ITMI970955A1 - PROCEDURE FOR PREPARING A HYDROPHOBIC PLATE - Google Patents
PROCEDURE FOR PREPARING A HYDROPHOBIC PLATE Download PDFInfo
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- ITMI970955A1 ITMI970955A1 IT97MI000955A ITMI970955A ITMI970955A1 IT MI970955 A1 ITMI970955 A1 IT MI970955A1 IT 97MI000955 A IT97MI000955 A IT 97MI000955A IT MI970955 A ITMI970955 A IT MI970955A IT MI970955 A1 ITMI970955 A1 IT MI970955A1
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- Prior art keywords
- hydrophobic
- plate
- preparing
- molded product
- fluorine
- Prior art date
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- 230000002209 hydrophobic effect Effects 0.000 title claims description 71
- 238000000034 method Methods 0.000 title claims description 22
- 239000011347 resin Substances 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 39
- 239000006185 dispersion Substances 0.000 claims description 26
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 21
- 229910052731 fluorine Inorganic materials 0.000 claims description 21
- 239000011737 fluorine Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 238000003490 calendering Methods 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 8
- 238000005507 spraying Methods 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RXXLFGUETWRYHY-UHFFFAOYSA-N 2-(butanoylamino)-3-[6-[(4-carbamimidoylphenyl)methoxy]naphthalen-2-yl]propanoic acid Chemical compound C(CCC)(=O)NC(C(=O)O)CC1=CC2=CC=C(C=C2C=C1)OCC1=CC=C(C=C1)C(N)=N RXXLFGUETWRYHY-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000878 H alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910018095 Ni-MH Inorganic materials 0.000 description 1
- 229910018477 Ni—MH Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/52—Removing gases inside the secondary cell, e.g. by absorption
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/24—Electrodes for alkaline accumulators
- H01M4/26—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/24—Electrodes for alkaline accumulators
- H01M4/32—Nickel oxide or hydroxide electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/34—Gastight accumulators
- H01M10/345—Gastight metal hydride accumulators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Cell Separators (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Fuel Cell (AREA)
Description
D E S C R I Z I O N E DESCRIPTION
annessa a domanda di brevetto per INVENZIONE INDUSTRIALE dal titolo : attached to a patent application for INDUSTRIAL INVENTION entitled:
"PROCEDIMENTO PER PREPARARE UNA PIASTRA IDROFOBA" "PROCEDURE FOR PREPARING A HYDROPHOBA PLATE"
D E S C R I Z I O N E DESCRIPTION
La presente invenzione si riferisce a un procedimento per preparare una piastra idrofoba e, in particolare, a un procedimento per preparare facilmente una piastra idrofoba avente buone proprietà idrofobe immergendo una piastra in una soluzione a dispersione. The present invention relates to a process for preparing a hydrophobic plate and, in particular, to a process for easily preparing a hydrophobic plate having good hydrophobic properties by immersing a plate in a dispersion solution.
In generale, una cella a nichel-idrogeno sigillata, che costituisce una batteria di accumulatori alcalina, usa ossido di metallo come anodo e lega idrogenata come catodo. Questa cella viene caricata o scaricata depositando gli ioni idrogeno della lega idrogenata prodotti per dissociazione di acqua nell’elettrolito durante il processo di carica, e rilasciando ioni idrogeno nell’elettrolito durante il processo di scarica . In general, a sealed nickel-hydrogen cell, which constitutes an alkaline storage battery, uses metal oxide as the anode and hydrogen alloy as the cathode. This cell is charged or discharged by depositing the hydrogen ions of the hydrogenated alloy produced by dissociation of water in the electrolyte during the charging process, and by releasing hydrogen ions in the electrolyte during the discharge process.
