ITMI20082274A1 - Wafer a semiconduttori con una pluralita' di elementi sensori e procedimento per misurare elementi sensori su un wafer a semiconduttori - Google Patents

Wafer a semiconduttori con una pluralita' di elementi sensori e procedimento per misurare elementi sensori su un wafer a semiconduttori

Info

Publication number
ITMI20082274A1
ITMI20082274A1 IT002274A ITMI20082274A ITMI20082274A1 IT MI20082274 A1 ITMI20082274 A1 IT MI20082274A1 IT 002274 A IT002274 A IT 002274A IT MI20082274 A ITMI20082274 A IT MI20082274A IT MI20082274 A1 ITMI20082274 A1 IT MI20082274A1
Authority
IT
Italy
Prior art keywords
semiconductors
wafer
elements
procedure
measuring sensor
Prior art date
Application number
IT002274A
Other languages
English (en)
Inventor
Hubert Benzel
Harald Guenschel
Roland Guenschel
Ross Holger
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20082274A1 publication Critical patent/ITMI20082274A1/it
Application granted granted Critical
Publication of IT1392482B1 publication Critical patent/IT1392482B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
ITMI2008A002274A 2007-12-27 2008-12-19 Wafer a semiconduttori con una pluralita' di elementi sensori e procedimento per misurare elementi sensori su un wafer a semiconduttori IT1392482B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007062711A DE102007062711A1 (de) 2007-12-27 2007-12-27 Halbleiterwafer mit einer Vielzahl von Sensorelementen und Verfahren zum Vermessen von Sensorelementen auf einem Halbleiterwafer

Publications (2)

Publication Number Publication Date
ITMI20082274A1 true ITMI20082274A1 (it) 2009-06-28
IT1392482B1 IT1392482B1 (it) 2012-03-09

Family

ID=40690746

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2008A002274A IT1392482B1 (it) 2007-12-27 2008-12-19 Wafer a semiconduttori con una pluralita' di elementi sensori e procedimento per misurare elementi sensori su un wafer a semiconduttori

Country Status (3)

Country Link
US (1) US7872487B2 (it)
DE (1) DE102007062711A1 (it)
IT (1) IT1392482B1 (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013102155B4 (de) * 2013-03-05 2015-04-09 Friedrich-Alexander-Universität Erlangen-Nürnberg Verfahren zum testen von bauelementen und messanordnung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4140965A (en) * 1976-02-25 1979-02-20 Optron, Inc. Isolation voltage test apparatus
EP0786667B1 (en) 1995-10-31 2004-10-27 Texas Instruments Incorporated Method and apparatus for testing integrated circuits
US6142021A (en) * 1998-08-21 2000-11-07 Motorola, Inc. Selectable pressure sensor
US20030043015A1 (en) * 2001-08-28 2003-03-06 Jack Gershfeld Matrix switcher with three-dimensional orientation of printed circuit boards
EP1466365A2 (en) * 2001-09-28 2004-10-13 Koninklijke Philips Electronics N.V. Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
US6771089B1 (en) * 2002-05-29 2004-08-03 Advanced Micro Devices, Inc. Test fixture having an adjustable capacitance and method for testing a semiconductor component

Also Published As

Publication number Publication date
US7872487B2 (en) 2011-01-18
IT1392482B1 (it) 2012-03-09
DE102007062711A1 (de) 2009-07-02
US20090189629A1 (en) 2009-07-30

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