plate
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- piezoelectric
- plates
- piezoelectric actuator
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、積層型圧電アクチ
ュエータに係わり、例えば、光学装置等の精密位置決め
装置や振動防止用の駆動素子、自動車用エンジンの燃料
噴射用の駆動素子等に使用される積層型圧電アクチュエ
ータに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated piezoelectric actuator, and is used, for example, as a precision positioning device such as an optical device, a drive element for preventing vibration, a drive element for fuel injection of an automobile engine, and the like. The present invention relates to a multilayer piezoelectric actuator.
【０００２】[0002]
【従来技術】従来、圧電板は、電圧を印加することによ
り伸縮する逆圧電効果を有している。しかしながら、圧
電板１枚１枚の伸縮量は微量であることから、圧電板を
複数枚積層して形成した積層型圧電アクチュエータを作
製していた。2. Description of the Related Art Conventionally, a piezoelectric plate has an inverse piezoelectric effect that expands and contracts when a voltage is applied. However, since the amount of expansion and contraction of each piezoelectric plate is very small, a laminated piezoelectric actuator formed by laminating a plurality of piezoelectric plates has been manufactured.
【０００３】この積層型圧電アクチュエータは、圧電板
に電圧を印加して数〜数十μｍ伸長させ、アクチュエー
タの駆動力源とするものである。公知例としては特公平
７−４０６１３号などがある。[0003] In this laminated piezoelectric actuator, a voltage is applied to a piezoelectric plate to extend the piezoelectric plate by several to several tens of μm, and this is used as a driving force source of the actuator. Known examples include Japanese Patent Publication No. 7-40613.
【０００４】このような積層型圧電アクチュエータで
は、例えば、圧電板の両表面に、電気導電性を有するペ
ーストを印刷や蒸着等の方法で数μｍの厚さの導電性接
着層を形成し、この導電性接着層の間に金属薄板を介在
させるように圧電板を積層し、加熱圧着し、一体化させ
た構造となっている。In such a laminated piezoelectric actuator, for example, a conductive adhesive layer having a thickness of several μm is formed on both surfaces of a piezoelectric plate by printing or vapor deposition of an electrically conductive paste. The structure is such that piezoelectric plates are laminated so that a metal thin plate is interposed between the conductive adhesive layers, heated and pressed, and integrated.
【０００５】このような積層型圧電アクチュエータとし
て、例えば、特開昭５９−２１８７８４号公報には、両
面に導電性接着層を形成した圧電板を、導電性接着層間
に金属薄板を配置した状態で複数積層し、金属薄板に形
成された接続用突起を圧電板の外周面に対して所定の空
隙を残すように軸方向に折り曲げ、同一極性の接続用突
起同士を重なり合わせてハンダ等で接合した積層型圧電
アクチュエータが開示されている。[0005] As such a laminated piezoelectric actuator, for example, Japanese Patent Application Laid-Open No. Sho 59-218784 discloses a piezoelectric plate having a conductive adhesive layer formed on both surfaces and a thin metal plate disposed between the conductive adhesive layers. A plurality of layers were laminated, and connection projections formed on a metal thin plate were bent in the axial direction so as to leave a predetermined gap with respect to the outer peripheral surface of the piezoelectric plate, and connection projections of the same polarity were overlapped and joined with solder or the like. A multilayer piezoelectric actuator is disclosed.
【０００６】また、実公昭６０−３５８９号公報では、
金属薄板が連結部材で連結された半田付けが不要なリボ
ン状の金属板が配線部材として開示されており、そうし
たリボン状金属板を利用した積層型圧電アクチュエータ
が多数開発されている（特開昭６０−１０３６８５号公
報、特開昭６１−２７６２７８号公報、特公平４−１６
０２９号公報、特開平７−２８３４５５号公報等参
照）。In Japanese Utility Model Publication No. 60-3589,
A ribbon-shaped metal plate in which thin metal plates are connected by a connecting member and soldering is unnecessary has been disclosed as a wiring member, and a large number of laminated piezoelectric actuators using such a ribbon-shaped metal plate have been developed (Japanese Patent Laid-Open Publication No. Sho. 60-103885, JP-A-61-276278, JP-B-4-16
029, JP-A-7-283455, etc.).