la cella al nichel-idr ogeno usa una lega idrogenata come materiale attivo negativo, Ni(OH)2 come materiale attivo positivo e una soluzione acquosa alcalina come elettrolito. Quando la cella al nichel-idrogeno è rappresentata dalla formula generale Ni-MH (nichelidruro metallico) , le reazioni elettrochimiche delle celle al nichel-idrogeno sono le seguenti: the nickel-hydrogen cell uses a hydrogenated alloy as the negative active material, Ni (OH) 2 as the positive active material and an aqueous alkaline solution as the electrolyte. When the nickel-hydrogen cell is represented by the general formula Ni-MH (metal nickel hydrogen), the electrochemical reactions of the nickel-hydrogen cells are as follows:
Anodo : Ni (OH) 2 OH NIOOH H2O (1) Anode: Ni (OH) 2 OH NIOOH H2O (1)
Catodo : M H2O <-> MH OH (2 ) Cathode: M H2O <-> MH OH (2)
Nelle suddette reazioni, M è una lega idrogenata che può assorbire ed emettere ioni idrogeno. In the above reactions, M is a hydrogenated alloy which can absorb and emit hydrogen ions.
Una carica e una scarica vengono effettuate secondo la suddetta reazione e gas d'ossigeno viene generato elettrochimicamente nell'anodo durante la carica e la scarica. Quando i cicli di carica e di scarica vengono effettuati in continuazione, il gas d'ossigeno generato causa l'ossidazione del catodo e l'aumento della pressione interna di una cella, diminuendo così la capacità della cella stessa. Di conseguenza, allo scopo di rimuovere il gas trasferendo il gas generato nell’anodo al catodo, la proprietà idrofoba permette al catodo di estendere la sua interfaccia in cui si sono verificati dissociazione o assorbimento del gas. A charge and discharge are carried out according to the above reaction and oxygen gas is electrochemically generated in the anode during charging and discharging. When the charging and discharging cycles are carried out continuously, the oxygen gas generated causes oxidation of the cathode and an increase in the internal pressure of a cell, thus decreasing the capacity of the cell itself. Consequently, in order to remove the gas by transferring the gas generated in the anode to the cathode, the hydrophobic property allows the cathode to extend its interface where dissociation or absorption of the gas has occurred.
La figura 2a mostra una piastra negativa 1 placcata con polvere di resina a base di fluoro come materiale idrofobo, spruzzando la piastra 7 mentre si muove nella direzione della freccia 11. La figura 2b mostra una piastra negativa 7 placcata con una polvere di resina a base di fluoro come materiale idrofobo spruzzando la piastra ferma 7 mentre lo spruzzatore 9 si muove nella direzione della freccia 13. Come mezzo di spruzzo è stato usato alcool, che può essere velocemente vaporizzato dopo spruzzatura, e non è stata usata acqua poiché essa impiega molto tempo a vaporizzare, provocando l’ossidazione della piastra. Figure 2a shows a negative plate 1 plated with fluorine-based resin powder as the hydrophobic material, spraying the plate 7 as it moves in the direction of arrow 11. Figure 2b shows a negative plate 7 plated with a resin-based powder of fluorine as the hydrophobic material by spraying the stationary plate 7 while the sprayer 9 moves in the direction of arrow 13. Alcohol, which can be quickly vaporized after spraying, was used as the spray medium, and no water was used as it takes a long time to vaporize, causing oxidation of the plate.
Come sopra descritto, quando polvere di resina a base di fluoro viene spruzzata sulla piastra, si forma un materiale trifase (vapore-liquido-solido) sulla sua superficie, quindi il gas aderisce velocemente alla piastra stessa. Pertanto, il gas viene assorbito o decomposto sulla piastra e quindi la pressione interna viene diminuita. Gli svantaggi del metodo a spruzzo, tuttavia, consistono nel fatto che è difficile rivestire uniformemente la piastra con la resina a base di fluoro, e l’alcool usato come mezzo viene vaporizzato, quindi è pericoloso per l’uomo ed è estremamente infiammabile. Inoltre, il metodo a spruzzo presenta problemi quando il foro dello spruzzatore si ostruisce con la resina della soluzione di spruzzatura, in tal modo diminuendo l’efficienza operativa. As described above, when fluorine-based resin powder is sprayed onto the plate, a three-phase material (vapor-liquid-solid) forms on its surface, so the gas quickly adheres to the plate. Thus, the gas is absorbed or decomposed on the plate and thus the internal pressure is decreased. The disadvantages of the spray method, however, consist in the fact that it is difficult to uniformly coat the plate with the fluorine-based resin, and the alcohol used as a medium is vaporized, so it is dangerous for humans and is extremely flammable. Furthermore, the spray method presents problems when the hole of the sprayer becomes clogged with the resin of the spray solution, thus decreasing the operating efficiency.
