ITMI20050616A1 - Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti - Google Patents

Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti

Info

Publication number
ITMI20050616A1
ITMI20050616A1 IT000616A ITMI20050616A ITMI20050616A1 IT MI20050616 A1 ITMI20050616 A1 IT MI20050616A1 IT 000616 A IT000616 A IT 000616A IT MI20050616 A ITMI20050616 A IT MI20050616A IT MI20050616 A1 ITMI20050616 A1 IT MI20050616A1
Authority
IT
Italy
Prior art keywords
deposits
forming
getrter
welcome
solvent
Prior art date
Application number
IT000616A
Other languages
English (en)
Inventor
Andrea Conte
Sara Guadagnolo
Marco Moraja
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Priority to IT000616A priority Critical patent/ITMI20050616A1/it
Priority to CN2006800116590A priority patent/CN101156227B/zh
Priority to ES06745274T priority patent/ES2308746T3/es
Priority to DE602006001518T priority patent/DE602006001518D1/de
Priority to CA2602808A priority patent/CA2602808C/en
Priority to AT06745274T priority patent/ATE398831T1/de
Priority to DK06745274T priority patent/DK1869696T3/da
Priority to PL06745274T priority patent/PL1869696T3/pl
Priority to US11/911,065 priority patent/US7998319B2/en
Priority to EP06745274A priority patent/EP1869696B1/en
Priority to PCT/IT2006/000242 priority patent/WO2006109343A2/en
Priority to KR1020077022069A priority patent/KR100930738B1/ko
Priority to JP2008506057A priority patent/JP4971305B2/ja
Publication of ITMI20050616A1 publication Critical patent/ITMI20050616A1/it
Priority to NO20074482A priority patent/NO338707B1/no

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00277Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612Composite web or sheet
    • Y10T428/2462Composite web or sheet with partial filling of valleys on outer surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Portable Nailing Machines And Staplers (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
IT000616A 2005-04-12 2005-04-12 Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti ITMI20050616A1 (it)

Priority Applications (14)

Application Number Priority Date Filing Date Title
IT000616A ITMI20050616A1 (it) 2005-04-12 2005-04-12 Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti
PL06745274T PL1869696T3 (pl) 2005-04-12 2006-04-11 Proces wytwarzania miniaturowych warstw gettera oraz warstwy gettera uzyskiwane w tym procesie
US11/911,065 US7998319B2 (en) 2005-04-12 2006-04-11 Process for the formation of miniaturized getter deposits and getter deposits so obtained
DE602006001518T DE602006001518D1 (de) 2005-04-12 2006-04-11 Prozess zur bildung miniaturisierter getter-ablagerungen und so erhaltene getterablagerungen
CA2602808A CA2602808C (en) 2005-04-12 2006-04-11 Process for the formation of miniaturized getter deposits and getter deposits so obtained
AT06745274T ATE398831T1 (de) 2005-04-12 2006-04-11 Prozess zur bildung miniaturisierter getter- ablagerungen und so erhaltene getterablagerungen
DK06745274T DK1869696T3 (da) 2005-04-12 2006-04-11 Fremgangsmåde til dannelse af miniaturiserede getteraflejringer og således opnåede getteraflejringer
CN2006800116590A CN101156227B (zh) 2005-04-12 2006-04-11 形成微型化吸气剂沉积层的方法以及由此制得的吸气剂沉积层
ES06745274T ES2308746T3 (es) 2005-04-12 2006-04-11 Proceso para la formacion de depositos de getter miniaturizados y los depositos de getter obtenidos de ese modo.
EP06745274A EP1869696B1 (en) 2005-04-12 2006-04-11 Process for the formation of miniaturized getter deposits and getterdeposits so obtained
PCT/IT2006/000242 WO2006109343A2 (en) 2005-04-12 2006-04-11 Process for the formation of miniaturized getter deposits and getterdeposits so obtained
KR1020077022069A KR100930738B1 (ko) 2005-04-12 2006-04-11 소형화된 게터 부착물 및 그 형성 방법
JP2008506057A JP4971305B2 (ja) 2005-04-12 2006-04-11 小型ゲッタ蒸着層の形成方法
NO20074482A NO338707B1 (no) 2005-04-12 2007-09-03 Prosess for å danne miniatyriserte getteravsetninger og getteravsetninger dannet slik

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000616A ITMI20050616A1 (it) 2005-04-12 2005-04-12 Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti

Publications (1)

Publication Number Publication Date
ITMI20050616A1 true ITMI20050616A1 (it) 2006-10-13

Family

ID=36968973

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000616A ITMI20050616A1 (it) 2005-04-12 2005-04-12 Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti

Country Status (14)

