IT9000630A0 - Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. - Google Patents
Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.Info
- Publication number
- IT9000630A0 IT9000630A0 IT90630A IT63090A IT9000630A0 IT 9000630 A0 IT9000630 A0 IT 9000630A0 IT 90630 A IT90630 A IT 90630A IT 63090 A IT63090 A IT 63090A IT 9000630 A0 IT9000630 A0 IT 9000630A0
- Authority
- IT
- Italy
- Prior art keywords
- application
- electronic components
- flexible printed
- mounting method
- printed circuits
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0173—Template for holding a PCB having mounted components thereon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT630A IT1242420B (it) | 1990-09-03 | 1990-09-03 | Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. |
AT91830293T ATE112923T1 (de) | 1990-09-03 | 1991-07-02 | Anordnung und verfahren zur anordnung für den einbau von elektronischen bauelementen auf flexiblen gedruckten schaltungen. |
DE69104580T DE69104580T2 (de) | 1990-09-03 | 1991-07-02 | Anordnung und Verfahren zur Anordnung für den Einbau von elektronischen Bauelementen auf flexiblen gedruckten Schaltungen. |
EP91830293A EP0474605B1 (en) | 1990-09-03 | 1991-07-02 | Assembly and method of assembly for the application of electronic components to flexible printed circuits |
US07/729,323 US5153985A (en) | 1990-09-03 | 1991-07-12 | Method of assembly for the application of electronic components to flexible printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT630A IT1242420B (it) | 1990-09-03 | 1990-09-03 | Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. |
Publications (3)
Publication Number | Publication Date |
---|---|
IT9000630A0 true IT9000630A0 (it) | 1990-09-03 |
IT9000630A1 IT9000630A1 (it) | 1992-03-04 |
IT1242420B IT1242420B (it) | 1994-03-04 |
Family
ID=11099951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT630A IT1242420B (it) | 1990-09-03 | 1990-09-03 | Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5153985A (it) |
EP (1) | EP0474605B1 (it) |
AT (1) | ATE112923T1 (it) |
DE (1) | DE69104580T2 (it) |
IT (1) | IT1242420B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5670009A (en) * | 1995-02-28 | 1997-09-23 | Eastman Kodak Company | Assembly technique for an image sensor array |
DE19739591A1 (de) * | 1997-09-10 | 1999-03-11 | Wuerth Elektronik Gmbh & Co Kg | Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem |
SE517944C2 (sv) * | 2000-04-06 | 2002-08-06 | Ericsson Telefon Ab L M | Förfarande och styrelement för fastsättning av ett mönsterkort på ett element |
SE518778C2 (sv) * | 2000-04-19 | 2002-11-19 | Ericsson Telefon Ab L M | Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort |
US6884313B2 (en) * | 2001-01-08 | 2005-04-26 | Fujitsu Limited | Method and system for joining and an ultra-high density interconnect |
US20080241991A1 (en) * | 2007-03-26 | 2008-10-02 | National Semiconductor Corporation | Gang flipping for flip-chip packaging |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
US3859723A (en) * | 1973-11-05 | 1975-01-14 | Microsystems Int Ltd | Bonding method for multiple chip arrays |
US3887996A (en) * | 1974-05-01 | 1975-06-10 | Gen Motors Corp | iconductor loading apparatus for bonding |
DE2713280C3 (de) * | 1977-03-25 | 1986-10-23 | Esser Sicherheitstechnik GmbH & Co KG, 4040 Neuss | Funktionsüberprüfbare Feuermelderanlage |
JPS53149763A (en) * | 1977-06-01 | 1978-12-27 | Citizen Watch Co Ltd | Mounting method of semiconductor integrate circuit |
FR2541828B1 (fr) * | 1983-02-28 | 1985-09-13 | Inf Milit Spatiale Aeronaut | Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif |
DE3336606A1 (de) * | 1983-10-07 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur mikropackherstellung |
DE3414552A1 (de) * | 1984-04-17 | 1985-10-17 | geb. Baur Christine 8042 Oberschleißheim Irnstetter | Verfahren und vorrichtung zur montage anschlussleiterloser elektrischer bauelemente |
JPH0793517B2 (ja) * | 1986-11-20 | 1995-10-09 | 松下電器産業株式会社 | 電子部品の装着方法 |
US4916807A (en) * | 1989-01-05 | 1990-04-17 | Wiese Paul H | Method and apparatus for assembling circuits having surface mounted components |
US5054193A (en) * | 1989-08-28 | 1991-10-08 | Hewlett-Packard Company | Printed circuit board fixture and a method of assembling a printed circuit board |
US4941255A (en) * | 1989-11-15 | 1990-07-17 | Eastman Kodak Company | Method for precision multichip assembly |
-
1990
- 1990-09-03 IT IT630A patent/IT1242420B/it active IP Right Grant
-
1991
- 1991-07-02 AT AT91830293T patent/ATE112923T1/de not_active IP Right Cessation
- 1991-07-02 DE DE69104580T patent/DE69104580T2/de not_active Expired - Fee Related
- 1991-07-02 EP EP91830293A patent/EP0474605B1/en not_active Expired - Lifetime
- 1991-07-12 US US07/729,323 patent/US5153985A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE112923T1 (de) | 1994-10-15 |
IT9000630A1 (it) | 1992-03-04 |
IT1242420B (it) | 1994-03-04 |
EP0474605A2 (en) | 1992-03-11 |
EP0474605B1 (en) | 1994-10-12 |
DE69104580T2 (de) | 1995-05-18 |
EP0474605A3 (en) | 1993-01-13 |
DE69104580D1 (de) | 1994-11-17 |
US5153985A (en) | 1992-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970929 |