ITUD20040034A1 - Scheda di espansione multistrato per apparecchiatura elettronica e relativo - Google Patents
Scheda di espansione multistrato per apparecchiatura elettronica e relativoInfo
- Publication number
- ITUD20040034A1 ITUD20040034A1 IT000034A ITUD20040034A ITUD20040034A1 IT UD20040034 A1 ITUD20040034 A1 IT UD20040034A1 IT 000034 A IT000034 A IT 000034A IT UD20040034 A ITUD20040034 A IT UD20040034A IT UD20040034 A1 ITUD20040034 A1 IT UD20040034A1
- Authority
- IT
- Italy
- Prior art keywords
- electronic
- card
- expansion board
- related equipment
- multilayer expansion
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
- Combinations Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000034A ITUD20040034A1 (it) | 2004-02-27 | 2004-02-27 | Scheda di espansione multistrato per apparecchiatura elettronica e relativo |
US11/060,360 US7344085B2 (en) | 2004-02-27 | 2005-02-18 | Multilayer expansion card for electronic apparatus and relative production method |
EP05101438A EP1569501B1 (en) | 2004-02-27 | 2005-02-25 | Multilayer expansion card for electronic apparatus and relative production method |
AT05101438T ATE535137T1 (de) | 2004-02-27 | 2005-02-25 | Mehrschichtige erweiterungskarte für elektronische vorrichtung und entsprechendes herstellungsverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000034A ITUD20040034A1 (it) | 2004-02-27 | 2004-02-27 | Scheda di espansione multistrato per apparecchiatura elettronica e relativo |
Publications (1)
Publication Number | Publication Date |
---|---|
ITUD20040034A1 true ITUD20040034A1 (it) | 2004-05-27 |
Family
ID=34746755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000034A ITUD20040034A1 (it) | 2004-02-27 | 2004-02-27 | Scheda di espansione multistrato per apparecchiatura elettronica e relativo |
Country Status (4)
Country | Link |
---|---|
US (1) | US7344085B2 (it) |
EP (1) | EP1569501B1 (it) |
AT (1) | ATE535137T1 (it) |
IT (1) | ITUD20040034A1 (it) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009224564A (ja) * | 2008-03-17 | 2009-10-01 | Panasonic Corp | 配線基板とそれを用いた電子機器とそれらの誤接続検出装置 |
TW201217979A (en) * | 2010-10-18 | 2012-05-01 | Sunix Co Ltd | employing single PCI slot on computer motherboard to be expanded with multiple PCI devices |
TW201217978A (en) * | 2010-10-18 | 2012-05-01 | Sunix Co Ltd | providing expansion of multiple PCI devices with only one PCI interface without replacement or upgrade of computer hardware and operating system |
CN101976100B (zh) * | 2010-11-08 | 2013-05-22 | 昆山五昌新精密电子工业有限公司 | 相容于pci介面的非同步扩充*** |
CN203072250U (zh) * | 2012-12-20 | 2013-07-17 | 奥特斯(中国)有限公司 | 用于生产印制电路板的半成品及印制电路板 |
EP3075006A1 (de) | 2013-11-27 | 2016-10-05 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Leiterplattenstruktur |
AT515101B1 (de) | 2013-12-12 | 2015-06-15 | Austria Tech & System Tech | Verfahren zum Einbetten einer Komponente in eine Leiterplatte |
AT515447B1 (de) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte |
US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
US20200029434A1 (en) * | 2018-07-23 | 2020-01-23 | Quanta Computer Inc. | Ladder type pcb for high layer count golden finger card design |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1419772A (fr) | 1964-10-19 | 1965-12-03 | Cie Des Produits Elementaires | Procédé permettant la réalisation de contacts électriques sur des agencements deplaquettes isolantes porteuses de réseaux de conducteurs métalliques |
JPS5856497A (ja) | 1981-09-30 | 1983-04-04 | 富士通株式会社 | 多層プリント基板の端子形成方法 |
US4740414A (en) * | 1986-11-17 | 1988-04-26 | Rockwell International Corporation | Ceramic/organic multilayer interconnection board |
US5156552A (en) * | 1990-02-23 | 1992-10-20 | General Electric Company | Circuit board edge connector |
JPH0574526A (ja) | 1991-09-13 | 1993-03-26 | Nec Niigata Ltd | プリント基板とコネクタおよびその接続方法 |
JPH0837381A (ja) | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | 端子付多層配線板の製造法 |
US5865631A (en) * | 1997-04-10 | 1999-02-02 | International Business Machines Corporation | Method for reducing shorts on a printed circuit board edge connector |
KR100355223B1 (ko) * | 1999-01-07 | 2002-10-09 | 삼성전자 주식회사 | 멀티 인라인 메모리 모듈 및 그와 결합되는 전자 부품 소켓 |
US6479765B2 (en) | 2000-06-26 | 2002-11-12 | Robinson Nugent, Inc. | Vialess printed circuit board |
US6674644B2 (en) | 2001-11-01 | 2004-01-06 | Sun Microsystems, Inc. | Module and connector having multiple contact rows |
US6671181B2 (en) * | 2001-12-06 | 2003-12-30 | Hewlett-Packard Development Company, L.P. | Latch for securing PCI card to a computer chassis |
US6908038B1 (en) * | 2004-02-27 | 2005-06-21 | Imotion Corp. | Multi-connector memory card with retractable sheath to protect the connectors |
-
2004
- 2004-02-27 IT IT000034A patent/ITUD20040034A1/it unknown
-
2005
- 2005-02-18 US US11/060,360 patent/US7344085B2/en active Active
- 2005-02-25 EP EP05101438A patent/EP1569501B1/en active Active
- 2005-02-25 AT AT05101438T patent/ATE535137T1/de active
Also Published As
Publication number | Publication date |
---|---|
US20050190537A1 (en) | 2005-09-01 |
EP1569501A1 (en) | 2005-08-31 |
EP1569501B1 (en) | 2011-11-23 |
ATE535137T1 (de) | 2011-12-15 |
US7344085B2 (en) | 2008-03-18 |
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