JP1582475S - - Google Patents
Info
- Publication number
- JP1582475S JP1582475S JPD2016-22415F JP2016022415F JP1582475S JP 1582475 S JP1582475 S JP 1582475S JP 2016022415 F JP2016022415 F JP 2016022415F JP 1582475 S JP1582475 S JP 1582475S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-22415F JP1582475S (zh) | 2016-10-14 | 2016-10-14 | |
US29/596,960 USD825502S1 (en) | 2016-10-14 | 2017-03-13 | Heater for substrate processing apparatus |
TW106301241F TWD187000S (zh) | 2016-10-14 | 2017-03-13 | 基板處理裝置用加熱機之部分 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-22415F JP1582475S (zh) | 2016-10-14 | 2016-10-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1582475S true JP1582475S (zh) | 2017-07-31 |
Family
ID=59384954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2016-22415F Active JP1582475S (zh) | 2016-10-14 | 2016-10-14 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD825502S1 (zh) |
JP (1) | JP1582475S (zh) |
TW (1) | TWD187000S (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD860420S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
USD860419S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD518450S1 (en) * | 2003-12-18 | 2006-04-04 | Honeywell International, Inc. | Modular electronic housing |
US7892983B2 (en) * | 2004-10-07 | 2011-02-22 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and producing method of semiconductor device |
WO2007018016A1 (ja) * | 2005-08-05 | 2007-02-15 | Hitachi Kokusai Electric Inc. | 基板処理装置、冷却ガス供給ノズルおよび半導体装置の製造方法 |
JP4944228B2 (ja) * | 2009-09-16 | 2012-05-30 | 株式会社日立国際電気 | 基板処理方法及び基板処理装置 |
JP2011066219A (ja) * | 2009-09-17 | 2011-03-31 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及び基板処理装置 |
JP5647502B2 (ja) * | 2010-02-23 | 2014-12-24 | 株式会社日立国際電気 | 熱処理装置、半導体装置の製造方法及び基板処理方法。 |
US8409352B2 (en) * | 2010-03-01 | 2013-04-02 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus |
JP5529634B2 (ja) * | 2010-06-10 | 2014-06-25 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び基板の製造方法 |
JP1548462S (zh) * | 2015-09-04 | 2016-04-25 |
-
2016
- 2016-10-14 JP JPD2016-22415F patent/JP1582475S/ja active Active
-
2017
- 2017-03-13 US US29/596,960 patent/USD825502S1/en active Active
- 2017-03-13 TW TW106301241F patent/TWD187000S/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD860420S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
USD860419S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
USD825502S1 (en) | 2018-08-14 |
TWD187000S (zh) | 2017-12-01 |