JP2000061626A - Method and device for surface-joining of metallic plate - Google Patents
Method and device for surface-joining of metallic plateInfo
- Publication number
- JP2000061626A JP2000061626A JP10240024A JP24002498A JP2000061626A JP 2000061626 A JP2000061626 A JP 2000061626A JP 10240024 A JP10240024 A JP 10240024A JP 24002498 A JP24002498 A JP 24002498A JP 2000061626 A JP2000061626 A JP 2000061626A
- Authority
- JP
- Japan
- Prior art keywords
- metal plates
- joined
- metal
- molten solder
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、金属板同士を面接
合するための方法及び装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for surface-bonding metal plates to each other.
【０００２】[0002]
【従来技術及びその課題】金属板同士の面接合をはんだ
を用いて行う場合においては、ボイドという欠陥が発生
することが問題となっていた。ボイドとは、接合箇所に
おいてはんだの行き渡っていない空洞のことである。2. Description of the Related Art In the case where surface joining of metal plates is performed by using solder, it has been a problem that defects such as voids occur. A void is a void where solder is not spread at the joint.
【０００３】そこで、ボイドの無い即ち無欠陥の面接合
を行うために、従来から、種々の方法が提案されて来て
いる。例えば、面接合させる金属板同士の少なくとも
一方を湾曲させた状態で金属板同士を重ね合わせ、湾曲
している金属板を矯正しながら接合する方法、金属板
の被接合面同士の間の間隙をピンや座金を介在させるこ
とにより制御した状態で接合する方法、金属板の被接
合面に閉ループの溝を形成し、該溝に余分なはんだを流
入させながら接合する方法、等がある。Therefore, various methods have heretofore been proposed for performing void-free or defect-free surface bonding. For example, a method of joining metal plates in a state in which at least one of the metal plates to be surface-bonded is curved, and bonding while correcting the curved metal plates, a gap between the bonded surfaces of the metal plates is There are a method of joining in a controlled state by interposing a pin or a washer, a method of forming a closed loop groove on a surface to be joined of a metal plate, and a method of joining while allowing excess solder to flow into the groove.
【０００４】しかし、上記従来の方法はいずれも、面倒
な作業を要し、また、完全な無欠陥を得るのが困難であ
った。However, all the above-mentioned conventional methods require troublesome work and it is difficult to obtain a perfect defect-free method.
【０００５】本発明は、金属板同士の無欠陥の面接合を
容易に行うことができる方法及び装置を提供することを
目的とする。An object of the present invention is to provide a method and an apparatus capable of easily performing defect-free surface bonding between metal plates.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の発明は、
溶融はんだ中に、面接合させる金属板同士を全部浸漬さ
せるとともに、各金属板の被接合面同士を対向させ且つ
立てた状態とし、その状態で、溶融はんだ又は各金属板
に超音波を印加して、被接合面にはんだめっきを形成す
る工程と、超音波印加後、各金属板を溶融はんだ中に浸
漬させた状態で、各金属板をその被接合面同士が圧接す
るよう押圧する工程とを有することを特徴とする金属板
の面接合方法である。The invention according to claim 1 is
In the molten solder, all the metal plates to be surface-joined are immersed, and the surfaces to be joined of the respective metal plates are made to face each other and stood up, and in that state, ultrasonic waves are applied to the molten solder or each metal plate. A step of forming solder plating on the surfaces to be joined, and a step of pressing each metal plate so that the surfaces to be joined are pressed against each other in a state where each metal plate is immersed in molten solder after application of ultrasonic waves. And a surface bonding method for metal plates.
