IT8821454A0 - HARDENABLE EPOXY RESIN/THERMOPLAST MIXTURES. - Google Patents

HARDENABLE EPOXY RESIN/THERMOPLAST MIXTURES.

Info

Publication number: IT8821454A0
Authority: IT; Italy
Prior art keywords: thermoplast; mixtures; epoxy resin; hardenable epoxy; hardenable
Prior art date: 1987-07-23

Application number

IT8821454A

Other languages

Italian (it)

Other versions

IT1226283B (en

Inventor

Rolf Schmid

Werner Stauffer

Original Assignee

Ciba Geigy Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-07-23

Filing date

1988-07-22

Publication date

1988-07-22

1988-07-22 Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag

1988-07-22 Publication of IT8821454A0 publication Critical patent/IT8821454A0/en

1990-12-27 Application granted granted Critical

1990-12-27 Publication of IT1226283B publication Critical patent/IT1226283B/en

Links

239000003822 epoxy resin Substances 0.000 title 1
239000000203 mixture Substances 0.000 title 1
229920000647 polyepoxide Polymers 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Epoxy Resins (AREA)
Reinforced Plastic Materials (AREA)
Compositions Of Macromolecular Compounds (AREA)
Adhesives Or Adhesive Processes (AREA)

IT8821454A 1987-07-23 1988-07-22 HARDENABLE MIXTURES EPOXY RESIN / THERMOPLAST. IT1226283B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CH2791/87A CH672494A5 (en)	1987-07-23	1987-07-23

Publications (2)

Publication Number	Publication Date
IT8821454A0 true IT8821454A0 (en)	1988-07-22
IT1226283B IT1226283B (en)	1990-12-27

Family

ID=4241672

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT8821454A IT1226283B (en)	1987-07-23	1988-07-22	HARDENABLE MIXTURES EPOXY RESIN / THERMOPLAST.

Country Status (10)

Country	Link
JP (1)	JPS6465118A (en)
BR (1)	BR8803677A (en)
CH (1)	CH672494A5 (en)
DE (1)	DE3824705A1 (en)
ES (1)	ES2007541A6 (en)
FR (1)	FR2618444A1 (en)
GB (1)	GB2207676A (en)
IT (1)	IT1226283B (en)
NL (1)	NL8801859A (en)
SE (1)	SE8802698L (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02283753A (en) *	1989-04-25	1990-11-21	Mitsubishi Electric Corp	Laminate resin composition
JPH0379621A (en) *	1989-05-12	1991-04-04	Mitsubishi Electric Corp	Resin composition for laminate
JPH0739463B2 (en) *	1989-05-25	1995-05-01	三菱電機株式会社	Resin composition for laminated board
JPH0333124A (en) *	1989-06-30	1991-02-13	Mitsubishi Electric Corp	Laminating resin composition
JPH0337256A (en) *	1989-07-04	1991-02-18	Mitsubishi Electric Corp	Resin composition for laminated board
JP3415144B2 (en) *	1989-12-21	2003-06-09	ロックヒードマーティンコーポレーション	Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same
US5470622A (en) *	1990-11-06	1995-11-28	Raychem Corporation	Enclosing a substrate with a heat-recoverable article
DE4110219A1 (en) *	1991-03-28	1992-10-01	Huels Troisdorf	METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
US5250228A (en) *	1991-11-06	1993-10-05	Raychem Corporation	Conductive polymer composition
TW215927B (en) *	1992-02-28	1993-11-11	Ciba Geigy
WO1996004329A1 (en) *	1994-08-04	1996-02-15	Hokuriku Toryo Kabushiki Kaisya	Flowable sealing resin composition
GB9709166D0 (en) *	1997-05-06	1997-06-25	Cytec Ind Inc	Preforms for moulding process and resins therefor
SG80627A1 (en) *	1998-05-18	2001-05-22	Nippon Catalytic Chem Ind	Lower alkane oxidative dehydrogenation catalysts and a process for producing olefins
US6486256B1 (en) *	1998-10-13	2002-11-26	3M Innovative Properties Company	Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
DE19913431C2 (en) *	1999-03-25	2001-10-11	Inst Verbundwerkstoffe Gmbh	Process for toughening of thermoset systems by adding partially cross-linked polyurethane
JP6678075B2 (en) *	2016-06-30	2020-04-08	サンアプロ株式会社	Epoxy resin curing accelerator