Allo scopo di risolvere i suddetti problemi del procedimento convenzionale, un obiettivo della presente invenzione è di fornire un procedimento per preparare piastre idrofobe non pericoloso per, l'uomo, che non ponga problemi di infiammabilità .e che presenti un’elevata 'efficienza operativa. In order to solve the aforementioned problems of the conventional process, an objective of the present invention is to provide a process for preparing hydrophobic plates that are not dangerous for humans, which does not pose flammability problems and which has a high operating efficiency.
Un obiettivo secondario della presente .invenzione è di fornire piastre idrofobe da usarsi in una cella a cui conferiscono bassa pressione interna e lunga durata. Studiando una piastra idrofoba per una cella allo scopo di risolvere i summenzionati problemi, i presenti inventori hanno scoperto che può essere facilmente preparata una piastra avente buone proprietà idrofobe rivestendo -con una soluzione a dispersione costituita da resina -idrofoba. Convenzionalmente, una persona normalmente esperta nella tecnica riteneva che quando veniva usata una dispersione idrofoba, era difficile preparare una piastra idrofoba e si otteneva una piastra con cattive proprietà idrofobe a causa dell’agente idrofilo aggiunto per facilitare la dispersione, cioè l’agente interfacciale attivo. Pertanto, nel procedimento convenzionale veniva usato un procedimento di spruzzatura di polvere di una resina idrofoba sulla piastra. Secondo la presente invenzione , invece, la piastra può essere facilmente rivestita- con resina idrofoba quando viene preparata immergendola' nella soluzione idrofoba a dispersione. Inoltre, una cella preparata usando.la piastra ha buone proprietà idrofobe, se confrontata con una cella che usa una piastra preparata con il metodo a spruzzo. La pressione interna di una cella viene pertanto diminuita, in tal modo prevenendo la mancanza di elettrolito in una cella. Inoltre, un elettrolito viene uniformemente distribuito, quindi può essere preparata una cella di lunga durata. A secondary object of the present invention is to provide hydrophobic plates for use in a cell to which they impart low internal pressure and long life. By studying a hydrophobic plate for a cell in order to solve the aforementioned problems, the present inventors have discovered that a plate having good hydrophobic properties can be readily prepared by coating with a dispersion solution consisting of a hydrophobic resin. Conventionally, a person normally skilled in the art believed that when a hydrophobic dispersion was used, it was difficult to prepare a hydrophobic plate and a plate with poor hydrophobic properties was obtained due to the hydrophilic agent added to facilitate dispersion, i.e. the active interfacial agent. . Therefore, a method of spraying powder of a hydrophobic resin onto the plate was used in the conventional process. According to the present invention, however, the plate can be easily coated with hydrophobic resin when it is prepared by immersing it in the hydrophobic dispersion solution. Furthermore, a cell prepared using the plate has good hydrophobic properties, when compared to a cell using a plate prepared by the spray method. The internal pressure of a cell is therefore decreased, thereby preventing the lack of electrolyte in a cell. In addition, an electrolyte is evenly distributed, so a long-life cell can be prepared.
Per conseguire l’obiettivo, la presente invenzione fornisce un- procedimento per preparare- una piastra idrofoba comprendente le fasi di rivestire una piastra con una soluzione a dispersione che comporta resina idrofoba, ed essiccando detta piastra -rivestita. To achieve the objective, the present invention provides a process for preparing a hydrophobic plate comprising the steps of coating a plate with a dispersion solution involving hydrophobic resin, and drying said coated plate.
Nella presente invenzione, la resina idrofoba preferita è una soluzione acquosa comprendente resina a base di fluoro, cioè il 3 - 10% in peso di un copolimero di tetrafluoroetilene ed esafluor opropilene, e/o politetrafluoroetilene. In the present invention, the preferred hydrophobic resin is an aqueous solution comprising fluorine-based resin, i.e. 3-10% by weight of a copolymer of tetrafluoroethylene and hexafluoropropylene, and / or polytetrafluoroethylene.
