JP1624353S - - Google Patents
Info
- Publication number
- JP1624353S JP1624353S JPD2018-15809F JP2018015809F JP1624353S JP 1624353 S JP1624353 S JP 1624353S JP 2018015809 F JP2018015809 F JP 2018015809F JP 1624353 S JP1624353 S JP 1624353S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-15809F JP1624353S (ja) | 2018-07-19 | 2018-07-19 | |
TW107306663F TWD197466S (zh) | 2018-07-19 | 2018-11-12 | 基板處理裝置用隔熱板 |
US29/672,222 USD924823S1 (en) | 2018-07-19 | 2018-12-04 | Adiabatic plate for substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-15809F JP1624353S (ja) | 2018-07-19 | 2018-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1624353S true JP1624353S (ja) | 2019-02-12 |
Family
ID=65269381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2018-15809F Active JP1624353S (ja) | 2018-07-19 | 2018-07-19 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD924823S1 (ja) |
JP (1) | JP1624353S (ja) |
TW (1) | TWD197466S (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
USD971192S1 (en) | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
USD971900S1 (en) | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
TWI735115B (zh) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | 晶圓儲存裝置及晶圓承載盤 |
USD962206S1 (en) * | 2020-01-09 | 2022-08-30 | Space Exploration Technologies Corp. | Antenna apparatus |
JP1700781S (ja) | 2021-03-22 | 2021-11-29 | ||
JP1730244S (ja) * | 2021-12-21 | 2022-11-21 | フレキシブルプリント基板 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0785919B2 (ja) * | 1990-11-30 | 1995-09-20 | ソマール株式会社 | 断熱板 |
US5088006A (en) * | 1991-04-25 | 1992-02-11 | International Business Machines Corporation | Liquid film interface cooling system for semiconductor wafer processing |
USD359476S (en) * | 1993-08-06 | 1995-06-20 | Sankyo Seiki Mfg. Co., Ltd. | Circuit board with mounting flange |
USD404374S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Fin for use in a semiconductor wafer heat processing apparatus |
US6783299B2 (en) * | 1999-07-26 | 2004-08-31 | Ovadia Meron | Latch for detachably attaching and mounting a semiconductor wafer to a support ring |
US6631935B1 (en) * | 2000-08-04 | 2003-10-14 | Tru-Si Technologies, Inc. | Detection and handling of semiconductor wafer and wafer-like objects |
AU2002355034A1 (en) * | 2002-11-26 | 2004-06-18 | Disco Corporation | Cassette for storing multiple sheets of semiconductor wafers |
US7329947B2 (en) * | 2003-11-07 | 2008-02-12 | Sumitomo Mitsubishi Silicon Corporation | Heat treatment jig for semiconductor substrate |
USD547147S1 (en) * | 2006-09-01 | 2007-07-24 | Huy Tran | Window tinting tool |
JP4748193B2 (ja) * | 2008-09-01 | 2011-08-17 | ソニー株式会社 | 非水電解質二次電池の絶縁板、非水電解質二次電池および非水電解質二次電池の絶縁板の製造方法 |
USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
JP1441120S (ja) * | 2010-08-17 | 2015-05-11 | ||
USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
TWD174921S (zh) * | 2014-12-17 | 2016-04-11 | 日本碍子股份有限公司 | 複合基板之部分 |
JP6318301B2 (ja) * | 2015-02-25 | 2018-04-25 | 株式会社日立国際電気 | 基板処理装置、ヒータおよび半導体装置の製造方法 |
JP1568061S (ja) | 2016-03-30 | 2017-01-30 | ||
USD843184S1 (en) * | 2016-06-02 | 2019-03-19 | David Harold Woodcock | Cutting tool for adhesive tape dispensers |
USD793352S1 (en) * | 2016-07-11 | 2017-08-01 | Asm Ip Holding B.V. | Getter plate |
USD804437S1 (en) * | 2016-09-30 | 2017-12-05 | Norton (Waterford) Limited | Circuit board |
JP6743905B2 (ja) * | 2016-11-28 | 2020-08-19 | 三菱電機株式会社 | 炭化珪素半導体ウエハ、炭化珪素半導体チップ、および炭化珪素半導体装置の製造方法 |
US10453713B2 (en) * | 2016-11-29 | 2019-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for controlling temperature of furnace in semiconductor fabrication process |
JP6770461B2 (ja) * | 2017-02-21 | 2020-10-14 | クアーズテック株式会社 | 縦型ウエハボート |
JP6916413B2 (ja) * | 2017-04-25 | 2021-08-11 | 株式会社島津製作所 | 電源一体型真空ポンプ |
USD852763S1 (en) * | 2017-08-31 | 2019-07-02 | ebm-papst Lanshut GmbH | Circuit board |
US10861727B2 (en) * | 2018-03-13 | 2020-12-08 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
USD879730S1 (en) * | 2018-12-18 | 2020-03-31 | SiFive, Inc. | Circuit board |
-
2018
- 2018-07-19 JP JPD2018-15809F patent/JP1624353S/ja active Active
- 2018-11-12 TW TW107306663F patent/TWD197466S/zh unknown
- 2018-12-04 US US29/672,222 patent/USD924823S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWD197466S (zh) | 2019-05-11 |
USD924823S1 (en) | 2021-07-13 |