【０００７】請求項２記載の発明は、溶融はんだ中に、
面接合させる金属板同士を全部浸漬させるとともに、各
金属板の被接合面同士を対向させ且つ立てた状態とし、
その状態で、溶融はんだ又は各金属板に超音波を印加し
ながら、各金属板をその被接合面同士が圧接するよう押
圧する工程を有することを特徴とする金属板の面接合方
法である。According to a second aspect of the invention, in the molten solder,
While immersing all the metal plates to be surface-bonded, the surfaces to be bonded of the metal plates are made to face each other and stand upright,
In this state, the method for surface-bonding metal plates comprises the step of pressing each metal plate so that the surfaces to be bonded are pressed against each other while applying ultrasonic waves to the molten solder or each metal plate.
【０００８】請求項３記載の発明は、請求項１又は２記
載の構成に加えて、一方の金属板がアルミニウム又はそ
の合金からなり、他方の金属板が銅以外であってアルミ
ニウムとは異種の金属又はその合金からなっており、溶
融はんだ中に浸漬させる前に、上記他方の金属板の被接
合面に、銅、アルミニウム、亜鉛、鉛、ケイ素、カドミ
ウム、スズ、及びこれらの１種以上を主成分とする合
金、の内から任意に選択した金属からなるめっきを形成
する工程を有するものである。According to a third aspect of the present invention, in addition to the structure of the first or second aspect, one metal plate is made of aluminum or its alloy, and the other metal plate is other than copper and is different from aluminum. It consists of a metal or its alloy, and before being dipped in the molten solder, copper, aluminum, zinc, lead, silicon, cadmium, tin, and one or more of these are applied to the surface to be joined of the other metal plate. It has a step of forming a plating made of a metal arbitrarily selected from the alloy as the main component.
【０００９】請求項４記載の発明は、溶融はんだを溜め
る浴槽と、浴槽内に設けられ、面接合させる金属板同士
を、被接合面同士が圧接するよう押圧する押圧手段と、
溶融はんだ又は各金属板に超音波を印加する超音波装置
とを備え、押圧手段は、金属板に当接する１対の当接部
を有し、該１対の当接部を金属板同士を挟むように両側
から金属板に当接させて金属板同士を押圧するようにな
っており、押圧手段の、当接部及びはんだに接触する部
分は、チタン又はカーボンでできており、超音波装置
は、溶融はんだ中に浸漬された金属板の被接合面にはん
だめっきを形成するよう、超音波を印加するようになっ
ていることを特徴とする金属板の面接合装置である。According to a fourth aspect of the present invention, there is provided a bath for storing the molten solder, and a pressing means provided in the bath for pressing the metal plates to be surface-bonded so that the surfaces to be bonded are pressed against each other.
The molten solder or an ultrasonic device for applying an ultrasonic wave to each metal plate is provided, and the pressing means has a pair of contact portions that contact the metal plates, and the pair of contact portions connect the metal plates to each other. The metal plates are pressed against each other so as to be sandwiched, and the metal plates are pressed against each other. The contact part of the pressing means and the part contacting the solder are made of titanium or carbon. Is a surface bonding apparatus for metal plates, wherein ultrasonic waves are applied so as to form solder plating on the surfaces to be bonded of the metal plates dipped in the molten solder.
【００１０】[0010]
【発明の実施の形態】図１及び図２は本発明の金属板の
面接合装置を示す縦断面図である。この面接合装置１
は、浴槽２と、押圧手段３と、超音波装置４とからなっ
ている。浴槽２には溶融はんだ５が満たされている。な
お、面接合させる金属板６はアルミニウム合金（例えば
Ａ６０６３、Ａ１０５０）であり、金属板７はインバー
合金（Ｆｅ−４２％Ｎｉ）である。また、溶融はんだ５
はアルミニウム又はその合金用のはんだであり、例えば
Ｚｎ−５％Ａｌである。1 and 2 are vertical sectional views showing a surface bonding apparatus for metal plates according to the present invention. This surface bonding device 1
Is composed of a bath 2, a pressing means 3, and an ultrasonic device 4. The bath 2 is filled with molten solder 5. The metal plate 6 to be surface-bonded is an aluminum alloy (for example, A6063, A1050), and the metal plate 7 is an Invar alloy (Fe-42% Ni). Also, molten solder 5
Is a solder for aluminum or its alloy, for example Zn-5% Al.