Quando: viene usata una dispersione con meno del 3% di resina a base di fluoro come soluzione a dispersione comprendente dispersione di resina" idrofoba, non può essere prodotta una piastra con sufficiente proprietà idrofoba. Quando invece viene usata uria dispersione con oltre il 10% in peso di resina a base di fluoro come soluzione a dispersione comprendente resina idrofoba, la proprietà idrofoba del catodo aumenta. Pertanto, non è preferibile produrre una cella usando una piastra avente eccessiva proprietà idrofoba poiché viene diminuito il grado di permeazione di un elettrolito. Nella presente invenzione, inoltre, la fase di rivestimento viene effettuata immergendo la piastra nella dispersione di resina idrofoba, ai preferisce che la fase di ·rivestimento venga messa in atto per 1 secondo - 5 minuti, allo scopo di ottenere 0,2 - 3,0 mg/cm2 di resina idrofoba sulla piastra. When: a dispersion with less than 3% fluorine-based resin is used as a dispersion solution comprising a "hydrophobic" resin dispersion, a plate with sufficient hydrophobic properties cannot be produced. When a dispersion with more than 10% is used instead by weight of fluorine-based resin as a dispersion solution comprising hydrophobic resin, the hydrophobic property of the cathode is increased. Therefore, it is not preferable to produce a cell using a plate having excessive hydrophobic property since the degree of permeation of an electrolyte is decreased. the present invention, moreover, the coating step is carried out by immersing the plate in the dispersion of hydrophobic resin, preferably that the coating step is carried out for 1 second - 5 minutes, in order to obtain 0.2 - 3.0 mg / cm2 of hydrophobic resin on the plate.
Il procedimento della presente invenzione, comprende preferibilmente la fase di calandratura dopo la fase di essiccazione per ottenere una piastra con spessore uniforme. The process of the present invention preferably comprises the calendering step after the drying step to obtain a plate with uniform thickness.
Inoltre, il procedimento della presente invenzione può essere applicato in generale a prodotti stampati, oltre che ad una piastra di una cella allo scopo di ottenere buone proprietà idrofobe. Furthermore, the process of the present invention can be applied in general to printed products, as well as to a plate of a cell in order to obtain good hydrophobic properties.
Nei disegni: In the drawings:
- La figura 1(a) è un disegno in scala che mostra una fase di rivestimento per immersione di una piastra in una soluzione acquosa comprendente resina a base di fluoro per conferire una buona proprietà idrofoba a una piastra secondo una forma di realizzazione della presente invenzione; Figure 1 (a) is a scale drawing showing a step of dipping a plate in an aqueous solution comprising fluorine-based resin to impart a good hydrophobic property to a plate according to an embodiment of the present invention ;
- la figura 1(b) è un disegno in scala che mostra una fase di rivestimento continuo per immersione di una piastra curvata in una soluzione acquosa, comprendente resina a base di fluoro, per conferire una buona proprietà idrofoba a una piastra secondo un'altra forma di realizzazione della presente invenzione; - figure 1 (b) is a scale drawing showing a step of continuous coating by immersion of a curved plate in an aqueous solution, comprising fluorine-based resin, to impart a good hydrophobic property to a plate according to another embodiment of the present invention;
- la figura 2(a) è un disegno in scala che mostra una fase di spruzzatura di una soluzione acquosa, comprendente resina a base di fluoro, sulla piastra in movimento per conferire una buona proprietà idrofoba, secondo il procedimento convenzionale; e Figure 2 (a) is a scale drawing showing a step of spraying an aqueous solution, comprising fluorine-based resin, on the moving plate to impart a good hydrophobic property, according to the conventional process; And
- la figura 2 (b) è un disegno in scala che mostra una fase di spruzzatura di una soluzione acquosa, comprendente resina a base di fluoro, su una piastra con uno spruzzatore in movimento, secondo il procedimento convenzionale. Figure 2 (b) is a scale drawing showing a step of spraying an aqueous solution, comprising fluorine-based resin, on a plate with a moving sprayer, according to the conventional process.
La presente invenzione viene illustrata in maggior dettaglio con riferimento ai seguenti esempi che riguardano l'ambito della stessa. The present invention is illustrated in greater detail with reference to the following examples which concern the scope thereof.