【０００７】一方、近年では、積層型圧電アクチュエー
タは大きな変位量を確保した状態で、積層型圧電アクチ
ュエータの特徴である高応答性を利用するため、高い電
圧を高周波数で印加し駆動を行っている。また、より小
型化を促進すべく、より薄い圧電板が用いられるように
なっている。On the other hand, in recent years, a multilayer piezoelectric actuator is driven by applying a high voltage at a high frequency at a high frequency in order to utilize a high response characteristic of the multilayer piezoelectric actuator while securing a large displacement. I have. Further, in order to promote further miniaturization, a thinner piezoelectric plate has been used.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、同一極
性の接続用突起同士を重なり合わせてハンダ等で接合し
た特開昭５９−２１８７８４号公報の積層型圧電アクチ
ュエータや、ハンダ等で接合する必要がないリボン状金
属板を使用した特開平７−２８３４５５号公報等の積層
型圧電アクチュエータでは、金属薄板としてヤング率の
低い金属を使用した場合、接続用突起やリボン状金属板
の連結部が変形しやすく、変位動作によって変形した接
続用突起や連結部に応力集中が発生し、疲労断線を起こ
したり、同一極性の接続用突起同士を重なり合わせてハ
ンダ等で接合した積層型圧電アクチュエータでは、高変
位に伴なう高応力により接合部が疲労し、剥離断線を起
こし易いという問題があった。However, it is not necessary to connect the connecting protrusions of the same polarity by overlapping and joining them by solder or the like, or by using a laminated piezoelectric actuator disclosed in JP-A-59-218784. In a laminated piezoelectric actuator using a ribbon-shaped metal plate as disclosed in Japanese Patent Application Laid-Open No. 7-283455, when a metal having a low Young's modulus is used as a metal thin plate, connection projections and a connecting portion of the ribbon-shaped metal plate are easily deformed. However, stress concentration occurs on the connecting projections and connecting parts that are deformed by the displacement operation, causing fatigue disconnection, and the stacked piezoelectric actuator in which the connecting projections of the same polarity are overlapped and joined with solder etc. There has been a problem that the joints are fatigued due to the accompanying high stress, and peeling and disconnection are likely to occur.
【０００９】これらの疲労断線を防ぐために、金属薄板
としてヤング率の高い金属を使用した場合、積層方向へ
の変位に伴う圧電板の径方向への伸縮動作を金属薄板が
抑制するために圧電板と金属薄板の接合部に高応力が発
生し、駆動時に圧電板に亀裂が発生し、アクチュエータ
の信頼性を低下させるという問題があった。In order to prevent such fatigue disconnection, when a metal having a high Young's modulus is used as the metal thin plate, the metal thin plate suppresses the expansion and contraction of the piezoelectric plate in the radial direction due to the displacement in the laminating direction. High stress is generated at the joint between the metal plate and the thin metal plate, and a crack is generated in the piezoelectric plate at the time of driving, thereby deteriorating the reliability of the actuator.
【００１０】これを解決する手段として、金属薄板と圧
電板を圧着させないで積層型圧電アクチュエータを構成
する方法が特公平７−１１８５５４号公報に開示されて
いる。これによると、金属薄板にはステンレス等の比較
的硬い材料を用い、この金属薄板の両面にこの金属薄板
より軟質な銅、銀、アルミニウム等の電極材料をメッキ
等の方法で形成することにより、積層後に、電極薄板に
形成された軟質な電極が圧電板と密接な接触状態とな
り、圧電板の電極として機能し、圧電板への電圧印加が
可能となる。As means for solving this problem, Japanese Patent Publication No. Hei 7-118554 discloses a method of forming a laminated piezoelectric actuator without compressing a thin metal plate and a piezoelectric plate. According to this, a relatively hard material such as stainless steel is used for a metal thin plate, and electrode materials such as copper, silver, and aluminum that are softer than the metal thin plate are formed on both surfaces of the metal thin plate by a method such as plating. After lamination, the soft electrode formed on the electrode thin plate comes into close contact with the piezoelectric plate, functions as an electrode of the piezoelectric plate, and enables voltage application to the piezoelectric plate.
【００１１】しかしながら、このような積層型圧電アク
チュエータでは、圧電板と金属薄板が接合されておら
ず、積層の状態を維持するのが困難であった。このた
め、この構造の積層型圧電アクチュエータは、積層後直
ちに、ケースへの封入等を行わなければならず、また、
製造工程におけるハンドリングも非常に困難であった。However, in such a laminated piezoelectric actuator, the piezoelectric plate and the metal thin plate are not joined, and it is difficult to maintain the laminated state. For this reason, the laminated piezoelectric actuator having this structure must be sealed in a case immediately after lamination, and
Handling in the manufacturing process was also very difficult.
【００１２】本発明は、圧電板の亀裂の発生を防止で
き、信頼性の高い積層型圧電アクチュエータを提供する
ことを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a laminated piezoelectric actuator which can prevent cracks in a piezoelectric plate and has high reliability.