Country Link
US (1) US7998319B2 (it)
EP (1) EP1869696B1 (it)
JP (1) JP4971305B2 (it)
KR (1) KR100930738B1 (it)
CN (1) CN101156227B (it)
AT (1) ATE398831T1 (it)
CA (1) CA2602808C (it)
DE (1) DE602006001518D1 (it)
DK (1) DK1869696T3 (it)
ES (1) ES2308746T3 (it)
IT (1) ITMI20050616A1 (it)
NO (1) NO338707B1 (it)
PL (1) PL1869696T3 (it)
WO (1) WO2006109343A2 (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20052343A1 (it) 2005-12-06 2007-06-07 Getters Spa Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti
ITMI20070301A1 (it) 2007-02-16 2008-08-17 Getters Spa Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
FR2922202B1 (fr) * 2007-10-15 2009-11-20 Commissariat Energie Atomique Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication.
DE102017210459A1 (de) 2017-06-22 2018-12-27 Robert Bosch Gmbh Mikromechanische Vorrichtung mit einer ersten Kaverne und einer zweiten Kaverne
FR3083537B1 (fr) * 2018-07-06 2021-07-30 Ulis Boitier hermetique comportant un getter, composant integrant un tel boitier hermetique et procede de fabrication associe
FR3088319B1 (fr) 2018-11-08 2020-10-30 Ulis Boitier hermetique comportant un getter, composant optoelectronique ou dispositif mems integrant un tel boitier hermetique et procede de fabrication associe
FR3109936B1 (fr) 2020-05-07 2022-08-05 Lynred Procede de fabrication d’un microsysteme electromecanique et microsysteme electromecanique

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1003826B (zh) * 1985-04-16 1989-04-05 北京有色金属研究总院 宽激活温度范围吸气剂和吸气元件
EP0341843A3 (en) * 1988-05-09 1991-03-27 International Business Machines Corporation A process of forming a conductor pattern
EP0734589B1 (en) * 1993-12-13 1998-03-25 Honeywell Inc. Integrated silicon vacuum micropackage for infrared devices
US5594170A (en) * 1994-06-15 1997-01-14 Alliedsignal Inc. Kip cancellation in a pendulous silicon accelerometer
US5656778A (en) * 1995-04-24 1997-08-12 Kearfott Guidance And Navigation Corporation Micromachined acceleration and coriolis sensor
US5705432A (en) * 1995-12-01 1998-01-06 Hughes Aircraft Company Process for providing clean lift-off of sputtered thin film layers
US5658469A (en) * 1995-12-11 1997-08-19 Quantum Peripherals Colorado, Inc. Method for forming re-entrant photoresist lift-off profile for thin film device processing and a thin film device made thereby
JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
US5821836A (en) * 1997-05-23 1998-10-13 The Regents Of The University Of Michigan Miniaturized filter assembly
US6499354B1 (en) * 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices
US6058027A (en) * 1999-02-16 2000-05-02 Maxim Integrated Products, Inc. Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate
IT1312248B1 (it) * 1999-04-12 2002-04-09 Getters Spa Metodo per aumentare la produttivita' di processi di deposizione distrati sottili su un substrato e dispositivi getter per la
JP4258960B2 (ja) 2000-07-28 2009-04-30 株式会社村田製作所 薄膜形成方法
US6590850B2 (en) * 2001-03-07 2003-07-08 Hewlett-Packard Development Company, L.P. Packaging for storage devices using electron emissions
DE10297185T5 (de) * 2001-11-10 2004-10-07 Trikon Holdings Ltd Verfahren zur Ausbildung einer gemusterten Metallschicht
US6923625B2 (en) * 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby
US6621134B1 (en) * 2002-02-07 2003-09-16 Shayne Zurn Vacuum sealed RF/microwave microresonator
US6635509B1 (en) * 2002-04-12 2003-10-21 Dalsa Semiconductor Inc. Wafer-level MEMS packaging
JP2004066225A (ja) * 2002-06-13 2004-03-04 Lg Electronics Inc ゲッタの組成物及び該ゲッタの組成物を利用した電界放出表示装置
JP4235438B2 (ja) * 2002-12-04 2009-03-11 株式会社テスコム 有機elディスプレイパネル、有機elディスプレイパネルのゲッタ部形成方法及び有機elディスプレイパネルのゲッタ部形成装置
ITMI20031178A1 (it) 2003-06-11 2004-12-12 Getters Spa Depositi multistrato getter non evaporabili ottenuti per

Also Published As

Publication number Publication date
US7998319B2 (en) 2011-08-16
ES2308746T3 (es) 2008-12-01
ATE398831T1 (de) 2008-07-15
CA2602808A1 (en) 2006-10-19
WO2006109343A2 (en) 2006-10-19
US20080171180A1 (en) 2008-07-17
EP1869696A2 (en) 2007-12-26
JP2008537981A (ja) 2008-10-02
CN101156227A (zh) 2008-04-02
DE602006001518D1 (de) 2008-07-31
PL1869696T3 (pl) 2008-10-31
NO338707B1 (no) 2016-10-03
WO2006109343A3 (en) 2006-12-14
CA2602808C (en) 2013-11-26
JP4971305B2 (ja) 2012-07-11
KR20080016991A (ko) 2008-02-25
DK1869696T3 (da) 2008-10-13
CN101156227B (zh) 2011-01-26
NO20074482L (no) 2007-10-25
KR100930738B1 (ko) 2009-12-09
EP1869696B1 (en) 2008-06-18

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