ITMI912345A0 - Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. - Google Patents
Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.Info
- Publication number
- ITMI912345A0 ITMI912345A0 IT91MI2345A ITMI912345A ITMI912345A0 IT MI912345 A0 ITMI912345 A0 IT MI912345A0 IT 91MI2345 A IT91MI2345 A IT 91MI2345A IT MI912345 A ITMI912345 A IT MI912345A IT MI912345 A0 ITMI912345 A0 IT MI912345A0
- Authority
- IT
- Italy
- Prior art keywords
- creation
- accuracy
- analysis
- procedure
- alignment measurement
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI912345A IT1251393B (it) | 1991-09-04 | 1991-09-04 | Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. |
DE69226234T DE69226234T2 (de) | 1991-09-04 | 1992-08-25 | Verfahren zur Herstellung metrologischen Strukturen besonders geeignet für die Bestimmung der Präzision in Vorrichtungen, die den Abstand auf bearbeiteten Substraten messen |
EP92114465A EP0539686B1 (en) | 1991-09-04 | 1992-08-25 | Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates |
US07/938,826 US5246539A (en) | 1991-09-04 | 1992-09-01 | Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates |
JP4233605A JPH05259152A (ja) | 1991-09-04 | 1992-09-01 | 加工された基板上の整列を測定するための機器の正確さを特に分析するための計測学的構造を製造するための方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI912345A IT1251393B (it) | 1991-09-04 | 1991-09-04 | Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI912345A0 true ITMI912345A0 (it) | 1991-09-04 |
ITMI912345A1 ITMI912345A1 (it) | 1993-03-04 |
IT1251393B IT1251393B (it) | 1995-05-09 |
Family
ID=11360608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI912345A IT1251393B (it) | 1991-09-04 | 1991-09-04 | Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5246539A (it) |
EP (1) | EP0539686B1 (it) |
JP (1) | JPH05259152A (it) |
DE (1) | DE69226234T2 (it) |
IT (1) | IT1251393B (it) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1248534B (it) * | 1991-06-24 | 1995-01-19 | Sgs Thomson Microelectronics | Procedimento per la realizzazione di strutture di calibrazione particolarmente per la taratura di macchine di misura del disallineamento in circuiti integrati in genere. |
IT1252539B (it) * | 1991-12-18 | 1995-06-19 | St Microelectronics Srl | Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento. |
US5952247A (en) * | 1994-11-23 | 1999-09-14 | Intel Corporation | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate |
EP0720216B1 (en) * | 1994-12-29 | 2001-10-17 | AT&T Corp. | Linewidth metrology of integrated circuit structures |
US5904486A (en) * | 1997-09-30 | 1999-05-18 | Intel Corporation | Method for performing a circuit edit through the back side of an integrated circuit die |
KR100234292B1 (ko) * | 1997-10-08 | 1999-12-15 | 윤종용 | 광디스크 제작용 마스터 디스크 제조방법 |
US6274393B1 (en) * | 1998-04-20 | 2001-08-14 | International Business Machines Corporation | Method for measuring submicron images |
US6069089A (en) * | 1998-12-18 | 2000-05-30 | Suh; Hong C. | Defective semiconductor redistribution labeling system |
US6218200B1 (en) * | 2000-07-14 | 2001-04-17 | Motorola, Inc. | Multi-layer registration control for photolithography processes |
US7301638B1 (en) | 2004-01-31 | 2007-11-27 | Kla Tencor, Inc. | Dimensional calibration standards |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59224123A (ja) * | 1983-05-20 | 1984-12-17 | Oki Electric Ind Co Ltd | ウエハアライメントマ−ク |
JPH0669031B2 (ja) * | 1984-07-17 | 1994-08-31 | 日本電気株式会社 | 半導体装置 |
CA1330837C (en) * | 1988-04-13 | 1994-07-19 | Yoichi Fukushima | Method of producing masks for rom type optical recording cards and method of inspecting masks |
IT1227758B (it) * | 1988-12-30 | 1991-05-06 | Sgs Thomson Microelectronics | Struttura di marca di riferimento per guidare l'allineamento tra topografie semilavorate di circuiti integrati a semiconduttore e successive maschere |
JP2897248B2 (ja) * | 1989-04-18 | 1999-05-31 | 富士通株式会社 | 半導体装置の製造方法 |
US5017512A (en) * | 1989-07-27 | 1991-05-21 | Mitsubishi Denki Kabushiki Kaisha | Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same |
US4992394A (en) * | 1989-07-31 | 1991-02-12 | At&T Bell Laboratories | Self aligned registration marks for integrated circuit fabrication |
JPH03139821A (ja) * | 1989-10-25 | 1991-06-14 | Toshiba Corp | 微細パターンの形成方法 |
-
1991
- 1991-09-04 IT ITMI912345A patent/IT1251393B/it active IP Right Grant
-
1992
- 1992-08-25 EP EP92114465A patent/EP0539686B1/en not_active Expired - Lifetime
- 1992-08-25 DE DE69226234T patent/DE69226234T2/de not_active Expired - Fee Related
- 1992-09-01 US US07/938,826 patent/US5246539A/en not_active Expired - Lifetime
- 1992-09-01 JP JP4233605A patent/JPH05259152A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
ITMI912345A1 (it) | 1993-03-04 |
JPH05259152A (ja) | 1993-10-08 |
IT1251393B (it) | 1995-05-09 |
DE69226234T2 (de) | 1999-04-01 |
EP0539686B1 (en) | 1998-07-15 |
DE69226234D1 (de) | 1998-08-20 |
US5246539A (en) | 1993-09-21 |
EP0539686A1 (en) | 1993-05-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970929 |