【００１３】[0013]
【課題を解決するための手段】本発明の積層型圧電アク
チュエータは、複数の圧電板と複数の金属薄板とを交互
に積層し、前記圧電板と前記金属薄板とを導電性接着層
により接合してなるとともに、前記金属薄板を交互に電
気的に接続した積層型圧電アクチュエータにおいて、前
記金属薄板が、金属母材板の両面に、この金属母材板よ
りもヤング率の小さい金属箔を接着してなるものであ
る。ここで、金属母材板はＮｉとＦｅを主成分とする合
金からなり、金属箔はＡｇからなることが望ましい。A laminated piezoelectric actuator according to the present invention comprises a plurality of piezoelectric plates and a plurality of thin metal plates alternately stacked, and the piezoelectric plates and the thin metal plates are joined by a conductive adhesive layer. In the laminated piezoelectric actuator in which the metal thin plates are alternately electrically connected, the metal thin plate is formed by bonding a metal foil having a Young's modulus smaller than that of the metal base material plate to both surfaces of the metal base material plate. It is. Here, the metal base material plate is preferably made of an alloy mainly containing Ni and Fe, and the metal foil is preferably made of Ag.
【００１４】[0014]
【作用】本発明の積層型圧電アクチュエータでは、金属
母材板の両面に、この金属母材板よりもヤング率の小さ
い金属箔を接着して金属薄板を構成しているため、圧電
板は導電性接着層、金属箔、金属母材板、金属箔、導電
性接着層を介して、他の圧電板に接合されることにな
り、圧電板の径方向への伸縮動作により生じる応力が金
属箔により十分に吸収され、圧電板と金属薄板との接合
部に発生する応力が緩和され、圧電板における亀裂の発
生を抑制することができる。In the laminated piezoelectric actuator of the present invention, a metal foil having a Young's modulus smaller than that of the metal base material plate is bonded to both surfaces of the metal base material plate to form a metal thin plate. Is bonded to another piezoelectric plate via the conductive adhesive layer, the metal foil, the metal base material plate, the metal foil, and the conductive adhesive layer. Thus, the stress generated at the joint between the piezoelectric plate and the thin metal plate is reduced, and the generation of cracks in the piezoelectric plate can be suppressed.
【００１５】また、金属薄板を交互に電気的に接続する
部材を、ヤング率の大きい材料により構成することによ
り、高変位に伴なう金属薄板を接続する部材の断線を防
止することができる。Further, by forming the member for electrically connecting the thin metal plates alternately with a material having a large Young's modulus, disconnection of the member for connecting the thin metal plates due to high displacement can be prevented.
【００１６】[0016]
【発明の実施の形態】図１は本発明の積層型圧電アクチ
ュエータを示すもので、図２に示すように、両面に導電
性接着層１が形成された圧電板２を、図３に示したよう
に金属薄板４を介した状態で複数枚積層して構成されて
いる。FIG. 1 shows a laminated piezoelectric actuator according to the present invention. FIG. 3 shows a piezoelectric plate 2 having a conductive adhesive layer 1 formed on both sides as shown in FIG. In this manner, a plurality of sheets are stacked with the metal thin plate 4 interposed therebetween.
【００１７】これらの圧電板２はＰｂ（ＺｒＴｉ）Ｏ3
（以下ＰＺＴと略す）を主成分とする焼結体が使用され
るが、これに限定されるものではなく、圧電性を有する
セラミックスであれば何でも良い。この圧電板２を構成
する圧電材料としては、圧電歪み定数ｄ33が高いものが
望ましい。特に、金属成分としてＰｂ、Ｚｒ、Ｔｉ、Ｚ
ｎ、Ｓｂ、Ｎｉ、Ｔｅと、ＳｒおよびＢａのうち少なく
とも一種を含む複合ペロブスカイト型化合物からなる圧
電磁器組成物が望ましい。These piezoelectric plates 2 are made of Pb (ZrTi) O 3
A sintered body containing (hereinafter abbreviated as PZT) as a main component is used, but is not limited to this, and any ceramic having piezoelectricity may be used. As the piezoelectric material constituting the piezoelectric plate 2, those piezoelectric strain constant d 33 is high is preferable. In particular, Pb, Zr, Ti, Z
A piezoelectric ceramic composition comprising a composite perovskite compound containing n, Sb, Ni, Te and at least one of Sr and Ba is desirable.
【００１８】この圧電板２の厚みｔは、小型化および高
い電圧を印加するという点から、０．２〜０．６ｍｍで
あることが望ましい。The thickness t of the piezoelectric plate 2 is desirably 0.2 to 0.6 mm from the viewpoint of miniaturization and application of a high voltage.