【００１１】押圧手段３は、面接合させる金属板６，７
を、被接合面６１，７１が圧接するよう押圧するもので
あり、浴槽２内にて相対向して設けられた１対の当接部
３１，３２及びロッド３３，３４からなっている。ロッ
ド３４は、その外周面にねじが切ってあり、浴槽２の側
壁２１を水平に貫通しており、ハンドル３４１を回転さ
せることにより前後進するようになっている。ロッド３
３は一端が側壁２２に固定されて水平に延びている。当
接部３１，３２はロッド３３，３４の先端にそれぞれ固
定されている。当接部３１，３２は、厚板でできてお
り、当接面３１１，３２１同士が平行に相対するよう設
けられている。当接部３１，３２及びロッド３３，３４
はチタン又はカーボンでできている。The pressing means 3 is a metal plate 6, 7 to be surface-bonded.
Are to be pressed against the surfaces 61, 71 to be joined, and are composed of a pair of abutting portions 31, 32 and rods 33, 34 provided facing each other in the bathtub 2. The rod 34 has a thread on its outer peripheral surface, penetrates the side wall 21 of the bathtub 2 horizontally, and is adapted to move forward and backward by rotating the handle 341. Rod 3
3 has one end fixed to the side wall 22 and extends horizontally. The contact portions 31 and 32 are fixed to the tips of the rods 33 and 34, respectively. The contact portions 31 and 32 are made of thick plates, and are provided so that the contact surfaces 311 and 321 face each other in parallel. Abutting portions 31, 32 and rods 33, 34
Is made of titanium or carbon.
【００１２】超音波装置４は、浴槽２内の底部に設けら
れた振動板４１と、振動板４１に係合しており、振動板
４１に超音波振動を与えるホーン４２と、ホーン２１に
接合されている振動子４３と、振動子４３に信号を送る
発振器４４とで構成されており、金属板６，７に振動板
４１を介して超音波を印加するようになっている。な
お、押圧手段３のロッド３３，３４は振動板４１の一部
に形成した貫通孔４１１を余裕を持って貫通している。The ultrasonic device 4 is joined to the vibration plate 41 provided at the bottom of the bathtub 2, the horn 42 engaged with the vibration plate 41 and applying ultrasonic vibration to the vibration plate 41, and the horn 21. The oscillator 43 and the oscillator 44 that sends a signal to the oscillator 43 are configured to apply ultrasonic waves to the metal plates 6 and 7 via the diaphragm 41. The rods 33 and 34 of the pressing means 3 pass through a through hole 411 formed in a part of the diaphragm 41 with a margin.
【００１３】次に、上記構成の面接合装置１を用いた面
接合方法について説明する。まず、面接合装置１を作動
させる前に、金属板７の被接合面７１に銅めっきを形成
する。Next, a surface bonding method using the surface bonding apparatus 1 having the above structure will be described. First, before operating the surface bonding apparatus 1, copper plating is formed on the bonded surface 71 of the metal plate 7.
【００１４】そして、面接合装置１を作動させて次のよ
うに面接合を行う。即ち、まず、ハンドル３４１を操作
して当接部３２を前後進させて、当接部３１，３２の当
接面３１１，３２１同士の間隔を、金属板６，７の厚さ
を合わせた寸法より少し大きく設定し、当接部３１，３
２間に、図１に示すように、金属板６，７を、当接面３
１１，３２１同士を対向させて且つ立てた状態で、その
全部を溶融はんだ５中に浸漬させる。Then, the surface bonding apparatus 1 is operated to perform surface bonding as follows. That is, first, the handle 341 is operated to move the contact portion 32 back and forth, and the distance between the contact surfaces 311 and 321 of the contact portions 31 and 32 is determined by the thickness of the metal plates 6 and 7. Set a little larger, contact parts 31, 3
Between the two, as shown in FIG.
