ITUD20040034A1 - Scheda di espansione multistrato per apparecchiatura elettronica e relativo - Google Patents

Scheda di espansione multistrato per apparecchiatura elettronica e relativo

Info

Publication number
ITUD20040034A1
ITUD20040034A1 IT000034A ITUD20040034A ITUD20040034A1 IT UD20040034 A1 ITUD20040034 A1 IT UD20040034A1 IT 000034 A IT000034 A IT 000034A IT UD20040034 A ITUD20040034 A IT UD20040034A IT UD20040034 A1 ITUD20040034 A1 IT UD20040034A1
Authority
IT
Italy
Prior art keywords
electronic
card
expansion board
related equipment
multilayer expansion
Prior art date
Application number
IT000034A
Other languages
English (en)
Inventor
Mauro Rossi
Original Assignee
Eurotech Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eurotech Spa filed Critical Eurotech Spa
Priority to IT000034A priority Critical patent/ITUD20040034A1/it
Publication of ITUD20040034A1 publication Critical patent/ITUD20040034A1/it
Priority to US11/060,360 priority patent/US7344085B2/en
Priority to EP05101438A priority patent/EP1569501B1/en
Priority to AT05101438T priority patent/ATE535137T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
IT000034A 2004-02-27 2004-02-27 Scheda di espansione multistrato per apparecchiatura elettronica e relativo ITUD20040034A1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT000034A ITUD20040034A1 (it) 2004-02-27 2004-02-27 Scheda di espansione multistrato per apparecchiatura elettronica e relativo
US11/060,360 US7344085B2 (en) 2004-02-27 2005-02-18 Multilayer expansion card for electronic apparatus and relative production method
EP05101438A EP1569501B1 (en) 2004-02-27 2005-02-25 Multilayer expansion card for electronic apparatus and relative production method
AT05101438T ATE535137T1 (de) 2004-02-27 2005-02-25 Mehrschichtige erweiterungskarte für elektronische vorrichtung und entsprechendes herstellungsverfahren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000034A ITUD20040034A1 (it) 2004-02-27 2004-02-27 Scheda di espansione multistrato per apparecchiatura elettronica e relativo

Publications (1)

Publication Number Publication Date
ITUD20040034A1 true ITUD20040034A1 (it) 2004-05-27

Family

ID=34746755

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000034A ITUD20040034A1 (it) 2004-02-27 2004-02-27 Scheda di espansione multistrato per apparecchiatura elettronica e relativo

Country Status (4)

Country Link
US (1) US7344085B2 (it)
EP (1) EP1569501B1 (it)
AT (1) ATE535137T1 (it)
IT (1) ITUD20040034A1 (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009224564A (ja) * 2008-03-17 2009-10-01 Panasonic Corp 配線基板とそれを用いた電子機器とそれらの誤接続検出装置
TW201217979A (en) * 2010-10-18 2012-05-01 Sunix Co Ltd employing single PCI slot on computer motherboard to be expanded with multiple PCI devices
TW201217978A (en) * 2010-10-18 2012-05-01 Sunix Co Ltd providing expansion of multiple PCI devices with only one PCI interface without replacement or upgrade of computer hardware and operating system
CN101976100B (zh) * 2010-11-08 2013-05-22 昆山五昌新精密电子工业有限公司 相容于pci介面的非同步扩充***
CN203072250U (zh) * 2012-12-20 2013-07-17 奥特斯(中国)有限公司 用于生产印制电路板的半成品及印制电路板
EP3075006A1 (de) 2013-11-27 2016-10-05 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenstruktur
AT515101B1 (de) 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
AT515447B1 (de) 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
US20200029434A1 (en) * 2018-07-23 2020-01-23 Quanta Computer Inc. Ladder type pcb for high layer count golden finger card design

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1419772A (fr) 1964-10-19 1965-12-03 Cie Des Produits Elementaires Procédé permettant la réalisation de contacts électriques sur des agencements deplaquettes isolantes porteuses de réseaux de conducteurs métalliques
JPS5856497A (ja) 1981-09-30 1983-04-04 富士通株式会社 多層プリント基板の端子形成方法
US4740414A (en) * 1986-11-17 1988-04-26 Rockwell International Corporation Ceramic/organic multilayer interconnection board
US5156552A (en) * 1990-02-23 1992-10-20 General Electric Company Circuit board edge connector
JPH0574526A (ja) 1991-09-13 1993-03-26 Nec Niigata Ltd プリント基板とコネクタおよびその接続方法
JPH0837381A (ja) 1994-07-21 1996-02-06 Hitachi Chem Co Ltd 端子付多層配線板の製造法
US5865631A (en) * 1997-04-10 1999-02-02 International Business Machines Corporation Method for reducing shorts on a printed circuit board edge connector
KR100355223B1 (ko) * 1999-01-07 2002-10-09 삼성전자 주식회사 멀티 인라인 메모리 모듈 및 그와 결합되는 전자 부품 소켓
US6479765B2 (en) 2000-06-26 2002-11-12 Robinson Nugent, Inc. Vialess printed circuit board
US6674644B2 (en) 2001-11-01 2004-01-06 Sun Microsystems, Inc. Module and connector having multiple contact rows
US6671181B2 (en) * 2001-12-06 2003-12-30 Hewlett-Packard Development Company, L.P. Latch for securing PCI card to a computer chassis
US6908038B1 (en) * 2004-02-27 2005-06-21 Imotion Corp. Multi-connector memory card with retractable sheath to protect the connectors

Also Published As

Publication number Publication date
US20050190537A1 (en) 2005-09-01
EP1569501A1 (en) 2005-08-31
EP1569501B1 (en) 2011-11-23
ATE535137T1 (de) 2011-12-15
US7344085B2 (en) 2008-03-18

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