【００１９】圧電板２の両面に形成される導電性接着層
１は、導電性ペーストを圧電板２に塗布し４００〜６０
０℃程度で焼き付けることにより形成される。この導電
性ペーストは、Ａｇ等の導電性の金属粉末とガラス成分
からなっており、ガラス成分を高温で溶融することによ
り圧電板２に焼き付けられる。この導電性ペーストは、
特に、Ａｇ粉末を９０〜９７重量％と、ＰｂＯ−ＳｉＯ
2 −Ｂ2 Ｏ3 からなるガラス成分３〜１０重量％とから
なることが望ましい。The conductive adhesive layers 1 formed on both surfaces of the piezoelectric plate 2 are formed by applying a conductive paste to the piezoelectric plate 2 and
It is formed by baking at about 0 ° C. The conductive paste is made of a conductive metal powder such as Ag and a glass component, and is baked on the piezoelectric plate 2 by melting the glass component at a high temperature. This conductive paste is
In particular, 90-97% by weight of Ag powder and PbO-SiO
It is preferably made of a 3-10 wt% glass component consisting of 2 -B 2 O 3.
【００２０】そして、複数の圧電板２が積層されてお
り、その間には２層の導電性接着層１が形成され、それ
らの導電性接着層１間には円板状の金属薄板４が介装さ
れている。これらの金属薄板４は、図４に示すように、
連結部５により連結されており、図３に示すように、連
結部５が折曲されて圧電板２の径方向に突出している。A plurality of piezoelectric plates 2 are stacked, two conductive adhesive layers 1 are formed between them, and a disc-shaped metal thin plate 4 is interposed between the conductive adhesive layers 1. Is equipped. These metal sheets 4 are, as shown in FIG.
The connecting portions 5 are connected to each other, and the connecting portions 5 are bent and project in the radial direction of the piezoelectric plate 2 as shown in FIG.
【００２１】これらの金属薄板４は、連結部５の突出位
置により正電極用金属薄板または負電極用金属薄板とさ
れている。These metal thin plates 4 are formed as a positive electrode thin metal plate or a negative electrode thin metal plate depending on the projecting position of the connecting portion 5.
【００２２】金属薄板４は、図３に示すように、金属母
材板６と、この金属母材板６の両面に接合され、金属母
材板６よりもヤング率が小さい金属箔７とから構成さ
れ、金属母材板６には、例えば、ステンレス、Ｎｉ−Ｆ
ｅを主成分とする合金箔を用いる。Ｎｉ−Ｆｅを主成分
とする合金は導電性を有するもので、例えば、圧電板２
の熱膨張係数に近いコバール（５２Ｆｅ−３１Ｎｉ−１
７Ｃｏ、ヤング率１３５０００Ｎ／ｍｍ2 ）、４２アロ
イ（５８Ｆｅ−４２Ｎｉ、ヤング率１３７０００Ｎ／ｍ
ｍ2 ）等の金属が好ましい。この金属母材板６の厚さ
は、変位量に寄与しないためにできるだけ薄いもの、例
えば２０〜５０μｍのものが好ましい。As shown in FIG. 3, the metal thin plate 4 is made up of a metal base plate 6 and a metal foil 7 joined to both sides of the metal base plate 6 and having a Young's modulus smaller than that of the metal base plate 6. For example, stainless steel, Ni-F
An alloy foil containing e as a main component is used. An alloy containing Ni—Fe as a main component has conductivity.
Kovar (52Fe-31Ni-1) close to the thermal expansion coefficient of
7Co, Young's modulus 135000 N / mm 2 ), 42 alloy (58Fe-42Ni, Young's modulus 137000 N / m)
Metals such as m 2 ) are preferred. The thickness of the metal base plate 6 is preferably as thin as possible so as not to contribute to the displacement amount, for example, 20 to 50 μm.
【００２３】金属母材板６の両面に形成される金属箔７
としては、例えば、Ａｇ（ヤング率８１３４０Ｎ／ｍｍ
2 ）、リン青銅（ヤング率９８０００Ｎ／ｍｍ2 ）から
なるものがある。金属箔７の厚みは、１５μｍ未満の場
合、応力緩和の効果がなく、また、この厚さも変位量に
寄与しないため、できるだけ薄いもの、例えば、１５〜
３０μｍのものが好ましい。Metal foil 7 formed on both sides of metal base plate 6
For example, Ag (Young's modulus 81340 N / mm
2 ) and phosphor bronze (Young's modulus 98000 N / mm 2 ). When the thickness of the metal foil 7 is less than 15 μm, there is no effect of relaxing the stress, and the thickness does not contribute to the displacement amount.
Those having a thickness of 30 μm are preferred.
【００２４】さらに、連結部５も、金属母材板６の両面
に金属箔７を接合して形成されている。図４に示すよう
な連結部５と金属薄板４の作製方法としては、例えば、
Ｎｉ−Ｆｅ金属母材板とその両面に接着されるＡｇ金属
箔を、圧延時に同時にローラーに投入して作製されたク
ラッド材を用い、図４の形状に切断する方法や、あるい
は、Ｎｉ−Ｆｅ金属母材板の表面に５μｍのＡｇメッキ
層を施し、圧電板の加熱圧着時にこのＡｇメッキ層を介
して、Ｎｉ−Ｆｅ金属母材板とＡｇ金属箔を接着し、図
４の形状に切断する方法が好ましい。尚、Ａｇ金属箔７
は圧電板の加熱圧着時には溶融しない。Further, the connecting portion 5 is also formed by joining metal foils 7 to both sides of the metal base material plate 6. As a method for manufacturing the connecting portion 5 and the metal thin plate 4 as shown in FIG.
