JP1711705S - - Google Patents

Info

Publication number
JP1711705S
JP1711705S JP2021016449F JP2021016449F JP1711705S JP 1711705 S JP1711705 S JP 1711705S JP 2021016449 F JP2021016449 F JP 2021016449F JP 2021016449 F JP2021016449 F JP 2021016449F JP 1711705 S JP1711705 S JP 1711705S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021016449F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2021016449F priority Critical patent/JP1711705S/ja
Priority to US29/823,888 priority patent/USD1032517S1/en
Application granted granted Critical
Publication of JP1711705S publication Critical patent/JP1711705S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021016449F 2021-07-29 2021-07-29 Active JP1711705S (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021016449F JP1711705S (ko) 2021-07-29 2021-07-29
US29/823,888 USD1032517S1 (en) 2021-07-29 2022-01-20 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021016449F JP1711705S (ko) 2021-07-29 2021-07-29

Publications (1)

Publication Number Publication Date
JP1711705S true JP1711705S (ko) 2022-04-04

Family

ID=80952756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021016449F Active JP1711705S (ko) 2021-07-29 2021-07-29

Country Status (2)

Country Link
US (1) USD1032517S1 (ko)
JP (1) JP1711705S (ko)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
JP1632999S (ko) * 2018-06-12 2019-06-03
CN112204739B (zh) * 2018-06-20 2024-03-15 罗姆股份有限公司 半导体器件

Also Published As

Publication number Publication date
USD1032517S1 (en) 2024-06-25

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