In a state where 11, 321 are opposed to each other and are stood, all of them are immersed in the molten solder 5.
【００１５】次に、超音波装置４を作動させて、金属板
６，７に超音波を印加する。即ち、発振器４４，振動子
４３，及びホーン４２を作動させて、振動板４１を介し
て金属板６，７に超音波振動を与える。これにより、被
接合面６１，７１にははんだめっきが形成される。な
お、被接合面７１では、次のような反応によりはんだめ
っきが形成される。即ち、被接合面７１に形成しておい
た銅めっき層とはんだ５との界面において、金属間化合
物及び酸化物からなる層が形成され、この層が超音波振
動に伴うキャビテーションによって剥離していき、その
際に、この層中の銅が被接合面７１表面の酸化物から酸
素を奪いながら、はんだ５中に拡散していき、これによ
り、被接合面７１表面が活性化され、はんだ５のぬれが
生じ、被接合面７１表面にははんだ５の成分と金属板７
即ちインバー合金の成分とからなる化合物層が形成され
るとともに、その化合物層を介してはんだ５が強固に付
着してはんだめっきが形成される。Next, the ultrasonic device 4 is operated to apply ultrasonic waves to the metal plates 6 and 7. That is, the oscillator 44, the oscillator 43, and the horn 42 are operated to apply ultrasonic vibration to the metal plates 6 and 7 via the diaphragm 41. As a result, solder plating is formed on the surfaces 61, 71 to be joined. In addition, solder plating is formed on the joined surface 71 by the following reaction. That is, a layer made of an intermetallic compound and an oxide is formed at the interface between the copper plating layer formed on the surface to be joined 71 and the solder 5, and this layer is separated by cavitation due to ultrasonic vibration. At that time, the copper in this layer diffuses into the solder 5 while depriving the oxide of the surface of the joined surface 71 of oxygen, thereby activating the surface of the joined surface 71 and Wetting occurs, and the components of the solder 5 and the metal plate 7 are formed on the surface of the joined surface 71.
That is, a compound layer composed of the components of the Invar alloy is formed, and the solder 5 is firmly attached through the compound layer to form solder plating.
【００１６】次に、超音波装置４を停止した後に、押圧
手段３を作動させて、金属板６，７を、溶融はんだ５中
に浸漬した状態のままで、被接合面６１，７１が圧接す
るよう押圧する。即ち、ハンドル３４１を操作してロッ
ド３４を前進させ、図２に示すように、金属板６，７を
当接部３１，３２で挟み込んでいき、金属板６，７の被
接合面６１，７１同士を圧接させる。Next, after stopping the ultrasonic device 4, the pressing means 3 is actuated, and the surfaces to be joined 61 and 71 are pressed against each other while the metal plates 6 and 7 are still immersed in the molten solder 5. Press to That is, the handle 341 is operated to move the rod 34 forward, and as shown in FIG. 2, the metal plates 6 and 7 are sandwiched by the contact portions 31 and 32, and the surfaces 61 and 71 to be joined of the metal plates 6 and 7 are joined. Press them together.
【００１７】そして、所定時間後、ハンドル３４１を操
作してロッド３４を後進させ、金属板６，７を溶融はん
だ５中から取り出す。これにより、被接合面６１，７１
同士がはんだ５で接合された即ち面接合された金属板
６，７が得られる。After a predetermined time, the handle 341 is operated to move the rod 34 backward, and the metal plates 6 and 7 are taken out of the molten solder 5. Thereby, the bonded surfaces 61, 71
The metal plates 6 and 7 in which the two are joined by the solder 5, that is, the surface joining is obtained.