A method of cutting the Ni-Fe metal base material plate and the Ag metal foil bonded to both surfaces thereof into the shape shown in FIG. An Ag plating layer of 5 μm is applied to the surface of the metal base plate, and the Ni—Fe metal base plate and the Ag metal foil are adhered to each other through the Ag plating layer when the piezoelectric plate is heated and pressed, and cut into the shape shown in FIG. Is preferred. In addition, Ag metal foil 7
Does not melt when the piezoelectric plate is heated and pressed.
【００２５】また、金属薄板４としては、異なる極性の
金属薄板４との短絡や放電を防止するために、圧電板２
の外周面に露出しないように、圧電板２よりも小さいこ
とが望ましい。積層体の上下面には、図１に示したよう
に、圧電的に不活性で機械的エネルギーを伝達する不活
性体８が形成される。金属薄板４とガラス接合される不
活性体８の片面にはガラスペーストを塗布し、４００〜
６００℃程度で焼き付けられている。このガラスペース
トは、圧電板２に焼き付けられる導電性ペーストのガラ
ス成分ＰｂＯ−ＳｉＯ2 −Ｂ2 Ｏ3 からなっている。In order to prevent a short circuit and discharge with the metal thin plates 4 having different polarities, the piezoelectric thin plates 2 are used.
Is preferably smaller than the piezoelectric plate 2 so as not to be exposed on the outer peripheral surface of the piezoelectric plate 2. As shown in FIG. 1, an inert body 8 that is piezoelectrically inactive and transmits mechanical energy is formed on the upper and lower surfaces of the laminate. A glass paste is applied to one surface of the inert body 8 to be glass-bonded to the thin metal plate 4, and 400 to
It is baked at about 600 ° C. This glass paste is made of a glass component PbO—SiO 2 —B 2 O 3 of a conductive paste that is baked on the piezoelectric plate 2.
【００２６】そして、圧電板２および連結部５の外周面
は絶縁性樹脂９で被覆され、また、圧電板２外周面と連
結部５との間の空隙にも、同様に絶縁性樹脂９が隙間が
ないように充填されている。充填方法としては、粘度等
の条件を調整し、真空脱法など減圧下で空隙内に絶縁樹
脂を充分に充填することが必要である。また、絶縁性樹
脂９については弾性率の低い材料を充填することが望ま
しい。尚、図５に示すように、連結部５の部分には金属
箔を設けなくても良い。また、上記例では、金属薄板４
を連結部５を連結した例について説明したが、図６に示
すように、金属薄板４に接続用突起１１を設け、圧電板
２間に金属薄板４を介装するとともに、接続用突起１１
を圧電板に沿って折曲し、同一の極性を有する接続用突
起１１に当接し、ハンダ等で接続した積層型圧電アクチ
ュエータであっても良い。The outer peripheral surfaces of the piezoelectric plate 2 and the connecting portion 5 are covered with an insulating resin 9, and the insulating resin 9 is similarly filled in the gap between the outer peripheral surface of the piezoelectric plate 2 and the connecting portion 5. It is filled so that there is no gap. As a filling method, it is necessary to adjust the conditions such as viscosity and to sufficiently fill the gap with the insulating resin under reduced pressure such as a vacuum removal method. It is desirable that the insulating resin 9 be filled with a material having a low elastic modulus. In addition, as shown in FIG. 5, the metal foil does not need to be provided in the portion of the connecting portion 5. In the above example, the metal sheet 4
Has been described with reference to FIG. 6, the connecting projections 11 are provided on the thin metal plate 4, and the thin metal plate 4 is interposed between the piezoelectric plates 2 as shown in FIG.
May be bent along the piezoelectric plate, abutted on the connection protrusion 11 having the same polarity, and connected by soldering or the like.
【００２７】[0027]
【実施例】ＰＺＴ焼結体の両面を研磨して、直径２０ｍ
ｍ、厚み０．３ｍｍの円板状の圧電板を形成した。この
圧電板の両主面に、Ａｇ粉末９５重量％、ＰｂＯ−Ｓｉ
Ｏ2 −Ｂ2 Ｏ3 を主成分とするガラス５重量％の電気伝
導性ペーストを１０μｍの厚みになるように印刷し、１
００℃にて乾燥し、５００℃で焼き付けた。Example: Both sides of a PZT sintered body were polished to a diameter of 20 m.