Esempio 1 Example 1
Un catodo di una cella al nichel-idrogeno è stato immerso in un copolimero al 5% in peso di tetraf luoroetilene ed esafluoropropilene, ND-1 (1, Dikyn Co. Ltd., Giappone) per 5 secondi come mostrato in figura 1(a), ed essiccato in un forno a 60°C. Lo spessore della piastra essiccata viene controllato mediante calandratura a rullo per preparare una piastra idrofoba. A cathode of a nickel-hydrogen cell was immersed in a 5 wt% copolymer of tetrafluoroethylene and hexafluoropropylene, ND-1 (1, Dikyn Co. Ltd., Japan) for 5 seconds as shown in figure 1 (a ), and dried in an oven at 60 ° C. The thickness of the dried plate is controlled by roll calendering to prepare a hydrophobic plate.
Esempio 2 Example 2
E’ stata preparata una piastra idrofoba con la stessa procedura dell’esempio 1, eccetto che è stata usata una soluzione a dispersione comprendente politetraflu'oroetilene, LDW-40 (1, Takedayakuhing Co., Ltd., Giappone) come soluzione a dispersione comprendente resina a base di fluoro, al posto di ND-1, e la piastra curvata 5 è stata immersa continuamente nella dispersione, come mostrato in figura 1(b). A hydrophobic plate was prepared with the same procedure as in Example 1, except that a dispersion solution comprising polytetrafluoroethylene, LDW-40 (1, Takedayakuhing Co., Ltd., Japan) was used as a dispersion solution comprising fluorine-based resin, in place of ND-1, and the curved plate 5 was continuously dipped into the dispersion, as shown in Figure 1 (b).
Esempio comparativo 1 Comparative example 1
Polvere di resina a base di fluoro è stata spruzzata su una piastra mentre la piastra 7 si muoveva, 11, come mostrato in figura 2(a), per preparare una piastra idrofoba. Fluorine-based resin powder was sprayed onto a plate as plate 7 moved, 11, as shown in Figure 2 (a), to prepare a hydrophobic plate.
Esempio comparativo 2 Comparative example 2
Polvere di resina a base di fluoro è stata spruzzata su una piastra mentre uno spruzzatore 9 si muoveva, 13, come mostrato in figura 2(b), per preparare una piastra idrofoba. Fluorine-based resin powder was sprayed onto a plate as a sprayer 9 moved, 13, as shown in Figure 2 (b), to prepare a hydrophobic plate.
Dopo che le celle erano state preparate con l’uso della piastra idrofoba ottenuta secondo gli esempi e gli esempi comparativi di cui sopra, le celle sono state caricate e scaricate per 100 volte, è stata determinata la loro pressione interna e la vita media (1CY. livello 90% della capacità totale) e i risultati sono riportati nella tabella 1 che segue. After the cells had been prepared with the use of the hydrophobic plate obtained according to the above examples and comparative examples, the cells were charged and discharged 100 times, their internal pressure and mean life (1CY . level 90% of total capacity) and the results are shown in Table 1 below.
Convenzionalmente, una persona normalmente esperta nella tecnica. riteneva che quando veniva usata dispersione idrofoba, era difficile preparare una piastra idrofoba e che si otteneva una piastra con cattive proprietà idrofobe a causa dell’aggiunta dell’agente idrofilo per facilitare la dispersione, cioè un agente attivo interfacciale. Pertanto nel procedimento convenzionale veniva spruzzata una polvere di resina idrofoba sulla piastra. Conventionally, a person normally skilled in the art. he believed that when hydrophobic dispersion was used, it was difficult to prepare a hydrophobic plate and that a plate with bad hydrophobic properties was obtained due to the addition of the hydrophilic agent to facilitate dispersion, that is, an interfacial active agent. Therefore in the conventional process a hydrophobic resin powder was sprayed onto the plate.
