JP1660180S - - Google Patents
Info
- Publication number
- JP1660180S JP1660180S JPD2019-23723F JP2019023723F JP1660180S JP 1660180 S JP1660180 S JP 1660180S JP 2019023723 F JP2019023723 F JP 2019023723F JP 1660180 S JP1660180 S JP 1660180S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-23723F JP1660180S (en) | 2019-10-25 | 2019-10-25 | |
| TW109301937D03F TWD209201S (en) | 2019-10-25 | 2020-04-10 | Film for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-23723F JP1660180S (en) | 2019-10-25 | 2019-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1660180S true JP1660180S (en) | 2020-05-25 |
Family
ID=70775656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-23723F Active JP1660180S (en) | 2019-10-25 | 2019-10-25 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1660180S (en) |
| TW (1) | TWD209201S (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1718123S (en) | 2021-10-15 | 2022-06-23 | Stamp parts for transferring microstructures | |
| JP1724476S (en) | 2021-10-15 | 2022-09-12 | Stamp parts for microstructure transfer | |
| JP1727914S (en) | 2021-10-15 | 2022-10-21 | Stamp parts for microstructure transfer | |
| JP1740419S (en) | 2021-10-15 | 2023-03-30 | Stamp parts for microstructure transfer | |
| JP1724478S (en) | 2021-10-15 | 2022-09-12 | Stamp parts for microstructure transfer | |
| JP1718080S (en) | 2021-10-15 | 2022-06-23 | Stamp parts for transferring microstructures |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5452900B2 (en) | 2007-09-21 | 2014-03-26 | 株式会社半導体エネルギー研究所 | Method for manufacturing substrate with semiconductor film |
| JP6029771B2 (en) | 2014-11-13 | 2016-11-24 | 新電元工業株式会社 | Semiconductor device manufacturing method and glass film forming apparatus |
| KR102487552B1 (en) | 2018-02-05 | 2023-01-11 | 삼성전자주식회사 | Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition |
-
2019
- 2019-10-25 JP JPD2019-23723F patent/JP1660180S/ja active Active
-
2020
- 2020-04-10 TW TW109301937D03F patent/TWD209201S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD209201S (en) | 2021-01-01 |