A disk-shaped piezoelectric plate having a thickness of 0.3 mm and a thickness of 0.3 mm was formed. 95% by weight of Ag powder, PbO-Si
An electrically conductive paste of 5% by weight of glass containing O 2 -B 2 O 3 as a main component is printed so as to have a thickness of 10 μm.
Dried at 00 ° C and baked at 500 ° C.
【００２８】厚さ３０μｍのコバールからなる金属母材
板の両面に、Ａｇからなる厚さ２５μｍの金属箔を圧延
接着したクラッド材を作製し、図４に示したような直径
１９ｍｍの円形からなる金属薄板を幅２ｍｍ、長さ２ｍ
ｍの連結部で５０枚連結したリボン状の電極部材を作製
し、金属薄板を圧電板の間に挟み込み、圧電板を９９層
積層して積層体を形成した。尚、金属薄板の連結部が一
層おきに同じ位置にくるように、金属薄板を交互に９０
度ずらして配置した。A clad material was prepared by rolling and bonding a metal foil of Ag having a thickness of 25 μm to both sides of a metal base material plate of Kovar having a thickness of 30 μm, and was formed into a circular shape having a diameter of 19 mm as shown in FIG. Metal sheet is 2mm wide and 2m long
A ribbon-shaped electrode member was prepared by connecting 50 sheets at the connection portion of m, a metal thin plate was sandwiched between the piezoelectric plates, and 99 layers of the piezoelectric plates were laminated to form a laminate. Note that the metal sheets are alternately placed 90 ° so that the connecting portions of the metal sheets are at the same position every other layer.
Staggered.
【００２９】また、不活性体をＰＺＴで作製し、この両
面を研磨して、直径２０ｍｍ、厚み５ｍｍの円柱状の不
活性体を形成した。これらの不活性体の片面にＰｂＯ−
ＳｉＯ2 −Ｂ2 Ｏ3 のガラスペーストを１０μｍの厚み
になるように印刷した後、１００℃にて乾燥し、５００
℃で焼き付けた。An inert material was prepared from PZT, and both surfaces thereof were polished to form a cylindrical inert material having a diameter of 20 mm and a thickness of 5 mm. One side of these inerts is PbO-
After printing a glass paste of SiO 2 —B 2 O 3 to a thickness of 10 μm, the paste was dried at 100 ° C.
Bake at ℃.
【００３０】積層体の上下に不活性体８を配置し、位置
ずれが生じないように軽く圧力を加えた後、上部に５ｋ
ｇの重りを乗せて、５００℃、１時間で加圧接着した。An inert body 8 is arranged above and below the laminate, and a slight pressure is applied so as not to cause a displacement.
g of weight and put on it at 500 ° C. for 1 hour under pressure.
【００３１】次に、上記積層体をシリコンゴムで被覆
し、これを８０℃のシリコンオイル中で３ｋｖ／ｍｍの
直流電圧を３０分間印加して分極処理を行なった。ま
た、金属薄板および連結部を、コバールのみ、Ａｇのみ
で作製したものを用い、上記と同様にして比較例の積層
型圧電アクチュエータを作製した。Next, the above-mentioned laminate was coated with silicon rubber, and a polarization treatment was performed by applying a DC voltage of 3 kv / mm in silicon oil at 80 ° C. for 30 minutes. In addition, a laminated piezoelectric actuator of a comparative example was manufactured in the same manner as described above, using a metal thin plate and a connecting portion made of only Kovar and only Ag.
【００３２】得られた３種類の積層型アクチュエータの
耐久性を比較するために、印加荷重４４０ｋｇｆ下で発
生変位量が５０μｍになるように各積層型圧電アクチュ
エータに印加する設定電圧を求め、印加荷重４４０ｋｇ
ｆ、印加電圧０Ｖから設定電圧を５０Ｈｚの周波数にて
１×１０9 回印加する耐久試験を行った。In order to compare the durability of the obtained three types of laminated actuators, a set voltage to be applied to each laminated piezoelectric actuator was determined so that the amount of displacement generated was 50 μm under an applied load of 440 kgf. 440kg
f, An endurance test was performed in which a set voltage was applied 1 × 10 9 times at a frequency of 50 Hz from an applied voltage of 0 V.
【００３３】その結果、本発明品は１×１０9 回でも問
題無く駆動するのを確認した。一方、コバールからなる
金属薄板の積層型圧電アクチュエータでは、１×１０8
回にて駆動が停止した。このアクチュエータの外観観察
を行った結果、磁器表面に黒く変色したスパークの跡が
確認された。As a result, it was confirmed that the product of the present invention could be driven without problems even at 1 × 10 9 times. On the other hand, in the laminated piezoelectric actuator made of a thin metal plate made of Kovar, 1 × 10 8
Driving was stopped at times. As a result of observing the appearance of this actuator, traces of sparks discolored black were confirmed on the porcelain surface.