【００１８】上記方法では、金属板６，７が溶融はんだ
５中に全部浸漬された状態で面接合されるので、被接合
面６１，７１の間に周囲から十分な量のはんだ５が供給
され、しかも、被接合面６１，７１が容易に適正温度に
保たれる。また、超音波を印加するので、被接合面６
１，７１の表面が活性化される。従って、被接合面６
１，７１同士は、ボイドのような欠陥を発生させること
なく、面接合される。In the above method, since the metal plates 6 and 7 are surface-joined in a state of being completely immersed in the molten solder 5, a sufficient amount of solder 5 is supplied from the surroundings between the surfaces 61 and 71 to be bonded. Moreover, the surfaces 61, 71 to be joined are easily kept at the proper temperature. Further, since ultrasonic waves are applied, the surface to be joined 6
The surface of 1,71 is activated. Therefore, the bonded surface 6
1, 71 are surface-bonded without causing defects such as voids.
【００１９】また、上記構成の面接合装置１では、押圧
手段３の当接部３１，３２及びロッド３３，３４がチタ
ン又はカーボンでできているので、これらへのはんだ５
の付着が防止される。従って、押圧手段３、ひいては面
接合装置１は繰り返しの使用が可能となる。Further, in the surface bonding apparatus 1 having the above-mentioned structure, since the contact portions 31, 32 and the rods 33, 34 of the pressing means 3 are made of titanium or carbon, the solder 5 to them is used.
Is prevented from adhering. Therefore, the pressing means 3 and thus the surface bonding apparatus 1 can be repeatedly used.
【００２０】なお、上記構成の面接合装置１では、押圧
手段３の一方の当接部３１及びロッド３３を固定とし、
他方の当接部３２及びロッド３４のみを可動としたが、
両者を可動としてもよい。In the surface bonding apparatus 1 having the above structure, one contact portion 31 of the pressing means 3 and the rod 33 are fixed,
Only the other contact portion 32 and the rod 34 are movable,
Both may be movable.
【００２１】また、上記構成の面接合装置１では、超音
波装置４を、金属板６，７に超音波振動を加える構成と
したが、浴槽２を介して溶融はんだ５に超音波振動を加
える構成としてもよい。その場合は、例えば、ホーン４
２を浴槽２の外壁に強く当接させ又は埋め込む構成とす
る。Further, in the surface bonding apparatus 1 having the above structure, the ultrasonic device 4 is configured to apply ultrasonic vibration to the metal plates 6 and 7, but ultrasonic vibration is applied to the molten solder 5 through the bath 2. It may be configured. In that case, for example, the horn 4
2 is strongly contacted with or embedded in the outer wall of the bathtub 2.
【００２２】また、上記面接合方法では、超音波装置４
の作動を停止した後に押圧手段３を作動させているが、
超音波装置４を作動させながら押圧手段３を作動させて
もよい。In the surface bonding method, the ultrasonic device 4 is used.
Although the pressing means 3 is operated after stopping the operation of
The pressing means 3 may be operated while operating the ultrasonic device 4.
【００２３】また、上記面接合方法では、金属板７の被
接合面７１に銅をめっきしたが、これに限らず、銅、ア
ルミニウム、亜鉛、鉛、ケイ素、カドミウム、スズ、及
びこれらの１種以上を主成分とする合金、の内から任意
に選択した他の金属をめっきしてもよい。Further, in the above surface bonding method, the surface 71 to be bonded of the metal plate 7 was plated with copper, but the present invention is not limited to this, and copper, aluminum, zinc, lead, silicon, cadmium, tin, and one of these are used. Other metals arbitrarily selected from the alloys containing the above as a main component may be plated.
【００２４】[0024]
【発明の効果】請求項１又は２に記載の発明によれば、
面接合させる金属板同士を溶融はんだ中に全部浸漬させ
た状態で面接合するので、被接合面の間に周囲から十分
な量のはんだを供給でき、しかも、被接合面を容易に適
正温度に保つことができる。また、超音波を印加するの
で、被接合面の表面を活性化できる。従って、金属板の
被接合面同士を、ボイドのような欠陥を発生させること
なく、面接合することができる。According to the invention described in claim 1 or 2,
Because the metal plates to be surface-bonded are all immersed in the molten solder, surface-bonding is possible, so a sufficient amount of solder can be supplied from the surroundings between the surfaces to be bonded, and the surfaces to be bonded can be easily heated to the proper temperature. Can be kept. Moreover, since ultrasonic waves are applied, the surface of the surface to be joined can be activated. Therefore, the surfaces to be joined of the metal plates can be surface-joined without causing defects such as voids.
