JP1711705S - - Google Patents
Info
- Publication number
- JP1711705S JP1711705S JP2021016449F JP2021016449F JP1711705S JP 1711705 S JP1711705 S JP 1711705S JP 2021016449 F JP2021016449 F JP 2021016449F JP 2021016449 F JP2021016449 F JP 2021016449F JP 1711705 S JP1711705 S JP 1711705S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021016449F JP1711705S (ko) | 2021-07-29 | 2021-07-29 | |
US29/823,888 USD1032517S1 (en) | 2021-07-29 | 2022-01-20 | Semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021016449F JP1711705S (ko) | 2021-07-29 | 2021-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1711705S true JP1711705S (ko) | 2022-04-04 |
Family
ID=80952756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021016449F Active JP1711705S (ko) | 2021-07-29 | 2021-07-29 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD1032517S1 (ko) |
JP (1) | JP1711705S (ko) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5337216A (en) * | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD459705S1 (en) * | 2001-03-06 | 2002-07-02 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
JP1632999S (ko) * | 2018-06-12 | 2019-06-03 | ||
CN112204739B (zh) * | 2018-06-20 | 2024-03-15 | 罗姆股份有限公司 | 半导体器件 |
-
2021
- 2021-07-29 JP JP2021016449F patent/JP1711705S/ja active Active
-
2022
- 2022-01-20 US US29/823,888 patent/USD1032517S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD1032517S1 (en) | 2024-06-25 |