【００３４】この部位近傍の断面観察を行った結果、金
属薄板と圧電板との接合界面における最外周部を起点に
圧電板に亀裂が生じているのが確認された。また、この
現象は、破損部位だけではなく、ほとんどの圧電板に見
られた。As a result of observing the cross section near this portion, it was confirmed that a crack was generated in the piezoelectric plate starting from the outermost peripheral portion at the joint interface between the thin metal plate and the piezoelectric plate. This phenomenon was observed not only in the damaged part but also in most piezoelectric plates.
【００３５】次に、Ａｇからなる金属薄板の積層型アク
チュエータでは、４×１０7 回にて発生変位量が３０％
に低下した。外観観察を行った結果、３０層目の連結部
が黒く変色しており、この部位が断線しているのが確認
された。Next, in the case of a laminated metal thin-film actuator made of Ag, the amount of generated displacement is 30% at 4 × 10 7 times.
Has dropped. As a result of external appearance observation, it was confirmed that the connecting portion of the 30th layer was discolored black, and that this portion was disconnected.
【００３６】尚、変位量の測定は、試料を防振台上に固
定し、試料上面にアルミニウム箔を張り付けて、レーザ
ー変位計により、素子の中心部及び周囲部３箇所で測定
した値の平均値で評価した。The displacement was measured by fixing the sample on an anti-vibration table, attaching an aluminum foil to the upper surface of the sample, and averaging the values measured at the center and three peripheral portions of the element by a laser displacement meter. The value was evaluated.
【００３７】[0037]
【発明の効果】以上詳述した通り、本発明の積層型圧電
アクチュエータでは、金属母材板の両面に、この金属母
材板よりもヤング率の小さい金属箔を接着して金属薄板
を構成しているため、圧電板は導電性接着層、金属箔、
金属母材板、金属箔、導電性接着層を介して、他の圧電
板に接合されることになり、圧電板の径方向への伸縮動
作に伴う応力は金属箔により十分に吸収され、圧電板と
金属薄板との接合部に発生する応力が緩和され、圧電板
における亀裂の発生を抑制することができる。As described above in detail, in the laminated piezoelectric actuator of the present invention, a metal foil having a Young's modulus smaller than that of the metal base plate is bonded to both surfaces of the metal base plate to form a metal thin plate. Because the piezoelectric plate is a conductive adhesive layer, metal foil,
It is joined to another piezoelectric plate via a metal base plate, metal foil, and conductive adhesive layer.The stress accompanying the expansion and contraction of the piezoelectric plate in the radial direction is sufficiently absorbed by the metal foil, The stress generated at the joint between the plate and the thin metal plate is reduced, and the generation of cracks in the piezoelectric plate can be suppressed.
【図１】本発明の積層型圧電アクチュエータの基本構成
を示すもので、絶縁性樹脂を一部切り欠いて示す側面図
である。FIG. 1 is a side view showing a basic configuration of a laminated piezoelectric actuator of the present invention, in which an insulating resin is partially cut away.
【図２】圧電板に導電性接着層を形成した状態を示す平
面図である。FIG. 2 is a plan view showing a state where a conductive adhesive layer is formed on a piezoelectric plate.
【図３】図１の一部を拡大して示す側面図（絶縁性樹脂
は省略）である。FIG. 3 is an enlarged side view showing a part of FIG. 1 (an insulating resin is omitted).
【図４】金属薄板を連結部材で連結したリボン状の金属
部材を示す平面図である。FIG. 4 is a plan view showing a ribbon-shaped metal member in which thin metal plates are connected by a connecting member.
【図５】連結部に金属箔を形成しない例を示す側面図
（絶縁性樹脂は省略）である。FIG. 5 is a side view (an insulating resin is omitted) showing an example in which a metal foil is not formed on a connecting portion.
【図６】金属薄板に設けられた接続用突起を用いた例を
示す側面図（絶縁性樹脂は省略）である。FIG. 6 is a side view (an insulating resin is omitted) showing an example in which connection projections provided on a thin metal plate are used.