Secondo la presente invenzione, invece, la piastra può essere facilmente rivestita con resina idrofoba per preparare una piastra idrofoba immergendo la piastra stessa in una soluzione a dispersione idrofoba. Inoltre, una cella preparata usando la piastra ha buone proprietà idrofobe rispetto a una cella che usa una piastra preparata con un metodo a spruzzo. Pertanto, viene diminuita la pressione interna di una cella, ovviando quindi alla carenza di elettrolito nella cella stessa. Elettrolito viene inoltre uniformemente distribuito e viene pertanto preparata una cella di lunga durata. According to the present invention, however, the plate can be easily coated with hydrophobic resin to prepare a hydrophobic plate by immersing the plate itself in a hydrophobic dispersion solution. Furthermore, a cell prepared using the plate has good hydrophobic properties compared to a cell using a plate prepared by a spray method. Therefore, the internal pressure of a cell is decreased, thus obviating the lack of electrolyte in the cell itself. Electrolyte is also evenly distributed and thus a long-lasting cell is prepared.
Come mostrato nella tabella 1 che precede, il procedimento di rivestimento con soluzione a dispersione della presente invenzione può essere messo in pratica facilmente rispetto al procedimento di spruzzatura di polvere. Inoltre, non viene dispersa polvere, permettendo una facile preparazione della piastra idrofoba, e la quantità della resina a base di fluoro che riveste la piastra viene facilmente controllata controllando la concentrazione della soluzione acquosa a dispersione. As shown in Table 1 above, the dispersion solution coating process of the present invention can be practiced easily as compared to the powder spraying process. Furthermore, no powder is dispersed, allowing easy preparation of the hydrophobic plate, and the amount of the fluorine-based resin coating the plate is easily controlled by controlling the concentration of the aqueous dispersion solution.
Il procedimento di preparazione della piastra idrofoba della presente invenzione può essere applicato alla preparazione di piastre in vari campi, come un condensatore, oltre a una cella, allo scopo di ottenere una piastra con l’obiettivo di aumentare l’area di contatto di un gas. The process of preparing the hydrophobic plate of the present invention can be applied to the preparation of plates in various fields, such as a capacitor, as well as a cell, in order to obtain a plate with the aim of increasing the contact area of a gas .
Il procedimento della presente invenzione è inoltre utile per conferire proprietà idrofobe ad alcuni oggetti . The process of the present invention is also useful for imparting hydrophobic properties to some objects.
Claims (16)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960019135A KR0172229B1 (en) | 1996-05-31 | 1996-05-31 | Method of manufacturing hydrophobic plate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITMI970955A0 ITMI970955A0 (en) | 1997-04-24 |
| ITMI970955A1 true ITMI970955A1 (en) | 1998-10-24 |
| IT1291648B1 IT1291648B1 (en) | 1999-01-19 |
Family
ID=19460386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT97MI000955A IT1291648B1 (en) | 1996-05-31 | 1997-04-24 | PROCEDURE FOR PREPARING A HYDROPHOBIC PLATE |
Country Status (11)
| Country | Link |
|---|---|
| JP (1) | JPH1040905A (en) |
| KR (1) | KR0172229B1 (en) |
| CN (1) | CN1170247A (en) |
| DE (1) | DE19716704A1 (en) |
| ES (1) | ES2125832B1 (en) |
| FR (1) | FR2749195A1 (en) |
| GB (1) | GB2313561A (en) |
| IT (1) | IT1291648B1 (en) |
| NL (1) | NL1006184C2 (en) |
| SE (1) | SE9701907L (en) |
| SG (1) | SG71706A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1085896C (en) * | 1997-12-19 | 2002-05-29 | 王纪三 | Electrode of charging battery and method and equipment for making electrode |