【００２５】請求項３記載の発明によれば、面接合させ
る金属板同士の、一方の金属板がアルミニウム又はその
合金からなり、他方の金属板が銅以外であってアルミニ
ウムとは異種の金属又はその合金からなるものであって
も、上記他方の金属板の被接合面に所定の金属めっきを
形成するので、両者を支障なく面接合することができ
る。According to the third aspect of the present invention, among the metal plates to be surface-bonded, one metal plate is made of aluminum or its alloy, and the other metal plate is made of a metal other than copper and different from aluminum or Even if it is made of the alloy, since the predetermined metal plating is formed on the surface to be joined of the other metal plate, they can be surface-joined without any trouble.
【００２６】請求項４記載の発明によれば、請求項１な
いし３の面接合方法を容易に実施できるので、金属板同
士の無欠陥の面接合を容易に行うことができる。しか
も、押圧手段の、当接部及びはんだに接触する部分が、
チタン又はカーボンでできているので、これらへのはん
だの付着を防止でき、これによって、押圧手段、ひいて
は面接合装置の繰り返し使用を可能にできる。従って、
金属板の面接合を連続して効率良く行うことができる。According to the invention described in claim 4, since the surface bonding method of claims 1 to 3 can be easily carried out, defect-free surface bonding of metal plates can be easily carried out. Moreover, the contact portion of the pressing means and the portion contacting the solder are
Since it is made of titanium or carbon, it is possible to prevent the solder from adhering to them, which makes it possible to repeatedly use the pressing means and thus the surface bonding apparatus. Therefore,
The surface bonding of the metal plates can be continuously and efficiently performed.
【図１】 本発明の金属板の面接合装置を用いた面接合
方法の前半の工程を示す縦断面図である。FIG. 1 is a vertical cross-sectional view showing a first half step of a surface bonding method using a surface bonding apparatus for metal plates of the present invention.
【図２】 図１に続く後半の工程を示す縦断面図であ
る。FIG. 2 is a vertical cross-sectional view showing the latter half of the process following FIG.
１ 面接合装置 ２ 浴槽 ３ 押圧手段 ３１，３２ 当接部 ４ 超音波装置 ５ 溶融はんだ ６，７ 金属板 ６１，７１ 被接合面 1-side joining device 2 bathtubs 3 Pressing means 31, 32 abutment part 4 Ultrasonic device 5 Molten solder 6,7 metal plate 61,71 Joined surface
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4E080 AA10 AB01 AB09 BA11 BA20 DA10 5D107 AA14 BB01 FF03 FF08 FF20 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 4E080 AA10 AB01 AB09 BA11 BA20 DA10 5D107 AA14 BB01 FF03 FF08 FF20
Claims (4)
士を全部浸漬させるとともに、各金属板の被接合面同士
を対向させ且つ立てた状態とし、その状態で、溶融はん
だ又は各金属板に超音波を印加して、被接合面にはんだ
めっきを形成する工程と、 超音波印加後、各金属板を溶融はんだ中に浸漬させた状
態で、各金属板をその被接合面同士が圧接するよう押圧
する工程とを有することを特徴とする金属板の面接合方
法。1. A method in which all the metal plates to be surface-joined are immersed in the molten solder, and the surfaces to be joined of the respective metal plates are made to face each other and stand upright. Applying ultrasonic waves to form solder plating on the surfaces to be joined, and after applying the ultrasonic waves, the surfaces to be joined are pressed against each other with each metal plate immersed in the molten solder. And a step of pressing the metal plates together.