１・・・導電性接着層 ２・・・圧電板 ４・・・金属薄板 ５・・・連結部 ６・・・金属母材板 ７・・・金属箔 DESCRIPTION OF SYMBOLS 1 ... Conductive adhesive layer 2 ... Piezoelectric plate 4 ... Metal thin plate 5 ... Connection part 6 ... Metal base material plate 7 ... Metal foil
───────────────────────────────────────────────────── フロントページの続き (72)発明者 東別府 誠 鹿児島県国分市山下町１番４号 京セラ株 式会社総合研究所内 (72)発明者 鬼塚 克彦 鹿児島県国分市山下町１番４号 京セラ株 式会社総合研究所内 Ｆターム(参考） 3G066 BA33 BA46 BA54 CD30 CE27 CE31 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Makoto Higashi Beppu 1-4-4 Yamashita-cho, Kokubu-shi, Kagoshima Inside the Kyocera Research Institute (72) Inventor Katsuhiko Onizuka 1-4-4 Yamashita-cho, Kokubu-shi, Kagoshima Kyocera 3G066 BA33 BA46 BA54 CD30 CE27 CE31
Claims (2)
積層し、前記圧電板と前記金属薄板とを導電性接着層に
より接合してなるとともに、前記金属薄板を交互に電気
的に接続した積層型圧電アクチュエータにおいて、前記
金属薄板が、金属母材板の両面に、該金属母材板よりも
ヤング率の小さい金属箔を接着してなることを特徴とす
る積層型圧電アクチュエータ。1. A plurality of piezoelectric plates and a plurality of metal thin plates are alternately laminated, and the piezoelectric plates and the metal thin plates are joined by a conductive adhesive layer, and the metal thin plates are alternately electrically connected. In the connected laminated piezoelectric actuator, the thin metal plate is formed by bonding a metal foil having a Young's modulus smaller than that of the metal base plate to both surfaces of the metal base plate.
金からなり、金属箔がＡｇからなることを特徴とする請
求項１記載の積層型圧電アクチュエータ。2. The multilayer piezoelectric actuator according to claim 1, wherein the metal base material plate is made of an alloy containing Ni and Fe as main components, and the metal foil is made of Ag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27619198A JP3506614B2 (en) | 1998-09-29 | 1998-09-29 | Multilayer piezoelectric actuator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27619198A JP3506614B2 (en) | 1998-09-29 | 1998-09-29 | Multilayer piezoelectric actuator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000114610A true JP2000114610A (en) | 2000-04-21 |
| JP3506614B2 JP3506614B2 (en) | 2004-03-15 |
Family
ID=17565976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27619198A Expired - Fee Related JP3506614B2 (en) | 1998-09-29 | 1998-09-29 | Multilayer piezoelectric actuator |
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| Country | Link |
|---|---|
| JP (1) | JP3506614B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002541401A (en) * | 1999-03-30 | 2002-12-03 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Piezoelectric actuator |
| JP2008535228A (en) * | 2005-04-01 | 2008-08-28 | シーメンス アクチエンゲゼルシヤフト | Monolithic piezoelectric component with mechanical separation layer, method for manufacturing the component, and use of the component |
| WO2009119820A1 (en) * | 2008-03-27 | 2009-10-01 | 京セラ株式会社 | Piezoelectric element, pressure sensor, and method of manufacturing piezoelectric element |
| JP2009288144A (en) * | 2008-05-30 | 2009-12-10 | National Institute Of Advanced Industrial & Technology | Piezo-electric element, piezoelectric sensor, method of manufacturing piezo-electric element, metal foil electrode |
| JP2014075433A (en) * | 2012-10-03 | 2014-04-24 | Tdk Corp | Piezoelectric element and manufacturing method therefor |
| CN115561874A (en) * | 2018-08-13 | 2023-01-03 | 米尼斯怀斯股份公司 | Ultrasonic motor, lens driving device, camera module, and camera mounting device |
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1998
- 1998-09-29 JP JP27619198A patent/JP3506614B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002541401A (en) * | 1999-03-30 | 2002-12-03 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Piezoelectric actuator |
| JP2008535228A (en) * | 2005-04-01 | 2008-08-28 | シーメンス アクチエンゲゼルシヤフト | Monolithic piezoelectric component with mechanical separation layer, method for manufacturing the component, and use of the component |
| WO2009119820A1 (en) * | 2008-03-27 | 2009-10-01 | 京セラ株式会社 | Piezoelectric element, pressure sensor, and method of manufacturing piezoelectric element |
| JP5527545B2 (en) * | 2008-03-27 | 2014-06-18 | 京セラ株式会社 | Piezoelectric element and pressure sensor |
| JP2009288144A (en) * | 2008-05-30 | 2009-12-10 | National Institute Of Advanced Industrial & Technology | Piezo-electric element, piezoelectric sensor, method of manufacturing piezo-electric element, metal foil electrode |
| JP2014075433A (en) * | 2012-10-03 | 2014-04-24 | Tdk Corp | Piezoelectric element and manufacturing method therefor |
| CN115561874A (en) * | 2018-08-13 | 2023-01-03 | 米尼斯怀斯股份公司 | Ultrasonic motor, lens driving device, camera module, and camera mounting device |
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| Publication number | Publication date |
|---|---|
| JP3506614B2 (en) | 2004-03-15 |
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