1987
- 1987-07-23 CH CH2791/87A patent/CH672494A5/de not_active IP Right Cessation
1988
- 1988-07-18 GB GB08817081A patent/GB2207676A/en not_active Withdrawn
- 1988-07-20 DE DE3824705A patent/DE3824705A1/en not_active Withdrawn
- 1988-07-21 SE SE8802698A patent/SE8802698L/en not_active Application Discontinuation
- 1988-07-22 NL NL8801859A patent/NL8801859A/en not_active Application Discontinuation
- 1988-07-22 BR BR8803677A patent/BR8803677A/en unknown
- 1988-07-22 IT IT8821454A patent/IT1226283B/en active
- 1988-07-22 ES ES8802320A patent/ES2007541A6/en not_active Expired
- 1988-07-22 FR FR8809924A patent/FR2618444A1/en not_active Withdrawn
- 1988-07-23 JP JP63184440A patent/JPS6465118A/en active Pending

Also Published As

Publication number	Publication date
NL8801859A (en)	1989-02-16
BR8803677A (en)	1989-02-14
GB8817081D0 (en)	1988-08-24
FR2618444A1 (en)	1989-01-27
JPS6465118A (en)	1989-03-10
DE3824705A1 (en)	1989-02-02
GB2207676A (en)	1989-02-08
CH672494A5 (en)	1989-11-30
IT1226283B (en)	1990-12-27
ES2007541A6 (en)	1989-06-16
SE8802698D0 (en)	1988-07-21
SE8802698L (en)	1989-01-24

Publication	Publication Date	Title
DE68904665D1 (en)	1993-03-18	HARDENABLE RESIN COMPOSITION.
DE58907670D1 (en)	1994-06-23	Modified epoxy resins.
DE3889950D1 (en)	1994-07-14	Epoxy resin composition.
DE3864484D1 (en)	1991-10-02	MODIFIED EPOXY RESINS.
DE3852839D1 (en)	1995-03-09	Thermosetting resin composition.
DE68920092D1 (en)	1995-02-02	Resin composition.
KR900700518A (en)	1990-08-13	Modified epoxy resin
DE3850373D1 (en)	1994-07-28	Flexibilized epoxy resin compositions.
DE68913781D1 (en)	1994-04-21	Thermoplastic resin mass.
IT1226283B (en)	1990-12-27	HARDENABLE MIXTURES EPOXY RESIN / THERMOPLAST.
DE68903181D1 (en)	1992-11-19	POLYIMIDE RESIN COMPOSITION.
DE69006422D1 (en)	1994-03-17	Epoxy resin compound.
DE3883933D1 (en)	1993-10-14	Curable epoxy resin composition.
DE68919151D1 (en)	1994-12-08	Resin composition.
DE3682310D1 (en)	1991-12-12	HARDENABLE EPOXY RESIN COMPOSITION.
DE68914150D1 (en)	1994-04-28	POLYIMIDE RESIN.
DE68911340D1 (en)	1994-01-27	Resin composition.
DE68913640D1 (en)	1994-04-14	Thermoplastic resin mass.
DE68920086D1 (en)	1995-02-02	Thermosetting epoxy resin composition.
DE68924798D1 (en)	1995-12-21	Resin composition.
DE68918544D1 (en)	1994-11-03	Resin composition.
DE68920062D1 (en)	1995-02-02	Thermosetting epoxy resin composition.
DE3886587D1 (en)	1994-02-10	Epoxy resin composition.
DE58900457D1 (en)	1992-01-02	HARDENABLE MIXTURE.
DE3855414D1 (en)	1996-08-14	Epoxy resin mixtures