士を全部浸漬させるとともに、各金属板の被接合面同士
を対向させ且つ立てた状態とし、その状態で、溶融はん
だ又は各金属板に超音波を印加しながら、各金属板をそ
の被接合面同士が圧接するよう押圧する工程を有するこ
とを特徴とする金属板の面接合方法。2. A method in which all of the metal plates to be surface-bonded are immersed in the molten solder, and the surfaces to be bonded of the respective metal plates are made to face each other and stand upright. A surface-bonding method for metal plates, comprising a step of pressing each metal plate so that the surfaces to be bonded are pressed against each other while applying ultrasonic waves.
金からなり、他方の金属板が銅以外であってアルミニウ
ムとは異種の金属又はその合金からなっており、溶融は
んだ中に浸漬させる前に、上記他方の金属板の被接合面
に、銅、アルミニウム、亜鉛、鉛、ケイ素、カドミウ
ム、スズ、及びこれらの１種以上を主成分とする合金、
の内から任意に選択した金属からなるめっきを形成する
工程を有する請求項１又は２に記載の金属板の面接合方
法。3. One of the metal plates is made of aluminum or an alloy thereof, and the other metal plate is made of a metal other than copper and a different metal from aluminum, or an alloy thereof, before being dipped in molten solder. On the surface to be joined of the other metal plate, copper, aluminum, zinc, lead, silicon, cadmium, tin, and an alloy containing one or more of these as main components,
The method for surface-bonding metal plates according to claim 1 or 2, further comprising the step of forming a plating made of a metal arbitrarily selected from the above.
面同士が圧接するよう押圧する押圧手段と、 溶融はんだ又は各金属板に超音波を印加する超音波装置
とを備え、 押圧手段は、金属板に当接する１対の当接部を有し、該
１対の当接部を金属板同士を挟むように両側から金属板
に当接させて金属板同士を押圧するようになっており、
押圧手段の、当接部及びはんだに接触する部分は、チタ
ン又はカーボンでできており、 超音波装置は、溶融はんだ中に浸漬された金属板の被接
合面にはんだめっきを形成するよう、超音波を印加する
ようになっていることを特徴とする金属板の面接合装
置。4. A bath for storing the molten solder, a pressing means provided in the bath for pressing the metal plates to be surface-bonded so that the surfaces to be bonded are pressed against each other, and ultrasonic waves are applied to the molten solder or each metal plate. The pressing means has a pair of abutting portions that abut the metal plate, and the abutting portion abuts the metal plate from both sides so as to sandwich the metal plates. It is designed to press the metal plates together,
The abutting part of the pressing means and the part that comes into contact with the solder are made of titanium or carbon, and the ultrasonic device is designed to form a solder plating on the joined surface of the metal plate immersed in the molten solder. A surface bonding apparatus for metal plates, which is adapted to apply a sound wave.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10240024A JP2000061626A (en) | 1998-08-26 | 1998-08-26 | Method and device for surface-joining of metallic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10240024A JP2000061626A (en) | 1998-08-26 | 1998-08-26 | Method and device for surface-joining of metallic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000061626A true JP2000061626A (en) | 2000-02-29 |
Family
ID=17053339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10240024A Pending JP2000061626A (en) | 1998-08-26 | 1998-08-26 | Method and device for surface-joining of metallic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000061626A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101196493B (en) * | 2007-12-14 | 2010-06-09 | 哈尔滨工业大学 | Device for simulating weak joint defect of diffusion weld interface |
| CN102059422A (en) * | 2010-12-10 | 2011-05-18 | 哈尔滨工业大学 | Electrical contact welding method |
-
1998
- 1998-08-26 JP JP10240024A patent/JP2000061626A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101196493B (en) * | 2007-12-14 | 2010-06-09 | 哈尔滨工业大学 | Device for simulating weak joint defect of diffusion weld interface |
| CN102059422A (en) * | 2010-12-10 | 2011-05-18 | 哈尔滨工业大学 | Electrical contact welding method |
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