| US9023556B2 (en) | 2006-03-17 | 2015-05-05 | GM Global Technology Operations LLC | Method of preparing gas diffusion media for a fuel cell |
| JP5975307B2 (en) * | 2012-11-28 | 2016-08-23 | パナソニックＩｐマネジメント株式会社 | Nickel metal hydride storage battery and battery pack |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5214749B2 (en) * | 1972-12-22 | 1977-04-23 | ||
| JPS5112643A (en) * | 1974-07-19 | 1976-01-31 | Matsushita Electric Ind Co Ltd | Denchokyokubanno seizoho |
| JPS5372139A (en) * | 1976-12-09 | 1978-06-27 | Matsushita Electric Ind Co Ltd | Method of manufacturing positive electrode plate for alkaline storage battery |
| WO1982003802A1 (en) * | 1981-04-28 | 1982-11-11 | Shamrock Corp Diamond | Method of depositing cation exchange membrane on a foraminous cathode |
| FR2513906A1 (en) * | 1981-10-06 | 1983-04-08 | Morin Joel | Coating metal surface with antistick or anti:lubricating compsn. - comprising mixt. of PTFE and thermoplastic fluorinated resin |
| US4503099A (en) * | 1983-06-15 | 1985-03-05 | Borg-Warner Corporation | Heat transfer surfaces having scale resistant polymer coatings thereon |
| JPH01143141A (en) * | 1987-11-27 | 1989-06-05 | Shin Kobe Electric Mach Co Ltd | Manufacture of electrode |
| US5034289A (en) * | 1989-02-23 | 1991-07-23 | Matsushita Electric Industrial Co., Ltd. | Alkaline storage battery and method of producing negative electrode thereof |
| JPH02227966A (en) * | 1989-02-28 | 1990-09-11 | Matsushita Electric Ind Co Ltd | Sealed alkaline storage battery and manufacture of its negative electrode |
| JP2918560B2 (en) * | 1989-03-09 | 1999-07-12 | 古河電池株式会社 | Manufacturing method of hydrogen storage electrode |
| US5242765A (en) * | 1992-06-23 | 1993-09-07 | Luz Electric Fuel Israel Limited | Gas diffusion electrodes |
| JPH0660876A (en) * | 1992-08-12 | 1994-03-04 | Nippon Oil Co Ltd | Alkaline storage battery and manufacture thereof |
| JPH0660871A (en) * | 1992-08-07 | 1994-03-04 | Nippon Oil Co Ltd | Zinc negative electrode for alkaline battery and manufacture thereof |
| DE4326944A1 (en) * | 1993-08-11 | 1995-02-16 | Varta Batterie | Negative electrode for gas-tight alkaline batteries, which has a gas-absorbing layer containing soot |
| JPH07240200A (en) * | 1994-02-28 | 1995-09-12 | Fuji Photo Film Co Ltd | Nonaqueous secondary battery |
-
1996
- 1996-05-31 KR KR1019960019135A patent/KR0172229B1/en not_active IP Right Cessation
-
1997
- 1997-04-18 ES ES009700839A patent/ES2125832B1/en not_active Expired - Lifetime
- 1997-04-21 DE DE19716704A patent/DE19716704A1/en not_active Withdrawn
- 1997-04-22 GB GB9708085A patent/GB2313561A/en not_active Withdrawn
- 1997-04-22 SG SG1997001274A patent/SG71706A1/en unknown
- 1997-04-24 IT IT97MI000955A patent/IT1291648B1/en active IP Right Grant
- 1997-04-25 JP JP9107971A patent/JPH1040905A/en active Pending
- 1997-05-15 CN CN97111404A patent/CN1170247A/en active Pending
- 1997-05-20 FR FR9706124A patent/FR2749195A1/en not_active Withdrawn
- 1997-05-22 SE SE9701907A patent/SE9701907L/en not_active Application Discontinuation
- 1997-05-30 NL NL1006184A patent/NL1006184C2/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| NL1006184A1 (en) | 1997-12-03 |
| SG71706A1 (en) | 2000-04-18 |
| ES2125832A1 (en) | 1999-03-01 |
| JPH1040905A (en) | 1998-02-13 |
| IT1291648B1 (en) | 1999-01-19 |
| ITMI970955A0 (en) | 1997-04-24 |
| KR0172229B1 (en) | 1999-03-30 |
| DE19716704A1 (en) | 1997-12-04 |
| CN1170247A (en) | 1998-01-14 |
| SE9701907L (en) | 1997-12-01 |
| ES2125832B1 (en) | 1999-11-16 |
| KR970077787A (en) | 1997-12-12 |
| FR2749195A1 (en) | 1997-12-05 |
| NL1006184C2 (en) | 1999-06-08 |
| SE9701907D0 (en) | 1997-05-22 |
| GB9708085D0 (en) | 1997-06-11 |
| GB2313561A (en) | 1997-12-03 |
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